CN103752576A - Jig universal for centrifugal cleaning - Google Patents

Jig universal for centrifugal cleaning Download PDF

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Publication number
CN103752576A
CN103752576A CN201410014968.XA CN201410014968A CN103752576A CN 103752576 A CN103752576 A CN 103752576A CN 201410014968 A CN201410014968 A CN 201410014968A CN 103752576 A CN103752576 A CN 103752576A
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CN
China
Prior art keywords
pallet
slide block
circular surface
tray
eccentric cleaning
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CN201410014968.XA
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Chinese (zh)
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CN103752576B (en
Inventor
王彦桥
孙忠新
刘晓阳
朱敏
高锋
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Wuxi Jiangnan Computing Technology Institute
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Wuxi Jiangnan Computing Technology Institute
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Priority to CN201410014968.XA priority Critical patent/CN103752576B/en
Publication of CN103752576A publication Critical patent/CN103752576A/en
Application granted granted Critical
Publication of CN103752576B publication Critical patent/CN103752576B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention provides a jig universal for centrifugal cleaning. The jig comprises a tray, a slider set and fixing pins, the tray is of a disc-shaped structure, the slider set is arranged on the round surface of the tray, multiple discharging hole pairs are arranged between the slider set and the periphery of the tray, a central connecting line opposite to each discharging hole pair is perpendicular to the radius of the round surface of the tray, the fixing pins are arranged in one of the discharging hole pairs according to actual needs, the slider component comprises three parts including a fixed slider, a spring and an adjustable slider which care fixed at the center of the round surface of the tray, one end of the spring is fixedly connected to the fixed slider while the other end of the same is connected to the adjustable slider, and the adjustable slider is attached to the tray in a manner of being only capable of sliding in the radius direction of the round surface of the tray.

Description

A kind of eccentric cleaning General purpose jig
Technical field
The present invention relates to integrated circuit and manufacture field, more particularly, the present invention relates to a kind of eccentric cleaning General purpose jig.
Background technology
The flow process in when assembling encapsulation generally comprises: print fluxing first, checks the quality of scaling powder printing, secondly print solder paste, check the printing quality of tin cream, the 3rd paster, is installed to components and parts the position of appointment, the 4th reflow soldering, the 5th nude film cleans, and fill the 6th bottom.
Reverse installation process is the conventional preparation method of a kind of wafer-level package, upside-down mounting bare chip and common SMT(surface mounting technology) device is different, its salient point is many, diameter and pitch little.Compare with traditional encapsulation, wafer-level package needs bottom to fill to alleviate the hot mismatch between chip and substrate, and the necessary condition that fill bottom is to clean up.As do not washed clean excessively clearly, will cause bottom to be filled and have bubble, have a strong impact on packaged chip life-span and reliability.As shown in Figure 1, after the reflow soldering of flip-chip silicon chip, at silicon chip and PCB substrate contacts face place, there is residual scaling powder, if this residual flux does not clean up the effect that the follow-up bottom of impact is filled, and then affect chip reliability.
Packaging body is different because of its design, has different sizes.Thus, conventional cleaning adopts eccentric cleaning, needs to use special fixture and special equipment, makes that the cost that drops into is high, the cycle is long, and cause processing parameter adjust complicated, adjustment cycle is long, need to carry out related process and test definite parameters.
Summary of the invention
Technical problem to be solved by this invention is for there being above-mentioned defect in prior art, provides a kind of and packaging body can be installed and is locked at the eccentric cleaning General purpose jig that cleans on centrifugal tool and meet the packaging body demand of different size.
According to the present invention, a kind of eccentric cleaning General purpose jig is provided, it comprises: pallet, slide block group and steady pin; Wherein, pallet is disc-shaped structure; Slide block group is arranged in the circular surface of pallet; In slide block group, between the periphery of pallet, be furnished with a plurality of rounds pair, wherein the right line of centres of each round is all vertical with the radius of the circular surface of pallet; Steady pin is arranged in a pair of round centering of a plurality of round centerings according to the actual requirements; Slide block group comprises 3 parts, is respectively fixedly slide block, spring and the adjustable skid of the center of the circular surface that is fixed to pallet; Wherein, one end of spring is fixedly attached to fixedly slide block, and the other end is connected to adjustable skid; Adjustable skid is attached to pallet in the mode that only can slide on the radial direction of the circular surface of pallet.
Preferably, the end that the main body of adjustable skid contacts with packaged chip to be cleaned has inverted triangle structure, wherein this three-legged structure limit is parallel with the circular surface of pallet, and another limit contacts with tray surface, and two determined planes in limit and holding tray surface are 45 ° and intersect.
Preferably, slide block group is arranged in the center of the circular surface of pallet.
Preferably, the diameter of the circular surface of pallet is determined according to the size of eccentric cleaning groove.
Preferably, the radius of the circular surface of pallet is preferably 80mm.
In the present invention, the structural design of adjustable skid and diverse location steady pin, in order to adjust distance; Steady pin is done initial adjustment, and adjustable skid is finely tuned.And a pair of steady pin and adjustable skid have formed triangle fixed structure, can lock packaged chip to be cleaned.Thus, the present invention not only can install packaging body be locked at and clean on centrifugal tool, and can meet the packaging body demand of different size.Further, the inverted triangle structural design of the end that adjustable skid main body contacts with packaged chip to be cleaned, in order to further locking packaged chip to be cleaned.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily to the present invention, there is more complete understanding and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows the welding assisted agent residuals after the reflow soldering of flip-chip silicon chip.
Fig. 2 schematically shows the structure of eccentric cleaning General purpose jig according to the preferred embodiment of the invention.
Fig. 3 schematically shows the structure of the slide block group of eccentric cleaning General purpose jig according to the preferred embodiment of the invention.
Fig. 4 schematically show eccentric cleaning General purpose jig according to the preferred embodiment of the invention installation the structure of packaged chip to be cleaned.
Fig. 5 schematically shows the topology example of the fixedly slide block of the slide block group of eccentric cleaning General purpose jig according to the preferred embodiment of the invention.
It should be noted that, accompanying drawing is used for illustrating the present invention, and unrestricted the present invention.Note, the accompanying drawing that represents structure may not be to draw in proportion.And in accompanying drawing, identical or similar element indicates identical or similar label.
The specific embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
Fig. 2 schematically shows the structure of eccentric cleaning General purpose jig according to the preferred embodiment of the invention.
As shown in Figure 2, eccentric cleaning General purpose jig comprises according to the preferred embodiment of the invention: pallet 100, slide block group 200 and steady pin 300.
Wherein, pallet 100 is disc-shaped structure; And slide block group 200 is arranged in the circular surface of pallet 100.Preferably, slide block group 200 is arranged in the center of the circular surface of pallet 100, and at this moment the size of installable chip to be cleaned can reach maximum.Wherein, for example, the diameter of the circular surface of pallet 100 is determined according to the size of eccentric cleaning groove.Particularly, the size of base plate for packaging to be cleaned is conventionally within 15*15mm-40*40mm, so the radius of the circular surface of pallet 100 is preferably 80mm, and such carrier has the ability to meet the demand of most of substrate completely.
In slide block group 200, to being furnished with a plurality of rounds between the periphery of pallet 100 to 101, wherein each round is all vertical with the radius of the circular surface of pallet 100 to 101 the line of centres.
Steady pin 300 be arranged in a plurality of rounds to a pair of round in 101 in 101.For example, Fig. 1 shows steady pin 300 and is arranged in outmost round to the situation in 101.Thus, make packaged chip to be cleaned can be arranged in outermost round to 101 and slide block group 200 between.
Further, as shown in Figure 3, slide block group 200 comprises fixedly slide block 21, spring 22 and the adjustable skid 23 of the center of the circular surface that is fixed to pallet 100.Wherein, one end of spring 22 is fixedly attached to fixedly slide block 21, and the other end is fixedly attached to adjustable skid 23.
Wherein, adjustable skid 23 is attached to pallet 100 in the mode that only can slide on the radial direction of the circular surface of pallet 100; Spring 22 can promote adjustable skid 23 on the radial direction of the circular surface of pallet 100 like this.
For example, the long lumbar hole 232 that adjustable skid 23 comprises card main body 231 and forms in card main body 231.Adjustable skid 23 is attached to pallet slidably by screw (not shown).
For the use of said apparatus, Fig. 4 schematically show eccentric cleaning General purpose jig according to the preferred embodiment of the invention installation the structure of packaged chip 400 to be cleaned.In operation, the adjustment of size is divided into two steps, and first according to the position of size Selection one end steady pin of packaged chip 400 to be cleaned, secondly the other end can be realized by the adjustment of adjustable skid the fine setting of package dimension; The size that has limited packaging body after the size at two ends is fixed, the position of steady pin and the various combination of adjustable skid have just been realized the demand of different package body sizes so.And a pair of steady pin and adjustable skid have formed triangle fixed structure, can lock packaged chip to be cleaned.
Although only show the situation that a pallet 100 only comprises one group of slide block group 200 and steady pin 300 in figure, in fact can comprise the combination of a plurality of slide block groups 200 and steady pin 300 on a pallet 100; Thus, can once to a plurality of packaged chips to be cleaned, carry out cleaning treatment.
More particularly, Fig. 5 schematically shows the topology example of the fixedly slide block of the slide block group of eccentric cleaning General purpose jig according to the preferred embodiment of the invention.
As shown in Figure 5, preferably, the main body of adjustable skid 23 (for example, card main body 231) end contacting with packaged chip to be cleaned has inverted triangle structure 2311, wherein this three-legged structure 2311 limit is parallel with the circular surface of pallet 100, another limit and pallet 100 Surface Contacts, two determined planes in limit and pallet 100 planes are 45 ° and intersect.
That is, this three-legged structure 2311 is recessed towards the circular surface of pallet 100.Like this, during mounted package substrate, packaged chip 400 to be cleaned promotes adjustable skid 23 along the direction of the arrow A shown in Fig. 5, adjustable skid 23 compresses towards fixing slide block direction, make spring 22 in compressive state, one jiao of substrate is packed between two steady pins, and the inverted triangle by adjustable skid end card designs, and further locks packaged chip to be cleaned.After locking, base plate for packaging can move in a circle together along with the rotation of disk, thereby realized locking, installs.Meet the requirement of eccentric cleaning.
Therefore, in the present invention, the structural design of adjustable skid and diverse location steady pin, in order to adjust distance; Steady pin is done initial adjustment, and adjustable skid is finely tuned.And a pair of steady pin and adjustable skid have formed triangle fixed structure, can lock packaged chip to be cleaned.Thus, the present invention not only can install packaging body be locked at and clean on centrifugal tool, and can meet the packaging body demand of different size.Further, the inverted triangle structural design of the end that card main body contacts with packaged chip to be cleaned, in order to further locking packaged chip to be cleaned.
Be understandable that, although the present invention with preferred embodiment disclosure as above, yet above-described embodiment is not in order to limit the present invention.For any those of ordinary skill in the art, do not departing from technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement to make many possible changes and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not depart from technical solution of the present invention,, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.

Claims (5)

1. an eccentric cleaning General purpose jig, is characterized in that comprising: pallet, slide block group and steady pin;
Wherein, pallet is disc-shaped structure; And slide block group is arranged in the circular surface of pallet; In slide block group, between the periphery of pallet, be furnished with a plurality of rounds pair, wherein the right line of centres of each round is all vertical with the radius of the circular surface of pallet; Steady pin is arranged in a pair of round centering of a plurality of round centerings;
And slide block group comprises fixedly slide block, spring and the adjustable skid of the center of the circular surface that is fixed to pallet; Wherein, one end of spring is fixedly attached to fixedly slide block, and the other end is fixedly attached to adjustable skid;
Wherein, adjustable skid is attached to pallet in the mode that only can slide on the radial direction of the circular surface of pallet.
2. eccentric cleaning General purpose jig according to claim 1, it is characterized in that, the end that the main body of adjustable skid contacts with packaged chip to be cleaned has inverted triangle structure, wherein this three-legged structure limit is parallel with the circular surface of pallet, another limit contacts with tray surface, it is characterized in that, two determined planes in limit and angle that holding tray surface is are preferably 45 °.
3. eccentric cleaning General purpose jig according to claim 1 and 2, is characterized in that, slide block group is arranged in the center of the circular surface of pallet.
4. eccentric cleaning General purpose jig according to claim 1 and 2, is characterized in that, the diameter of the circular surface of pallet is determined according to the size of eccentric cleaning groove.
5. eccentric cleaning General purpose jig according to claim 1 and 2, is characterized in that, the radius of the circular surface of pallet is preferably 80mm.
CN201410014968.XA 2014-01-14 2014-01-14 A kind of eccentric cleaning General purpose jig Active CN103752576B (en)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495732A (en) * 1982-09-13 1985-01-29 Turner Roger S Semiconductor wafer sectioning machine
US5471279A (en) * 1992-02-10 1995-11-28 Canon Kabushiki Kaisha Apparatus and method for supporting a substrate
CN1536640A (en) * 2003-02-20 2004-10-13 应用材料有限公司 Method for positioning substratge relatively to supporting table and its equipment
CN201222492Y (en) * 2008-04-03 2009-04-15 东捷科技股份有限公司 Fixed device and system
CN201838569U (en) * 2010-08-04 2011-05-18 珠海天威技术开发有限公司 Locating device for chip package
CN102543818A (en) * 2012-01-09 2012-07-04 北京七星华创电子股份有限公司 Balance wafer clamping device
CN202495435U (en) * 2011-12-31 2012-10-17 上海新阳半导体材料股份有限公司 Wafer clamping device
CN102751228A (en) * 2011-06-28 2012-10-24 清华大学 Wafer clamping device by utilizing spring pinch cock
CN203241443U (en) * 2013-05-09 2013-10-16 金英杰 Clamp of unpacked chip testing tool

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4495732A (en) * 1982-09-13 1985-01-29 Turner Roger S Semiconductor wafer sectioning machine
US5471279A (en) * 1992-02-10 1995-11-28 Canon Kabushiki Kaisha Apparatus and method for supporting a substrate
CN1536640A (en) * 2003-02-20 2004-10-13 应用材料有限公司 Method for positioning substratge relatively to supporting table and its equipment
CN201222492Y (en) * 2008-04-03 2009-04-15 东捷科技股份有限公司 Fixed device and system
CN201838569U (en) * 2010-08-04 2011-05-18 珠海天威技术开发有限公司 Locating device for chip package
CN102751228A (en) * 2011-06-28 2012-10-24 清华大学 Wafer clamping device by utilizing spring pinch cock
CN202495435U (en) * 2011-12-31 2012-10-17 上海新阳半导体材料股份有限公司 Wafer clamping device
CN102543818A (en) * 2012-01-09 2012-07-04 北京七星华创电子股份有限公司 Balance wafer clamping device
CN203241443U (en) * 2013-05-09 2013-10-16 金英杰 Clamp of unpacked chip testing tool

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