CN103706525A - Photoresist suction prevention type spin coater tray - Google Patents
Photoresist suction prevention type spin coater tray Download PDFInfo
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- CN103706525A CN103706525A CN201310685767.8A CN201310685767A CN103706525A CN 103706525 A CN103706525 A CN 103706525A CN 201310685767 A CN201310685767 A CN 201310685767A CN 103706525 A CN103706525 A CN 103706525A
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- vacuum
- silicon chip
- photoresist
- suction
- glue
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Abstract
The invention discloses a photoresist suction prevention type spin coater tray, comprising a silicon chip bearing platform, a vacuum chip suction structure and a suction opening protection structure located on the vacuum chip suction structure, wherein a silicon chip bearing plane is arranged at the upper end of the silicon chip bearing platform, a concave photoresist storage tank is formed in the middle of the silicon chip bearing platform, and a lug boss is arranged in the middle of the photoresist storage tank; the vacuum chip suction structure comprises an upper end and a vacuum chip suction opening, the upper end is located in the lug boss, and the vacuum chip suction opening is located on the top of the upper end; the suction opening protection structure is located at the top end of the lug boss. By means of the manner, the photoresist suction prevention type spin coater tray disclosed by the invention can effectively prevent photoresist from being sucked into the vacuum chip suction opening in a swinging process and prevent the photoresist flowing into the photoresist storage tank from being sucked into the vacuum chip suction opening again after reaching a certain height so as to avoid the insufficient suction force or blockage of the vacuum chip suction opening due to suction of the photoresist.
Description
Technical field
The present invention relates to sol evenning machine apparatus field, particularly relate to a kind of sol evenning machine pallet that prevents that glue from sucking.
background technology
The mode that existing photoresist glue evenning table adopts vacuum to inhale sheet holds silicon chip, but existing silicon chip wafer-supporting platform cannot effectively stop that photoresist infiltrates vacuum and inhales in sheet mouth in whipping process, prior art as shown in Figure 1, silicon chip is inhaled sheet mouth with vacuum and is directly contacted, sol evenning machine is in High Rotation Speed process, photoresist is subject to rotary centrifugal force and capillary synergy, be launched into thin film, wherein in whipping process, be thrown out of to the glue of silicon chip edge and drip, due to silicon chip edge and the pressure differential of wafer-supporting platform suction sheet mouth and the capillary effect of colloid, the glue of part silicon chip edge drips and can be inhaled into along the back side of silicon chip in vacuum suction sheet mouth, thereby stop up vacuum and inhale sheet mouth, cause vacuum to inhale sheet mouth suction not enough, thereby cause the uniformity variation of photoresist film, can cause damage to glue evenning table simultaneously.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of sol evenning machine pallet that prevents that glue from sucking, can effectively stop that photoresist is inhaled into vacuum and inhales in sheet mouth in whipping process, can prevent from flowing into simultaneously and after photoresist in storage glue groove reach a certain height, be again inhaled into vacuum and inhale in sheet mouth, avoid vacuum to inhale sheet mouth because the suction that sucks photoresist and cause is not enough or stop up.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of sol evenning machine pallet that prevents that glue from sucking is provided, comprises: silicon chip wafer-supporting platform, vacuum are inhaled chip architecture and are positioned at vacuum and inhale the suction inlet protection structure in chip architecture; The upper end of described silicon chip wafer-supporting platform is provided with silicon chip load plane, centre offers a recessed storage glue groove, in the centre of described storage glue groove, is provided with a boss; Described vacuum is inhaled chip architecture and is comprised: upper end and vacuum are inhaled sheet mouth, and described upper end is positioned at described boss, and described vacuum is inhaled the top that sheet mouth is positioned at described upper end, and the vertical range that described vacuum is inhaled between sheet mouth and described silicon chip load plane is greater than 3mm; Described suction inlet protection structure is positioned at the top of described boss, in described suction inlet protection structure, is also provided with " T " shape bleed-off passage, and the lower port of described bleed-off passage is communicated with described vacuum suction sheet mouth.
In a preferred embodiment of the present invention, described storage glue groove is circular platform type, comprising: notch and bottom land, and the area of described notch is greater than the area of described bottom land.
In a preferred embodiment of the present invention, described boss is cylindrical, and it is highly the 3/5-4/5 of described storage glue groove depth.
In a preferred embodiment of the present invention, the cylindrical cap-like structure of described suction inlet protection structure, comprising: at the bottom of crown, cap and the cap wall concaving between being positioned at the bottom of described crown and cap.
In a preferred embodiment of the present invention, the through hole of bleeding of described bleed-off passage both sides is positioned on described cap wall, and is close to described crown.
In a preferred embodiment of the present invention, the center of circle of described vacuum suction sheet mouth and the center of circle of described silicon chip load plane are on same vertical line.
The invention has the beneficial effects as follows: the present invention prevents the sol evenning machine pallet that glue sucks, in the centre of silicon chip wafer-supporting platform, offer storage glue groove, photoresist is thrown out of to the glue of silicon chip back side in whipping process and under the effect of gravity, first flow into and store up in glue groove, avoided vacuum to inhale sheet mouth and caused suction deficiency or stop up because sucking photoresist; And the suction inlet protection structure of cap-like structure is installed on the top of boss; portion is provided with " T " shape bleed-off passage within it; protect on the one hand vacuum to inhale sheet mouth; thoroughly prevent that glue from splashing into; changing on the other hand air-flow suction direction is side direction; make to store up the certain draught head of the interior formation of vacuum cavity of glue groove and silicon chip formation, suction inlet can prevent that the photoresist that inflow is stored up in glue groove is again inhaled in vacuum suction sheet mouth after reaching a certain height at the bottom of protecting structural cap simultaneously.
Accompanying drawing explanation
Fig. 1 is existing sol evenning machine support holder structure schematic diagram;
Fig. 2 is the structural representation that the present invention prevents sol evenning machine pallet one preferred embodiment that glue sucks;
Fig. 3 is local structure for amplifying schematic diagram shown in Fig. 2;
Fig. 4 is structural representation in running order shown in Fig. 2;
In accompanying drawing, the mark of each parts is as follows: 1, silicon chip wafer-supporting platform, 2, vacuum inhales chip architecture, 3, suction inlet protection structure; 4, silicon chip, 10, storage glue groove, 11, boss; 12, silicon chip load plane, 20, upper end, 21, vacuum inhales sheet mouth; 30, the through hole of bleeding, 31, cap wall, 32, crown; 33, at the bottom of cap; 100, notch, 101, bottom land, H, vacuum are inhaled the vertical range between sheet mouth and silicon chip load plane.
The specific embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
Refer to Fig. 2, Fig. 3 and Fig. 4, the embodiment of the present invention comprises:
Prevent the sol evenning machine pallet that glue sucks, comprising: silicon chip wafer-supporting platform 1, vacuum are inhaled chip architecture 2 and are positioned at vacuum and inhale the suction inlet protection structure 3 in chip architecture 2, the upper end of described silicon chip wafer-supporting platform 1 is provided with silicon chip load plane 12, centre offers a recessed storage glue groove 10, in the centre of described storage glue groove 10, is provided with a boss 11, described vacuum is inhaled chip architecture 2 and is comprised: upper end 20 and vacuum are inhaled sheet mouth 21, described upper end 20 is positioned at described boss 11, described vacuum is inhaled the top that sheet mouth 21 is positioned at described upper end 20, and the vertical range that described vacuum suction sheet mouth 21 and described silicon chip load plane are 12 is greater than 3mm, even if inhaling sheet mouth 21, vacuum directly do not contact with silicon chip, leave certain gap between the two, thereby first photoresist is thrown out of to the glue at silicon chip 4 back sides in whipping process flow into and stores up in glue groove 10 under the effect of gravity, thereby can effectively stop that photoresist is inhaled into vacuum and inhales in sheet mouth 21, described suction inlet protection structure 3 is positioned at the top of described boss 11, in described suction inlet protection structure 3 inside, be also provided with " T " shape bleed-off passage, and the lower port of described bleed-off passage is inhaled sheet mouth 21 with described vacuum and is communicated with, making air pass through T " shape bleed-off passage inhales sheet mouth 21 places toward vacuum and takes out, thereby further protect vacuum to inhale sheet mouth 21.
Wherein, described storage glue groove 10 is circular platform type, comprise: notch 100 and bottom land 101, and the area of described notch 100 is greater than the area of described bottom land 101, the area of notch 100 is larger can guarantee that the photoresist that throws away silicon chip edge in sol evenning machine rotation all penetrates in storage glue groove 10.。
Described boss 11 is cylindrical, and it is highly the 3/5-4/5 of described storage glue groove depth, and structure 3 is also protected for fixing described suction inlet is installed in the top of described boss 11, and suction inlet protection structure 3 is not protruded from outside described notch 100, avoids affecting laying of silicon chip 4.
The cylindrical cap-like structure of described suction inlet protection structure 3; comprise: at the bottom of crown 32, cap 33 and be positioned at 33 cap walls 31 that concave at the bottom of described crown 32 and cap; can effectively avoid vacuum to inhale sheet mouth 21 and suck photoresist; and at the bottom of cap, 33 can prevent that the photoresist that is positioned at storage glue groove 10 is after reaching a certain height, and again by vacuum, are inhaled sheet mouth 21 and suck.
The through hole 30 of bleeding of described bleed-off passage both sides is positioned on described cap wall 31, and be close to described crown 32, the back side and the air in storage glue groove 10 of silicon chip 4 are taken away toward vacuum suction sheet mouth 21 places by the through hole 30 of bleeding, thereby make the back side of silicon chip 4 and storage glue groove 10 interior in negative pressure state, form a vacuum chamber.
The center of circle of described vacuum suction sheet mouth 21 and the center of circle of described silicon chip load plane 12 are on same vertical line, be center of circle alignment, to realize the photoresist that drops on silicon chip surface even coating the uniform film of generate one deck under rotary centrifugal force and capillary synergy.
The course of work is as follows: as shown in Figure 4, first silicon chip 4 is placed on silicon chip load plane 12, and alignd in both centers of circle, then open vacuum and inhale chip architecture 2, air is inhaled sheet mouth 21 and is moved from " T " shape bleed-off passage toward vacuum, thereby make the back side of silicon chip 4 and storage glue groove 11 form a vacuum cavity, it is the atmospheric pressure that the atmospheric pressure in silicon chip 4 fronts is greater than its back side, thereby silicon chip 4 is firmly adsorbed on silicon chip load plane 12, then in or low speed rotation static at silicon chip 4, drip glue, dripping glue amount determines according to the size of the viscosity of photoresist and silicon chip 4, drip after cementing bundle, sol evenning machine High Rotation Speed makes photoresist layer attenuation reach the thickness of final requirement.Wherein photoresist is thrown out of to the glue at silicon chip 4 back sides when arriving the notch 100 of described storage glue groove 10 in whipping process, due to the air pressure of the air pressure in storage glue groove 10 lower than storage glue groove 10 edges, photoresist drops under draught head and Action of Gravity Field and overcomes surface tension, therefore glue drips, under meeting, drop in storage glue groove 10 and be stored in wherein, thereby prevented that glue from dripping obstruction vacuum and inhaling sheet mouth 21, but in glue evenning table High Rotation Speed process, glue in storage glue groove 10 drips the effect that is subject to centrifugal force, still can be to surrounding whipping, at the bottom of cap in suction inlet protection structure 3,33 can keep away the photoresist that is positioned at storage glue groove 10 and after reaching a certain height, inhaled sheet mouth 21 again by vacuum and suck, there is further protection vacuum and inhale the effect of sheet mouth 21.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. prevent the sol evenning machine pallet that glue sucks, it is characterized in that, comprising: silicon chip wafer-supporting platform, vacuum are inhaled chip architecture and are positioned at vacuum and inhale the suction inlet protection structure in chip architecture; The upper end of described silicon chip wafer-supporting platform is provided with silicon chip load plane, centre offers a recessed storage glue groove, in the centre of described storage glue groove, is provided with a boss; Described vacuum is inhaled chip architecture and is comprised: upper end and vacuum are inhaled sheet mouth, and described upper end is positioned at described boss, and described vacuum is inhaled the top that sheet mouth is positioned at described upper end, and the vertical range that described vacuum is inhaled between sheet mouth and described silicon chip load plane is greater than 3mm; Described suction inlet protection structure is positioned at the top of described boss, in described suction inlet protection structure, is also provided with " T " shape bleed-off passage, and the lower port of described bleed-off passage is communicated with described vacuum suction sheet mouth.
2. the sol evenning machine pallet that prevents that glue from sucking according to claim 1, is characterized in that, described storage glue groove is circular platform type, comprising: notch and bottom land, and the area of described notch is greater than the area of described bottom land.
3. the sol evenning machine pallet that prevents that glue from sucking according to claim 1, is characterized in that, described boss is cylindrical, and it is highly the 3/5-4/5 of described storage glue groove depth.
4. the sol evenning machine pallet that prevents that glue from sucking according to claim 1, is characterized in that, the cylindrical cap-like structure of described suction inlet protection structure, comprising: at the bottom of crown, cap and the cap wall concaving between being positioned at the bottom of described crown and cap.
5. according to the sol evenning machine pallet that glue sucks that prevents described in claim 1 or 4, it is characterized in that, the through hole of bleeding of described bleed-off passage both sides is positioned on described cap wall, and is close to described crown.
6. the sol evenning machine pallet that prevents that glue from sucking according to claim 1, is characterized in that, the center of circle of described vacuum suction sheet mouth and the center of circle of described silicon chip load plane are on same vertical line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310685767.8A CN103706525B (en) | 2013-12-16 | 2013-12-16 | The sol evenning machine pallet preventing glue from sucking |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310685767.8A CN103706525B (en) | 2013-12-16 | 2013-12-16 | The sol evenning machine pallet preventing glue from sucking |
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| Publication Number | Publication Date |
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| CN103706525A true CN103706525A (en) | 2014-04-09 |
| CN103706525B CN103706525B (en) | 2015-12-09 |
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| CN201310685767.8A Expired - Fee Related CN103706525B (en) | 2013-12-16 | 2013-12-16 | The sol evenning machine pallet preventing glue from sucking |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921368A (en) * | 2016-06-29 | 2016-09-07 | 南通大学 | Three-cavity-layer type end cap special for vacuum suction piece mouth of spin coater tray |
| CN105954975A (en) * | 2016-06-29 | 2016-09-21 | 南通大学 | Special WiFi-type end cover for vacuum suction sheet opening of spin coater tray |
| CN105964498A (en) * | 2016-06-29 | 2016-09-28 | 南通大学 | Special inserting strip type end cover used on vacuum substrate sucking port of tray of photoresist homogenizing machine |
| CN110052370A (en) * | 2019-05-15 | 2019-07-26 | 苏州美图半导体技术有限公司 | Sol evenning machine vacuum spin coating device |
| CN113522650A (en) * | 2021-07-14 | 2021-10-22 | 衡东光通讯技术（深圳）有限公司 | Automatic glue injection and suction equipment and method for optical communication connector |
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| US4889069A (en) * | 1987-11-23 | 1989-12-26 | Tazmo Co., Ltd. | Substrate coating equipment |
| JPH10294261A (en) * | 1997-04-18 | 1998-11-04 | Sony Corp | Device for applying resist |
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| CN101498895A (en) * | 2008-01-28 | 2009-08-05 | 东京应化工业株式会社 | Photoresist supply recovering system and photoresist recovering method |
| CN102259083A (en) * | 2011-01-19 | 2011-11-30 | 沈阳芯源微电子设备有限公司 | Spin-coating method of thick film used in semiconductor packaging |
| US8091504B2 (en) * | 2006-09-19 | 2012-01-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for cleaning spin coater |
| CN203725340U (en) * | 2013-12-16 | 2014-07-23 | 南通大学 | Spin coater tray capable of preventing glue suction |
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2013
- 2013-12-16 CN CN201310685767.8A patent/CN103706525B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4889069A (en) * | 1987-11-23 | 1989-12-26 | Tazmo Co., Ltd. | Substrate coating equipment |
| US5952050A (en) * | 1996-02-27 | 1999-09-14 | Micron Technology, Inc. | Chemical dispensing system for semiconductor wafer processing |
| JPH10294261A (en) * | 1997-04-18 | 1998-11-04 | Sony Corp | Device for applying resist |
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| CN102259083A (en) * | 2011-01-19 | 2011-11-30 | 沈阳芯源微电子设备有限公司 | Spin-coating method of thick film used in semiconductor packaging |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105921368A (en) * | 2016-06-29 | 2016-09-07 | 南通大学 | Three-cavity-layer type end cap special for vacuum suction piece mouth of spin coater tray |
| CN105954975A (en) * | 2016-06-29 | 2016-09-21 | 南通大学 | Special WiFi-type end cover for vacuum suction sheet opening of spin coater tray |
| CN105964498A (en) * | 2016-06-29 | 2016-09-28 | 南通大学 | Special inserting strip type end cover used on vacuum substrate sucking port of tray of photoresist homogenizing machine |
| CN105964498B (en) * | 2016-06-29 | 2018-08-10 | 南通大学 | A kind of slip-type end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth |
| CN105954975B (en) * | 2016-06-29 | 2019-11-26 | 南通大学 | A kind of WiFi shape end cap being exclusively used on sol evenning machine tray vacuum suction piece mouth |
| CN110052370A (en) * | 2019-05-15 | 2019-07-26 | 苏州美图半导体技术有限公司 | Sol evenning machine vacuum spin coating device |
| CN110052370B (en) * | 2019-05-15 | 2024-04-02 | 苏州美图半导体技术有限公司 | Vacuum glue homogenizing device of glue homogenizing machine |
| CN113522650A (en) * | 2021-07-14 | 2021-10-22 | 衡东光通讯技术（深圳）有限公司 | Automatic glue injection and suction equipment and method for optical communication connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103706525B (en) | 2015-12-09 |
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Granted publication date: 20151209 Termination date: 20161216 |