CN103464892A - 激光加工装置及激光加工方法 - Google Patents

激光加工装置及激光加工方法 Download PDF

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Publication number
CN103464892A
CN103464892A CN2013102182512A CN201310218251A CN103464892A CN 103464892 A CN103464892 A CN 103464892A CN 2013102182512 A CN2013102182512 A CN 2013102182512A CN 201310218251 A CN201310218251 A CN 201310218251A CN 103464892 A CN103464892 A CN 103464892A
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layer
laser
pulse irradiation
processing
grid
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CN103464892B (zh
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久保拓矢
高桥正训
日向野哲
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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CN201310218251.2A 2012-06-05 2013-06-04 激光加工装置及激光加工方法 Active CN103464892B (zh)

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JP2012-128444 2012-06-05
JP2012128444A JP5920661B2 (ja) 2012-06-05 2012-06-05 レーザ加工装置およびレーザ加工方法

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CN103464892A true CN103464892A (zh) 2013-12-25
CN103464892B CN103464892B (zh) 2016-03-09

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108436283A (zh) * 2018-04-11 2018-08-24 大族激光科技产业集团股份有限公司 激光打标机及其打标方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7023214B2 (ja) * 2018-11-05 2022-02-21 京セラ株式会社 切削工具の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1087750A (zh) * 1992-06-26 1994-06-08 株式会社半导体能源研究所 激光加工方法
US6087625A (en) * 1997-03-21 2000-07-11 Sumitomo Heavy Industries, Ltd. Laser machining apparatus
CN1678426A (zh) * 2002-08-30 2005-10-05 住友重机械工业株式会社 激光加工方法及加工装置
CN1819878A (zh) * 2003-07-08 2006-08-16 光谱技术有限公司 激光从基底去除层或涂层
US20100197116A1 (en) * 2008-03-21 2010-08-05 Imra America, Inc. Laser-based material processing methods and systems
CN102196880A (zh) * 2008-10-23 2011-09-21 住友电气工业株式会社 激光加工方法以及激光加工装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3764155B2 (ja) * 2003-10-23 2006-04-05 住友重機械工業株式会社 レーザ加工方法及びレーザ加工装置
JP5116979B2 (ja) * 2006-02-28 2013-01-09 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
JP2010194560A (ja) * 2009-02-23 2010-09-09 Nisshinbo Holdings Inc 太陽電池パネルのレーザ加工方法
JP2011212726A (ja) * 2010-03-31 2011-10-27 Fujifilm Corp レーザ加工装置及びレーザ加工方法
JP5861494B2 (ja) * 2012-02-23 2016-02-16 三菱マテリアル株式会社 レーザ加工装置およびレーザ加工方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1087750A (zh) * 1992-06-26 1994-06-08 株式会社半导体能源研究所 激光加工方法
US6087625A (en) * 1997-03-21 2000-07-11 Sumitomo Heavy Industries, Ltd. Laser machining apparatus
CN1678426A (zh) * 2002-08-30 2005-10-05 住友重机械工业株式会社 激光加工方法及加工装置
CN1819878A (zh) * 2003-07-08 2006-08-16 光谱技术有限公司 激光从基底去除层或涂层
US20100197116A1 (en) * 2008-03-21 2010-08-05 Imra America, Inc. Laser-based material processing methods and systems
CN102196880A (zh) * 2008-10-23 2011-09-21 住友电气工业株式会社 激光加工方法以及激光加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108436283A (zh) * 2018-04-11 2018-08-24 大族激光科技产业集团股份有限公司 激光打标机及其打标方法

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JP5920661B2 (ja) 2016-05-18
CN103464892B (zh) 2016-03-09
JP2013252528A (ja) 2013-12-19

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