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Número de publicaciónCN103567642 A
Tipo de publicaciónSolicitud
Número de solicitudCN 201210280285
Fecha de publicación12 Feb 2014
Fecha de presentación8 Ago 2012
Fecha de prioridad8 Ago 2012
También publicado comoCN103567642B
Número de publicación201210280285.X, CN 103567642 A, CN 103567642A, CN 201210280285, CN-A-103567642, CN103567642 A, CN103567642A, CN201210280285, CN201210280285.X
Inventores陈杰良
Solicitante鸿富锦精密工业(深圳)有限公司, 鸿海精密工业股份有限公司
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Enlaces externos:  SIPO, Espacenet
蓝宝石切割装置 Sapphire cutting device traducido del chino
CN 103567642 A
Resumen
The invention provides a sapphire cutting device. The sapphire cutting device comprises an ultraviolet laser source and a collimating lens, wherein the ultraviolet laser source is used for sending out a laser beam; the collimating lens is used for converging the laser beam into a parallel laser beam; the parallel laser beam is used for cutting sapphire; the working wavelength range of the ultraviolet laser source is 200-400 nm. Thus, the cost can be reduced since the ultraviolet laser source and the collimating lens with lower cost are adopted for replacing diamond with higher cost. In addition, laser cutting can realize high-speed cutting, and the efficiency is improved.
Reclamaciones(6)  traducido del chino
1.一种蓝宝石切割装置,其特征在于包括一紫外激光源及一准直透镜;该紫外激光源用于发出一激光束;该准直透镜用于将该激光束汇聚成一平行激光束;该平行激光束用于切割蓝宝石;该紫外激光源的工作波段为200-400纳米。 A sapphire cutting device, comprising an ultraviolet laser source and collimating lens; The ultraviolet laser source for emitting a laser beam; the collimator lens for converging a laser beam parallel to the laser beam; the parallel laser beam is used to cut sapphire; the ultraviolet laser source operating band of 200-400 nm.
2.如权利要求1所述的蓝宝石切割装置,其特征在于,该紫外激光源为准分子激光源。 2. The cutting device 1 according sapphire claim, characterized in that the laser light source is an ultraviolet excimer laser source.
3.如权利要求1所述的蓝宝石切割装置,其特征在于,该紫外激光源采用激光二极管或者高功率发光二极管。 Sapphire 1 according to claim cutting apparatus, characterized in that the ultraviolet laser source is a high power laser diode or a light emitting diode.
4.如权利要求1所述的蓝宝石切割装置,其特征在于,该紫外激光源的工作波长为350-390 纳米。 1 wherein the cutting means 4. The sapphire claims, characterized in that the operating wavelength of the ultraviolet laser source is 350-390 nm.
5.如权利要求1所述的蓝宝石切割装置,其特征在于,该蓝宝石切割装置还包括一外壳;该外壳形成有一收容空间;该收容空间具有一开口;该紫外激光源收容于该收容空间内,并用于朝该开口发射该激光束;该准直透镜封闭该开口。 5. The cutting apparatus according to claim sapphire, characterized in that the apparatus further includes a sapphire cutter housing; the housing is formed with a receiving space; accommodation space having an opening; The ultraviolet laser source accommodated in the accommodating space and for emitting towards the opening of the laser beam; the collimator lens closing the opening.
6.如权利要求5所述的蓝宝石切割装置,其特征在于,该蓝宝石切割装置还包括一工作台;该工作台包括一承载台、一个三维移动臂及一控制系统;该承载台用于承载定位该蓝宝石;该承载台形成有一缝隙;该蓝宝石横跨该缝隙设置;该三维移动臂用于固持该外壳;该控制系统用于驱动该三维移动臂按预定的轨迹移动并控制该紫外激光源的开启与关闭从而切割定位于该承载台上的该蓝宝石;该预定的轨迹落入该缝隙内。 6. A cutting apparatus as claimed in claim 5, wherein the sapphire, characterized in that the apparatus further includes a sapphire cutting table; the table includes a mounting base, a three-dimensional movement and a control arm; for carrying the load platform the positioning of the sapphire; the load platform is formed with a gap; the gap across the sapphire set; three-dimensional movement of the arm for holding the housing; the control system for driving the three-dimensional movement of the control arm movement and UV laser source at a predetermined trajectory on and off in order to cut the carrier positioned in the table sapphire; the predetermined trajectory falls within the gap.
Descripción  traducido del chino

蓝宝石切割装置 Sapphire cutting device

技术领域 TECHNICAL FIELD

[0001] 本发明涉及蓝宝石切割技术,特别涉及一种蓝宝石切割装置。 [0001] The present invention relates to a cutting sapphire, sapphire and particularly to a cutting device.

背景技术 Background technique

[0002] 目前,主要通过金刚石涂层线(diamond coated wire)切割蓝宝石,然而,一方面由于金刚石本身较为昂贵,另一方面由于是接触式切割,金刚石涂层线损耗到一定程度后需更换,造成切割成本高。 [0002] Currently, the main line through the diamond coating (diamond coated wire) cut sapphire, however, on the one hand due to the diamond itself more expensive, partly because the contact cutting, diamond coating line losses to a certain extent to be replaced, resulting in high cutting costs. 另外,靠金刚石涂层线来回磨损切割蓝宝石效率较低。 In addition, diamond-coated wire by cutting back and forth wear sapphire lower efficiency.

发明内容 SUMMARY

[0003] 有鉴于此,有必要提供一种可降低成本并提高效率的蓝宝石切割装置。 [0003] In view of this, it is necessary to reduce costs and to provide a more efficient cutting means sapphire.

[0004] 一种蓝宝石切割装置,其包括一紫外激光源及一准直透镜。 [0004] A sapphire cutting device, which comprises an ultraviolet laser source and collimating lens. 该紫外激光源用于发出一激光束。 The UV laser source for emitting a laser beam. 该准直透镜用于将该激光束汇聚成一平行激光束。 The collimator lens for converging the laser beam is a parallel laser beam. 该平行激光束用于切割蓝宝石。 The parallel laser beam is used to cut sapphire. 该紫外激光源的工作波段为200-400纳米。 The ultraviolet laser source operating wavelength band of 200-400 nm.

[0005] 如此,由于采用成本较低的该紫外激光源及该准直透镜代替成本较高的金刚石,可降低成本。 [0005] Thus, thanks to the low cost of the ultraviolet laser source and collimator lens instead of the high cost of diamond, the cost can be reduced. 另外,激光切割可实现高速切割,提高效率。 Further, high-speed laser cutting can be cut, to improve efficiency.

附图说明 BRIEF DESCRIPTION

[0006] 图1为本发明较佳实施方式的蓝宝石切割装置的立体示意图。 A schematic perspective view [0006] FIG. 1 sapphire present invention the preferred embodiment of the cutting device.

[0007] 图2为图1的蓝宝石切割装置的部分平面示意图。 [0007] FIG. 2 is a partial schematic plan view of FIG. 1 sapphire cutting device.

[0008] 主要元件符号说明 [0008] The main elements Symbol Description

Figure CN103567642AD00031

如下具体实施方式将结合上述附图进一步说明本发明。 Specific embodiments are described above in conjunction with the accompanying drawings further illustrate the invention.

具体实施方式 detailed description

[0009] 请参阅图1-2,本发明较佳实施方式的蓝宝石切割装置10包括一紫外激光源100及一准直透镜200。 [0009] in Figure 1-2, the preferred embodiment of the present invention sapphire cutting means 10 comprises an ultraviolet laser source 100 and a collimator lens 200. 该紫外激光源100用于发出一激光束110。 The UV laser source 100 for emitting a laser beam 110. 该准直透镜200用于将该激光束110汇聚成一平行激光束120。 The collimator lens 200 for converging the laser beam 110 a parallel laser beam 120. 该平行激光束120用于切割蓝宝石20。 The parallel laser beam is used to cut sapphires 120 20. 该紫外激光源100的工作波段为200-400纳米。 The UV laser source operating band 100 is 200-400 nm.

[0010] 如此,由于采用成本较低的该紫外激光源100及该准直透镜200代替成本较高的金刚石,可降低成本。 [0010] Thus, due to the use of lower cost higher the UV laser source 100 and the collimator lens 200 instead of the cost of diamond, the cost can be reduced. 另外,激光切割可实现高速切割,提高效率。 Further, high-speed laser cutting can be cut, to improve efficiency.

[0011] 该紫外激光源100为准分子激光源,或者采用激光二极管或者高功率发光二极管。 [0011] The ultraviolet laser source 100 is an excimer laser light source, or the use of high-power laser diode or a light emitting diode.

[0012] 该紫外激光源100优选的工作波长为350-390纳米。 [0012] The ultraviolet laser source 100 is the preferred operating wavelength of 350-390 nm.

[0013] 具体的,该蓝宝石切割装置还包括一外壳300。 [0013] Specifically, the sapphire cutting device further comprises a housing 300. 该外壳300形成有一收容空间310。 The housing 300 is formed with a receiving space 310. 该收容空间310具有一开口312。 The housing space 310 having an opening 312. 该紫外激光源100收容于该收容空间310内,并朝该开口312发射该激光束110。 The UV laser source 100 is accommodated in the accommodating space 310, and toward the opening 312 to transmit the laser beam 110. 该准直透镜200封闭该开口312,并汇聚该激光束110。 The collimator lens 200 to close the opening 312, and the convergence of the laser beam 110.

[0014] 具体的,该蓝宝石切割装置10还包括一工作台400。 [0014] Specifically, the sapphire cutting apparatus 10 further comprises a work table 400. 该工作台400包括一承载台410、一个三维移动臂420及一控制系统430。 The table 400 includes a carrier station 410, a three-dimensional movement arm 420 and a control system 430. 该承载台410用于承载定位该蓝宝石20。 The carrier station 410 for positioning the sapphire carrier 20. 该承载台410形成有一缝隙412。 The carrier station 410 is formed with a slit 412. 该蓝宝石20横跨该缝隙412设置。 The Sapphire 20 across the slit 412 is set. 该三维移动臂420用于固持该外壳300。 The three-dimensional movement arm 420 for holding the housing 300. 该控制系统430用于驱动该三维移动臂420按预定的轨迹移动并控制该紫外激光源100的开启与关闭从而切割定位于该承载台410上的该蓝宝石20。 The control system 430 for driving the three-dimensional movement of the control arm 420 and move on and off UV laser source 100 so that the cutting station is positioned on the carrier 410 of the sapphire 20 by a predetermined trajectory. 该预定的轨迹落入该缝隙412内,如此,该蓝宝石切割装置10不会切割到该承载台410。 The predetermined trajectory falls within the slit 412, so that the sapphire cutting means 10 does not cut into the carrier station 410.

[0015] 总之,本技术领域的普通技术人员应当认识到,以上的实施方式仅是用来说明本发明,而并非用作为对本发明的限定,只要在本发明的实质精神范围之内,对以上实施例所作的适当改变和变化都落在本发明要求保护的范围之内。 [0015] In summary, one of ordinary skill in the art should be appreciated that the above embodiments are only illustrative of the invention and not used as a definition of the present invention, as long as the true spirit of the scope of the present invention, the above within the appropriate changes and modifications made to Example embodiments of the present invention fall within the scope of protection.

Citas de patentes
Patente citada Fecha de presentación Fecha de publicación Solicitante Título
CN1527754A *10 Ene 20028 Sep 2004电子科学工业公司Ultraviolet laser ablative patterning of microstructures in semiconductors
CN1607998A *27 Dic 200220 Abr 2005杰特西斯国际有限公司A method and related apparatus for cutting a product from a sheet material
CN1761549A *19 Feb 200419 Abr 2006J.P.瑟塞尔联合公司System and method for cutting using a variable astigmatic focal beam spot
CN101983825A *9 Oct 20109 Mar 2011苏州德龙激光有限公司Picosecond laser scribing device for light emitting diode (LED) wafer
CN102306624A *15 Jun 20114 Ene 2012江苏晶瑞半导体有限公司Manufacturing methods for photonic crystal and semiconductor and device comprising semiconductor
CN201913386U *30 Dic 20103 Ago 2011沈阳新松机器人自动化股份有限公司Optical fiber transmission laser welding head
JP2007320124A * Título no disponible
JPH09270565A * Título no disponible
US6437363 *3 Sep 199920 Ago 2002Murata Manufacturing Co. Ltd.Semiconductor photonic device
Otras citas
Referencia
1 *杨伟: "高精密激光切割的理论及应用技术研究", 《中国优秀硕士学位论文全文数据库 信息科技》
Clasificaciones
Clasificación internacionalB23K26/38
Clasificación cooperativaB23K2203/50, B23K26/40, B23K26/38
Eventos legales
FechaCódigoEventoDescripción
12 Feb 2014C06Publication
12 Ago 2015EXSBDecision made by sipo to initiate substantive examination
27 Jun 2017TA01
11 Jul 2017GR01