CN103607839A - Composite flexible substrate - Google Patents
Composite flexible substrate Download PDFInfo
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- CN103607839A CN103607839A CN201310516024.8A CN201310516024A CN103607839A CN 103607839 A CN103607839 A CN 103607839A CN 201310516024 A CN201310516024 A CN 201310516024A CN 103607839 A CN103607839 A CN 103607839A
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- flexible substrate
- conductive
- conductive patterns
- base material
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Abstract
The invention discloses a composite flexible substrate which has the following structure: the composite flexible substrate includes a first flexible substrate and a second flexible substrate. A plurality of first conductive patterns on the first flexible substrate and a plurality of second conductive patterns on the second flexible substrate are combined together through a conductive adhesive so as to form a plurality of interconnected structures, wherein an electrical isolation column is arranged between very two interconnected structures.
Description
Technical field
The present invention relates to a kind of printed base plate field, particularly relate to a kind of compound flexible substrate.
Background technology
Flexible substrate (flexible printed circuit board, FPCB) is due to its special bent character, so a large amount of being applied in portable electric appts.Compound flexible substrate is that multi-disc is had to the circuit board structure that the flexible substrate of conductive pattern combines.By compound flexible substrate, can be by electronics miniaturization.
But in prior art, compound flexible substrate all connects by connector conventionally, and this connected mode not only complicate fabrication process, cost cannot reduce, and the more important thing is, owing to having had more connector, therefore the further miniaturization of compound flexible substrate is restricted.
Summary of the invention
The present invention is directed to the problem that prior art exists, a kind of compound flexible substrate is provided, this flexible substrate can connect without connector, thereby can realize further miniaturization.
The compound flexible substrate that the present invention proposes, has following structure:
Compound flexible substrate comprises the first flexible substrate and the second flexible substrate, and described the first flexible substrate and the second flexible substrate combine by electroconductive binder; Wherein, the first flexible substrate is one side flexible substrate, and it comprises the first base material, covers a plurality of the first conductive patterns and first registration holes on the first base material surface;
The second flexible substrate is double-faced flexible substrate, it comprises the second base material, cover respectively a plurality of the second conductive patterns and a plurality of the 3rd conductive pattern on the first base material two sides, wherein, a plurality of the second conductive pattern surfaces do not cover insulating barrier, a plurality of the 3rd conductive pattern surface coverage have insulating barrier, and the second registration holes;
Wherein, the second registration holes alignment of the first registration holes of the first flexible substrate and the second flexible substrate, a plurality of second conductive patterns of a plurality of first conductive patterns of described the first flexible substrate by electroconductive binder and described the second flexible substrate are corresponding being bonded together one by one, jointly to form a plurality of interconnection structures, and between each interconnection structure, there is electric insulated column, the height of described electric insulated column is at least greater than the height sum of the first conductive pattern and the second conductive pattern, and the width of electric insulated column is less than the distance between a plurality of the first conductive patterns;
Wherein, described the first and second base material are formed by mylar, for example polyimides, polyimides acid imide or polyethylene naphthalenedicarboxylate formaldehyde;
Electroconductive binder is comprised of conductive particle, binder resin, curing agent and lytic agent.Described conductive particle is nano-level conducting particle, and conductive particle is for example silver, nickel or copper, and particle diameter is 100-200 nanometer.Described binder resin is for example mylar, epoxy resin or polyimide resin.When mylar is used as binder resin, isocyanate compound is as curing agent.When mylar is used as binder resin, curing agent is selected isocyanate compound.When epoxy resin is used as binder resin, curing agent is selected amines or imidazolium compounds.Lytic agent is for example cellulose solvent or butyl carbitol acetate.
Wherein, described insulating barrier is insulating resin.
Accompanying drawing explanation
Fig. 1 is the generalized section of the compound flexible substrate that proposes of the present invention.
Embodiment
Referring to Fig. 1, the compound flexible substrate that the present invention proposes, has following structure:
Compound flexible substrate comprises the first flexible substrate and the second flexible substrate, and described the first flexible substrate and the second flexible substrate combine by electroconductive binder; Wherein, the first flexible substrate is one side flexible substrate, and it comprises the first base material 100, covers a plurality of the first conductive patterns 101 and first registration holes 105 on the first base material 100 surfaces;
The second flexible substrate is double-faced flexible substrate, it comprises the second base material 200, cover respectively a plurality of the second conductive patterns 201 and a plurality of the 3rd conductive pattern 202 on the first base material 200 two sides, wherein, a plurality of the second conductive pattern 201 surfaces do not cover insulating barrier, a plurality of the 3rd conductive pattern 202 surface coverage have insulating barrier 203, and the second registration holes 205;
Wherein, the second registration holes 205 alignment of the first registration holes 105 of the first flexible substrate and the second flexible substrate, a plurality of first conductive patterns 101 of described the first flexible substrate are bonded together by electroconductive binder 300 and a plurality of second conductive patterns 201 of described the second flexible substrate, jointly to form a plurality of interconnection structures, and between each interconnection structure, there is electric insulated column 400, the height of described electric insulated column 400 is at least greater than the height sum of the first conductive pattern 101 and the second conductive pattern 201, this design of electricity insulated column 400 height, in order to meet the first flexible substrate and the second flexible substrate when bonding, electricity insulated column 400 has enough height to each interconnect architecture is carried out to electricity isolation, preferably, the height of electricity insulated column 400 be the first conductive pattern 101 and the second conductive pattern 201 1.5 times of height sum or more than.The width of electricity insulated column 400 is less than the distance between a plurality of the first conductive patterns;
Wherein, described the first base material 100 and the second base material 200 are formed by mylar, for example polyimides, polyimides acid imide or polyethylene naphthalenedicarboxylate formaldehyde;
Wherein, described insulating barrier 203 is insulating resin.
The manufacture method of introducing the compound flexible substrate of the present invention's proposition below, described method in turn includes the following steps:
(1) between a plurality of conductive patterns on the first flexible substrate surface, form electric insulated column 400;
(2) by electroconductive binder 300, the mode by spin coating is coated on the first flexible substrate;
(3) by electroconductive binder 300, the mode by spin coating is coated on the second flexible substrate;
(4) by the contraposition of the first registration holes 105 and the second registration holes 205, by the first flexible substrate and the alignment of the second flexible substrate;
(5) the first flexible substrate and the second flexible substrate is bonding;
(6) by the first flexible substrate after bonding and the heating of the second flexible substrate, thereby electroconductive binder 300 is solidified.
Wherein, the heating-up temperature of step (6) is 100-150 degree Celsius, and be 0.5-1 hour heating time.
The compound flexible substrate that the present invention proposes, the first flexible substrate is directly connected by electroconductive binder 300 with the second flexible substrate, therefore without by connector, the first flexible substrate being connected to the second flexible substrate, thereby can simplify the structure that the first flexible substrate is connected to the second flexible substrate, and owing to first first forming electric insulated column between a plurality of first conductive patterns of the first flexible substrate, therefore electroconductive binder is coated on the first flexible substrate without the mode by silk screen printing, only need to be coated on the first flexible substrate by the mode of spin coating, the mode of spin coating has been removed the process of in screen printing process, silk screen being aimed at circuit board of needing from, therefore the coating efficiency of electroconductive binder is higher, be beneficial to large-scale production.
So far the present invention has been done to detailed explanation, but the embodiment of description above the preferred embodiments of the present invention just only, it is not intended to limit the present invention.Those skilled in the art can make any modification to the present invention, and protection scope of the present invention is limited to the appended claims.
Claims (3)
1. a compound flexible substrate, has following structure:
Compound flexible substrate comprises the first flexible substrate and the second flexible substrate, a plurality of the first conductive patterns on described the first flexible substrate and a plurality of the second conductive patterns on the second flexible substrate combine by electroconductive binder, jointly to form a plurality of interconnection structures, and between each interconnection structure, there is electric insulated column.
2. compound flexible substrate as claimed in claim 1, is characterized in that:
Wherein, the first flexible substrate is one side flexible substrate, and it comprises the first base material, covers a plurality of the first conductive patterns and first registration holes on the first base material surface;
The second flexible substrate is double-faced flexible substrate, it comprises the second base material, cover respectively a plurality of the second conductive patterns and a plurality of the 3rd conductive pattern on the first base material two sides, wherein, a plurality of the second conductive pattern surfaces do not cover insulating barrier, a plurality of the 3rd conductive pattern surface coverage have insulating barrier, and the second registration holes;
Wherein, the second registration holes alignment of the first registration holes of the first flexible substrate and the second flexible substrate, a plurality of second conductive patterns of a plurality of first conductive patterns of described the first flexible substrate by electroconductive binder and described the second flexible substrate are corresponding being bonded together one by one, jointly to form a plurality of interconnection structures, and between each interconnection structure, there is electric insulated column, the height of described electric insulated column is at least greater than the height sum of the first conductive pattern and the second conductive pattern, and the width of electric insulated column is less than the distance between a plurality of the first conductive patterns.
3. compound flexible substrate as claimed in claim 2, is characterized in that:
Wherein, described the first and second base material are formed by mylar, for example polyimides, polyimides acid imide or polyethylene naphthalenedicarboxylate formaldehyde;
Electroconductive binder is comprised of conductive particle, binder resin, curing agent and lytic agent; Described conductive particle is nano-level conducting particle, and conductive particle is for example silver, nickel or copper, and particle diameter is 100-200 nanometer; Described binder resin is for example mylar, epoxy resin or polyimide resin; When mylar is used as binder resin, isocyanate compound is as curing agent; When mylar is used as binder resin, curing agent is selected isocyanate compound; When epoxy resin is used as binder resin, curing agent is selected amines or imidazolium compounds; Lytic agent is for example cellulose solvent or butyl carbitol acetate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310516024.8A CN103607839A (en) | 2013-10-26 | 2013-10-26 | Composite flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310516024.8A CN103607839A (en) | 2013-10-26 | 2013-10-26 | Composite flexible substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103607839A true CN103607839A (en) | 2014-02-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310516024.8A Pending CN103607839A (en) | 2013-10-26 | 2013-10-26 | Composite flexible substrate |
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| CN (1) | CN103607839A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0710058A2 (en) * | 1994-10-14 | 1996-05-01 | Samsung Display Devices Co., Ltd. | Inhibiting short-circuits between electrically conductive paths |
| US5545281A (en) * | 1991-11-27 | 1996-08-13 | Nec Corporation | Method of bonding circuit boards |
| CN1287285A (en) * | 1999-09-03 | 2001-03-14 | 精工爱普生株式会社 | Flexible wiring base plate, electrooptical apparatus and electronic apparatus |
| JP2001134211A (en) * | 1999-11-09 | 2001-05-18 | Seiko Epson Corp | Manufacturing method of electrooptical device |
| US20060054351A1 (en) * | 2003-03-14 | 2006-03-16 | Telefonaktiebolaget Lm Ericsson (Publ) | Substrate structure, a method and an arrangement for producing such substrate structure |
-
2013
- 2013-10-26 CN CN201310516024.8A patent/CN103607839A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5545281A (en) * | 1991-11-27 | 1996-08-13 | Nec Corporation | Method of bonding circuit boards |
| EP0710058A2 (en) * | 1994-10-14 | 1996-05-01 | Samsung Display Devices Co., Ltd. | Inhibiting short-circuits between electrically conductive paths |
| CN1287285A (en) * | 1999-09-03 | 2001-03-14 | 精工爱普生株式会社 | Flexible wiring base plate, electrooptical apparatus and electronic apparatus |
| JP2001134211A (en) * | 1999-11-09 | 2001-05-18 | Seiko Epson Corp | Manufacturing method of electrooptical device |
| US20060054351A1 (en) * | 2003-03-14 | 2006-03-16 | Telefonaktiebolaget Lm Ericsson (Publ) | Substrate structure, a method and an arrangement for producing such substrate structure |
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Application publication date: 20140226 |