CN103403370B - Composite structure and manufacture method thereof - Google Patents
Composite structure and manufacture method thereof Download PDFInfo
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- CN103403370B CN103403370B CN201280009833.3A CN201280009833A CN103403370B CN 103403370 B CN103403370 B CN 103403370B CN 201280009833 A CN201280009833 A CN 201280009833A CN 103403370 B CN103403370 B CN 103403370B
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- electronic device
- metal base
- device housing
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- 239000002131 composite material Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 238000005530 etching Methods 0.000 claims description 40
- 239000007769 metal material Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000004033 plastic Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000012778 molding material Substances 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000004070 electrodeposition Methods 0.000 claims description 6
- -1 acryl Chemical group 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000000806 elastomer Substances 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000007373 indentation Methods 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000004873 anchoring Methods 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000003721 gunpowder Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B17/00—Connecting constructional elements or machine parts by a part of or on one member entering a hole in the other and involving plastic deformation
- F16B17/006—Connecting constructional elements or machine parts by a part of or on one member entering a hole in the other and involving plastic deformation of rods or tubes to sheets or plates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B37/00—Nuts or like thread-engaging members
- F16B37/04—Devices for fastening nuts to surfaces, e.g. sheets, plates
- F16B37/048—Non-releasable devices
Abstract
A kind of composite structure, comprises: bottom a metal base and at least one features, has the bond zone that at least one is formed with several undercut groove bottom described metal base.Described features to be formed on described bond zone and to comprise the projection of several described undercut groove of filling up respectively in described bond zone.
Description
The RELATED APPLICATION of related application
The application advocates to put forward the U.S. Provisional Patent Application the 61/430th of Shen, the preference of No. 555 cases on January 7th, 2011.
Technical field
Technology described herein relates to a kind of composite structure and manufacture method thereof, particularly relates to a kind ofly having bottom metal base and be formed on bottom metal base a model features and therebetween having the composite structure of mutual interlocking gear.
Background technique
Metal parts often needs the features for decorating or for assembling.In the molding process of solid metal, such as, in punching press or forging processing procedure, the formability of material is poor.Add the cost that the flank of different-thickness, teat or ornamental marking part are almost difficult to reach or needs are expensive.Although liquid-metal casting can be used to cast the metal parts with complicated shape, but the surface of the parts so formed and the quality of structure often because of containing hole, lack of fill or current mark, and can not be able to be accepted.Require high-quality light cleanliness for those and have for the product of high complicated shape, computer numerical controls (CNC) and has been used to undesired material on removal one block of metal.But the generation of tediously long mechanical machining cycles time and a large amount of waste material makes CNC ten points of costlinesses and affects environment.Although welding manner can be used to be bonded to by alloy components on preformed metal parts, the fringe cost of these assemblies, the cost of high power thermal source and burning trace, make welding manner not have competitiveness.Therefore, have and need to find a kind of method, can be formed on preformed metal parts and connect subreticulate features, and it has high cost-effectiveness ratio (costeffectively) and can not damage its outer surface.
Summary of the invention
Therefore, this technology, desirable to provide a kind of composite part and manufacture method thereof, can overcome at least one shortcoming in the described shortcoming mentioned in background technique.
According to an aspect of this technology, a kind of composite structure is provided, comprise: bottom a metal base and at least one features, there is bottom described metal base the bond zone that at least one is formed with several undercut groove, described features is formed on described bond zone, and comprises the projection of several described undercut groove of filling up respectively in bottom described metal base.
According to another aspect of this technology, a kind of method manufacturing composite structure is provided, comprises following steps: preparation has bottom a metal base of at least one bond zone; An etching mask layer is formed to hide described bond zone on bottom described metal base; Several perforation is formed, to expose the several etching areas in described bond zone to the open air in described etching mask layer; Etch the described etching area in described bond zone, to form several undercut groove in described bond zone; And on described bond zone, model one can molding material, to form the features being incorporated into described bond zone.Described features has several projection filling up described undercut groove respectively.
Accompanying drawing explanation
Accompanying drawing is for illustration of embodiments of the invention.
Fig. 1 is the three-dimensional exploded view of the preferred embodiment according to electronic device housing composite structure of the present invention;
Fig. 2 is the sectional drawing along the hatching line II-II in Fig. 1;
Fig. 3 A to 3E is schematic diagram, and the consecutive steps manufacturing the preferred embodiment of the method for electronic device housing composite structure according to the present invention is described;
Fig. 4 illustrates the second preferred embodiment according to mechanical parts composite structure of the present invention;
Fig. 5 is the sectional drawing along the hatching line V-V in Fig. 4.
Embodiment
Before describing this technology in further detail with reference to appended preferred embodiment, it is to be noted at this, reference numerals identical herein refers to similar components.
Fig. 1 and Fig. 2 shows electronic equipment 100, such as a mobile phone, and described electronic equipment 100 comprises the preferred embodiment according to electronic device housing composite structure 2 of the present invention.Described electronic equipment 100 comprises a protecgulum 3 and external module 41 further, and protecgulum 3 has a display screen 31 and protecgulum 3 engages with electronic device housing composite structure 2, and described external module 41 is such as circuit board and camera module.For the sake of simplicity, one of them in external module 41 is only described, that is, circuit board in the description of Fig. 1 and Fig. 2 and following paragraph.
Electronic device housing composite structure 2 is applicable to accommodating for external module 41 and be immobilizated in wherein, and electronic device housing composite structure 2 comprises: bottom a metal base 5 and four model features 6, bottom described metal base, 5 have a surface 51 made by the first metallic material, and several nonpenerative micro-undercut groove 512 from described surperficial 51 depressions; Described model features 6 is suitable for one of them external module 41 of fixing electronic equipment 100.Described model features 6 separately model in and be incorporated on bottom described metal base 5 described surperficial 51, and respectively comprising the anchoring projection 62 main body 61 with bottom surface 611 and several bottom surface 611 from described main body 61 protruded, described bottom surface 611 is incorporated into bottom described metal base 5 described surperficial 51.The main body 61 of each model features 6 is arranged outwardly relative to micro-undercut groove 512 on described surperficial 51, and described main body 61 is formed with the interlocking part 612 being applicable to be interlocked with one of them external module 41 described in electronic equipment 100 by a fastening piece 42.The described anchoring projection 62 of each model features 6 enters respectively and fills up the described micro-undercut groove 512 being arranged in described surperficial 51.
In this embodiment, each micro-undercut groove 512 has the shape substantially in spherical (bulb-shaped), and diameter is about 0.05-0.5mm.
This interlocking part 612 is formed in the form in a screw in this main body 61, and is applicable to be spirally connected described fastening piece 42 so that one of them external module 41 described in electronic equipment 100 is anchored on described model features 6.Or the structure of this main body 61 can be coordinate the mode of (pressfit) to engage with this external module 41 with convex-concave engaging (tongue-and-groove) or press-in, replaces screw connection manner.
Described first metallic material is preferably and is selected from aluminium, nickel, magnesium, titanium, copper, their alloy and stainless steel.
Described model features 6 is made by the second metallic material or plastic materials, and described plastic materials is selected from thermoplastic (thermoplastic), thermosetting resin (thermosettingresin), elastomer (elastomer) and plastic alloy (plasticalloy) (plastics add carbon/glass fibre (plasticpluscarbon/glassfiber)).Preferably, described plastic materials is selected from polycarbonate (PC) and polyacetylene.Described second metallic material can be identical or different with described first metallic material.
Fig. 3 A to Fig. 3 E, composition graphs 1 and Fig. 2, illustrate the preferred embodiment manufacturing the method for electronic device housing composite structure 2 according to the present invention.Described method comprises following steps: to prepare bottom a metal base 5, bottom described metal base, 5 made by metallic material, and has a surface 51 (see Fig. 3 A); Bottom described metal base, an etching mask layer 71 is formed on 5 to hide described surperficial 51 (see Fig. 3 A) by coating technique; Several perforation 710 is formed, to expose the several etching areas (see Fig. 3 B) in described surperficial 51 to the open air in described etching mask layer 71; Etch the described etching area in described surperficial 51, to form several micro-undercut groove 512 (see Fig. 3 C) described surperficial 51; Can bottom metal base, 5 remove described etching mask layer 71 (see Fig. 3 D) with accepting or rejecting; And on described surperficial 51, model one can molding material respectively, with formed several be incorporated into described surperficial 51 model features 6 (see Fig. 3 E).Described can molding material can be plastic materials or metallic material.
In this embodiment, the formation of described etching mask layer 71 can be implemented by electrocoating paint (electrodepositioncoating) technology.Or, the formation of this etching mask layer 71 also can by printing or micro-shadow technology use the mode of photoresistance to carry out or bottom metal base described in anodization 5 mode carry out.
Preferably, described etching mask layer 71 is made by resin, and described resin is selected from epoxy resin and acryl resin.For example, described electrodeposition step is undertaken by following action: by 5 immersion one electrodeposition bath (not shown)s bottom described metal base, described electrodeposition bath is containing 10-30wt% epoxy resin liquid or 3-20wt% acryl liquid, then, apply the VDC of 80-120V in described deposition bath continue about 6-120 second, to form the coating that thickness is about 5-40 μm on 5 bottom described metal base.The described coating formed is dried 10 minutes through first time with 85 DEG C again, to dry subsequently again and solidifies this coating in, thus form described etching mask layer 71 on 5 with 180 DEG C through second time bottom described metal base.
Preferably, the formation of the described perforation 710 of this etching mask layer 71 is implemented in laser beam drilling mode.
The etching that described etching area in described surperficial 51 carries out is implemented in isotropic wet etch mode, is formed to make each micro-undercut groove 512 and have substantially in spherical shape.Etching described surperficial 51 etching solutions used can be ferric chloride solution (ferricchloridesolution) or sodium hydroxide solution (NaOHsolution).When wanting etched metallic material to be aluminium, Baume (Baume) proportion of this ferric chloride solution is preferably 10 °-48 °, and when metallic material is stainless steel, the gravity Baume of this ferric chloride solution is preferably 30 °-48 °.
Described etching mask layer 71 can by will 5 to be immersed in an acid solution after (such as phosphoric acid, the smoke of gunpowder and sulfuric acid) etches bottom the metal base scribbling this etching mask layer 71, then 5 to remove bottom described metal base.
Preferably, can implement to imbed model (insertionmolding) mode by molding material on described surperficial 51 described in model, the model features 6 so formed has the structure that comprises main body 61, anchoring projection 62 and interlocking part 612.
Fig. 4 and Fig. 5 shows the second preferred embodiment according to mechanical parts composite structure 2 of the present invention.With previous embodiment unlike, in the second preferred embodiment, the main body 61 of described model features 6 is formed with a decorative indicia 65.The optional tagging of this decorative indicia 65, predetermined pattern, decorative pattern, poster and analog.
Composite structure 2 of the present invention comprises model features 6, and at least one shortcoming in the described shortcoming mentioned in background technique can be eliminated.
Although the present invention has combined think that the most practicable and preferred embodiment is described, but should be understood that, the present invention is not limited to disclosed embodiment, but wishes to cover the various configurations included by most broad interpretation, thus comprises all such amendments and equivalent.
Preferably all elements described herein, parts and step are all included in the present invention.But it is to be understood that as apparent for one of ordinary skill in the art, any one in these elements, parts and step completely can be replaced by other elements, parts and step or delete.
Substantially, following content is at least disclosed herein: a kind of composite structure, comprising: bottom a metal base with a surface and several nonpenerative undercut groove from described surface indentation; And at least one features.The described surface of described features model bottom described metal base is applicable to an external module to be immobilizated in wherein, and comprise a main body and several projection, described main body has the bottom surface that is incorporated into the described surface bottom described metal base, and described projection protrudes from the described bottom surface of described main body and enters respectively and fill up described undercut groove.
Concept
Also disclose at least following concept herein.
Concept 1. 1 kinds of composite structures, comprise:
Bottom a metal base, there is bottom described metal base a surface, and several nonpenerative undercut groove from described surface indentation; And
At least one features, the described surface of described features model bottom described metal base is applicable to an external module to be immobilizated in wherein, and comprise a main body and several projection, described main body has the bottom surface that is incorporated into the described surface bottom described metal base, and described projection protrudes from the described bottom surface of described main body and enters respectively and fill up the described undercut groove in bottom described metal base.
The composite structure of concept 2. according to concept 1, wherein said undercut groove respectively has substantially in spherical shape.
The composite structure of concept 3. according to concept 1, wherein said features is formed with an interlocking part being applicable to interlock with described external module.
The composite structure of concept 4. according to concept 3, wherein said interlocking part is the form in screw, and is applicable to be spirally connected a fastening piece so that described external module is anchored on described features.
The composite structure of concept 5. according to concept 1, wherein said features is formed with a mark.
The composite structure of concept 6. according to concept 5, wherein said mark is selected from mark, predetermined pattern and decorative pattern.
The composite structure of concept 7. according to concept 1, wherein said metallic material is selected from aluminium, nickel, magnesium, titanium, copper, their alloy and stainless steel.
The composite structure of concept 8. according to concept 1, wherein said features is made by the second metallic material or plastic materials, and described plastic materials is selected from thermoplastic, thermosetting resin, elastomer and plastic alloy.
Concept 9. 1 kinds manufactures the method for composite structure, comprises following steps: prepare, bottom a metal base, to have a surface bottom described metal base;
Described base part forms an etching mask layer to hide described surface;
Several perforation is formed, to expose the several etching areas in described surface to the open air in described etching mask layer;
Etch the described etching area in described surface, to form several undercut groove on described surface; And
Model one can molding material on said surface, and to form the features being incorporated into described surface, described features has several projection filling up described undercut groove respectively.The method of concept 10. according to concept 9 is wherein implement in Wet-type etching mode to the etching of the described etching area in described surface.
The method of concept 11. according to concept 9, wherein said each undercut groove has substantially in spherical shape.
The method of concept 12. according to concept 9, the formation of wherein said etching mask layer implements with electrocoating paint technical approach.
The method of concept 13. according to concept 9, wherein said etching mask layer is made by resin, and described resin is selected from epoxy resin and acryl resin.
The method of concept 14. according to concept 9, the formation of the described perforation in wherein said etching mask layer implements in laser beam drilling mode.
The method of concept 15. according to concept 9 can molding material be wherein imbed model mode to implement described in model on said surface.
The method of concept 16. according to concept 9, wherein said features is formed with an interlocking part being applicable to interlock with an external module.
The method of concept 17. according to concept 16, wherein said interlocking part is the form in screw, and is applicable to be spirally connected a fastening piece so that described external module is anchored on described features.
The method of concept 18. according to concept 9, wherein said features is formed with a mark.
The method of concept 19. according to concept 17, wherein said mark is selected from mark, predetermined pattern and decorative pattern.
Claims (27)
1. an electronic device housing, comprises:
Bottom a metal base, there is bottom described metal base a surface, and several nonpenerative undercut groove from described surface indentation; And
At least one features, the described surface of described features model bottom described metal base is applicable to an external module to be immobilizated in wherein, and comprise a main body and several projection, described main body has the bottom surface that is incorporated into the described surface bottom described metal base, and described projection protrudes from the described bottom surface of described main body and enters respectively and fill up the described undercut groove in bottom described metal base.
2. electronic device housing according to claim 1, wherein said undercut groove respectively has in spherical shape.
3. electronic device housing according to claim 1, wherein said features is formed with an interlocking part being applicable to interlock with described external module.
4. electronic device housing according to claim 3, wherein said interlocking part is the form in screw, and is applicable to be spirally connected a fastening piece so that described external module is anchored on described features.
5. electronic device housing according to claim 1, wherein said features is formed with a mark.
6. electronic device housing according to claim 5, is wherein saidly labeled as mark.
7. electronic device housing according to claim 5, is wherein saidly labeled as predetermined pattern.
8. electronic device housing according to claim 5, is wherein saidly labeled as decorative pattern.
9. electronic device housing according to claim 1, the metallic material bottom wherein said metal base is selected from aluminium, nickel, magnesium, titanium, copper, their alloy and stainless steel.
10. electronic device housing according to claim 1, wherein said features is made by the second metallic material or plastic materials.
11. electronic device housings according to claim 1, wherein said features is made by thermoplastic.
12. electronic device housings according to claim 1, wherein said features is made by thermosetting resin.
13. electronic device housings according to claim 1, wherein said features is made by elastomer.
14. electronic device housings according to claim 1, wherein said features is made by plastic alloy.
15. 1 kinds of methods manufacturing composite structure, comprise following steps: prepare, bottom a metal base, to have a surface bottom described metal base;
Described base part forms an etching mask layer to hide described surface;
Several perforation is formed, to expose the several etching areas in described surface to the open air in described etching mask layer;
Etch the described etching area in described surface, to form several undercut groove on described surface; And
Model one can molding material on said surface, and to form the features being incorporated into described surface, described features has several projection filling up described undercut groove respectively.
16. methods according to claim 15 are wherein implement in Wet-type etching mode to the etching of the described etching area in described surface.
17. methods according to claim 15, wherein said each undercut groove has in spherical shape.
18. methods according to claim 15, the formation of wherein said etching mask layer implements with electrocoating paint technical approach.
19. methods according to claim 15, wherein said etching mask layer is made by resin, and described resin is selected from epoxy resin and acryl resin.
20. methods according to claim 15, the formation of the described perforation in wherein said etching mask layer implements in laser beam drilling mode.
21. methods according to claim 15 can molding material be wherein imbed model mode to implement described in model on said surface.
22. methods according to claim 15, wherein said features is formed with an interlocking part being applicable to interlock with an external module.
23. methods according to claim 22, wherein said interlocking part is the form in screw, and is applicable to be spirally connected a fastening piece so that described external module is anchored on described features.
24. methods according to claim 15, wherein said features is formed with a mark.
25. methods according to claim 24, are wherein saidly labeled as mark.
26. methods according to claim 24, are wherein saidly labeled as predetermined pattern.
27. methods according to claim 24, are wherein saidly labeled as decorative pattern.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161430555P | 2011-01-07 | 2011-01-07 | |
| US61/430,555 | 2011-01-07 | ||
| PCT/US2012/020552 WO2012094640A1 (en) | 2011-01-07 | 2012-01-06 | Composite structure and method for making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103403370A CN103403370A (en) | 2013-11-20 |
| CN103403370B true CN103403370B (en) | 2015-11-25 |
Family
ID=46457732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280009833.3A Expired - Fee Related CN103403370B (en) | 2011-01-07 | 2012-01-06 | Composite structure and manufacture method thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN103403370B (en) |
| TW (1) | TWI512816B (en) |
| WO (1) | WO2012094640A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112013005176T5 (en) | 2012-10-29 | 2015-07-16 | Innotec, Corp. | Illuminated trim assembly and punched component for it |
| US10016921B2 (en) | 2015-05-01 | 2018-07-10 | Apple Inc. | Apparatus and method of forming a compound structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4004774A (en) * | 1975-01-08 | 1977-01-25 | Du Pont Of Canada Limited | Coated panel |
| US6913666B1 (en) * | 1997-03-21 | 2005-07-05 | Woodwelding Ag | Process for anchoring connecting elements in a material with pores or cavities and connecting elements therefor |
| CN201149674Y (en) * | 2007-12-24 | 2008-11-12 | 全康精密工业股份有限公司 | Adapting card fixed device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006343182A (en) * | 2005-06-08 | 2006-12-21 | Renesas Technology Corp | Manufacturing method of semiconductor integrated circuit device |
| TW201031515A (en) * | 2009-02-20 | 2010-09-01 | Taiwan Green Point Entpr Co | A method of selective plastic insert molding on metal component |
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2012
- 2012-01-04 TW TW101100313A patent/TWI512816B/en not_active IP Right Cessation
- 2012-01-06 CN CN201280009833.3A patent/CN103403370B/en not_active Expired - Fee Related
- 2012-01-06 WO PCT/US2012/020552 patent/WO2012094640A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4004774A (en) * | 1975-01-08 | 1977-01-25 | Du Pont Of Canada Limited | Coated panel |
| US6913666B1 (en) * | 1997-03-21 | 2005-07-05 | Woodwelding Ag | Process for anchoring connecting elements in a material with pores or cavities and connecting elements therefor |
| CN201149674Y (en) * | 2007-12-24 | 2008-11-12 | 全康精密工业股份有限公司 | Adapting card fixed device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012094640A1 (en) | 2012-07-12 |
| TW201303993A (en) | 2013-01-16 |
| CN103403370A (en) | 2013-11-20 |
| TWI512816B (en) | 2015-12-11 |
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