CN1036945C - Microwave probe for coplanar integrated circuit chip - Google Patents
Microwave probe for coplanar integrated circuit chip Download PDFInfo
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- CN1036945C CN1036945C CN94102728A CN94102728A CN1036945C CN 1036945 C CN1036945 C CN 1036945C CN 94102728 A CN94102728 A CN 94102728A CN 94102728 A CN94102728 A CN 94102728A CN 1036945 C CN1036945 C CN 1036945C
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- probe card
- ground wire
- probe
- microwave
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Abstract
The present invention relates to a signal transmission device used for the electrical property sheet detection of a coplanar integrated circuit chip, wherein a signal wire 15, a front grounding wire 16 and a conductive contact 19 are arranged on the lower surface of a probe board, a back grounding wire 8 is arranged on the upper surface, and all the grounding wires and a conductive metal module 2 are electrically conductive wires by a low-temperature metal welding material. The conductive contact is formed by that a hard metal ball is coated in soft metal, and the lower end of an insulting medium column 7 is in a semicylindrical staircase shape. A central conductive wire 3 in the insulting medium column 7 and the signal wire 15 switch into conduction by the low-temperature metal welding material 4. The present invention has the advantages of little insertion and reflection loss, bandwidth increase, uniform and continuous characteristic impedance, reduction of radio frequency inductance in a grounding loop, high durability of conductive contact, no chip damage, etc.
Description
The invention belongs to a kind of signal transmitting apparatus that is used for detecting the coplanar integrated circuit chip electrology characteristic at sheet.
When coplanar integrated circuit chip was detected, common electron probe (for example tungsten tipped probe) with producing serious spurious impedance, can't transmit signal when frequency tens of million is above.Therefore, it can only provide direct current or low frequency characteristic, is not enough to judge the quality of performance of integrated circuits.The chip microwave probe that particular design is made is a kind of transition.It will finish coaxial transmission line is transition between the signal bond pad to the conversion between the co-planar waveguide and co-planar waveguide to the external transmission line of device under test chip, realize the uniformity consistency of direct current, arrive the broadband electricity contact of microwave frequency range for an interim direct current is provided between testing apparatus and the coplanar integrated circuit chip bond pad to the impedance of microwave wideband band scope internal characteristic.Use the chip microwave probe before coplanar integrated circuit chip cleavage, bonding, encapsulation, to detect performance of integrated circuits.
With the immediate chip microwave probe of the present invention be " surveying the device of microwave circuit " that a patent of invention of the U.S. provides, patented claim day is on June 5th, 1989, application number is 363027, patent announcement number is 4965514.The structure of the device of this patent disclosure can be divided into three parts-probe card, metal module and converter joint.The bottom surface of probe card wherein is equipped with coplanar waveguide transmission line, the ground wire that comprises signal wire and both sides thereof, the conductive contact of metal is housed at the test lead of signal wire and two ground wires, the other end at probe card, the center conductor of signal wire and converter joint links, and two ground wires and metal module link.This structure, for the characteristic impedance that guarantees coplanar waveguide transmission line does not depart from setting value, the upper surface of probe card (being the substrate back of the probe card) metal conducting layer that do not have, and should adopt on metal module cutting method to eliminate influence to characteristic impedance.This cutting method just is difficult to prove effective when on probe card many signal line being arranged.Simultaneously, the characteristic impedance of the transition portion of coaxial X-over and coplanar waveguide transmission line when microwave is converted to the coplane conduction by coaxial conduction, can cause bigger energy loss because structural former thereby have a uncontinuity.The conductive contact that this patent provides because material is single, is not that to be damaged the life-span easily not long.It is exactly the performance of the bond pad destruction chip under test of damage chip under test when measuring.
The objective of the invention is to overcome the shortcoming of prior art, farthest improve the uncontinuity of coaxial transmission line, realize the uniformity consistency of the characteristic impedance of chip microwave probe in the broad frequency range effectively to conversion and transition between the co-planar waveguide; Save the complicated technologies such as cutting of metal module simultaneously, also even continuously when finishing many signal line, and conductive contact is suitable for durable.
For achieving the above object, on the basis of prior art, co-planar waveguide (CPW) plate is designed to ground co-planar waveguide (GCPW) plate, promptly make the land used coplanar waveguide transmission line at probe card of the present invention, upper surface (being the back side) at probe card is covered with the large-area back side ground wire that metal level constitutes, provide a good RF earth potential, no longer cutting on metal module simultaneously.Adopt many signal line convergent form, and add additional ground wire and the method for good ground RF current potential is provided between two adjacent signal wires, conversion continuity when finishing many signal line and impedance operator uniformity reduce the stray inductance of RF ground passage effectively.Adopt the way that includes hard conductive metallic material ball in the soft conductive metallic material to make conductive contact, reaching is the durable purpose of not damaging chip bonding pad to be measured again.
Following mask body is narrated the structure of microwave probe for coplanar integrated circuit chip of the present invention.
Microwave probe of the present invention mainly includes probe card, conducting metal module, three parts of microwave coaxial X-over.
Probe card wherein is that the microwave-medium substrate with insulating material is the ground co-planar waveguide plate of body making.The signal wire of metal is arranged and at the front ground wire of two strip metals of signal wire both sides on the microwave-medium substrate of the front of probe card (being bottom surface), on signal wire and front ground wire, conductive contact is housed respectively in the end of probe of probe card.On the microwave-medium substrate, be covered with metal level as back side ground wire at the back side of probe card (being upper surface); Between the front and back of probe card, penetrate the microwave-medium substrate.Have several apertures, use the low-temperature metal scolder that front ground wire and back side ground wire electricity are connected by aperture; Simultaneously two front ground wires are connected with the conductive filament electricity by the low-temperature metal scolder in the aperture.
Conducting metal module wherein plays a part fixing probe card and microwave coaxial X-over, also be in the two transition jointly.The conducting metal module is a derby with vertical circular hole, vertically circular hole is used to insert the insulating medium post of microwave coaxial X-over, in the bottom surface of conducting metal module level probe card is installed, and the rear end (other end corresponding with end of probe) of probe card and the lower end of insulating medium post are joined.Probe card is to be installed on the conducting metal module by the groove that has on the conducting metal module bottom surface, and the concentration of groove is identical with the thickness of probe card; The shape of groove and size are in harmony the rearward end that makes probe card and are bumped in the groove; After probe card was bumped into the groove of conducting metal module, the front ground wire used low-temperature metal scolder envelope to connect and the electricity connection by the marginal portion of probe card side and the recess edge of conducting metal module.
Microwave coaxial X-over wherein comprises the insulating medium post that inserts in the vertical circular hole of conducting metal module, the insulating medium post is along axis hollow, the center conductor of packing in it, center conductor touches the rear end end surfaces of probe card, and connect with signal wire electricity, coaxial cable connector is screwed the top in the conducting metal module.Probe links to each other with external unit by coaxial cable connector.
Signal wire on the aforesaid probe card, front ground wire and back side ground wire are ground co-planar waveguide (GCPW) plates that adopts the gradual change of photoetching process making.Probe card uses conducting resinl to make the surperficial bonding to guarantee firmly and good electrical contact of back side ground wire and groove when being bumped into the groove of conducting metal module.The end of probe of probe card can be made into gable top, and promptly sloping detection termination, its oblique angle can be about 10 °, like this when measuring, but measuring microscope Direct observation and determine the position foremost in probe card front.
In order to be illustrated more clearly in structure of the present invention, can be referring to Fig. 1～4.
Fig. 1 is that figure is partly cutd open in the structure side-looking of microwave probe of the present invention.
Fig. 2 is the structure backplan of microwave probe of the present invention.
Fig. 3 is the A-A sectional view of Fig. 1.
Fig. 4 is the multiple contact probe card of the present invention backplan of (comprising two signal line).
In Fig. 1, the 1st, coaxial cable connector by the top of screw retention in conducting metal module 2, is inserted with insulating medium post 7 in the vertical circular hole in the centre of conducting metal module 2.Probe card is to be bumped into conducting metal module 2 by the groove that has on conducting metal module 2 lower surfaces.The bottom surface of the front of probe card and conducting metal module 2 is in (being the deep equality of the thickness and the groove of probe card) in the same plane.The back side of probe card is covered with the back side ground wire 8 of metal level, and back side ground wire 8 is connected with the groove surfaces electricity of conducting metal module 2.
It is step-like that the lower end of insulating medium post 7 is a semicylinder, and the high surface 5 of step is higher than the low surface 6 of step.Their difference in height can equal the thickness of probe card.The high surface of step 5 contact with the back side, probe card rear end face, and does not have back side ground wire 8 on the plane that contacts with each other, and promptly belongs to insulating medium post 7 and follows the electrical isolation of microwave-medium substrate 10 to contact.The rear end end face of probe card is near center conductor 3, and the signal wire 15 on the probe card is connected with center conductor 3 usefulness low-temperature metal scolders 4 electricity.
On the make, center conductor 3 can grow insulating medium post 7 sub-fractions, and promptly the lower surface of center conductor 3 is lower than the low surface 6 of step of insulating medium post 7, and fraction and signal wire 15 usefulness low-temperature metal scolders 4 electricity that center conductor 3 grows are connected.The front of low surface 6 of step and probe card and the bottom surface of conducting metal module 2 are in a plane substantially.
Among Fig. 1, the 9th, be used to the low-temperature metal material material that the front ground wire is connected with conducting metal module 2 bottom recesses edges electricity; 19 are mounted in the conductive contact of front ground wire 16 end of probe, and the 13rd, make front ground wire and back side ground wire 8 electricity connect the aperture of being opened.
Fig. 2 provides the bottom surface structural drawing of microwave probe, to probe card is front view, given is has three conductive contacts 18,19,20, each front ground wire the 16,17, the 10th of a signal line 15 placed in the middle and both sides, the microwave-medium substrate of the insulation that manifests between signal wire 15 and the two front ground wires 16,17.The 13rd, front ground wire 16 penetrates several apertures that microwave-medium substrate 10 is left with between the back side ground wire 8,14 is some apertures of leaving with 8 of back side ground wires at another front ground wire 17, be welded with conductive filament 21 between each relative aperture in twos 13 and 14, low-temperature metal scolder in conductive filament 21 and the aperture 13,14 is with front ground wire 16,17, back side ground wire 8 all electricity is connected, and by low-temperature metal scolder 9 and conducting resinl they and conducting metal module 2 electricity are connected, provide a common earth potential to effectively reduce the stray inductance of RF ground passage.The same meaning that label 2,3,4,6 among Fig. 2 and Fig. 1 represent.
As shown in Figure 2, the shape of the front and back of probe card is that two waists are grown up in the triangle on base, and detector is made on leg-of-mutton top, and leg-of-mutton base is the rear end of probe card; Said signal wire 15, front ground wire 16,17 are made into the ground coplanar waveguide transmission line of gradual change.This transmission line that narrows down gradually can be designed to required characteristic impedance value.The said conductive contact the 18,19, the 20th that is installed in coplanar waveguide transmission line tip, ground constitutes by comprising a hard conductive metallic material ball in the softer metals.
The part that conducting metal module 2 is installed probe card can be made into trapezoidal cross-section, and promptly from insulation medium post 6, the width of conducting metal module 2 narrows down gradually, can reduce the side direction volume of microwave probe of the present invention like this, is suitable for practicality.
Fig. 3 can significantly demonstrate the position relation of conducting metal module 2 bottom surfaces groove of leaving and the probe card that is bumped into.Demonstrate the position relation of aperture 13,14, back side ground wire 8, front ground wire, demonstrate the situation that conducting metal module 2 recess edge and probe card edge ( front ground wire 16,17 edges) are connected with low-temperature metal scolder 9 electricity.
The structure of this many signal line that is be that the structure of many conductive contacts is called the multiconductor probe, said additional ground wire also is the gradually narrow transmission line of making by the photoetching way, and they are connected with the electricity of front ground wire, back side ground wire also can pass through aperture, conductive filament and the realization of low-temperature metal scolder.
The present invention can also be made into the double-contact probe of a signal line and a front ground wire; The multiconductor probe of many front ground wires of many signal line; Can also be many signal line, many front ground wires and the multiconductor probe that has the power supply supply lines, wherein the power supply supply lines need to consider an impedance resistance, links to each other with the feedthrough capacitor that is fixed on conducting metal module place and draws.
Fig. 4 has provided a kind of structural drawing of the multiconductor probe of many signal line.Provide two signal line 15,25 arranged side by side among Fig. 4, two front ground wires 16,17 are arranged in both sides, between two signal line 15,25, increase an additional ground wire 26.All ground wires-just at ground wire 16,17, back side ground wire 8, additional ground wire 26 connects into electric pathway by aperture 13,14,24 usefulness low-temperature metal scolders, the conductive filament 21 that penetrates microwave-medium substrate 10.The effect of additional ground wire 26 can reduce electrical cross talk between each signal wire 15,25, the characteristic impedance in keeping again transmitting.
The present invention has in use reduced insertion and reflection loss significantly, increases the bandwidth of microwave probe.Owing to make the conduction of land used coplane, at the probe card back side large-area metal ground is arranged, the characteristic impedance of microwave transmission line is not subjected to the influence of conducting metal module contact area, thereby needn't be in the place's grooving of probe card surface of contact, thereby help making, help improving the homogeneity of microwave probe characteristic impedance.Owing to used the step-like insulating medium post of a semicylinder, improved the uncontinuity of the characteristic impedance in coaxial-co-planar waveguide transition, help reducing transition loss.Owing to front ground wire, back side ground wire electricity are connected with the low-temperature metal scolder by aperture, conductive filament, are made the ground co-planar waveguide have a good same earth potential, thereby reduced the stray inductance in the ground circuit.Because the probe card rear end is to be bumped in the groove of conducting metal module, make conducting metal module and ground that good electrical contact be arranged, also be of value to the radio frequency inductive that reduces in the ground circuit.Make conductive contact owing to used the way of soft, hard metal material combination.And make chip bonding pad to be measured injury-free, prolonged the serviceable life of microwave probe again.Because the conducting metal module has reduced the detection termination that the end of probe of side direction volume and probe card has the slope, and easy to use.Owing to when many and column signal line, between every adjacent two signal line, increase an additional ground wire, and make the characteristic impedance of multiple contact probe in can keeping transmitting, can reduce the electrical cross talk between signal wire again.
Claims (5)
1. microwave probe for coplanar integrated circuit chip, its structure is mainly by probe card, conducting metal module (2), three parts of microwave coaxial X-over constitute, probe card wherein is that the microwave-medium substrate (10) with insulating material is the co-planar waveguide plate of body making, front at probe card, it is bottom surface, the signal wire (15) of metal is arranged and at the front ground wire (16 of two strip metals of signal wire (15) both sides on microwave-medium substrate (10), 17), in the end of probe of probe card at signal wire (15) and front ground wire (16, conductive contact (18 is housed respectively 17), 19,20), conducting metal module (2) wherein is a derby with vertical circular hole, vertically circular hole is used to insert the insulating medium post (7) of microwave coaxial X-over, in the bottom surface of conducting metal module (2) level probe card is installed, and the rear end of probe card and the lower end of insulating medium post (7) are joined; Microwave coaxial X-over wherein comprises the insulating medium post (7) that inserts in the vertical circular hole of conducting metal module (2), insulating medium post (7) is along axis hollow, the center conductor (3) of packing in it, center conductor (3) touches the rear end end surfaces of probe card, and connect with signal wire (15) electricity, coaxial cable connector (1) is screwed on conducting metal module (2) top, the invention is characterized in:
1. at the back side of probe card, promptly upper surface is covered with metal level as back side ground wire (8) on microwave-medium substrate (10); Between the front and back of probe card, penetrate microwave-medium substrate (10) and have several apertures (13,14), use the low-temperature metal scolder, front ground wire (16,17) and back side ground wire (8) electricity are connected by aperture (13,14); Simultaneously two front ground wires (16,17) are connected with conductive filament (21) electricity by the low-temperature metal scolder in the aperture (13,14).
The bottom surface of 2. said conducting metal module (2) has groove, depth of groove is identical with the thickness of probe card, the shape of groove and size are in harmony the rearward end that makes probe card and are bumped in the groove, after probe card was bumped into the groove of conducting metal module (2), front ground wire (16,17) used low-temperature metal scolder (9) envelope to connect and the electricity connection by the marginal portion of probe card side and the recess edge of conducting metal module (2).
2. according to the described microwave probe for coplanar integrated circuit chip of claim 1, the lower end that it is characterized in that said insulating medium post (7) is that a semicylinder is step-like, the high surface of step (5) is higher than the low surface of step (6), the high surface of step (5) contacts with the back side, the rear end face of probe card, and there is not back side ground wire (8) on the plane that contacts with each other, the rear end end face of probe card is near center conductor (3), and the signal wire on the probe card (15) is connected with low-temperature metal scolder (4) electricity with center conductor (3).
3. according to claim 1 or 2 described microwave probe for coplanar integrated circuit chip, the shape that it is characterized in that the front and back of probe card is that two waists are grown up in the triangle on base, and end of probe is made on leg-of-mutton top, and leg-of-mutton base is the rear end of probe card; Described signal wire (15) and front ground wire (16,17) are made into the ground coplanar waveguide transmission line of gradual change; Said conductive contact (18,19,20) is to constitute by comprising a hard conductive metallic material ball in the softer metals.
4. according to claim 1 or 2 described microwave probe for coplanar integrated circuit chip, it is characterized in that said signal wire (15) makes many side by side, between every adjacent two signal line (15), increase an additional ground wire (26), all additional ground wires (26) and front ground wire (16,17) and back side ground wire (8) electricity are connected.
5. according to the described microwave probe for coplanar integrated circuit chip of claim 3, it is characterized in that said signal wire (15) makes many side by side, increase an additional ground wire (26) between every adjacent two signal line (15), all additional ground wires (26) and front ground wire (16,17) and back side ground wire (8) electricity are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN94102728A CN1036945C (en) | 1994-03-15 | 1994-03-15 | Microwave probe for coplanar integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN94102728A CN1036945C (en) | 1994-03-15 | 1994-03-15 | Microwave probe for coplanar integrated circuit chip |
Publications (2)
| Publication Number | Publication Date |
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| CN1095483A CN1095483A (en) | 1994-11-23 |
| CN1036945C true CN1036945C (en) | 1998-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94102728A Expired - Fee Related CN1036945C (en) | 1994-03-15 | 1994-03-15 | Microwave probe for coplanar integrated circuit chip |
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Families Citing this family (10)
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| JP4789686B2 (en) * | 2006-04-05 | 2011-10-12 | 株式会社ユニオンアロー・テクノロジー | Microprobe unit using microprobe guide and staggered microprobe unit |
| TW200829922A (en) | 2007-01-08 | 2008-07-16 | Microelectonics Technology Inc | High frequency probe |
| CN101275970B (en) * | 2007-03-28 | 2010-05-26 | 南亚科技股份有限公司 | Testing device and probe structure thereof |
| JP2009192419A (en) * | 2008-02-15 | 2009-08-27 | Micronics Japan Co Ltd | Probe unit and inspection device |
| CN103995157A (en) * | 2013-02-17 | 2014-08-20 | 诚佑光电股份有限公司 | Probe, detecting head and wafer detecting device using the detecting head |
| CN104678132A (en) * | 2013-11-27 | 2015-06-03 | 中国航空工业集团公司雷华电子技术研究所 | Ka frequency band base plate integrated magnetic coupling near field probe |
| CN105092975B (en) * | 2015-09-23 | 2017-11-03 | 广州兴森快捷电路科技有限公司 | Single-ended impedance measuring head in pcb board |
| CN107315098B (en) * | 2017-05-27 | 2019-09-17 | 中国电子科技集团公司第十三研究所 | Coplanar test probe of microwave and preparation method thereof |
| CN110470917A (en) * | 2019-07-22 | 2019-11-19 | 西安电子科技大学 | A kind of high temperature resistant electric-field probe applied to high temperature and high speed plasma internal electric field distribution measuring |
| CN114062736B (en) * | 2021-10-14 | 2022-12-06 | 西安电子科技大学 | Broadband coaxial probe structure for microwave near-field test |
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| EP0230766A1 (en) * | 1985-12-23 | 1987-08-05 | Tektronix, Inc. | Wafer probes |
| US4697143A (en) * | 1984-04-30 | 1987-09-29 | Cascade Microtech, Inc. | Wafer probe |
| US4749942A (en) * | 1985-09-26 | 1988-06-07 | Tektronix, Inc. | Wafer probe head |
| US4764723A (en) * | 1986-11-10 | 1988-08-16 | Cascade Microtech, Inc. | Wafer probe |
| EP0290182A1 (en) * | 1987-05-06 | 1988-11-09 | Hewlett-Packard Company | High frequency passive probe |
| US4853627A (en) * | 1985-12-23 | 1989-08-01 | Triquint Semiconductor, Inc. | Wafer probes |
| US4965514A (en) * | 1989-06-05 | 1990-10-23 | Tektronix, Inc. | Apparatus for probing a microwave circuit |
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1994
- 1994-03-15 CN CN94102728A patent/CN1036945C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4697143A (en) * | 1984-04-30 | 1987-09-29 | Cascade Microtech, Inc. | Wafer probe |
| US4749942A (en) * | 1985-09-26 | 1988-06-07 | Tektronix, Inc. | Wafer probe head |
| EP0230766A1 (en) * | 1985-12-23 | 1987-08-05 | Tektronix, Inc. | Wafer probes |
| US4853627A (en) * | 1985-12-23 | 1989-08-01 | Triquint Semiconductor, Inc. | Wafer probes |
| US4764723A (en) * | 1986-11-10 | 1988-08-16 | Cascade Microtech, Inc. | Wafer probe |
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| US4965514A (en) * | 1989-06-05 | 1990-10-23 | Tektronix, Inc. | Apparatus for probing a microwave circuit |
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| CN1095483A (en) | 1994-11-23 |
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