CN103561538A

CN103561538A - Method for making soft and hard double-sided circuit board

Info

Publication number: CN103561538A
Application number: CN201310406846.0A
Authority: CN
Inventors: 覃安族
Original assignee: ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD CO Ltd
Current assignee: Jiangxi Hongxin Flexible Electronic Technology Co ltd
Priority date: 2013-09-10
Filing date: 2013-09-10
Publication date: 2014-02-05
Anticipated expiration: 2033-09-10
Also published as: CN103561538B

Abstract

The invention provides a method for making a soft and hard double-sided circuit board. The method comprises steps of substrate selection, waterproof processing, gap processing, hollow processing, cold pressing, packing and lamination coating, coating and false fixation with an iron, and hot and compact pressing through a quickly pressing machine. The method has the advantages that: (1) an adverse phenomenon that a back substrate at a PCB slot is depressed in the synthesis and pressing process of the substrate can be effectively solved, and the quality of a product circuit and resistance welding production is raised; (2) an adverse phenomenon that the substrate is raised at a place where a part in an FPC is reinforced in the synthesis and pressing process of the substrate can be effectively solved, and the quality of a product circuit and resistance welding production is raised; (3) two layers of FR4 synthesis structures are used, an adverse phenomenon that the substrate is depressed is solved, and a condition that a potion penetrates into the inner layer of the substrate from the PCB slot when the plating or the horizontal line of an overwetting process is made in the production process is avoided.

Description

Soft or hard double-sided circuit board manufacturing method

Technical field

This invention relates to a kind of manufacture method of double-sided PCB, and particularly a kind of soft or hard double-sided circuit board manufacturing method, belongs to circuit board print field.

Background technology

The product substrate composite structure of traditional double face rigid-flexible circuit board is that one side hardboard adds one deck one side soft board and combines by sticker.

Main production: 1, one side PCB substrate is first slotted in specific region; (object of fluting is in order to be convenient to herein PCB be taken off lid in the final stage of product in advance); 2, AD glue is first removed part glue with cutting mode in specific region; 3, PI stiffening plate is sticked in the specific region on one side FPC substrate; 4, with AD glue as sticker in intermediate layer, one side FPC substrate and one side PCB substrate are combined into one with pressing mode, now PI stiffening plate be also contained in the inside.Substrate after pressing has formed the structure of two-sided soft or hard combination.

Existing product structure &processes shortcoming: have liquid medicine to penetrate into substrate internal layer from PCB fluting while 1, electroplating or crossing the horizontal line of wet process, cause liquid medicine to pollute substrate internal layer, in the production process of postorder, also have liquid medicine and flow backwards out from internal layer, thereby cause substrate to occur that quality problems cause product rejection simultaneously; 2, because PCB slots in advance, when pressing and forming, FPC substrate has been slotted without supporting because of the back side, will cause FPC substrate to have depressed phenomenon, occurs obvious difference of height, and the problem because of difference of height when circuit is made and welding resistance is made will cause many quality problem; 3, because part above FPC needs reinforcing, with existing product structure pressing, internal layer, because FPC substrate after having reinforcement will cause pressing has obvious protruding phenomenon, because of the out-of-flatness of FPC substrate surface, has protruding phenomenon will cause many quality problem while causing circuit making and welding resistance to make.

Summary of the invention

Goal of the invention: the object of this invention is to provide a kind of substrate PCB fluting place back substrate generation depression, inner part of FPC in synthetic pressing process can avoided has the local substrate of reinforcement to produce protruding soft or hard double-sided circuit board manufacturing method.

Technical scheme: a kind of soft or hard double-sided circuit board manufacturing method, comprises the following steps:

A) according to the thickness of product, select a PCB one side substrate to add one and replace an original one side substrate without copper FR4, for example: the thickness of former one side substrate is 1.0MM, present with a 0.8MM one side substrate, add a 0.2MM and synthesize replacement without the FR4 of copper, concrete material is selected to carry out free collocation according to the thickness of product;

B) in PCB one side substrate slot area, carry out in advance water-proofing treatment;

C) in synthetic material, without the specific slot area of copper FR4, go out in advance a gap, be beneficial to substrate after synthetic and when forming the final stage of product, take off lid and use;

D) at FPC, have the specific region of reinforcement, first to carrying out hollow out processing without the equitant position of copper FR4, exempting from substrate FPC real estate after pressing is synthetic has protruding phenomenon;

That e) uses that hollow out processed is used as jig plate without copper FR4 and uses, and AD glue, with hole contraposition, is distributed in to plate face, through colding pressing, makes AD glue and combines in advance without copper FR4;

F) and then by stiffening plate by the position of processing without copper FR4 hollow out, clog laminating, post the rear flatiron of using false fixing, then through too fast press hot pressing compacting.

For the ease of product in the end the stage take off lid, the gap of going out in described step c overlaps with PCB slot area.

Describedly without copper FR4 material thickness, need to arrange in pairs or groups according to the thickness of PI stiffening plate, within the be controlled at ± 0.05MM of thickness difference of the thickness of described FR4 material and PI stiffening plate, otherwise the phenomenon of substrate surface projection cannot solve.

Beneficial effect: 1, can effectively solve the bad phenomenon that substrate PCB fluting place back substrate in synthetic pressing process produces depression, improve the quality that product circuit and welding resistance are made; 2, can effectively solve substrate inner part of FPC in synthetic pressing process has the local substrate of reinforcement to produce protruding bad phenomenon, has improved the quality that product circuit and welding resistance are made; 3, use two-layer FR4 composite structure, can substrate produce the bad phenomenon of depression, while avoiding electroplating in process of production or cross the horizontal line of wet process, have liquid medicine to penetrate into substrate internal layer from PCB fluting.

Accompanying drawing explanation

Fig. 1 is product structure schematic diagram of the present invention;

Fig. 2 is the synthetic pressing structure schematic diagram of substrate of the present invention;

Fig. 3 is the parameter list of the synthetic pressing of the present invention.

Embodiment

Below in conjunction with accompanying drawing, the invention will be further described.

As shown in Figure 1, a kind of soft or hard double-sided circuit board manufacturing method, comprises the following steps:

A) according to the thickness of product, select a PCB one side substrate to add one and replace an original one side substrate without copper FR4, for example: the thickness of former one side substrate is 1.0MM, present with a 0.8MM one side substrate, add a 0.2MM and synthesize replacement without the FR4 of copper, concrete material is selected to carry out free collocation according to the thickness of product; Describedly without copper FR4 material thickness, need to arrange in pairs or groups according to the thickness of PI stiffening plate, within the be controlled at ± 0.05MM of thickness difference of the thickness of described FR4 material and PI stiffening plate, otherwise the phenomenon of substrate surface projection cannot solve.

C) in synthetic material, without the specific slot area of copper FR4, go out in advance a gap, gap overlaps with PCB slot area, is beneficial to substrate after synthetic and when forming the final stage of product, takes off lid and use;

D) at FPC, there is the specific region of reinforcement, first to carrying out hollow out processing without the equitant position of copper FR4, size is monolateral than the large 0.2MM of stiffening plate, to the reinforcement processing of stepping down, avoid synthesizing pressing process MR medium reinforcing by substrate jack-up at substrate, avoid substrate FPC real estate after pressing is synthetic to have protruding phenomenon;

The present invention in the situation that do not affect structure and the original design of final finished, by change product substrate composite structure in process of production and local design, has reached the feasibility that can produce in batches, has improved the quality of product.

Without the material of copper FR4, must select the material of high TG value, the synthetic pressing maximum temperature of substrate can not surpass the TG value without copper FR4.See Fig. 3

Pressing maximum temperature is set and can not be surpassed the TG value without copper FR4.(for example: TG Zhi Wei≤170 ℃ of FR4, pressing maximum temperature is set can not be over 170 ℃)

As shown in Figure 2, pressing auxiliary material are selected KY3001 release film, KY3002 filling film.

Claims

1. a soft or hard double-sided circuit board manufacturing method, is characterized in that, comprises the following steps:

A) according to the thickness of product, select a PCB one side substrate to add one and replace an original one side substrate without copper FR4;

C) in synthetic material, without the specific slot area of copper FR4, go out in advance a gap;

D) at FPC, there is the specific region of reinforcement, first to carrying out hollow out processing without the equitant position of copper FR4;

2. soft or hard double-sided circuit board manufacturing method according to claim 1, is characterized in that: the gap of going out in described step c overlaps with PCB slot area.

3. soft or hard double-sided circuit board manufacturing method according to claim 1, it is characterized in that: describedly without copper FR4 material thickness, need to arrange in pairs or groups according to the thickness of PI stiffening plate, within the be controlled at ± 0.05MM of thickness difference of the thickness of described FR4 material and PI stiffening plate.