CN103382016A - BioMEMS employing integrated package member and planar optical circuit - Google Patents
BioMEMS employing integrated package member and planar optical circuit Download PDFInfo
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- CN103382016A CN103382016A CN2013101385524A CN201310138552A CN103382016A CN 103382016 A CN103382016 A CN 103382016A CN 2013101385524 A CN2013101385524 A CN 2013101385524A CN 201310138552 A CN201310138552 A CN 201310138552A CN 103382016 A CN103382016 A CN 103382016A
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- pipe line
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Abstract
The invention provides a BioMEMS employing an integrated package member and a planar optical circuit. The invention discloses a BioMEMS device and a method for manufacturing the same. A substrate is provided and at least one signal pipe is formed on the substrate. A sacrificial layer made of sacrificial material can be deposited on the signal pipe and selectively the sacrificial layer is patterned and the sacrificial material is removed from the outside of a package coverage area. A connection layer can be deposited on at least one part of the signal pipe and the sacrificial layer (if included). The connection layer can be leveled and patterned to form one or more coverage part connection pads and define the package coverage area. A coverage part can be connected to the coverage part connection pad(s) for defining a coverage area. Therefore, the signal pipe is extended to the inside of the coverage area from the outside of the coverage area. Testing material such as fluid can be provided in the coverage area.
Description
Related application
The application requires the priority of the U.S. Provisional Application " 61/641,657 " submitted on May 2nd, 2012 number, and its full content is hereby expressly incorporated by reference.
Technical field
The present invention relates to adopt BioMEMSN and the planar light circuit of integration packaging spare.
Background technology
The BioMEMS device is the MEMS with sensing element for biologic applications, and usually has light or the signal of telecommunication pipeline that is connected between encapsulation fluidic hardware and external environment condition.Usually use to surround the covering of encapsulation fluidic hardware and external environment condition isolation, so directly be bonded on above the optical signal pipeline because the optical signal pipeline arrives this covering of fluent material that the coating cover piece keeps.Traditionally, can be used for covering is bonded on the signal pipe line top with the adhesion joint of dimethyl silicone polymer (" PDMS ") or anodic bonding, but this needs pipeline to introduce minimum pattern to change (for example, in the situation that anodic bonding less than 1000 dusts).Use PDMS directly to be bonded on pipeline as cement and commonly use, due to its refractive index and SiO
2Similar, the therefore not operation of stray light signal pipe line.Usually, the BioMEMS system of this use PDMS is easy to keep prototype and does not need clean room environment.Yet, in some cases, because can not being bonded on securely, PDMS has the pipeline top that larger pattern changes, so the limitation that PDMS has brought the pipeline pattern to cause, this limitation needs the height of signal pipe line less than 200 nanometers usually.In addition, PDMS absorbs in the overlay area molecule such as fluorogen that the generation to signal plays a crucial role, and PDMS can be also porous in some cases, thereby makes water pass the seal evaporation.
In addition, anodic bonding or directly be bonded on by electrostatic field and need high voltage on pipeline particularly surpasses the pipeline of hundreds of dust for thickness, and usually needing approximately, 800V to 1000V realizes suitable joint.The high-energy relevant to this anodic bonding may change the physical property of light or electric pipe, thereby makes pipeline Efficiency Decreasing or improper in other respects.And, anodic bonding also can occur the limitation that the pipeline pattern causes (＜100nm), and sometimes need to be up to the about temperature of 400 to 500 degrees centigrade, this may make it and to make the BioMEMS device on the CMOS wafer incompatible.
The adhesion joining technique additive method used of fluidic hardware comprises with glue or epoxy resin the Merlon covering is directly joined on pipeline.Yet, the function of these materials possibility interfering signal pipelines used in this technology.
Summary of the invention
In order to solve problems of the prior art, according to an aspect of the present invention, provide a kind of micro electro mechanical device, comprising: substrate; At least one signal pipe line is arranged on described substrate; At least one covering joint sheet is arranged on described substrate and the top of the part of described signal pipe line; And covering, being arranged to and forming the overlay area, described covering is arranged on described at least one covering joint sheet, and wherein said at least one signal pipe line extends to inside, described overlay area from outside, described overlay area; Wherein, described covering is configured to keep the controlled environment in described overlay area.
Described device further comprises and is arranged in described overlay area and is configured to and the interactional acceptor of the target molecule of predefined type.
In described device, described signal pipe line is the optical signal pipeline.In one embodiment, described device further is included in the photodetector that described substrate arranges, and wherein, described optical signal pipeline is configured to transport light to target molecule, and described photodetector is configured to detect the response from described target molecule.
In described device, described signal pipe line is signal of telecommunication pipeline.
In described device, described covering joint sheet is that refractive index is lower than the oxide of the refractive index of described signal pipe line.
In described device, a kind of during described covering engages by adhesive, anodic bonding or melting joins described covering joint sheet to.
In described device, described overlay area is filled with the fluid test material at least in part.
According to a further aspect in the invention, provide a kind of micro electro mechanical device, having comprised: substrate; At least one signal pipe line is arranged on described substrate; At least one covering joint sheet has smooth first surface and is arranged on described substrate and the top of the part of described signal pipe line; Input structure is connected with described signal pipe line; And covering, be arranged to and form the overlay area, described covering is arranged on the smooth first surface of described at least one covering joint sheet, and wherein said at least one signal pipe line extends to inside, described overlay area from outside, described overlay area.
Described device further comprises and is arranged in described overlay area and is configured to and the interactional surface chemistry layer of target molecule.In one embodiment, described device further comprises and is arranged in described overlay area and is configured to and the interactional acceptor of the target molecule of predefined type.In another embodiment, described device further comprises and is arranged on described substrate and is configured to and the interactional one or more electrodes of described target molecule.
According to another aspect of the invention, provide a kind of method that is used to form microelectromechanicdevices devices, having comprised: substrate is provided; Be formed at least one signal pipe line that arranges on described substrate; Form the sacrifice layer that is consisted of by expendable material at least a portion of described at least one signal pipe line; Deposit knitting layer at least a portion of described at least one signal pipe line; The described knitting layer of patterning is to form one or more covering joint sheets and to limit the package footprint territory; And joining covering to the covering joint sheet, it is inner that wherein said at least one signal pipe line extends to described package footprint territory from described package footprint overseas section.
In described method, formed described sacrifice layer before the described knitting layer of deposition, wherein the described knitting layer of deposition above described at least one signal pipe line and described sacrifice layer.In one embodiment, described method further comprises: after the described knitting layer of patterning, from described package footprint territory removal expendable material.
Described method further comprises: the described knitting layer of planarization before the described knitting layer of patterning.
In described method, provide described substrate to comprise and be provided at one or more electrodes that described substrate arranges.In one embodiment, described covering joint sheet is thicker than described signal pipe line.
In described method, a kind of in engaging by anodic bonding, melting joint or epoxy resin joins described covering to described covering joint sheet.
Described method further comprises: be provided at the fluid test material that arranges in the zone that limits by described covering.
Description of drawings
For understanding more fully the embodiment of the present invention and advantage thereof, the following description of doing in connection with accompanying drawing now as a reference, wherein:
Fig. 1 is the top view that is illustrated in the covering that applies above signal pipe line;
Fig. 2 A and Fig. 2 B are illustrated in the light tunnel of setting in covering below and overlay area and the side view of light input structure;
Fig. 3 A to Fig. 3 B illustrates the sectional view that uses fluidic hardware embodiment;
Fig. 4 A to Fig. 4 F and Fig. 5 A to Fig. 5 B are the schematic diagrames that the embodiment of the method that is used to form the BioMEMS device architecture is shown.
The specific embodiment
Discuss below manufacturing and the use of the embodiment of the present invention in detail.Yet, should be appreciated that, the invention provides many applicable inventive concepts that can realize in various specific environments.The specific embodiment of discussing is only the illustrative of specific ways of making and use disclosed theme, and is not used in the scope of the different embodiment of restriction.Below will describe embodiment for specific environment, namely be used to form the system and method for BioMEMS device architecture.
Herein disclosed is a kind of device (especially microfluid) for the application of BioMEMS packaging part and the method that forms this device.Embodiment disclosed herein has avoided the interference of signal pipe line or damage and has overcome the pattern limitation that is applied by signal pipe line.Signal pipe line allows to control or induction between packaging part or overlay area inside and outside.This paper describes the accompanying drawing that the principle of the invention is shown, but and do not mean that restriction, and accompanying drawing is drawn in proportion.
Fig. 1 is the top view that the covering that applies above light tunnel according to the present invention is shown, and obtains BioMEMS device architecture 100.Substrate 106 can have one or more signal pipe lines or waveguide pipe 102, and it can be arranged on light or electric pipe or waveguide pipe on substrate alternatively, and wherein input structure is configured to input source is connected with signal pipe line.Input structure can be coupled structure, such as, but not limited to the grating coupler 110 that serves as the interface between light source and optical signal pipeline 102 or cable splice structure 112.Alternatively, signal pipe line 102 can conducting electrical signals sending the signal of telecommunication or make the signal of telecommunication enter into overlay area 108 or inner 108 collect signals from the overlay area, and input structure can be configured to install the electrical connection such as wire or cross tie part.For example, signal pipe line 102 can interact with the material of 108 inside, overlay area.In certain embodiments, signal pipe line 102 can be by applying AC voltage and measuring and measure impedance through the electric current of the material in overlay area 108.
Covering wall 104 can be arranged on the overlay area 108 of signal pipe line 102 tops to limit and to hold sealing.Overlay area 108 can be configured to seal a constant volume and keep controlled environment to contact with signal pipe line 102.For example, overlay area 108 can be fluid reservoir (fluid reservoir), perhaps can air inclusion environment or any combination of materials.In a useful embodiment, overlay area 108 can be filled with fluid at least in part, and this fluid can have the material for test.Those skilled in the art will recognize that, although principle disclosed herein partly is described as the transmission of light and light, advantageously, can use the electromagnetic radiation of any frequency in described embodiment.Therefore, can substitute visible light with infrared ray and ultraviolet radiation, wireless radio transmission, x ray, gamma ray and any other radiation.
Fig. 2 A is the side view of embodiment that the part 200 of BioMEMS device architecture is shown, and wherein signal pipe line 102 is arranged in covering 202 belows and overlay area 108.Signal pipe line has optical cable 210 inputs that are positioned at 108 outsides, overlay area.Have covering wall 104 and covering top 206 covering 202 and can be arranged on the top of covering joint sheet 204 to limit overlay area 108.Therefore, covering 202 can keep test material to separate with external environment condition and prevent from polluting.
In addition, the covering 202 of restriction overlay area 108 can have for one or more openings of introducing test material.Therefore, can in the situation that 108 inside, overlay area produce the BioMEMS test component without any specific environment, then can catch sample in overlay area 108 at the time point of back.
Fig. 2 B is the side view of optional embodiment that the part 220 of BioMEMS device architecture is shown, and wherein light tunnel 102 is arranged in covering 202 belows and overlay area 108.Pipeline has the grating coupler 110 that is positioned at 108 outsides, overlay area.In this embodiment, laser or other light sources can long-rangely be provided and laser or other light sources can be directed in grating coupler 110, then being transferred in light tunnel 102.
Fig. 3 A is the sectional view of operation of transducing part 300 that the embodiment of BioMEMS device architecture is shown.Photodetector 308 or other light-sensitive devices can be set, such as, but not limited to photodiode, CMOS active pixel sensor, phototransistor, photo-resistor, charge-coupled image sensor etc. in substrate 106.Alternatively, electricity or chemical sensor can be set in substrate or on substrate, and this electricity or chemical sensor can be configured to detect performance or reaction by target molecule 302 when interacting with signal pipe line 102.Advantageously, light tunnel 102 can also be arranged on the surface of substrate 106, and can have surface chemistry layer 306 and be configured to and the interactional acceptor 304 of the target molecule 302 of specific or predefined type.Surface chemistry layer 306 can be arranged on any other vantage point on signal pipe line 102 or in overlay area 108 alternatively, and can be configured to attract target molecule 302 or interact with target molecule 302.Alternatively, surface chemistry layer 306 can be filter, and can be adjusted into specially and filter the fluorescence that sends from target molecule 302.Advantageously, acceptor 304 can be molecule, protein, antibody, enzyme, polymerase, bacterium, cell etc.Target molecule 302 can be for example the analyte with fluorescent dye, can be perhaps fluorescin, fluorescently-labeled antibody, fluorescently-labeled DNA etc. alternatively.Excite fluorescent dye, mark or albumen in target molecule 302 such as the light transmission from the evanescent wave of signal pipe line 102, and detect fluorescence response from target molecule 302 by photodetector 308.As shown in Fig. 3 B, can one or more electrodes 310 be set at substrate 106.For example, electrode 310 can but be not limited to be arranged on the surface of substrate 106 or be included in substrate 106.
Electrode 310 can be configured to read and target molecule 302 interactions by the data of for example controlling or measuring from target molecule.In one embodiment, electrode 310 can resistance heated be included in fluid or the environment in overlay area 108.In optional embodiment, electrode 310 can apply AC voltage and be used for helping analyte or target molecule 302 are directed to signal pipe line 102 or acceptor 304 by dielectrophoresis.In another embodiment, electrode 310 can be configured to read the electrical characteristic of the material in target molecule 302 or overlay area 108.For example, electrode 310 can be to the overlay area 108 applies AC voltage, and reads impedance or the electric current of overlay area 108.
Fig. 4 A to Fig. 4 F and Fig. 5 A to Fig. 5 B are in the sectional view of the BioMEMS device architecture in the stages of manufacturing according to one or more embodiment.At first, Fig. 4 A illustrates and is in the BioMEMS device architecture 400 of making initial stage.Signal pipe line 102 can be arranged on substrate 106, and wherein substrate 106 is the materials such as, but not limited to glass, silicon (Si), GaAs (GaAs), glass fibre, metal etc.In addition, substrate 106 can comprise circuit such as cmos device, interconnection line, sensor, electrode, photodetector, doped region alternatively.In one embodiment, can patterning signal pipe line 102 with dispersed light or the pipe section of separation is provided.Optical signal pipeline 102 can be for example high k material, such as silicon nitride (Si
3N
4), silicon oxynitride (SiON), hafnium oxide (HfO
2), tantalum pentoxide (Ta
2O
5) etc.Alternatively, signal of telecommunication pipeline 102 can be for example metal or other conductive materials, such as gold (Au), aluminium (Al), copper (Cu), titanium nitride (TiN) and their alloy etc.The thickness of typical signal pipe line 102 can be between about 500 dusts with approximately between 6000 dusts.In one embodiment of the invention, can come patterning optical signal pipeline 102 with dry etching technology, and dry etching technology can provide than the better light tunnel critical dimension control of wet etching.And some embodiment can have the optical signal pipeline 102 with smooth outer surface, thereby make optical signal more effectively transmit.
Fig. 4 B is illustrated in the sectional view that forms sacrifice layer 412 BioMEMS device architecture 400 afterwards.In one embodiment, sacrifice layer 412 can be hard material or non-polymer materials such as germanium (Ge), silicon (Si), titanium-tungsten (TiW), aluminium (Al), and advantageously can be deposited on by plasma vapor deposition, chemical vapor deposition or PVD etc. the top of substrate 106 and signal pipe line 102.In one embodiment, the thickness of sacrifice layer 412 can be between about 2000 dusts with approximately between 6000 dusts.
Fig. 4 C is illustrated in the sectional view of the BioMEMS device architecture 400 after sacrificial patterned 412.Can remove sacrifice layer 412 by photoetching or any other suitable art pattern CAD sacrifice layer 412 or from the zone of 422 outsides, package footprint territory in the future, only stay the material of the sacrifice layer 412 that is arranged in package footprint territory 422.Can complete the removal of sacrifice layer 412 by the etchant that is suitable for specific sacrifice layer 412 materials, described etchant includes but not limited to hydrogen peroxide (H
2O
2), phosphoric acid (H
3PO
4), potassium hydroxide (KOH), TMAH (TMAH), ethylene diamine pyrocatechol (EDP), xenon difluoride (XeF
2) etc.
Fig. 4 D is illustrated in the sectional view that forms knitting layer BioMEMS device architecture 400 afterwards.Knitting layer 434 can be deposited on the top of sacrifice layer 412 and the signal pipe line 102 of patterning.In one embodiment, thus can apply knitting layer 434 makes knitting layer be arranged in engaging zones 432 to cover signal pipe line 102 and to be provided for the pad of joint covering member wall 104 above signal pipe line 102.In certain embodiments, knitting layer 434 can be such as oxides such as silica, and can be by for example chemical vapor deposition process, plasma enhanced deposition technique or any other suitable process deposits.Alternatively, knitting layer 434 can be nitride, metal level, polysilicon layer etc., and can select the knitting layer material according to the performance of signal pipe line 102.
In removing the zone of knitting layer 434 subsequently, sacrifice layer 412 can make it engage with the knitting layer 434 of top by guard signal pipeline 102.
In one embodiment of the invention, it may be favourable having hard sacrifice layer 412 rather than sacrifice photoresist (PR) below knitting layer 434, because polymer residues may be disturbed the surface chemistry layer 306 of BioMEMS device sensing arrangement.In addition, may also can have problems in the planarization of sacrificing the knitting layer 434 that deposits on photoresist layer, because oxide is positioned on soft material: photoresist distortion and knitting layer that the stress that is produced by planarization during planarization and pressure can cause polymer type lost efficacy.Yet, can use the photoresist of bio-compatible, and can determine by the test material that expection is used for overlay area 108 chemical action of the photoresist of this bio-compatible.In this case, the preferred photoresist of the bio-compatible of the chemical action of not disturbed test program and any target molecule 302.
Fig. 4 E is illustrated in the sectional view of the BioMEMS device architecture 400 after patterning knitting layer 434.Can make knitting layer 434 patternings or be formed in covering joint sheet 204 to remove the material of knitting layer 434 by etching, thereby limit or form package footprint territory 422, wherein be retained in the material of the knitting layer 434 in engaging zones 432 as the target spot that is used for joint covering member wall 104.In a useful especially embodiment, can use the dry etching technology such as plasma etching or ion sputtering to come etching knitting layer 434.Alternatively, advantageously, according to the material of knitting layer 434, can come with the etching of wet etching or any other type patterning knitting layer 434.In one embodiment; can be before patterning planarization knitting layer 434, this can be avoided during patterning damage or the pollution of the part of the substrate of the involuntary exposure that the mask that may be caused by pattern or photoresist coverage deficiency cause or signal pipe line.In addition, before patterning, planarization knitting layer 434 has been patterned the area decreases of removal or has stoped damage or destroy by its knitting layer of planarization.
Fig. 4 F is illustrated in and removes the sectional view that sacrifice layer 412 exposes the BioMEMS device architecture 400 of signal pipe line 102 afterwards.Can be etched with and above the sacrifice layer 412 described similar fashion of patterning be implemented the removal of sacrifice layer 412 by for example wet etching or vapour phase.Therefore, expose signal pipe line 102 in package footprint territory 422.
Fig. 5 A and Fig. 5 B illustrate one or more embodiment according to the present invention and engage the BioMEMS device architecture 400 that covering 206 is arranged.Fig. 5 A illustrates to have and is arranged on the embodiment of BioMEMS device architecture 400 of covering joint sheet 204 that covering wall 104 belows and covering are positioned at the signal pipe line 102 of 108 outsides, overlay area.Fig. 5 B illustrates to has in the zone that is arranged on covering wall 104 belows but exposes the embodiment of BioMEMS device architecture 400 of covering joint sheet 204 of the Outboard Sections of signal pipe line 102.During the step shown in Fig. 4 B to Fig. 4 F, can remove the covering joint sheet 204 that is retained in the outside, overlay area and expendable material 412 to expose the Outboard Sections of signal pipe line 102.Alternatively, can expose the Outboard Sections of signal pipe line 102 in independent step, for example, after covering 202 is applied to covering joint sheet 204.
Can use the technology that adhesive engages by melting or any other is suitable such as epoxy resin to join covering wall 104 to covering joint sheet 204.In a useful embodiment, for example the material at covering joint sheet 204 is in the embodiment of oxide, and it may be suitable using the melting joint of low temperature (＜300 ℃) annealing.Covering can be pushed up 206 and join covering wall 104 to form covering 202 and to limit overlay area 108.Can be before joint covering member pushes up 206 or 108 provide gaseous environment or fluent material by sealable opening to the overlay area after joint covering member top 206.Covering 202 can preferably be configured to keep waterproof or liquid-tight in the embodiment of overlay area reservation fluent material.Similarly, in overlay area 108 kept the embodiment of gas material, covering 202 comprised that the structure of covering and joint close will be all air-locked.
Because knitting layer 434 and covering joint sheet 204 are positioned at signal pipe line 102 and then substrate 106 tops are flattened, therefore by covering joint sheet 204, grafting material and covering wall 104 are separated with signal pipe line 102 and allowed smooth composition surface.Due to joint sheet 204 planarizations, so this covering joint sheet 204 can be used for making up the out-of-flatness that may be present on the upper and substrate 106 in signal pipe line 102 surfaces.Those skilled in the art will recognize that, in order to keep suitable flat surfaces, the thickness of covering joint sheet 204 will equal the height of signal pipe line 102 at least, thereby make covering joint sheet 204 be positioned on the top of signal pipe line 102.In useful especially embodiment, signal pipe line 102 is less than about 600 nanometers, and wherein the covering joint sheet 204 of planarization is thicker than signal pipe line 102.
Therefore, in order to form the BioMEMS microelectromechanicdevices devices, the practitioner can provide substrate and be deposited at least one signal pipe line that arranges on substrate.Sacrifice layer 412 can be deposited on signal pipe line and be patterned alternatively with from the package footprint territory 422 outside remove the material of sacrifice layer 412.Knitting layer 434 can be deposited at least a portion of signal pipe line and on sacrifice layer 412 (if comprising).Can carry out planarization and patterning to form one or more covering joint sheets 204 and to limit package footprint territory 422 to knitting layer 434.Covering 202 can be bonded on covering joint sheet 204 to limit overlay area 108, and 108 outsides extend to 108 inside, overlay area from the overlay area thereby make signal pipe line.In addition, can provide test material such as fluid in overlay area 108.
In useful embodiment, especially in the embodiment with optical signal pipeline 102, the fluorogen that uses the joining technique that is different from the PDMS adhesive to avoid affecting signal detection in the Bio-optical fluidic system absorbs and the porous problem.In addition, when epoxy resin directly was coated to optical signal pipeline 102 as grafting material, the refractive index of epoxy resin may stray light signal pipe line 102.Using oxide on the optical signal pipeline may be favourable as knitting layer 434 and follow-up covering joint sheet 204, because oxide has the refractive index lower than signal pipe line usually, therefore, oxide is the lightray propagation of stray light pipeline 102 not, thereby has avoided to epoxy resin as the relevant problem of grafting material.
Although described the embodiment of the present invention and advantage thereof in detail, should be appreciated that, can in the situation that do not deviate from design and the scope of the embodiment that claims limit, carry out various changes, replacement and change.For example, many parts of above discussing and function can be implemented on various substrates and be used for encapsulating various closed systems, and especially those have the closed system that the optical signal pipeline is installed on the surface.As another example, those skilled in the art will be readily appreciated that, purposes and the pipeline material of the position of pipeline, the quantity of pipeline, pipeline can change, and still keep within the scope of the invention.
And the application's scope is not limited in the specific embodiment of technique, machine, manufacturing, material component, device, method and the step described in this specification.Should be readily appreciated that according to the present invention as those of ordinary skills, can utilize be used for carrying out of existing or the Future Development function substantially the same with corresponding embodiment described herein according to the present invention or obtain technique, machine, manufacturing, material component, device, method or the step of substantially the same result.Therefore, claims are expected at and comprise such technique, machine, manufacturing, material component, device, method or step in its scope.
Claims (10)
1. micro electro mechanical device comprises:
Substrate;
At least one signal pipe line is arranged on described substrate;
At least one covering joint sheet is arranged on described substrate and the top of the part of described signal pipe line; And
Covering is arranged to and forms the overlay area, and described covering is arranged on described at least one covering joint sheet, and wherein said at least one signal pipe line extends to inside, described overlay area from outside, described overlay area;
Wherein, described covering is configured to keep the controlled environment in described overlay area.
2. device according to claim 1, further comprise being arranged in described overlay area and being configured to and the interactional acceptor of the target molecule of predefined type.
3. device according to claim 1, wherein, described signal pipe line is the optical signal pipeline.
4. device according to claim 3, further be included in the photodetector that described substrate arranges, and wherein, described optical signal pipeline is configured to transport light to target molecule, and described photodetector is configured to detect the response from described target molecule.
5. device according to claim 1, wherein, described signal pipe line is signal of telecommunication pipeline.
6. device according to claim 1, wherein, described covering joint sheet is that refractive index is lower than the oxide of the refractive index of described signal pipe line.
7. device according to claim 1, wherein, a kind of during described covering engages by adhesive, anodic bonding or melting joins described covering joint sheet to.
8. device according to claim 1, wherein, described overlay area is filled with the fluid test material at least in part.
9. micro electro mechanical device comprises:
Substrate;
At least one signal pipe line is arranged on described substrate;
At least one covering joint sheet has smooth first surface and is arranged on described substrate and the top of the part of described signal pipe line;
Input structure is connected with described signal pipe line; And
Covering is arranged to and forms the overlay area, and described covering is arranged on the smooth first surface of described at least one covering joint sheet, and wherein said at least one signal pipe line extends to inside, described overlay area from outside, described overlay area.
10. method that is used to form microelectromechanicdevices devices comprises:
Substrate is provided;
Be formed at least one signal pipe line that arranges on described substrate;
Form the sacrifice layer that is consisted of by expendable material at least a portion of described at least one signal pipe line;
Deposit knitting layer at least a portion of described at least one signal pipe line;
The described knitting layer of patterning is to form one or more covering joint sheets and to limit the package footprint territory; And
Join covering to the covering joint sheet, it is inner that wherein said at least one signal pipe line extends to described package footprint territory from described package footprint overseas section.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261641657P | 2012-05-02 | 2012-05-02 | |
| US61/641,657 | 2012-05-02 | ||
| US13/652,999 | 2012-10-16 | ||
| US13/652,999 US8791557B2 (en) | 2012-05-02 | 2012-10-16 | Microelectromechanical device with integrated package |
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| Publication Number | Publication Date |
|---|---|
| CN103382016A true CN103382016A (en) | 2013-11-06 |
| CN103382016B CN103382016B (en) | 2015-11-04 |
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| CN201310138552.4A Active CN103382016B (en) | 2012-05-02 | 2013-04-19 | Adopt BioMEMS and the planar light circuit of integration packaging part |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040077117A1 (en) * | 2002-10-18 | 2004-04-22 | Xiaoyi Ding | Feedthrough design and method for a hermetically sealed microdevice |
| US20070181979A1 (en) * | 2006-02-03 | 2007-08-09 | Gottfried Beer | Microelectromechanical semiconductor component with cavity structure and method for producing the same |
| CN102081041A (en) * | 2009-11-27 | 2011-06-01 | 采钰科技股份有限公司 | Biosensor devices and method for fabricating the same |
| FR2961899A1 (en) * | 2010-06-29 | 2011-12-30 | Commissariat Energie Atomique | METHOD FOR FUNCTIONALIZING THE FLUIDIC VEINS CONTAINED IN A MICROMECHANICAL DEVICE, MICROMECHANICAL DEVICE, MICROMECHANICAL DEVICE COMPRISING FUNCTIONALIZED VEINS AND METHOD FOR PRODUCING THE SAME |
-
2013
- 2013-04-19 CN CN201310138552.4A patent/CN103382016B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040077117A1 (en) * | 2002-10-18 | 2004-04-22 | Xiaoyi Ding | Feedthrough design and method for a hermetically sealed microdevice |
| US20070181979A1 (en) * | 2006-02-03 | 2007-08-09 | Gottfried Beer | Microelectromechanical semiconductor component with cavity structure and method for producing the same |
| CN102081041A (en) * | 2009-11-27 | 2011-06-01 | 采钰科技股份有限公司 | Biosensor devices and method for fabricating the same |
| FR2961899A1 (en) * | 2010-06-29 | 2011-12-30 | Commissariat Energie Atomique | METHOD FOR FUNCTIONALIZING THE FLUIDIC VEINS CONTAINED IN A MICROMECHANICAL DEVICE, MICROMECHANICAL DEVICE, MICROMECHANICAL DEVICE COMPRISING FUNCTIONALIZED VEINS AND METHOD FOR PRODUCING THE SAME |
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| CN103382016B (en) | 2015-11-04 |
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