CN103456725A - Emitter package and light emitting device displayer - Google Patents

Emitter package and light emitting device displayer Download PDF

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Publication number
CN103456725A
CN103456725A CN2012101779767A CN201210177976A CN103456725A CN 103456725 A CN103456725 A CN 103456725A CN 2012101779767 A CN2012101779767 A CN 2012101779767A CN 201210177976 A CN201210177976 A CN 201210177976A CN 103456725 A CN103456725 A CN 103456725A
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CN
China
Prior art keywords
lead frame
emitter package
shell
package according
feature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101779767A
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Chinese (zh)
Inventor
陈志强
彭泽厚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cree Huizhou Solid State Lighting Co Ltd
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Cree Huizhou Solid State Lighting Co Ltd
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Priority to CN2012101779767A priority Critical patent/CN103456725A/en
Publication of CN103456725A publication Critical patent/CN103456725A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Abstract

The invention relates to an emitter package and a light emitting device displayer, in particular to an LED package and an LED displayer with the thin/low fracture surface LED package which has the improved structural integrity, the improved emission characteristics and the improved customizable properties. In some embodiments, the improved structural integrity is provided through various characteristics beneficial to cooperation with an outer shell and further beneficial to the relatively strong packaging in a lead frame. Particularly, the emitter package comprises the outer shell, the conductive lead frame, and at least one light emitting device, wherein the conductive lead frame is integrated with the outer shell, the lead frame has the characteristics beneficial to cooperation with the outer shell so as to increase adhesion of the lead frame and the outer shell, the light emitting device is arranged on a conductive portion of the lead frame, and the characteristics are embodied on the surface, opposite to the surface provided with the at least one light emitting device, of the lead frame.

Description

Emitter package and light emitting device display
Technical field
Present invention relates in general to Electronic Packaging, more specifically, relate to the thin surface mounted package of the increase bonding had between package parts.
Background technology
The solid state device that light-emitting diode (LED) is is light by electric energy conversion, and generally include the active layer that is clipped in the one or more semi-conducting materials between contrary doped layer.When crossing over doped layer and apply bias voltage, hole and electronic injection are compound and produce in the active layer of light to them.Light penetrates from active layer and LED all surface.
In recent years, the LED technology has been improved significantly, as has the brightness of enhancing and color fidelity, the less LED taken up room, and has proposed the emission effciency of whole raising.LED also has that (photophore emitter) is compared the working life of prolongation with other emitter.For example, when the working life of incandescent lamp approaches 2,000 hours, the working life of LED can be over 50,000 hours.In the situation that consume less power, LED also may be more firm than other light source.For some reason or other, it is more universal that LED is becoming, and the increasing application of the present traditional field for incandescent lamp, fluorescent lamp, Halogen lamp LED and other emitter.
Due to these improved LED and improved image processing techniques, LED can be as the light source of multiple display type at least in part.In order in these application types, to use LED chip, well-known, one or more LED chips of packing in encapsulation to be so that protection environment and/or machinery to be provided, the selection of color, and the focusing of light, etc.The LED encapsulation also comprises in order to the LED packaged battery is connected to electrical lead wire, contact or the trace of external circuit.The LED encapsulation is arranged on printed circuit board (PCB) (PCB) usually.
Different LED encapsulation not only can be as large-scale but also can be as the light source of miniscope.When the display based on than the small screen LED, as television set, game machine and computer monitor, in a lot of indoor place ，Ru families and company, when becoming more and more universal, the display based on big screen LED becomes more and more universal in a lot of indoor and outdoors place.These LED-based displays can comprise thousands of " pixels " or " picture element module ", its each can comprise a plurality of LED.Picture element module can be used the LED of high efficiency and high brightness, and it allows display from various distances and in the situation that various surround lighting is all visible.Picture element module can have the minority LED as three or four, and it allows the light of pixel emission from a lot of different colours in red, green-blue light combination, and/or sometimes comprises gold-tinted.
The most traditional LED-based display can be by computer system control, it accepts input signal (as TV signal), and the particular color based on the picture element module place needs forms overall demonstration image, computer system is determined which (which) LED utilizing emitted light in each picture element module and how is brightly sent out.Also can comprise the power-supply system that power is provided to each picture element module; The power provided to each LED can be modulated, so it launches the light of desirable brightness.Provide conductor to apply suitable power signal to each LED in picture element module.
When watching, the beholder is not usually directly in LED-based display front.At indoor and outdoors, across off-axis angle in a big way in display all can watch, for example, up to 145 ° or even larger.Depend on the position at beholder place, level and/or vertical angle of view may be different.And, when the people moves along light-emitting diode display, can on a lot of different angles, watch.There is the decline that may experience the emissive porwer at different angles place at the typical light-emitting diode display of the peak emission that approaches center.The far-field pattern (far field pattern, FFP) that is used for the different LED encapsulation of each picture element module can be also different, so that, when watching from different perspectives, light-emitting diode display may experience the variation of picture quality.
No matter indoor or, in outdoor application, thin flat-panel monitor becomes more and more universal.When the flat-panel monitor popularization increases, LED encapsulation is merged in the become display of thinner/lower section (profile) of this needs.The encapsulation of wishing this thin/low section can be solid so that their manufacture and use procedure in keep their structural intergrity, still the integrality of this encapsulation may suffer damage.For example, prior art current thin/encapsulation of low section in, during reflux technique, encapsulating structure may be out of shape.And, manufacture and use procedure in, current thin/encapsulation of hanging down section suffers separating between package casing and lead-in wire/lead frame possibly.
In addition, when section that emitter package becomes more and more less He more and more lower, be starved of for the available amount of space of radiated element (as LED) on the current-carrying part of encapsulation.Less encapsulation also may have their sizes corresponding with the mounting portion of traditional PCB or other suitable mechanical/electrical supporter of obstruction.
As shown in Figure 19 a to Figure 19 b, can cause that with the bad bonding between current-carrying part 1902 current-carrying part 1902 separates with shell 1900 between the shell 1900 that encapsulates 1906, form gap 1904 and cause wire bump or towering-up 1908.Described gap can form due to bad bonding and the different heat expansion during manufacturing thermal cycle with separating.Described gap or wire bump can reduce the reliability of final products and between lead frame and be arranged at the connection reliability between the emitter on lead frame.Expectation bonds to prevent described gap or protuberance by improvement.
Summary of the invention
The invention provides emitter package and light-emitting diode display, it provides improved color emission uniformity at different viewing angles place, wherein emitter package be thin/low section with for more smooth application.The present invention also provides has the emitter package of improving structural intergrity, and wherein encapsulation has LED chip for desired number is installed and the appropriate surfaces area of corresponding parts.In addition, the invention provides customizable emitter package, this encapsulation can allow to be attached to standardization mechanical support/electric strutting piece.
One aspect of the present invention comprises emitter package, and this emitter package comprises shell.This encapsulation further comprises the conductive lead wire frame, and conductive lead wire frame and described shell are integrated, and wherein lead frame comprises the feature that cooperates to increase the bonding between lead frame and shell with shell.In addition, encapsulation comprises at least one light-emitting device on the conductive part that is arranged in lead frame.In addition, described feature is positioned on relative surface, the surface with being furnished with light-emitting device of lead frame.
According on the other hand, emitter package is provided, this emitter package comprises shell.This encapsulation further comprises the conductive lead wire frame, and conductive lead wire frame and shell are integrated, and wherein the feature of the increase bonding that cooperates with shell to provide between lead frame and shell is provided lead frame.At least one light-emitting device is arranged on a plurality of parts of lead frame.In addition, described feature comprises the edge locked feature, and the edge locked feature is positioned on the part at the edge that the part with being furnished with light-emitting device of lead frame is adjacent, makes the auxiliary lead frame of stablizing of edge locked feature.
According to another aspect of the invention, provide low section emitter package, encapsulation comprises shell.Encapsulation comprises the conductive lead wire frame, and conductive lead wire frame and shell are integrated, and wherein lead frame comprises the feature that cooperates to increase the bonding between lead frame and shell with shell.At least one LED is arranged on lead frame.In addition, the height of encapsulation is for being less than 2.0mm; And the injection moulding mouth of encapsulation has the degree of depth that is less than 0.2mm and the diameter that is less than 0.5mm.
According to another aspect of the invention, light emitting device display is provided, display comprises the substrate of carrying emitter package array.Each in emitter package comprises shell.Emitter package further comprises the conductive lead wire frame, and conductive lead wire frame and shell are integrated, and wherein the feature of the increase bonding that cooperates with shell to provide between lead frame and shell is provided lead frame.Emitter package further comprises that the mode with linear alignment is arranged at least one LED on described lead frame.The height of each encapsulation is for being less than 2.0mm, and described feature is positioned at least a portion on relative surface, the surface with being furnished with LED of lead frame.Display further comprises the electrical connection drive circuit, for selectivity, gives described array energising to produce vision imaging on display.
The accompanying drawing explanation
To those skilled in the art, from following detailed description and accompanying drawing, these or other further Characteristics and advantages of the present invention will become obviously, wherein:
Fig. 1 is the stereogram according to emitter package of the present invention;
Fig. 2 is the vertical view of the embodiment shown in Fig. 1;
Fig. 3 is the sectional view of embodiment in the Fig. 1 looked over along the 3-3 line in Fig. 2;
Fig. 4 is the bottom view of the embodiment shown in Fig. 1;
Fig. 5 is the end-view of the embodiment shown in Fig. 1, and opposite end is similar basically;
Fig. 6 is the end view of the embodiment shown in Fig. 1, and opposite side is similar basically;
Fig. 7 is the top view that can be used on the lead frame in the device in Fig. 1 according to an embodiment;
Fig. 7 a is the sectional view of Fig. 7 embodiment of looking over along the 7a-7a line in Fig. 7;
Fig. 8 is the end view of the lead frame shown in Fig. 7;
Fig. 9 is the top dimension figure of the embodiment shown in Fig. 1;
Figure 10 is the lateral dimension figure of the embodiment shown in Fig. 1;
Figure 11 is the stereogram according to another embodiment of emitter package of the present invention;
Figure 12 is the vertical view of the embodiment shown in Figure 11;
Figure 13 is the bottom view of the embodiment shown in Figure 11;
Figure 14 is the end-view of the embodiment shown in Figure 11, and opposite end is similar basically;
Figure 15 is the end view of the embodiment shown in Figure 11, and opposite side is similar basically;
Figure 16 is the top view that can be used on the lead frame in the device in Figure 11 according to an embodiment;
The sectional view of Figure 16 embodiment that Figure 16 a looks over along the 16a-16a line in Figure 16;
Figure 17 is the top dimension figure of the embodiment shown in Figure 11;
Figure 18 is the lateral dimension figure of the embodiment shown in Figure 11;
The viewgraph of cross-section that Figure 19 a is emitter package;
The closed cross-section view of the lead frame that Figure 19 b is Figure 19 a and shell;
Figure 20 a is the stereogram according to emitter package of the present invention;
Figure 20 b is the bottom perspective view according to emitter package of the present invention;
Figure 20 c is the bottom perspective view according to the lead frame of emitter package of the present invention;
Figure 20 d is the viewgraph of cross-section according to emitter package of the present invention;
Figure 20 e to Figure 20 i is the top view that the bonding on lead-in wire according to the present invention is improved the Multi-instance of feature;
Figure 21 a is the bottom perspective view according to emitter package of the present invention;
Figure 21 b is the bottom perspective view according to the lead frame of emitter package of the present invention;
Figure 21 c is the viewgraph of cross-section according to emitter package of the present invention;
Figure 21 d is the bottom perspective view according to another emitter package of the present invention;
Figure 21 e is the bottom perspective view according to the lead frame of emitter package of the present invention;
Figure 21 f is the viewgraph of cross-section according to emitter package of the present invention;
Figure 21 g be according to another emitter package of the present invention bottom perspective view;
Figure 21 h is the bottom perspective view according to the lead frame of emitter package of the present invention;
Figure 21 i is the viewgraph of cross-section according to emitter package of the present invention;
Figure 22 a to Figure 22 k is the cross-sectional side view that has a part of lead frame of multiple edge locked feature according to the present invention.
Embodiment
Here describe the present invention with reference to some embodiment, but be appreciated that the present invention can realize and should not be construed as the embodiment that is confined to describe in detail here with different forms.
According in some embodiments of the present invention, be provided for the structure of the multi-emitting encapsulation of thin/low section, it allows to be encapsulated in and locates with great visual angle the light that emission has the color uniformity of improvement by the encapsulation internal linear, arranging emitter and minimize the encapsulation cavity depth.Some embodiments of the present invention provide the emitter package of thin/low section in addition, partly because making package casing and lead frame, the feature in package leadframe can mutually adhere to securely, provide so strong connection between them, so these emitter package are in the integrality of manufacturing and can keep between the operating period structure.Such feature can comprise the veining section of patterning section, the lead frame of the metal gap that changes size between the lead frame adjacent part, the otch in lead frame, the through hole in lead frame, the recess in lead frame, bending lead, lead frame, from projection of lead frame etc.
In other embodiments, when the cavity top is conventional shape (as circle) when maximizing light emission and visual angle, shape that can the custom encapsulation cavity is so that the peculiar shape of the diode that provides larger useable surface area to engage desired quantity is provided cavity bottom.This special cavity makes allowances in encapsulation, comprising more diode, otherwise for the diode of the desired quantity of carrying its too little (and therefore thering is too little surface area).According to other embodiments of the invention, the shell of encapsulation can comprise stepped variation, it is upper that described stepped variation makes the bottom of encapsulation be arranged on habitual electronic/mechanical supporter (as the PCB of standard), and the size on the top encapsulated for less application may descend.
The present invention is suitable for dissimilar emitter package, as can be used on a lot of different illumination application, as the surface mounted device in LED color/graphics or decorative lighting (SMD).Below can describe and use the different embodiments of light-emitting diode as the emitter package of their emitter, but be appreciated that other emitter package embodiment can be used dissimilar emitter.
Will be understood that when mentioning an element " on another element ", " being connected to another element ", " being coupled to another element " or " contacting with another element ", it can be directly on this another element, be connected to this another element or be coupled to this another element, or contact with this another element, maybe can there is insertion element.By contrast, when mentioning an element " directly on other element ", " being connected directly to other element ", " directly being coupled to other element " or " directly contacting with other element ", there do not is insertion element.Similarly, when mentioning the first element " electrical contact the second element " or " being electrically coupled to the second element ", there is the electrical path that allows mobile electric current between the first element and the second element here.Electrical path can comprise capacitor, couples inductor and/or even there is no other element that directly contacts and allow the current flowing between conducting element.
Although first, second grade of term can be for describing various elements, parts, zone and/or part here, these terms will not limit these elements, parts, zone and/or part.These terms are only for distinguishing an element, parts, zone or part and another element, parts, zone or part.Therefore, the first element be discussed below, parts, zone or part can be called the second element, parts, zone or part and not depart from instruction of the present invention.
Here describe embodiments of the invention with reference to sectional view, wherein sectional view shows the illustrative diagram of embodiments of the invention.According to this, the actual (real) thickness of parts can be different, and, due to for example manufacturing technology and/or tolerance limit, can expect and change illustrated shape.Embodiments of the invention will be not interpreted as the given shape that is confined to the shown here zone, but because the reason of for example manufacturing comprises departing from shape.Typically, due to the manufacture tolerance limit of standard, diagram or square or the rectangular area described will have circle or arc feature.Therefore the zone shown in figure is actually schematically, and their shape is not intended to illustrate the accurate shape in the zone of device, and also is not intended to limit the scope of the invention.
Fig. 1-10 show the embodiment according to the multiple beam encapsulation 10 of thin/low section of the present invention, and it comprises SMD.According to above mentioned, be appreciated that the present invention can be for the emitter package of other type except SMD.This encapsulation 10 comprises shell 12, its carrying integrated-lead frame 14.This lead frame 14 comprises for by electrical signal conduction, a plurality of conductive connection parts to the light emitter of encapsulation divide.This lead frame can also assist to be dissipated in the heat produced by emitter in application, and the emitter encapsulated in described application can produce a large amount of heat.
This lead frame 14 can be arranged in multiple different mode, and can use the parts of varying number in different encapsulation embodiment.Below with three emitters, describe this encapsulation 10, and in the illustrated embodiment, lead frame is arranged such that each emitter is driven by the corresponding signal of telecommunication.Therefore six conductive components are arranged in the illustrated embodiment, each emitter comprises conductive component pair, and the signal of telecommunication by its conductive component to being applied on each emitter.For encapsulation 10, conductive component comprises first, second, and third anode component 16,18,20, and first, second, and third cathode assembly 22,24, best being shown in Fig. 7 of 26(), each has the attached pad of emitter.But, be appreciated that some embodiment can comprise and be less than three LED, be less than six LED and other can comprise more than three LED more arranged can comprising of other simultaneously.In these various embodiment, each LED can have their own corresponding conductive components pair, or can share conductive component with other LED.LED chip is fewer, and the cost of encapsulation and complexity usually may be lower.
Shell 12 can have a lot of different shape and size, and, in this embodiment illustrated, normally square or rectangle, have upper surface 28 and lower surface 30, side surface 32 and 34 and end surfaces 36 and 38.The top of shell further comprises recessed or cavity 40, and it extends into the main body of shell 12 to lead frame 14 from upper surface 28.Emitter be disposed on lead frame so that from emitter light out from encapsulating 10 emissions through cavity 40.In certain embodiments, can at least along the side of cavity 40 or the part of wall 44, place and the fixation reflex parts, shown in reflection insert or ring 42(Fig. 3).
By making cavity 40 and wherein inwardly tapered towards the ring 42 of enclosure carried, can strengthen the effect of reflectivity of this ring 42 and the angle of departure of encapsulation.As an example but be not restriction, and best being shown in Figure 10, approximately the cavity angles 46 of 50.0 degree can provide suitable and visual angle hope, if comprise the reflector parts the reflectivity of hope also can be provided.At another in possible embodiment, approximately the cavity angles of 90.0 degree can provide suitable and visual angle hope.Still have some may embodiment, be less than 50.0 degree, be greater than 50.0 degree, between the 50.0-90.0 degree and/or the cavity angle that is greater than 90.0 degree suitable and visual angle hope can be provided.
In addition, can customize the degree of depth of cavity 40 to increase the visual angle of encapsulation.As an example but be not restriction, in the encapsulation of thin/low section of this embodiment, the degree of depth be 0.45mm+/-the loculus body 40(of 0.05mm as shown in Figure 10) visual angle hope, that increase can be provided.At another, in possible embodiment, the cavity depth that is less than 0.45mm can provide the visual angle of hope.Still have some may embodiment, be greater than 0.45mm but the cavity depth that is less than the total height of emitter package can provide the visual angle of hope.
In certain embodiments, the base section 41 of cavity 40 that is close to the expose portion of lead frame 14 can comprise the shape different from the top section 43 of cavity 40.Best, in this embodiment shown in Fig. 1 and 2, the base section 41 of cavity 40 is limited by the shape that comprises four arcs, and this shape is similar to the square with curvilinear.This top section 43 is limited by circle.Be appreciated that according to the present invention bottom and top section 41,43 can comprise the suitable shape of any kind.With keep from top to bottom round-shaped traditional cavity and compare, the difformity of base section 41 makes allowances for the more lead frame 14 exposed by cavity 40, and this has increased the useable surface area (being discussed below more details) that the lead frame 14 of all kinds LED or other diode can be installed thereon.The useable surface area that increases the lead frame 14 exposed in cavity 40 may be essential, especially in little emitter package, in the situation that lack suitable shape for base section 41, it may not assemble installation diode or other device component of desired number.
In certain embodiments, cavity 40 can be filled by packing material/sealant 48 at least in part, and it can be protected and this lead frame 14 of strong fix reaches the emitter of carrying thus.In some instances, the part lead frame 14 that packing material/sealant 48 can cover emitter and expose by cavity 40.In order to strengthen the projection from the light of LED, can Selective filling material/sealant 48 for thering is predetermined optical characteristics, and packing material/sealant 48 is transparent for the light of the emission of the emitter by encapsulation substantially in certain embodiments.This packing material/sealant 48 can be flat along its upper surface substantially, or also shape can be arranged, and as hemisphere or bullet shaped, or can be recessed in wholly or in part in cavity 40.This packing material/sealant 48 can being combined to form by silicones, resin, epoxy resin, thermoplastic condensed polymer, glass and/or other suitable material or material.In certain embodiments, can in packing material/sealant 48, add material entered and/or came from the light of LED emission, absorption and/or scattering with enhancing.
This shell 12 can be by the electrical insulating material manufacture; It can be also thermal conducting.This material is well-known in the art, and can include but not limited to thermoplastic condensed polymer's (for example polyphthalamide (polyphthalamide, PPA)), some pottery, resin, epoxy resin and glass.This shell 12 can also make to improve the aborning contrast of SMD package image, the SMD used in video display as had by dark color or black material.
This encapsulation 10 and shell 12 thereof can be by forming and/or assemble as any one of various known methods in this area.For example, can around anode component 16,18,20 and cathode assembly 22,24,26 for example forms by injection moulding or this shell 12 of molding.Can have the hole 47 shown in Fig. 4 in the encapsulation formed by known injection molding technology, it has represented the inlet point of injection molding sheathing material on described lead frame 14.Replacedly, shell can be formed in a plurality of, for example top and bottom, and anode component 16,18,20 and cathode assembly 22,24,26 are formed on bottom.This top and bottom can be used known method and material to be bonded together afterwards, as passed through epoxy resin, adhesive or other suitable bond material.
In described illustrative embodiment, encapsulate 10 use first, second, and third LED 50,52,54, its each light that can launch same color with comparing of other or the light of different colours.In this embodiment illustrated, LED50,52,54 launches respectively blue, red and green, and therefore when suitably being powered up, by combination LED, producing is FR color substantially.Further, when suitably being powered up, LED50,52,54 can launch the white light combination of different-colour.Be appreciated that according to the present invention and can use in encapsulation greater or less than 3 LED, and these LED launch the color of any hope.
This encapsulation 10 can also comprise that protection is not subject to the element of Electrostatic Discharge infringement.Can use different elements, as various vertical Zener diode (not shown), be arranged in parallel and to compare the different LED(be reverse biased not shown from LED chip 50,52,54), rheostat (not shown) and horizontal Si diode (not shown) are installed in surface.In the embodiment that uses Zener diode, can use known mounting technique to attach it to the attached pad of separation.Diode can relatively littlely make it not cover the lip-deep too much area of the lead frame 14 exposed by cavity 40.When using many group LED coupled in series, for the group of each series connection, only need an ESD element.
LED structure, feature and manufacture thereof and operation are normally known in the art, and brief discussion only here.LED can have a lot of different semiconductor layers of arranging by different way and can launch different colours.Can manufacture by processes well known the layer of LED, and a kind of suitable manufacturing process is to use Organometallic Chemistry gas deposition (MOCVD).The floor of LED chip generally includes the active layer/district be clipped between the first and second contrary doped epitaxial layers, and its all these be to be formed on continuously on growth substrates or wafer.Being formed on LED chip on wafer can be by singulation and for different application, as is arranged in encapsulation.Be appreciated that growth substrates/wafer can be used as final singulation LED a part and retain or growth substrates can be removed whole or in part.
Be further appreciated that and can also comprise other layer and element in LED, include but not limited to resilient coating, nucleating layer, contact layer and current extending, and light-extraction layer and element.Active area can comprise single quantum well (SQW), Multiple Quantum Well (MQW), double heterojunction or superlattice structure.
Active area and doped layer can be manufactured by the different materials system, and a this system is III nitride base material system.The III group-III nitride refers to the semiconducting compound formed between the element (normally aluminium (Al), gallium (Ga) and indium (In)) in those families of III at nitrogen and periodic table.This term also relates to ternary and quaternary compound, as aluminum gallium nitride (AlGaN) and aluminium indium gallium nitrogen (AlInGaN).In a possible embodiment, doped layer is that gallium nitride (GaN) and active layer are InGaN.In alternative embodiment, doped layer can be AlGaN, gallium aluminium arsenic (AlGaAs) or Al-Ga-In-As phosphorus (AlGaInAsP) or aluminium indium gallium phosphorus (AlInGaP) or zinc oxide (ZnO).
Growth substrates/wafer can be made by a lot of materials, as silicon, glass, sapphire, carborundum, aluminium nitride (AlN), gallium nitride (GaN), suitable substrate is 4H polytype carborundum, yet also can use other carborundum polytype that comprises 3C, 6H and 15R polytype.Carborundum has some advantage, as compared Lattice Matching with sapphire, more approaches the III group-III nitride, therefore causes producing having higher-quality III nitride films.Carborundum also has very high thermal conductivity so that the gross output of the III nitride devices on carborundum can not limited by the heat radiation of substrate (situation that is formed on some devices on sapphire may be like this).The SiC substrate can obtain from the Cree Research, Inc of North Carolina Du Lun, and about the method for making them in scientific literature and United States Patent (USP) No.Re.34, be stated in 861, No.4,946,547 and No.5,200,022.
LED can also comprise supplementary features, as the current-dispersing structure of conduction, and current extending and closing line pad, all these can be made by the well known materials of using the known method deposition.LED that can be some or all of by one or more phosphor-coating, phosphor absorbs at least some LED light and launches the light of different wave length, so that the LED emission is from the combination of the light of LED and phosphor.Can use a lot of distinct methods for the LED chip associated with phosphor coating, in sequence number, be No.11/656,759 and No.11/899, a kind of suitable method has been described in 790 U.S. Patent application, the denomination of invention of these two patent applications is all " Wafer Level Phosphor Coating Method and Devices Fabricated Utilizing Method ", and the two is merged in herein by reference.Replacedly, can use other method to apply LED, as electrophoretic deposition (EPD), in denomination of invention, be the U.S. Patent application No.11/473 of " Close Loop Electrophoretic Deposition of Semiconductor Devices ", described a kind of suitable EPD method in 089, it also is incorporated to herein by reference.
In addition, as known in the art, LED can have vertical or horizontal geometry.Those that comprise vertical geometry can have the first contact and have second contact on P type layer on substrate.The propagation of electrical signals that is applied to the first contact enters the N-shaped layer, and the signal that is applied to the second contact spreads into the p-type layer.In the situation that the III nitride devices is well known that thin translucent typically cover part or whole p-type layer.Be appreciated that the second contact can comprise such layer, it typically is metal, as platinum (Pt), or transparent conductive oxide, as indium tin oxide (ITO).
LED can also comprise lateral geometry, and wherein two contacts are all at the top of LED.As removed the part of p-type layer and active area by etching, to expose the contact table top on the N-shaped layer.The second horizontal N-shaped contact is provided on the table top of N-shaped layer.These contacts can comprise the well known materials of using known techniques of deposition.
In the illustrative embodiment illustrated, the anode of lead frame and cathode assembly 16,18,20,22,24,26 be the outstanding apparent surface 36 and 38 through shell 12 outwards.Anode component 16,18,20 is 36 extensions from surface, and cathode assembly 22,24,26 38 extensions from surface.When in order to operate, during surface mounted package 10, arranging that anode and cathode assembly are to operate in couples electrical signal conduction to they light emitters separately.In the illustrated embodiment, anode and cathode assembly 16,18,20,22,24,26 vertical curve are to extend to housing exterior and to extend along their shell end surface 36 and 38 downwards, and then vertical curve to be to form end 82,84,86,88,90,92, its lower surface along shell 12 30 extends.The lead-in wire end 82,84,86,88,90,92 substantially with the bottom of shell 12, flush to facilitate the mechanical/electrical supporting construction 94 below being connected to towards outer surface, as PCB.
As preferably be shown in Fig. 3, can use any one in a plurality of known interconnection technique that comprises welding, by the end of lead-in wire 82,84,86,88,90,92(end the 86, the 88th only, visible) be electrically connected to or join to trace or pad on supporting construction 94.Be appreciated that in other embodiments, can all of end 82,84,86,88,90,92 or some are crooked in the opposite direction, still for surface, install and make allowances simultaneously.
Cathode assembly 22,24,26 comprises center surface or mounting mat 68,70,72, the LED chip 50,52,54 that is linear array for carrying, it extends along the direction 74 perpendicular to side surface 32 and 34, and LED50,52,54 aligns along the central shaft of shell 12 usually.Compare the encapsulation that has otherwise the LED that arranges (as arranged in a cluster), this color uniformity improved at different places, horizontal view angle that is arranged as makes allowances.Be appreciated that the linear array extended along the direction perpendicular to side surface 36,38 makes allowances for the color uniformity improved at different places, vertical angle of view.In other embodiments, if need, attach pad can be out-of-alignment, to allow non-linear mounting.
Mounting mat 68 and 78 can extend to shell 12 center, and it is that LED50,54 installs to such an extent that more approach shell 12 center so that they can penetrate cavity 40 makes allowances.Anode component 16,18,20 comprises respectively electrical connection pad 76,78,80, and its position is close to but separates by gap 96 with mounting mat 68,70,72. Connection gasket 76,80 extends to shell 12 center, so as for be electrically connected to by the extension of mounting mat 68,70 install more approach shell 12 center LED50,54 make allowances.
Anode component 16,18,20 stretches usually in parallel to each other, and cathode assembly 22,24,26 stretches usually in parallel to each other, and all extends on the direction of the direction 74 perpendicular to linear LED array.Lead-in wire can have different width and, when watch the encapsulation can be enough little 10 the time from top, they be minimum visible or sightless.In addition and/or replacedly, due to stopping of shell 12, from top, may can't see lead-in wire.
As be preferably in Fig. 1 and 2, see, cavity 40 extends into the enough degree of depth of enclosure to expose attached pad and connection gasket 68,70,72,76,78,80.In a possible embodiment, each LED50,52,54 have its oneself contact to or electrode pair, described contact to or electrode pair be arranged such that LED is luminous when crossing over contact while applying the signal of telecommunication.The contact of LED is electrically connected to anode and cathode assembly pair.Guarantee that each LED50,52,54 has its oneself negative electrode and anode to having superiority, reason is a lot, as be easier to, to each LED, provides electrical control.
According to shown in the exemplary embodiment of embodiment, LED50,52, one of them contact of 54 are coupled to chip carrier pad 68,70,72, and LED50,52, other contact of 54 are coupled to pad 76,78,80.But be appreciated that alternatively carries chips of pad 76,78,80, pad 68,70,72 and be electrically connected to pad 76,78,80.Can use different known configurations and method to manufacture this connection, a kind of such structure is the closing line (wire bond) 95,97,99 that uses known method to apply.Although show a kind of possible closing line structure, be appreciated that the structure according to each chip, various other suitable closing line structures also are fine.For example, on a chip, the closing line more than can be arranged, a closing line is attached on connection gasket, and other closing line is attached on the chip carrier pad.
Anode component 16,18,20 and cathode assembly 22,24,26 can be made by conducting metal or metal alloy, as the combination of copper, copper alloy and/or corrosion-resistant material other suitable conduction, low-resistivity or material.As indicated, the thermal conductivity of lead-in wire can help according to the arrow 98 illustrated to a certain extent from the LED50,52 by the SMD carrying, the 54 conduction amounts of becoming popular.In the encapsulation of the lower-wattage of the embodiment of the present invention (as the encapsulation of those operating currents at about 20-60mA), heat management may not be key issue.
Each LED50,52,54 can be by conduction and heat conduction grafting material 100, as scolder, adhesive, coating, film, sealant, paste, grease and/or other suitable material, with its one of them pad 68,70,72 electric coupling.In one embodiment, can use solder pads on the LED bottom by the LED electric coupling and be fixed on their pads separately.The manufacture of connector component 16,18,20 and carrier body 22,24,26 may complete by punching press, injection moulding, cutting, etching, bending or the combination by other known method and/or method, to realize desirable structure.For example, connector component and/or carrier body can for example, by metal stamping partly (by the single sheet of associated materials by the while punching press), suitably crooked, and finally after forming some or all shells, separated fully.
In some manufacture methods, can, before moulding around connection gasket and/or package shell 12, LED be coupled to pad 68,70,72.Replacedly, can after anode and cathode assembly are partly put into to shell, LED be coupled to 68,70,72.The cavity 40 that extends into shell can be set, as by difform base section 41, in order that expose pad 68,70,72 and pad enough parts of 76,78,80 to hold LED and relevant closing line, and allow LED by cavity 40 emission bright dippings.
In conventional package, the anode of smooth surface and lead frame and the narrow path between cathode assembly, and to make reliable bonding be difficult in the top and the bottom of shell.The smooth surface of these cooperations and the narrow path between metal gap may reduce the fastness of emitter package, and use and manufacturing process as backflow during because shell separates from lead frame, may increase the chance of component failure.In order to make encapsulation more solid, by the Cohesion reliability increased between shell and lead frame, improve the structural intergrity of encapsulation.This can be by comprising one or more recesses, through hole, hole, extension, patterning section, veining section and/or further feature anode component 16,18,20 and one or more realization the in cathode assembly 22,24,26, it contributes to stability, integrality and/or the robustness of SMD encapsulation.In addition, can provide metal gap 102,104,106 and 108 in the various positions between adjacent anode component and adjacent cathode assembly, these gaps are compared with the narrow path seen in the encapsulation of legacy transmission body, have width large and that change.Compare with the encapsulation that does not comprise larger metal gap, fill these gaps between these lead frame parts, to form thicker path and/or route segment by sheathing material more lately.
As preferably be shown in Fig. 7, anode component 16,18 and 18 and 20 can have larger metal gap 102,104 between them, and cathode assembly 22 and 24 and 24 and 26 can have larger metal gap 106 and 108 between them.When cast envelope material above lead frame 14, this sheathing material is inserted larger metal gap 102,104,106,108 to produce wide path and/or route segment, described path and/or route segment can improve the bonding between shell 12 and lead frame 14, and improve the general structure integrality/fastness of encapsulation 10.Anode and cathode assembly can also comprise a plurality of features, and as recess (not shown), through hole (not shown) or otch (as V-otch 110), it can be on the upper surface and lower surface of anode component 16,18,20 and cathode assembly 22,24,26.The feature of metal gap 102,104,106,108, through hole, recess, otch, bending lead and/or other this lead frame coordinates with shell and/or packing material, strengthens at least in part structural stability and the integrality of encapsulation 10.Sheathing material and/or packing material extend at least in part and/or these features by lead frame to increase fastness.In the situation that do not improve the feature of these types of encapsulating structure integrality, encapsulation during manufacture may damage or during encapsulation operation lead frame with shell, may separate.Additionally bond and improve structure in conjunction with Figure 19 to Figure 22 discussion after a while.
With reference now to Fig. 9-10,, show some examples of size characteristic of the various elements of emitter package 10.As an example rather than restriction, encapsulate 10 can have 3.20+/-total length 112 of 0.1mm, the overall width 114 of about 2.80mm, and 0.95+/-height 116 of 0.05mm.In other embodiments, length can be less than 3.20mm, is less than 5.0mm or is greater than 3.20mm.Overall width can be less than 2.80mm, is less than 4.0mm or is greater than 2.80mm.According to the possible embodiment of the emitter package of thin/low section, the height/thickness of encapsulation can change at 0.9-1.3mm, can be less than 0.95mm and maybe can be less than 1.5mm.
Figure 11-18 show another the possible embodiment according to the multiple beam encapsulation 200 of thin/low section of the present invention, and it can comprise SMD.This encapsulation 200 comprises the shell 212 with integrated-lead frame 214.Lead frame 214 comprises as previously mentioned a plurality of conductive connecting elements for encapsulating 10.
Below use three emitters to describe encapsulation 200, and in the illustrated embodiment, arrange lead frame so that each emitter is driven by the signal of telecommunication separately.But be appreciated that the present invention has also considered other layout of encapsulation and lead frame.Therefore, encapsulate in 200 six conductive components are arranged, comprise first, second, and third anode component 216,218,220, and first, second, and third cathode assembly 222,224,226.
Shell 212 is square or rectangle normally, has upper and lower surface 228 and 230, side surface 232 and 234 and end surfaces 236 and 238.The top of shell further comprises from upper surface 228 and extends in the body of shell 212 cavity 240 to lead frame 214.Emitter be arranged on lead frame so that the light sent from emitter by cavity 240 from encapsulating 200 ejaculations.In certain embodiments, can at least along the side of cavity 240 or the part of wall 244, place and fixation reflex body component (not shown).
As described in conjunction with other embodiment, by making cavity 240 and wherein inwardly tapered towards the reflector parts of enclosure carried, can strengthen the effect of reflection part (if comprising) and the angle of departure of encapsulation.As an example but be not restriction, and best being shown in Figure 18, approximately the cavity angles 246 of 90.0 degree can provide suitable and visual angle hope, if comprise the reflector parts the reflectivity of hope also can be provided.In addition, can customize the degree of depth of cavity 240 to increase the visual angle of encapsulation.
In certain embodiments, shell 212 can comprise stepped variation, and the size of the base section 213 of shell 212 is larger than the top section of shell 212 215.It is upper that at least one purpose of this staged shell 212 is that mechanical/electrical that the bottom that makes to have the encapsulation of the lead frame member that it comprises can be installed to conventional size supports (as PCB), simultaneously for the application of various hope can custom encapsulation top dimension.Like this, described supporter is gone up and be electrically connected to the supporter (for example PCB) that new encapsulation 200 can easily be mounted in use.Be appreciated that according to encapsulation of the present invention and can comprise the variation of any amount and type so that the top dimension of shell 212 is different from the bottom size of shell 212.For example, can comprise in encapsulation according to the present invention more than two stageds and changing, or also can consider gradual change, tilt variation.
In certain embodiments, cavity 240 can be filled and/or be covered by the sealant (not shown) by packing material at least in part as previously mentioned.In addition, shell 212 can comprise foregoing material and be formed as previously mentioned.
In described illustrative embodiment, encapsulate 200 use first, second, and third LED250,252,254, its each light that can launch same color with comparing of other or the light of different colours.In this embodiment illustrated, LED250,252,254 launches respectively blue, red and green, and therefore when suitably being powered up, by combination LED, producing is FR color substantially.Further, when suitably being powered up, LED250,252,254 can launch the white light combination of different-colour.Be appreciated that according to the present invention and can use in encapsulation greater or less than 3 LED, and these LED launch color or the color combination of any hope.
The same with encapsulation 10 recited above, encapsulate 200 and can comprise that protection is not subject to the element (not shown) of ESD infringement.This element can comprise Zener diode, is arranged in parallel and compares from LED chip 250,252,254 the different LED be reverse biased, and rheostat and horizontal Si diode are installed in surface.When using many group LED coupled in series, for the group of each series connection, only need an ESD element.
In the illustrative embodiment illustrated, the anode of lead frame and cathode assembly 216,218,220,222,224,226 be the outstanding apparent surface 236 and 238 through shell 212 outwards.Anode component 216,218,220 is 236 extensions from surface, and cathode assembly 222,224,226 238 extensions from surface.When in order to operate, during surface mounted package 200, arranging that anode and cathode assembly are to operate in couples electrical signal conduction to they light emitters separately.In the illustrated embodiment, anode and cathode assembly 216,218,220,222,224,226 vertical curve with extend to housing exterior and downwards along they shell end surface 236 and 238 and the base section 213 of shell extend, and then vertical curve to be to form end 282,284,286,288,290,292, the lower surface 230 of its base section along shell 212 213 extends.The lead-in wire end 282,284,286,288,290,292 substantially with the bottom of shell 212, flush to facilitate the mechanical/electrical supporting construction below being connected to towards outer surface, as not shown as PCB(), PCB comprises the electrical connections conformed to end 282,284,286,288,290,292.
Cathode assembly 222,224,226 comprises center surface or mounting mat 268,270,272, the LED chip 250,252,254 that is linear array for carrying, it extends along the direction 274 perpendicular to side surface 232 and 234, and LED250,252,254 aligns along the central shaft of shell 212 usually.Compare the encapsulation that has otherwise the LED that arranges (as arranged in a cluster), this color uniformity improved at different places, horizontal view angle that is arranged as makes allowances.Be appreciated that the linear array extended along the direction perpendicular to side surface 236,238 makes allowances for the color uniformity improved at different places, vertical angle of view.
Mounting mat 268 and 278 extends to shell 212 center, and it is that LED250,254 installs to such an extent that more approach shell 212 center so that they can penetrate cavity 240 makes allowances.Anode component 216,218,220 comprises respectively electrical connection pad 276,278,280, and its position is close to but separates by gap 296 with mounting mat 268,270,272.Connection gasket 276,280 extends to shell 212 center, so as for be electrically connected to by the extension of mounting mat 268,270 install more approach shell 212 center LED250,254 make allowances.
Anode component 216,218,220 stretches usually in parallel to each other, and cathode assembly 222,224,226 stretches usually in parallel to each other, and all extends on the direction of the direction 274 perpendicular to linear LED array.
The contact of LED is electrically connected to anode and negative electrode pair.According to shown in the exemplary embodiment of embodiment, LED250,252, one of them contact of 254 are coupled to chip carrier pad 268,270,272, and LED250,252, other contact of 254 are coupled to pad 276,278,280.But be appreciated that alternatively carries chips of pad 276,278,280, pad 268,270,272 and be electrically connected to pad 276,278,280.Closing line 295,297,299 can be for the manufacture of this connection.Although show a kind of possible closing line structure, as 10 described about encapsulating as front, various other suitable closing line structures are also possible.
According to shown in the exemplary embodiment of embodiment, LED50,52, one of them contact of 54 are coupled to chip carrier pad 68,70,72, and LED50,52, other contact of 54 are coupled to pad 76,78,80.Can use different known configurations and method to manufacture this connection, a kind of such structure is the closing line 95,97,99 that uses known method to apply.
As front in greater detail, in order to increase Cohesion reliability and the structural intergrity of encapsulation 200, one or more one or more recesses, through hole, hole, extension and/or further features of may further include in anode component 216,218,220 and cathode assembly 222,224,226, it contributes to stability, integrality and/or the robustness of encapsulation.In addition, can provide metal gap 302,304,306 and 308 in the various positions between adjacent anode component and adjacent cathode assembly, compare with the encapsulation that does not comprise larger metal gap, fill these gaps between these lead frame parts, to form thicker path and/or route segment by sheathing material more lately.
As preferably be shown in Figure 16, anode component 216,218 and 218 and 220 can have metal gap 302,304 between them, and cathode assembly 222 and 224 and 224 and 226 can have metal gap 306 and 308 between them.When sheathing material is inserted metal gap 302,304,306,308, produce wide path and/or route segment, it can improve the bonding between shell 212 and lead frame 214, and improves the general structure integrality/intensity of encapsulation 200.Anode and cathode assembly can also comprise a plurality of features, for example, as recess 314, through hole 312 or otch (the V-otch 310).The feature of metal gap 302,304,306,308, through hole 312, recess 314, otch 310, bending lead and/or other this lead frame coordinates with shell and/or packing material/sealant, strengthens at least in part structural stability and the integrality of encapsulation 200.Sheathing material and/or packing material/sealant extend at least in part and/or these features by lead frame to increase fastness.In the situation that do not improve the feature of these types of encapsulating structure integrality, encapsulation during manufacture may damage or be out of shape and/or during encapsulation operation lead frame with shell, may separate.
With reference now to Figure 17-18,, show some examples of size characteristic of the various elements of emitter package 200.As an example rather than restriction, encapsulate 200 can have 6.0+/-total length 316 of 0.1mm, the overall width 318 of about 5.2mm, and 1.30+/-height 320 of 0.05mm.In other embodiments, length can be less than 6.0mm, is less than 7.0mm or is greater than 6.0mm.Overall width can be less than 5.20mm, is less than 6.0mm or is greater than 5.20mm.The top section 215 of shell 212 can have about 5.20mm, is less than 6.0mm, is less than 5.20mm or is greater than the total length 322 of 5.20mm.The base section 213 of shell 212 can have the total length that is greater than 5.20mm but is less than or equal to 6.0mm, or can be greater than dimensionally top section 215.The width of top section 215 can be less than, be equal to or greater than the width of base section 213.According to the possible embodiment of the emitter package 200 of thin/low section, the height/thickness of encapsulation can change at 1.0-1.35mm, can be less than 1.35mm, can be greater than 1.30mm, can be less than 1.8mm and maybe can be less than 2.0mm.
In light-emitting diode display according to the present invention, driver PCB can be provided, can install a plurality of according to SMD of the present invention thereon.SMD can be arranged in rows and columns, and each SMD determines a pixel.SMD can comprise emitter package, as those encapsulation by encapsulation 10 and 200 concrete enforcements.SMD can be electrically connected to trace or the pad on PCB, and PCB is connected with the Electric signal processing in response to suitable and drive circuit.As previously mentioned, the linear array of the vertical orientation of indigo plant of each SMD carrying, red and green LED.Have been found that such linear orientation of LED is used for improving the fidelity of the color in wide angular field of view.But, be appreciated that each SMD can alternatively carry the linear array of the horizontal orientation of indigo plant, red and green LED.According to the present invention, LED can arrange with any linear precedence, and can provide in the color combination of any hope and be less than or more than three LED.
As above partly described, in order to increase Cohesion reliability and the structural intergrity of encapsulation 2000, as shown in Figure 20 a to Figure 20 d, one or morely in anode portion 2002 and negative pole part 2004 also can comprise that bonding improves features 2014, such as one or more patterns, texture, recess, through hole, hole, extension and/or contribute to other features of stability, integrality and/or the robustness of encapsulation.
As shown in Figure 20 a to Figure 20 d, in some constructions, anode lead frame part and cathode leg frame part 2002,2004 can comprise bonding improvement feature 2014, such as the patterning section on surperficial at least a portion or veining section.In this structure, can find that patterning section is positioned on the sidepiece relative with chamber 2006 of lead frame anode part and cathode portion 2002,2004 (shown in Figure 19 b on the sidepiece of formed position, gap), make the described part that patterning section is anode part and cathode portion 2002,2004, this part and sheathing material 2008 cooperations and relative with the sidepiece that photophore can be set.Yet, should be appreciated that in other embodiments, patterning section can be arranged in the diverse location on anode part and cathode portion 2002,2004.As shown in Figure 20 a and Figure 20 d, the top of these parts 2002,2004 is smooth, and the bottom shown in Figure 20 b to Figure 20 d or opposite side will be patterned.
In other structures, except shown in Figure 20 a to Figure 20 d, the larger zone of lead frame also can comprise patterning section.Although this structure illustrates the pattern similar to line (this pattern creates by the notch in leadframe surfaces, line or recess), can use any pattern that the leadframe surfaces area change contacted with sheathing material is provided.Notch shown in Figure 20 a to Figure 20 d can have any degree of depth, the ability that preferably makes this degree of depth not disturb the stability of lead frame and reliability and lead frame to conduct the suitable signal of telecommunication.In addition, although these notches seem to have the V-arrangement cross section, they also can have U-shaped, square or any other shape of cross section.
Figure 20 a to Figure 20 d illustrates the notch of arranging with the parallel orientation of the shorter width along lead-in wire.Should be understood that, this notch or other bondings are improved feature and can be arranged in the multiple structure with multiple different orientations, some examples shown in Figure 20 e to Figure 20 i.Figure 20 e shows for example bonding of notch and improves feature 2014, and but it is arranged in parallel to each other self compares in an angle with lead-in wire 2002.Figure 20 f illustrates another exemplary arrangement, and wherein for example the bonding of notch is improved feature 2014 and is included in 2002 the layout of going between and compares sweep at angle.Figure 20 g illustrates for example bonding of notch and improves feature 2014, and wherein sweep is arranged on the shorter width of lead-in wire 2002.Figure 20 h illustrates for example bonding of notch and improves feature 2014, and it is arranged so that pattern has cross one another crossover part.Figure 20 i illustrates for example bonding of notch and improves feature 2014, and it has cross part and compares with an angle and arrange with lead-in wire 2002.Should be appreciated that multiple other patterns or random character can be used as bonding and improve feature, and any pattern or randomization feature can be bonded to each other and be used in the lip-deep same area or zones of different of lead-in wire 2002.
Some examples of other patterns that improve feature 2114 for boning comprise the pattern shown in Figure 21 a to Figure 21 i, such as depressed part, protuberance or cross figure.Pattern or the texture of the maximum increase of surface area preferably are provided.Pattern or texture can form by any appropriate process that comprises roughening, etching or metal piercing or punching press.
Figure 21 a to Figure 21 i illustrates encapsulation 2100 and lead frame structure, and wherein anode part 2102 and the cathode portion 2104 improvement feature 2114 that will bond is incorporated on the bottom side of lead frame 2102,2104, with shell 2108, cooperates.The bonding of Figure 21 a to Figure 21 c is improved feature 2114 and is had the pattern similar to depressed part.These depressed parts can have unified size and shape, maybe can have random size and shape.This depressed part can be circle, square, hemisphere, taper shape, irregularly shaped or any other suitable shape.
The bonding of Figure 21 d to Figure 21 f is improved feature 2114 and is had the pattern similar to the cross figure center line.These lines can form by the notch in leadframe surfaces, line or recess.These cross spiders can have unified size and shape, or can have random size and shape.This cross spider can have dissimilar cross section, such as V-arrangement, U-shaped, semicircle, square, irregularly shaped or any other suitable shape, as mentioned above.
The bonding of Figure 21 g to Figure 21 i is improved feature 2114 and is had the pattern similar to protuberance.These protuberances outstanding from the surface of lead-in wire can have unified size and shape, or can have random size and shape.This protuberance can be circle, square, hemisphere, taper shape, bullet shaped, irregularly shaped or any other suitable shape.
Should be appreciated that these depressed parts, protuberance, line and other patterns can be used alone or use with mutual any combination.For example, lead-in wire can comprise depressed part and protuberance, depressed part and line, protuberance and line etc., or these features can with any other useful pattern or Feature Combination.
Partially patterned or the veining that has the lead frame of the feature that increases the leadframe surfaces area shown in making makes and can be bonded to better sheathing material, and this is because can be used for the increase surface area of bonding.The bonding increased especially forms more stable and reliable product during being encapsulated in the thermal cycle of manufacturing and may experience between the operating period.The bonding increased also can prevent that wire bump and gap from forming, as shown in Figure 19 b.Sheathing material and/or packing material/sealant extend at least in part in this feature of lead frame and/or extend through this feature, to increase robustness.
In another structure, as shown in Figure 22 a to Figure 22 k, except bonding is improved feature 2214, also can assist and reduce gap formation or lead frame protuberance by lead frame edge locked feature.Figure 22 a to Figure 22 k illustrates lead-in wire edge 2200, sheathing material 2204 and edge locked feature 2202.Figure 22 a shows staged outward flange lock-in feature 2202.Figure 22 b illustrates difform staged outward flange lock-in feature 2202.Figure 22 c illustrates the semi-circular indentation as edge locked feature 2202.Figure 22 d illustrates the use as two slightly conical projections of edge locked feature 2202.Figure 22 e illustrates the angled surface as edge locked feature 2202, and this angled surface is similar to gable top or roof.Figure 22 f illustrates the zigzag staged part as edge locked feature 2202.Figure 22 g illustrates the zigzag coniform shape as edge locked feature 2202, and this shape is similar to the projection of Figure 22 d.Figure 22 h illustrates as the angled surface of the zigzag of edge locked feature 2202, and this angled surface is similar to the inversion of Figure 22 e.Figure 22 i illustrates the projection as edge locked feature 2202, and this projection has a plurality of angled sidepieces, and this angled sidepiece is similar to the triangle in being formed on edge center.Figure 22 j illustrates the edge as edge locked feature 2202, and it has angled sides and staged sidepiece.Finally, Figure 22 k illustrates edge locked feature 2202, and it has the combination of staged surface and inclined surface.These edge locked features 2202 can be used on a plurality of lead-in wires edge, as shown in Figure 22 b to Figure 22 j, or only can be used on the part at single lead-in wire edge or single lead-in wire edge, as shown in Figure 22 k.Although Figure 22 a to Figure 22 k illustrates various shape, these shapes are only the exemplary shape of edge locked feature, and can utilize other shapes and the size of edge locked feature.For example, can use irregular recess or projection, circular projection or on a sidepiece angled and on the other side straight or crooked recess or projection.In addition, but any combination of use characteristic.The lead frame edge locked is characterized as the variation at the lead frame edge of Figure 19 b, to comprise the feature that contributes to lead frame to be bonded to the stability of sheathing material, prevents that gap from forming and lead-in wire perk or protuberance.
In some constructions, the edge locked feature can be formed at the position at the edge that can be described as lead frame, and it illustrates by the profile 2010 in Figure 20 b and Figure 20 c.When sheathing material is inserted edge locked feature 2202(such as ladder, recess, projection, section's section (segment) or flange) on every side the time, can improve the bonding between shell 2204 and lead frame 2200, and also can improve the overall structural integrity/intensity of encapsulation.These improvement can be partly owing to sheathing material and lead frame edge now together with " locking " because the edge locked feature is as stop part, the ability that the reduction lead frame moves up and down.Although this profile only is illustrated on the part of lead frame, this profile can extend on whole lead frame.In addition, the edge locked feature also can be included on other parts of lead frame.Sheathing material and/or packing material/sealant extend at least in part in this feature of lead frame and/or extend through this feature, to increase robustness.In the situation that, not for improvement of these type features of encapsulating structure integrality, can damage encapsulation during manufacture, and/or during encapsulation operation lead frame and shell separable.
In some constructions, when manufacturing and encapsulation 2000,2100, sheathing material is injected moulding on lead frame.Stay hole 2012,2112 by injection forming equipment or system in sheathing material.This hole causes the part of shell thinner than the remainder of shell, and as shown in Figure 20 d, 21c, 21f and 21i, this can cause point of instability, and this point can affect Performance And Reliability.According in some embodiments of the present invention, by reducing the size as the hole 2012,2112 of the point (this point is injected moulding on lead frame) of sheathing material entrance, in conjunction with above-mentioned other structures or with above-mentioned other structures, separate, can further improve shell to lead frame and bond, thereby increase the sheathing material amount.As shown in Figure 20 d, 21c, 21f and 21i, hole 2012,2112 or injection moulding mouth are the recess in sheathing material 2008,2108, make sheathing material in this zone with peripheral region be in a ratio of thinner, to hold Coinjection molding apparatus.Due at this zone housing material by thinning, can reduce bonding and the stability of sheathing material to lead frame.
By reducing the size in hole 2012,2112, sheathing material 2008 amounts in hole 2012,2112 can increase bonding and stability.Yet the size in hole can not be reduced too many so that hinder injection molding technique.In some constructions, the conventional injection molding mouth can have the degree of depth of 0.2mm, and this degree of depth can be reduced to any size that is less than 0.2mm to 0.1mm.In these structures, the conventional injection molding mouth can have the diameter of 0.5mm, and this diameter can be reduced to any size that is less than 0.5mm to 0.45mm.In thering are other structures of other big or small injection moulding mouths, the reducing of size that can use similar proportion.In other structures, as long as the injection moulding mouth does not hinder injection molding technique substantially, any reducing of injection moulding mouth size may be just suitable.
Although illustrate and described several illustrative embodiment of the present invention, for a person skilled in the art, will there will be a lot of distortion and alternate embodiment, as the present invention is used for to LED decorative lighting or analogue.This distortion and alternate embodiment can be taken into account, and can implement this distortion and alternate embodiment in the situation that do not break away from the spirit and scope of the present invention as defined by the appended claims.

Claims (48)

1. an emitter package comprises:
Shell;
The conductive lead wire frame, be integrated with described shell, and wherein said lead frame comprises the feature that cooperates to increase the bonding between described lead frame and described shell with described shell; And
At least one light-emitting device, be arranged on the conductive part of described lead frame;
Wherein, described feature is positioned on relative surface, the surface with being furnished with described at least one light-emitting device of described lead frame.
2. emitter package according to claim 1, further comprise the edge locked feature, described edge locked feature is positioned on the part that the part with being furnished with described light-emitting device of described lead frame is adjacent, makes described edge locked feature for stablizing described lead frame.
3. emitter package according to claim 1, wherein, described edge locked feature comprises staged edge, recess or projection.
4. emitter package according to claim 1, wherein, described light-emitting device comprises the LED arranged in the mode of linear alignment.
5. emitter package according to claim 1, wherein, described lead frame further comprises:
A plurality of conductive cathode section; And
Corresponding a plurality of conductive anode section, separate with described negative pole part;
Wherein, described negative pole part or described anode portion are carried at least one in described light-emitting device, and each in described anode portion and described negative pole part is electrically connected in described at least one light-emitting device.
6. emitter package according to claim 5, wherein, described light-emitting device comprises at least two contacts, at least one being electrically coupled in described negative pole part in described contact, and another in described contact is electrically coupled at least one in described anode portion.
7. emitter package according to claim 5, wherein:
Described light-emitting device is arranged in the mode of the linear array that extends in a first direction;
Described anode portion arranges with the relation be parallel to each other; And
Described negative pole part arranges with the relation be parallel to each other;
Wherein, described anode portion and described negative pole part extend upward in the second party with described first direction quadrature.
8. emitter package according to claim 1, wherein, described lead frame comprises conducting metal or metal alloy.
9. emitter package according to claim 1, wherein, described shell comprises plastics or resin.
10. emitter package according to claim 1, wherein, described feature comprises with lower one or more: patterning section, veining section, otch, recess, the prominent wing or perforated metal section, wherein said shell comprises described feature in order to compare the bonding strengthened between described shell and described lead frame with the encapsulation that does not comprise described feature.
11. emitter package according to claim 10, wherein, described patterning section comprises protuberance, depressed part, line, cross spider and round dot pattern.
12. emitter package according to claim 4, wherein, described LED vertically aims at.
13. emitter package according to claim 1, further comprise chamber, described chamber extends to the inside of described shell from the top surface of described shell, and a plurality of parts and the described light-emitting device of described lead frame expose by described chamber.
14. emitter package according to claim 13, wherein, described chamber further comprises the degree of depth that is less than or equal to 0.5mm, and wherein, the described degree of depth increases viewing angle.
15. emitter package according to claim 1, further be included in the anti-UV sealant in described encapsulation.
16. emitter package according to claim 15, wherein, described sealant comprises silicones.
17. emitter package according to claim 1, wherein, described feature increases the surface area of described lead frame.
18. emitter package according to claim 13, wherein, described chamber is filled with packing material at least in part.
19. emitter package according to claim 13, wherein, described chamber comprises reflector.
20. emitter package according to claim 1, wherein, the injection moulding notch portion of described encapsulation has the degree of depth that is less than 0.2mm.
21. emitter package according to claim 1, wherein, the injection moulding notch portion of described encapsulation has the diameter that is less than 0.5mm.
22. emitter package according to claim 1, wherein, the height of described encapsulation is between between 0.9mm to 1.0mm.
23. emitter package according to claim 1, wherein, the height of described encapsulation is for being less than 1.35mm.
24. an emitter package comprises:
Shell;
The conductive lead wire frame, be integrated with described shell, and the feature of the increase bonding that cooperates with described shell to provide between described lead frame and described shell is provided wherein said lead frame; And
At least one light-emitting device, be arranged on a plurality of parts of described lead frame;
Wherein, described feature comprises the edge locked feature, and described edge locked feature is positioned on the part at the edge that the part with being furnished with described light-emitting device of described lead frame is adjacent, makes that described edge locked feature is auxiliary stablizes described lead frame.
25. emitter package according to claim 24, wherein, described feature further comprises patterning section, veining section, recess, the prominent wing or the perforated metal section on the relative part of the part with being furnished with described light-emitting device that is positioned at described lead frame, makes described feature increase the surface area of the described shell of contact of described lead frame.
26. emitter package according to claim 24, wherein, described lead frame further comprises:
A plurality of conductive cathode section, at least one in described at least one light-emitting device all carried in each conductive cathode section; And
Corresponding a plurality of conductive anode section, with described cathode portion from, each in described anode portion all is electrically connected in described at least one light-emitting device;
Wherein, each in described at least one light-emitting device all engages via wire and is attached to negative pole part separately, and each in described light-emitting device all is attached to anode portion separately via scolder.
27. emitter package according to claim 24, wherein, described light-emitting device comprises a plurality of color LEDs of arranging in the mode of linear alignment, and described LED is suitable for being energized in order to produce FR color basically in the mode combined.
28. emitter package according to claim 24, wherein, described edge locked feature comprises staged edge, recess or projection.
29. emitter package according to claim 24, further comprise chamber, described chamber extends to the inside of described shell from the top surface of described shell, and wherein, described lead frame exposes by described chamber.
30. emitter package according to claim 29, wherein, the degree of depth in described chamber is for being less than or equal to 0.5mm, and the described degree of depth increases viewing angle.
31. emitter package according to claim 29, wherein, described chamber is filled with packing material at least in part.
32. emitter package according to claim 29, wherein, described chamber comprises reflector.
33. emitter package according to claim 24, further be included in the Silicone Sealants in described encapsulation, the top of wherein said sealant is basically smooth.
34. emitter package according to claim 24, wherein, the height of described encapsulation is between between 1.25mm to 1.35mm.
35. emitter package according to claim 24, wherein, the height of described encapsulation is for being less than 2.0mm.
36. emitter package according to claim 24, wherein, the injection moulding mouth of described encapsulation has the diameter that is less than 0.5mm.
37. emitter package according to claim 24, wherein, the injection moulding mouth of described encapsulation has the degree of depth that is less than 0.2mm.
38. one kind low section emitter package comprises:
Shell;
The conductive lead wire frame, be integrated with described shell, and wherein said lead frame comprises the feature that cooperates to increase the bonding between described lead frame and described shell with described shell; And
At least one LED, be arranged on described lead frame;
Wherein, the height of described encapsulation is for being less than 2.0mm; And the injection moulding mouth of described encapsulation has the degree of depth that is less than 0.2mm and the diameter that is less than 0.5mm.
39. according to the described low section emitter package of claim 38, wherein, described feature comprises with lower one or more: the otch in the part with being furnished with light-emitting device of described lead frame on adjacent part, recess, the prominent wing, projection, pattern or texture, wherein said shell comprises described feature in order to compare the bonding strengthened between described shell and described lead frame with the encapsulation that does not comprise described feature.
40. according to the described low section emitter package of claim 38, further comprise chamber, described chamber extends to the inside of described shell from the top surface of described shell, a plurality of parts and the described LED of described lead frame expose by described chamber.
41. a light emitting device display comprises:
Substrate, the array of carrying emitter package, each in described emitter package includes:
Shell;
The conductive lead wire frame, be integrated with described shell, and the feature of the increase bonding that cooperates with described shell to provide between described lead frame and described shell is provided wherein said lead frame; And
At least one LED, be arranged on described lead frame in the mode of linear alignment;
Wherein, the height of each described encapsulation is for being less than 2.0mm, and wherein, described feature is positioned at least a portion on relative surface, the surface with being furnished with described LED of described lead frame; And
The drive circuit be electrically connected to, give described array energising on described display, to produce vision imaging for selectivity.
42., according to the described display of claim 41, wherein, each in the described LED in described emitter package is all driven by the signal of telecommunication separately, each in described at least one LED further limits a pixel of described display.
43., according to the described display of claim 41, wherein, described feature further comprises end difference, zigzag section or the jut on the edge that the part with being furnished with described LED that is positioned at described lead frame is adjacent.
44., according to the described display of claim 41, wherein, described feature increases the surface area of described lead frame.
45., according to the described display of claim 41, wherein, each in described emitter package all has the height changed in the scope from 0.9mm to 1.35mm.
46., according to the described display of claim 41, wherein, the injection moulding notch portion of described emitter package has the diameter that is less than 0.5mm.
47., according to the described display of claim 41, wherein, the injection moulding notch portion of described emitter package has the degree of depth that is less than 0.2mm.
48. according to the described display of claim 41, further comprise chamber, described chamber extends to the inside of described shell from the top surface of described shell, a plurality of parts of described lead frame and described at least one LED expose by described chamber.
CN2012101779767A 2012-05-31 2012-05-31 Emitter package and light emitting device displayer Pending CN103456725A (en)

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CN103456726A (en) * 2012-05-31 2013-12-18 惠州科锐半导体照明有限公司 LED package, LED displayer and LED package manufacturing method
CN110447110A (en) * 2017-08-25 2019-11-12 惠州科锐半导体照明有限公司 Multiple LED light source lens designs in integration packaging
CN111554792A (en) * 2019-02-11 2020-08-18 陈在彦 Light emitting element package with adjusted pointing angle and light emitting device using the same

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CN111554792B (en) * 2019-02-11 2023-08-18 陈在彦 Light emitting element package with adjusted pointing angle and light emitting device using the same

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