CN103681411B - Naked core discharger - Google Patents
Naked core discharger Download PDFInfo
- Publication number
- CN103681411B CN103681411B CN201310390738.9A CN201310390738A CN103681411B CN 103681411 B CN103681411 B CN 103681411B CN 201310390738 A CN201310390738 A CN 201310390738A CN 103681411 B CN103681411 B CN 103681411B
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- Prior art keywords
- naked core
- deliverying unit
- bracket
- discharger
- main body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
The naked core discharger being to discharge a kind of cutting belt naked core from attaching naked core disclosed by the invention.This naked core discharger includes one of them naked core of selectively lifting so that the deliverying unit of the naked core selected by Pai Chuing；Having inner space to accommodate the bracket of deliverying unit, it includes having at least one through hole to allow the top panel that deliverying unit is vertically moved and the shell downwardly extending and having under shed from top panel by this through hole；It is connected with deliverying unit thus moves the driver element of deliverying unit in vertical direction；And insert in the under shed of bracket and accommodate the main body of driver element.In this case, bracket and main body utilize magnetic picture to connect.
Description
Technical field
Embodiments of the present invention relate to a kind of naked core discharger, more particularly, to one in semiconductor manufacturing mistake
Cheng Zhong, isolates the naked core comprising semiconductor device from wafer thus the naked core that is bonded on substrate by naked core discharges dress
Put.
Background technology
Typically, by being repeatedly carried out a series of manufacturing process, semiconductor device may be formed at as semiconductor chip
On Silicon Wafer.Semiconductor device formed as discussed above separately and can be bonded to base by bonding process by cutting process
Sheet.
The device performing naked core bonding process can include pickup model and bonding module, and pickup model is from (being divided into bag
Naked core containing semiconductor device) pick up and isolate naked core on wafer, and bonding module will the semiconductor equipment patch of pickup
It is attached on substrate.Pickup model can include supporting the countertop unit of wafer central (wafer is attached on this wafer central), being configured to
Can be moved vertically thus from the wafer that countertop unit is supported, isolate the discharger of naked core selectively and from crystalline substance
Circle picks up naked core and naked core is installed the pickup unit to substrate.
Typically, naked core discharger can include vertical lifting naked core to isolate the discharge list of naked core from cutting belt
Unit, the bracket of receiving deliverying unit, the driver element vertically moving deliverying unit and the main body of receiving driver element.In Korea S
Patent Publication No No.10-0975500 and Korean Patent Laid No.10-2009-0108447 discloses naked core described above
The example of discharger.
On the other hand, when changing deliverying unit and bracket with the size of corresponding naked core, owing to a considerable amount of time is used
In calibrating the anglec of rotation and location deliverying unit and the center of bracket, therefore use the naked core bonding facility of naked core discharger
The utilization of capacity become to significantly decrease.
Summary of the invention
Technical problem
Embodiments of the present invention provide a kind of naked core discharger, and it can be the simplest in naked core discharger
Naked core deliverying unit and bracket are changed in ground.
Technical scheme
According to the embodiment of the present invention, in the cutting belt naked core from attaching, discharge the naked core discharger of naked core
In, this naked core discharger can include one of them naked core of selectively lifting to discharge the deliverying unit of selected naked core；
Having inner space to accommodate the bracket of deliverying unit, it includes having at least one through hole to allow deliverying unit to be led to by this
Top panel that hole vertically moves and downwardly extend and have the shell of under shed from top panel；Be connected with deliverying unit thus
Vertical Square moves up the driver element of deliverying unit；And insert in the under shed of bracket and accommodate the main body of driver element.
Especially, bracket and main body may utilize magnetic picture and connect.
According to the embodiment of the present invention, the limiting section that restriction deliverying unit moves down may be provided at the inner surface of shell
On.
According to the embodiment of the present invention, the stage portion limiting main body insertion bracket degree may be provided at the upper appearance of main body
On face.
According to the embodiment of the present invention, it is provided that the permanent magnet of magnetic force can be placed in stage portion.
According to the embodiment of the present invention, deliverying unit and driver element may utilize magnetic picture and connect.
According to the embodiment of the present invention, driver element can include the head being connected with deliverying unit.Especially, permanent magnet
May be provided in head to allow head to be connected with each other with deliverying unit.
According to the embodiment of the present invention, deliverying unit can include the air chamber with upper shed, and deliverying unit passes through
Driver element forms the bottom surface with cutting belt and is in close contact, and then, air is available for being given in air chamber upwards inflate cutting with local
Band.
According to the embodiment of the present invention, deliverying unit upwards can be moved by the driver element stretched out from the top panel of bracket
Dynamic with the naked core selected by lifting.
According to the embodiment of the present invention, multiple vacuum holes are arranged above the periphery of at least one through hole of plate to hold
Cutting belt.
According to the embodiment of the present invention, deliverying unit can include inserting the eject pin at least one through hole and setting
Within the carrier to support the support panel of eject pin.
Beneficial effect
As it has been described above, according to the embodiment of the present invention, the naked core being attached in cutting belt is discharged at naked core discharger
In the case of, naked core discharger can include deliverying unit, accommodate the driving list that the bracket of deliverying unit is connected with deliverying unit
Unit and the main body being connected with bracket.
Main body can be inserted in the under shed of bracket, and the stage portion limiting main body insertion degree may be provided at the top of main body.
Especially, the permanent magnet utilizing magnetic force to connect bracket and main body can be placed in stage portion.And, deliverying unit is possible with magnetic force
It is connected with driver element.
It is as noted previously, as bracket to be connected by magnetic picture respectively with main body with main body and deliverying unit, discharges single
The replacing of unit and bracket can be very easily accomplished.It is additionally, since available meter calibration tank alignment pin to complete deliverying unit and torr
The anglec of rotation of frame is calibrated, and the time being therefore used for changing deliverying unit and bracket can greatly reduce.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the naked core adhering device using the naked core discharger according to embodiment of the present invention；
Fig. 2 and 3 is the diagrammatic cross-sectional figure of naked core discharger in Fig. 1；
Figure 4 and 5 are to utilize naked core discharger in Fig. 2 to discharge the diagrammatic cross-sectional figure of the method for naked core；
Fig. 6 is the axonometric chart of the bracket shown in Fig. 2 and deliverying unit；
Fig. 7 is the deliverying unit axonometric chart from the bracket upwards lifting state shown in Fig. 2；
Fig. 8 is the side view of the bracket shown in Fig. 2 and main body；
Fig. 9 is the diagrammatic cross-sectional figure of another embodiment of deliverying unit in Fig. 2；
Figure 10 is the axonometric chart of the bracket shown in Fig. 9 and deliverying unit；And
Figure 11 is the eject pin axonometric chart from the upwards raised condition of the bracket shown in Fig. 9.
Detailed description of the invention
Hereinafter, embodiments of the present invention are described in detail with reference to the drawings.But, the present invention is not limited to reality described below
Execute mode, and can thus be embodied in various forms.Embodiments below is provided to make those skilled in the art abundant
Understand the scope of the present invention rather than be ideally accomplished the present invention.
When describe component positioning or when being connected to another element or layer, element can be directly positioned on or be directly connected to
Can be placed in therebetween to another element or other elements or layer.Differently, it is directly positioned on or directly when describing element
When being connected to another element, there is no other elements here.In order to describe different element, assembly, region, layer and/or portions
Part, can use the term that first, second, third, etc. are like this.But, element, assembly, region, layer and/or parts are not
It is limited to this.
Techniques below term is for describing the embodiment of demonstration, but is not limited to the present invention.Or, if had
Different definition, has including all terms of technology and scientific terminology and can be understood by those skilled in the art
Same implication.Be understood at the term defined in general dictionary, have in describing correlation technique and the present invention with up and down
The implication that civilian implication is identical.Without being expressly limited by, they are not understood as that ideally or exceedingly outside contain
Justice.
Schematic diagram with reference to wherein exemplary implementations describes embodiments of the present invention.According to it, can fully expect with
The change of view shape, such as, the change in manufacture method and/or allowable error.Correspondingly, embodiments of the present invention are also
It not to be described as being limited to the concrete shape of demonstration area in view but include form variations, and the district demonstrated in the view
Territory is generally illustrated, shape therein is not that the exact shape describing this region does not limits the scope of the invention yet.
Fig. 1 is the schematic diagram of the naked core adhering device using the naked core discharger 100 according to embodiment of the present invention, figure
2 and 3 is the diagrammatic cross-sectional figure of naked core discharger 100.
Referring to figs. 1 to 3, during naked core discharger 100 can be used on naked core bonding, for from the crystalline substance being made up of naked core 20
Circle 10 isolates the naked core 20 comprising semiconductor device, and naked core 20 is bonded to substrate.Especially, wafer 10 can be set to
It is attached to cutting belt 32, and cutting belt 32 can be fixed on and have on the wafer central 30 that diameter is bigger than wafer 10 diameter.
Wafer central 30 can be clamped by the fixture 42 being placed on workbench 40, and the marginal portion of cutting belt 32 can be by disposing
Extension ring 44 on workbench 40 supports.Fixture 42 can move wafer central 30 vertically downward to extend cutting belt 32, therefore
Cutting belt 32 is extended by extension ring 44.As its result, the interval between the naked core 20 being attached to cutting belt 32 can be extended.
Naked core discharger 100 can be placed in below workbench 40, with lifting naked core 20 selectively from cutting belt 32
In isolate naked core 20, and pick device 50 can be placed in the top of workbench 40 and lifted by naked core discharger 100 with pickup
The naked core 20 risen.
With reference to Fig. 2 and 3, naked core discharger 100 can be used to discharge naked core 20 from cutting belt 32.
According to present embodiment, naked core discharger 100 can include the deliverying unit 110 of upwards lifting naked core 20, accommodate
The bracket 120 of deliverying unit 110, the driver element 130 vertically moving deliverying unit 110 and the master of receiving driver element 130
Body 140.
In order to discharge in naked core 20 selectively, deliverying unit 110 can naked core 20 selected by lifting.Drive single
Unit 130 can include the head 132 being connected with deliverying unit 110 and for transmitting the drive shaft 134 of driving force.Although the most in detail
Carefully illustrating, drive shaft 134 is connectable to provide the driving force feed unit (not shown) of driving force, available motor, cylinder,
Analog such as driving force transmitting element and by using different methods for configuration driven power feed unit.
Bracket 120 can have the inner space for accommodating deliverying unit 110.Such as, bracket 120 can include top panel
122 and shell 124, top panel 122 has at least one through hole 122A to allow deliverying unit 110 to move in vertical direction,
Shell 124 downwardly extends from top panel 122 and has under shed.
The under shed of shell 124 can be connected with main body 140, and the head 132 of driver element 130 and drive shaft 134 can led
Body 140 moves in vertical direction.
Such as, the shell 124 of bracket 120 and main body 140 can have the shape of substantially pipe.But, the scope of the present invention
It is not limited to this shell 124 and the shape of main body 140.
The top of main body 140 can be inserted in the under shed of shell 124, as it can be seen, limit main body 140 to insert the platform of degree
Rank portion 142 can be placed in the upper outer surface of main body 140.
On the other hand, the limiting section 126 moved down for limiting deliverying unit 110 can be placed in the interior table of shell 124
On face.Deliverying unit 110 moving horizontally in bracket 120 can be limited by the through hole 122A of top panel 122, the most fair
Permitted to vertically move.Especially, moving up of deliverying unit 110 can be limited by top panel 122, moves down, can be subject to
The restriction of stop 126.As its result, deliverying unit 110 can be allowed to only to vertically move in bracket 120 one section predetermined
Distance, and if necessary, deliverying unit 110 and bracket 120 can together be replaced.
According to present embodiment, when deliverying unit 110 must be changed with the change in size of corresponding naked core 20, bracket 120
Can together be changed with deliverying unit 110.Especially, corresponding to each naked core 20, be made up of deliverying unit 110 and bracket 120
Replacing group prepare in advance, deliverying unit 110 and bracket can be used selectively according to the size of corresponding naked core 20
120。
Further, connect the structure of bracket 120 and main body 140 and be connected the structure of deliverying unit 110 and driver element 130
Can be configured to complete deliverying unit 110 and the replacing of bracket 120 simplerly.
According to present embodiment, the shell 124 of bracket 120 and main body 140 may utilize magnetic picture and connect.Such as, permanent magnetism
Body 150 can be placed in the stage portion 142 of main body 140 thus allows bracket 120 and main body 140 to utilize magnetic picture to connect.Example
As, as it can be seen, multiple permanent magnet 150 can be embedded in below stage portion 142 upper surface.But, or, permanent magnet 150 can
Come out from the upper surface of stage portion 142.In this case, the shell 124 of bracket 120 can be made up of magnetic material, and
And, the top of main body 140 can be made up of nonmagnetic substance.
On the other hand, what permanent magnet 150 can be greatly enhanced between the bottom surface of shell 124 and the end face of stage portion 142 is tight
Close exposure level and the depth of parallelism, and available magnetic force firmly keeps the connection status between bracket 120 and main body 140.Phase
Ying Di, naked core 20 stably can be discharged in naked core discharge process.
According to another embodiment of the present invention, the additional permanent magnet corresponding with the permanent magnet 150 of main body 140 (does not shows
Go out) may be installed in the shell 124 of bracket 120.In this case, the shell 124 of bracket 120 and the top of main body 140
All can be made up of nonmagnetic substance.
And, it is possible with magnetic picture according to present embodiment, deliverying unit 110 and driver element 130 and connects.Example
As, the multiple permanent magnets 136 utilizing magnetic force clamp to handle deliverying unit 110 can be embedded in the head 132 of driver element 130, row
Go out unit 110 to be made up of magnetic material.It addition, or, the permanent magnet corresponding with the permanent magnet 136 of head 132 (does not shows
Go out) can be embedded in deliverying unit 110.
On the other hand, deliverying unit 110 can have the air chamber 112 with upper shed.Air can be supplied in air chamber 112
Thus the naked core 20 selected by allowing easily is discharged.
Figure 4 and 5 are the diagrammatic cross-sectional figures of the method utilizing naked core discharger 100 to discharge naked core, and Fig. 6 is bracket 120
With the axonometric chart of deliverying unit 110, Fig. 7 is that deliverying unit 110 moves up the axonometric chart of state from bracket 120.
With reference to Fig. 4 to 7, be not shown, naked core discharger 100 can by additional driver element (not shown) to
Upper movement, in order to the top panel 122 of bracket 120 can start the bottom surface with cutting belt 32 and be in close contact.
Then, deliverying unit 110 can by the driver element 130 that stretches out as shown in Figure 4 from the end face of top panel 122 upwards
Mobile, the most upwards naked core 20 selected by lifting and cutting belt 32.In this case, it is used for holding part cutting belt 32
Multiple vacuum hole 122B may be provided on top panel 122.
Such as, as it can be seen, multiple vacuum hole 122B can dispose around the through hole 122A disposing deliverying unit 110, and can
Hold the part cutting belt 32 being placed in selected naked core 20 periphery.It is placed in selected naked core 20 periphery by holding
Part cutting belt 32 so that selected naked core 20 easily separates from cutting belt 32.
Especially, as shown in Figure 4, when the top of deliverying unit 110 protrudes upward from top panel 122, selected is naked
The marginal portion of core 20 can separate from cutting belt 32.
Then, as it is shown in figure 5, when air is supplied to air chamber 112, owing to the end face of deliverying unit 110 starts and cutting
Bottom surface with 32 is in close contact, and a part for the cutting belt 32 being positioned on the air chamber 112 of deliverying unit 320 is inflated, and therefore permits
Permitted from cutting belt 32, be gradually disengaged out selected naked core 20.
On the other hand, air can be supplied in air chamber 112 by drive shaft 134 and head 132, and vacuum can pass through main body
140 provide in bracket 120.In this case, as it can be seen, potted component 170 and 172 can be respectively disposed on main body 140
And between shell 124 and between deliverying unit 110 and head 132.
On the other hand, as shown in Figures 6 and 7, there is linear or criss-cross identification line may be formed at the top of bracket 120
Face, and can be used for using vision module to carry out center calibration when changing bracket 120 and deliverying unit 110.
Fig. 8 is bracket 120 and the side view of main body 140.
With reference to Fig. 8, the alignment pin 144 that the anglec of rotation for bracket 120 and deliverying unit 110 is calibrated can be placed in main body
The upper outer surface of 140, corresponding to this, can form meter calibration tank 129 in the under shed part of bracket 120, and alignment pin 144 is inserted in
In meter calibration tank 129.
As it has been described above, according to present embodiment, owing to bracket 120 and main body 140 are by being placed in the stage portion of main body 140
Permanent magnet 150 in 142 is connected, and the replacing of bracket 120 can be very easily accomplished.And, utilize alignment pin 144 and school
Quasi-groove 128, can be very easily accomplished anglec of rotation calibration, the most greatly subtract when changing bracket 120 and deliverying unit 110
Lack and changed the time that bracket 120 and deliverying unit 110 are consumed.
Especially, according to present embodiment, kind many groups bracket 120 and deliverying unit 110 according to naked core 20 are in advance
Preparing, when changing, the replacing of bracket 120 and deliverying unit 110 can complete at short notice.As its result, by
Decreasing in the time being used for changing one group of bracket 120 and deliverying unit 110, the naked core including naked core discharger 100 bonds
The utilization of capacity of equipment improves.
Fig. 9 is the diagrammatic cross-sectional figure of the deliverying unit 180 according to another embodiment of the present invention, and Figure 10 is bracket 190
With the axonometric chart of deliverying unit 180, Figure 11 is that eject pin 182 moves up the axonometric chart of state from bracket 190.
With reference to Fig. 9 to 11, according to another embodiment of the present invention, deliverying unit 180 may be housed in and includes top panel 192 He
In the bracket 190 of shell 194, and can include eject pin 182 and support panel 184, eject pin 182 is inserted in the upper of bracket 190
In the through hole 192A formed in panel 192, support panel 184 is arranged in bracket 190 support eject pin 182.
As it can be seen, support panel 184 can include relative with the permanent magnet 136 being placed in driver element 130 head 132
The permanent magnet 186 answered, and deliverying unit 180 can be by the magnetic picture interconnection produced by permanent magnet 136 and 186 with head 132
Connect.And, eject pin 182 also can be by the magnetic force of permanent magnet 186 being embedded in support panel 184 and support panel 184 phase
Connect.
On the other hand, as shown in Figure 10, there is linear or criss-cross identification line may be provided at the end face of bracket 190
On, and can be used for using vision module to carry out center calibration when changing bracket 190 and deliverying unit 180.Especially, basis is worked as
When the kind of naked core 20 prepares many group brackets and deliverying unit, identify that line can be used for determining the position that eject pin 182 inserts.That is,
During preparing these many groups, the support panel 184 of deliverying unit 180 can be prepared in bracket 190 in advance.In this situation
Under, identify that line can be used for determining the position that eject pin 182 inserts through hole 192A.
Being as noted previously, as eject pin 182 is to be prepared by the pre-position being inserted in bracket 190, is used for
The time changing bracket 190 and deliverying unit 180 more decreases.
As it has been described above, according to the embodiment of the present invention, discharge at naked core discharger 100 and be attached in cutting belt 32
In the case of naked core 20, naked core discharger 100 can include deliverying unit 110, the bracket 120 accommodating deliverying unit 110 and row
Go out the driver element 130 that unit 110 connects and the main body 140 being connected with bracket 120.
Main body 140 can be inserted in the under shed of bracket 120, and restriction main body 140 is inserted the stage portion 142 of degree and be may be provided at
On the top of main body 140.Especially, the permanent magnet 150 utilizing magnetic force to connect bracket 120 and main body 140 can be placed in stage portion
In 142.And, deliverying unit 110 is possible with magnetic force and is connected with driver element 130.
Being as noted previously, as bracket 120 and main body 140 and deliverying unit 110 with main body 140 is by magnetic force phase respectively
Connecting, the replacing of deliverying unit 110 and bracket 120 is very readily completed.It is additionally, since deliverying unit 110 and torr
The available meter calibration tank 128 of anglec of rotation calibration of frame 120 and alignment pin 144 complete, and are used for changing deliverying unit 110 and bracket
The time of 120 can greatly reduce.
Although the present invention is shown specifically with reference to exemplary implementations and is described, it should be recognized that affiliated technology is led
The those of ordinary skill in territory, in the case of without departing from the spirit and scope of the present invention being defined by the claims, can be made at shape
Various changes in formula and details.
Claims (8)
1. the naked core discharger discharging described naked core the cutting belt of naked core from attaching, this naked core discharger bag
Include:
One of them naked core of lifting is to discharge the deliverying unit of selected naked core selectively；
Having inner space to accommodate the bracket of described deliverying unit, described bracket includes having at least one through hole to allow institute
State the top panel that deliverying unit is vertically moved by described through hole, and downwardly extend from described top panel and there is under shed
Shell；
It is connected with described deliverying unit thus moves the driver element of described deliverying unit in vertical direction；
Insert in the under shed of described bracket and accommodate the main body of described driver element, and
Limit the limiting section that described deliverying unit moves down to be arranged on the inner surface of described shell,
Wherein said bracket utilizes magnetic picture to connect with described main body, and described deliverying unit utilizes with described driver element
Magnetic picture connects.
Naked core discharger the most according to claim 1, wherein limits described main body and inserts the step of described bracket degree
Portion is arranged on the upper outer surface of described main body.
Naked core discharger the most according to claim 2, wherein provides the permanent magnet of magnetic force to be arranged in described stage portion.
Naked core discharger the most according to claim 1, wherein said driver element includes being connected with described deliverying unit
Head, and
During wherein permanent magnet is arranged on described head, to allow described head to be connected with each other with described deliverying unit.
Naked core discharger the most according to claim 1, wherein said deliverying unit includes the air chamber with upper shed, and
And described deliverying unit forms the bottom surface with described cutting belt by described driver element and is in close contact, then, air is supplied to
Described air chamber upwards inflates described cutting belt with local.
Naked core discharger the most according to claim 5, wherein said deliverying unit is by from the top panel of described bracket
The described driver element stretched out moves up with naked core selected described in lifting.
Naked core discharger the most according to claim 5, plurality of vacuum hole is arranged at least the one of described top panel
The periphery of individual through hole is to hold described cutting belt.
Naked core discharger the most according to claim 1, wherein said deliverying unit includes:
Insert the eject pin at least one through hole described；And
It is arranged in described bracket to support the support panel of described eject pin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020120007791U KR200468690Y1 (en) | 2012-08-31 | 2012-08-31 | Die ejecting apparatus |
| KR20-2012-0007791 | 2012-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103681411A CN103681411A (en) | 2014-03-26 |
| CN103681411B true CN103681411B (en) | 2016-09-14 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310390738.9A Active CN103681411B (en) | 2012-08-31 | 2013-08-30 | Naked core discharger |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR200468690Y1 (en) |
| CN (1) | CN103681411B (en) |
| TW (1) | TWI508220B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101585316B1 (en) | 2014-01-29 | 2016-01-13 | 세메스 주식회사 | Apparatus for ejecting a die |
| KR101640533B1 (en) * | 2015-04-06 | 2016-07-19 | 한미반도체 주식회사 | Semiconductor Chip Pick-Up System |
| KR101687022B1 (en) * | 2015-06-26 | 2016-12-22 | 주식회사 네오세미텍 | Die suction device |
| CN106783713A (en) * | 2015-11-20 | 2017-05-31 | 环维电子(上海)有限公司 | The manufacture of SIP modules, pick-up method and equipment and EMI electromagnetic shielding layer manufacturing methods |
| CN107221510B (en) * | 2016-03-22 | 2020-09-15 | 晟碟信息科技（上海）有限公司 | System and method for separating semiconductor die from die attach film tape |
| KR101935097B1 (en) * | 2016-08-10 | 2019-01-03 | 세메스 주식회사 | Die ejecting apparatus |
| KR102594542B1 (en) * | 2018-10-31 | 2023-10-26 | 세메스 주식회사 | Die ejecting apparatus |
| CN110504208B (en) * | 2019-09-24 | 2021-11-16 | 大连佳峰自动化股份有限公司 | Thimble system |
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| US6201306B1 (en) * | 1995-12-05 | 2001-03-13 | Kabushiki Kaisha Toshiba | Push-up pin of a semiconductor element pushing-up device, and a method for separating |
| CN1768422A (en) * | 2003-04-10 | 2006-05-03 | 松下电器产业株式会社 | Apparatus and method for picking up semiconductor chip |
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| KR970005492Y1 (en) * | 1994-03-12 | 1997-06-05 | 현대전자산업 주식회사 | Semiconductor chip ejector |
| US7665204B2 (en) * | 2006-10-16 | 2010-02-23 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
| JP4985513B2 (en) * | 2008-03-26 | 2012-07-25 | 富士通セミコンダクター株式会社 | Method and apparatus for peeling electronic parts |
| JP4215818B1 (en) * | 2008-06-30 | 2009-01-28 | 株式会社新川 | Semiconductor die pickup apparatus and pickup method |
| KR100975500B1 (en) * | 2008-07-14 | 2010-08-11 | 세미텍 주식회사 | Die Ejecting Device For Die Bonding Device |
| TW201011857A (en) * | 2008-09-02 | 2010-03-16 | Gallant Prec Machining Co Ltd | Peeling off method and device |
| TW201124321A (en) * | 2010-01-11 | 2011-07-16 | Asm Assembly Automation Ltd | Flanged collet for die pick-up tool |
| KR20110090553A (en) * | 2010-02-04 | 2011-08-10 | 한미반도체 주식회사 | Ejecting device for die bonder |
| US8256103B2 (en) * | 2010-03-05 | 2012-09-04 | Asm Assembly Automation Ltd | Actuator for maintaining alignment of die detachment tools |
| JP5598205B2 (en) * | 2010-09-22 | 2014-10-01 | トヨタ自動車株式会社 | Socket quick change adapter |
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2012
- 2012-08-31 KR KR2020120007791U patent/KR200468690Y1/en active IP Right Grant
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- 2013-07-31 TW TW102127399A patent/TWI508220B/en active
- 2013-08-30 CN CN201310390738.9A patent/CN103681411B/en active Active
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|---|---|---|---|---|
| US6201306B1 (en) * | 1995-12-05 | 2001-03-13 | Kabushiki Kaisha Toshiba | Push-up pin of a semiconductor element pushing-up device, and a method for separating |
| CN1768422A (en) * | 2003-04-10 | 2006-05-03 | 松下电器产业株式会社 | Apparatus and method for picking up semiconductor chip |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200468690Y1 (en) | 2013-08-29 |
| TW201426903A (en) | 2014-07-01 |
| TWI508220B (en) | 2015-11-11 |
| CN103681411A (en) | 2014-03-26 |
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