CN103561538B - Soft or hard double-sided circuit board manufacturing method - Google Patents

Soft or hard double-sided circuit board manufacturing method Download PDF

Info

Publication number
CN103561538B
CN103561538B CN201310406846.0A CN201310406846A CN103561538B CN 103561538 B CN103561538 B CN 103561538B CN 201310406846 A CN201310406846 A CN 201310406846A CN 103561538 B CN103561538 B CN 103561538B
Authority
CN
China
Prior art keywords
substrate
copper
soft
thickness
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310406846.0A
Other languages
Chinese (zh)
Other versions
CN103561538A (en
Inventor
覃安族
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Hongxin Flexible Electronic Technology Co ltd
Original Assignee
ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD CO Ltd filed Critical ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD CO Ltd
Priority to CN201310406846.0A priority Critical patent/CN103561538B/en
Publication of CN103561538A publication Critical patent/CN103561538A/en
Application granted granted Critical
Publication of CN103561538B publication Critical patent/CN103561538B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

A kind of soft or hard double-sided circuit board manufacturing method, comprises substrate apolegamy, water-proofing treatment, gap processing, hollow out processing, colds pressing, clogs laminating, posts false the fixing of rear use flatiron, then through steps such as too fast press hot pressing compactings. Beneficial effect: 1, can effectively solve substrate PCB fluting place back substrate in synthetic pressing process and produce the bad phenomenon caving in, improve the quality that product circuit and welding resistance are made; 2, can effectively solve substrate inner part of FPC in synthetic pressing process has the local substrate of reinforcement to produce protruding bad phenomenon, has improved the quality that product circuit and welding resistance are made; 3, use two-layer FR4 composite structure, can substrate produce the bad phenomenon of depression, while avoiding electroplating in process of production or crossing the horizontal line of wet process, have liquid medicine to penetrate into substrate internal layer from PCB fluting.

Description

Soft or hard double-sided circuit board manufacturing method
Technical field
This invention relates to a kind of preparation method of double-sided PCB, and particularly a kind of soft or hard double-sided circuit board manufacturing method, belongs to circuit board print field.
Background technology
The product substrate composite structure of traditional double face rigid-flexible circuit board is that one side hardboard adds one deck one side soft board and combines by sticker.
Main production: 1, one side PCB substrate is first slotted in specific region; (object of fluting is in order to be convenient to herein PCB be taken off lid in the final stage of product in advance); 2, AD glue is first removed part glue with cutting mode in specific region; 3, PI stiffening plate is sticked in the specific region on one side FPC substrate; 4, with AD glue as sticker in intermediate layer, one side FPC substrate and one side PCB substrate are combined into one with pressing mode, now PI stiffening plate be also contained in the inside. Substrate after pressing has formed the structure of two-sided soft or hard combination.
Existing product structure &processes shortcoming: 1, electroplate or have liquid medicine to penetrate into substrate internal layer from PCB fluting while crossing the horizontal line of wet process, cause liquid medicine to pollute substrate internal layer, in the production process of postorder, also have liquid medicine and flow backwards out from internal layer, thereby cause substrate to occur that quality problems cause product rejection simultaneously; 2, because PCB slots in advance, in the time of pressing and forming, FPC substrate has been slotted without supporting because of the back side, will cause FPC substrate to have depressed phenomenon, occurs obvious difference of height, and circuit is made and welding resistance when making will cause many quality problem because of the problem of difference of height; 3, because part above FPC needs reinforcing, with existing product structure pressing, internal layer, because FPC substrate after having reinforcement will cause pressing has obvious protruding phenomenon, because of the out-of-flatness of FPC substrate surface, has protruding phenomenon will cause many quality problem while causing circuit making and welding resistance to make.
Summary of the invention
Goal of the invention: the object of this invention is to provide a kind of substrate PCB fluting place back substrate generation depression, inner part of FPC in synthetic pressing process can avoided has the local substrate of reinforcement to produce protruding soft or hard double-sided circuit board manufacturing method.
Technical scheme: a kind of soft or hard double-sided circuit board manufacturing method, comprises the following steps:
A) select a PCB one side substrate to add one according to the thickness of product and replace an original one side substrate without copper FR4, for example: the thickness of former one side substrate is 1.0MM, present add a 0.2MM with a 0.8MM one side substrate and synthesize replacement without the FR4 of copper, concrete material is selected to carry out free collocation according to the thickness of product;
B) carry out in advance water-proofing treatment in PCB one side substrate slot area;
C) in synthetic material, go out in advance a gap without the specific slot area of copper FR4, be beneficial to substrate after synthetic and in the time forming the final stage of product, take off lid and use;
D) have the specific region of reinforcement at FPC, first to carrying out hollow out processing without the equitant position of copper FR4, exempting from substrate FPC real estate after pressing is synthetic has protruding phenomenon;
What e) use that hollow out processed is used as jig plate without copper FR4 and uses, and AD glue, with hole contraposition, is distributed in to plate face, through colding pressing, makes AD glue and combines in advance without copper FR4;
F) and then by stiffening plate by clogging laminating without the position of copper FR4 hollow out processing, post rear false fixing with flatiron, then through too fast press hot pressing compacting.
For the ease of product in the end the stage take off lid, the gap of going out in described step c overlaps with PCB slot area.
Describedly need to arrange in pairs or groups according to the thickness of PI stiffening plate without copper FR4 material thickness, within the be controlled at ± 0.05MM of thickness difference of the thickness of described FR4 material and PI stiffening plate, otherwise the phenomenon of substrate surface projection cannot solve.
Beneficial effect: 1, can effectively solve substrate PCB fluting place back substrate in synthetic pressing process and produce the bad phenomenon caving in, improve the quality that product circuit and welding resistance are made; 2, can effectively solve substrate inner part of FPC in synthetic pressing process has the local substrate of reinforcement to produce protruding bad phenomenon, has improved the quality that product circuit and welding resistance are made; 3, use two-layer FR4 composite structure, can substrate produce the bad phenomenon of depression, while avoiding electroplating in process of production or crossing the horizontal line of wet process, have liquid medicine to penetrate into substrate internal layer from PCB fluting.
Brief description of the drawings
Fig. 1 is product structure schematic diagram of the present invention;
Fig. 2 is the synthetic pressing structure schematic diagram of substrate of the present invention;
Fig. 3 is the parameter list of the synthetic pressing of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figure 1, a kind of soft or hard double-sided circuit board manufacturing method, comprises the following steps:
A) select a PCB one side substrate to add one according to the thickness of product and replace an original one side substrate without copper FR4, for example: the thickness of former one side substrate is 1.0MM, present add a 0.2MM with a 0.8MM one side substrate and synthesize replacement without the FR4 of copper, concrete material is selected to carry out free collocation according to the thickness of product; Describedly need to arrange in pairs or groups according to the thickness of PI stiffening plate without copper FR4 material thickness, within the be controlled at ± 0.05MM of thickness difference of the thickness of described FR4 material and PI stiffening plate, otherwise the phenomenon of substrate surface projection cannot solve.
B) carry out in advance water-proofing treatment in PCB one side substrate slot area;
C) in synthetic material, go out in advance a gap without the specific slot area of copper FR4, gap overlaps with PCB slot area, is beneficial to substrate after synthetic and in the time forming the final stage of product, takes off lid and use;
D) there is the specific region of reinforcement at FPC, first to carrying out hollow out processing without the equitant position of copper FR4, size is monolateral than the large 0.2MM of stiffening plate, to the reinforcement processing of stepping down, avoid synthesizing pressing process MR medium reinforcing by substrate jack-up at substrate, avoid substrate FPC real estate after pressing is synthetic to have protruding phenomenon;
What e) use that hollow out processed is used as jig plate without copper FR4 and uses, and AD glue, with hole contraposition, is distributed in to plate face, through colding pressing, makes AD glue and combines in advance without copper FR4;
F) and then by stiffening plate by clogging laminating without the position of copper FR4 hollow out processing, post rear false fixing with flatiron, then through too fast press hot pressing compacting.
The present invention, in the case of the structure and original design that do not affect final finished, by change product substrate composite structure in process of production and local design, has reached the feasibility that can produce in batches, has improved the quality of product.
Must select the material of high TG value without the material of copper FR4, the synthetic pressing maximum temperature of substrate can not exceed the TG value without copper FR4. See Fig. 3.
Pressing maximum temperature is set and can not be exceeded TG value without copper FR4 (for example: TG Zhi Wei≤170 DEG C of FR4, the setting of pressing maximum temperature can not exceed 170 DEG C).
As shown in Figure 2, pressing auxiliary material are selected KY3001 mould release membrance, KY3002 filling film.

Claims (3)

1. a soft or hard double-sided circuit board manufacturing method, is characterized in that, comprises the following steps:
A) select a PCB one side substrate to add one according to the thickness of product and replace an original one side substrate without copper FR4;
B) carry out in advance water-proofing treatment in PCB one side substrate slot area;
C) in synthetic material, go out in advance a gap without the specific slot area of copper FR4;
D) there is the specific region of reinforcement at FPC, first to carrying out hollow out processing without the equitant position of copper FR4;
What e) use that hollow out processed is used as jig plate without copper FR4 and uses, and AD glue, with hole contraposition, is distributed in to plate face, through colding pressing, makes AD glue and combines in advance without copper FR4;
F) and then by stiffening plate by clogging laminating without the position of copper FR4 hollow out processing, post rear false fixing with flatiron, then through too fast press hot pressing compacting.
2. soft or hard double-sided circuit board manufacturing method according to claim 1, is characterized in that: the gap of going out in described step c overlaps with PCB slot area.
3. soft or hard double-sided circuit board manufacturing method according to claim 1, it is characterized in that: describedly need to arrange in pairs or groups according to the thickness of PI stiffening plate without copper FR4 material thickness, within the be controlled at ± 0.05MM of thickness difference of the thickness of described FR4 material and PI stiffening plate.
CN201310406846.0A 2013-09-10 2013-09-10 Soft or hard double-sided circuit board manufacturing method Active CN103561538B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310406846.0A CN103561538B (en) 2013-09-10 2013-09-10 Soft or hard double-sided circuit board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310406846.0A CN103561538B (en) 2013-09-10 2013-09-10 Soft or hard double-sided circuit board manufacturing method

Publications (2)

Publication Number Publication Date
CN103561538A CN103561538A (en) 2014-02-05
CN103561538B true CN103561538B (en) 2016-05-11

Family

ID=50015639

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310406846.0A Active CN103561538B (en) 2013-09-10 2013-09-10 Soft or hard double-sided circuit board manufacturing method

Country Status (1)

Country Link
CN (1) CN103561538B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104507260B (en) * 2014-12-16 2018-04-06 江门崇达电路技术有限公司 A kind of preparation method of the Rigid Flex provided with reinforcing chip
CN111132446A (en) * 2019-12-20 2020-05-08 江苏弘信华印电路科技有限公司 Manufacturing method of six-layer rigid-flex printed circuit board with partially sunk middle part of camera head
CN112261799A (en) * 2020-09-16 2021-01-22 东莞康源电子有限公司 Rigid-flexible plate with rigid-flexible inner layer Y-shaped and processing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5739585A (en) * 1995-11-27 1998-04-14 Micron Technology, Inc. Single piece package for semiconductor die
CN101076227A (en) * 2006-05-18 2007-11-21 施汉忠 Method for crimping soft-hard combined circuit board by thermal solid gel
CN102781173A (en) * 2012-07-24 2012-11-14 景旺电子(深圳)有限公司 Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material
CN103179789A (en) * 2011-12-22 2013-06-26 深圳市大族激光科技股份有限公司 Uncapping method for soft and hard combined plate and operating system thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5739585A (en) * 1995-11-27 1998-04-14 Micron Technology, Inc. Single piece package for semiconductor die
CN101076227A (en) * 2006-05-18 2007-11-21 施汉忠 Method for crimping soft-hard combined circuit board by thermal solid gel
CN103179789A (en) * 2011-12-22 2013-06-26 深圳市大族激光科技股份有限公司 Uncapping method for soft and hard combined plate and operating system thereof
CN102781173A (en) * 2012-07-24 2012-11-14 景旺电子(深圳)有限公司 Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material

Also Published As

Publication number Publication date
CN103561538A (en) 2014-02-05

Similar Documents

Publication Publication Date Title
CN103561538B (en) Soft or hard double-sided circuit board manufacturing method
CN103648240B (en) A kind of preparation method of symmetric form rigid-flex combined board
CN103068185A (en) Manufacturing method of printed circuit board soft-hard combination substrate flexible area
CN101698367A (en) Manufacturing method of screen used for screen printing of special-shaped surfaces
CN101772268A (en) Technology for aligning circuit board by PIN nail
CN104540316A (en) Pseudo soft-rigid circuit board made of full-rigid materials and manufacturing method thereof
CN112040670A (en) Uncovering method of ultrathin rigid-flex printed circuit board
CN202293493U (en) Anti-curling asymmetric-structure copper-clad plate
CN206136480U (en) Soft or hard combines half production board
CN106455311B (en) A method of double-sided flex circuit is made using laser printing
CN105555061B (en) Improve the pcb board design method and device of internal layer plating orifice plate pressing white edge
CN102695375A (en) Method for processing 2mil micro via
CN108093569A (en) A kind of processing method for reducing super thick copper circuit board welding resistance difficulty
CN107318234A (en) Soft or hard combination half-finished product plate and preparation method thereof, Rigid Flex preparation method
CN104754488A (en) Heat-shrinkable film fitting process used for loudspeaker net cover
CN203040024U (en) Auxiliary frame plate used for flexible circuit board
CN104185363A (en) Composite type ultra-thin non-core substrate and manufacturing method thereof
CN101486291A (en) Method for manufacturing stereo pattern on object surface
CN203645911U (en) Inner-layer core plate of improving hole arranging area flat layering and multi-layer printed circuit board (PCB)
CN109219275A (en) High-level, the thick thin core layer of copper of one kind covers type method and pcb board
CN103203984B (en) A kind of printing Three-dimensional mask plate
CN104869761A (en) Manufacture method of rigid-flexible printed circuit board with outer-layer flexible printed circuit board
CN113681935A (en) Production process and application of transparent 3D glass fiber board with textures
CN103203982B (en) A kind of printing Three-dimensional mask plate
JP2011171353A (en) Method of manufacturing printed board, and printed board using this

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160614

Address after: 212000 Zhenjiang City, Jiangsu province Runzhou District Nan Xu Road No. 308 -1

Patentee after: JIANGSU HONGXIN HUAYIN CIRCUIT TECHNOLOGY Co.,Ltd.

Address before: No. 200 Nan Xu Road 212005 Zhenjiang city of Jiangsu province Runzhou Industrial Park

Patentee before: ZHENJIANG HUAYIN PRINTED CIRCUIT BOARD Co.,Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20221229

Address after: 335000 No.2 Zhilian Avenue, high tech Industrial Development Zone, Yingtan City, Jiangxi Province

Patentee after: Jiangxi Hongxin Flexible Electronic Technology Co.,Ltd.

Address before: 212000 no.308-1, Nanxu Avenue, Runzhou District, Zhenjiang City, Jiangsu Province

Patentee before: JIANGSU HONGXIN HUAYIN CIRCUIT TECHNOLOGY Co.,Ltd.