CN103759633A - Micro-interference platform based on micro-electromechanical system - Google Patents
Micro-interference platform based on micro-electromechanical system Download PDFInfo
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- CN103759633A CN103759633A CN201410032346.XA CN201410032346A CN103759633A CN 103759633 A CN103759633 A CN 103759633A CN 201410032346 A CN201410032346 A CN 201410032346A CN 103759633 A CN103759633 A CN 103759633A
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Abstract
The invention discloses a micro-interference platform based on a micro-electromechanical system. The micro-interference platform based on the micro-electromechanical system comprises a silicon substrate. The silicon substrate is provided with a first reflecting mirror, a movable second reflecting mirror, a light splitter and a second reflecting mirror bonding pad. The second reflecting mirror bonding pad is connected with an external control circuit controlling the second reflecting mirror to move. Light emitted on the light splitter can be divided into two paths by the light splitter and after the two paths of light are reflected by the first reflecting mirror and the second reflecting mirror respectively, interference fringes can be generated on the light splitter. According to the micro-interference platform based on the micro-electromechanical system, the semiconductor processing technology and an MEMS micro-mirror are utilized and the micro-inference platform is designed on a silicon wafer so that the dimension and size of the interference platform can be greatly reduced; meanwhile, the semiconductor processing method is used, optical elements such as the movable mirror, the fixed mirror and the light splitter can be aligned, and therefore assembly errors are reduced; the optical elements can be arranged on the same silicon wafer, so that modularization of the interference platform is achieved; after volume production, cost of the interference platform can be greatly reduced.
Description
Technical field
The present invention relates to the optical design field of MEMS (micro electro mechanical system), more specifically, relate to a kind of micro-interference platform based on MEMS (micro electro mechanical system).
Background technology
MEMS (micro electro mechanical system) micro mirror is a most typical device in optical MEMS field.MEMS (micro electro mechanical system) micro mirror successfully has benefited from its simple exquisite design, hews out the field that numerous traditional large reflective mirrors cannot touch.The features such as nowadays MEMS (micro electro mechanical system) micro mirror can open the light for making micro projector, micro spectrometer, the scanning of optical chromatography endoscopic imaging, light, optical attenuator etc., and they all have efficiently, energy-conservation, small and exquisite, low price.
Laser interferometer can coordinate various refracting telescopes and catoptron etc. to make the surveying work of linear position, speed, angle, true Pingdu, straigheness, the depth of parallelism and verticality etc., and can be used as the aligning tool of precision instrument machine or surveying instrument.The principle of work of interferometer is the light beam sending from laser instrument, after beam-expanding collimation, by spectroscope, be divided into two-way and from stationary mirror and moving reflector reflect, at spectroscope, produce interference fringe, and by mobile moving reflector, observe the variation of interference fringe respectively.And interfere platform, be the core component of laser interferometer, conventional interference platform is all comprised of stationary mirror, moving reflector and spectroscope, then these optical device is built in space.Therefore conventional interference platform size is all larger, and assembling and debug process operation more complicated, adjust precision not high, price comparison high, thus affected performance and the price of laser interferometer.
Summary of the invention
Based on above problem, the object of the present invention is to provide a kind of micro-interference platform based on MEMS (micro electro mechanical system), utilize semiconducter process and MEMS micro mirror element, on silicon chip, designed a kind of miniature interference platform, can reduce to interfere platform by volume, reduce the complexity of assembling and adjustment process, put forward high accuracy of adjustment and reduce costs price.
For reaching this object, the present invention by the following technical solutions:
A kind of micro-interference platform based on MEMS (micro electro mechanical system), comprise silicon substrate, on described silicon substrate, be provided with the first catoptron, movable the second catoptron, spectroscope and the second catoptron pad, described the second catoptron pad is for being connected with the external control circuit of controlling described the second mirror motion, and the light being radiated on described spectroscope can be divided into two-way and from the first catoptron, the second catoptron, reflecting, at spectroscope, produce interference fringe respectively by spectroscope.
As preferably, described the second catoptron is MEMS micro mirror, described MEMS micro mirror is fixedly installed on card extender and with the pad on card extender and is connected, and described card extender fixedly sticks on silicon substrate, and the electrical lead pad on it is connected with the second catoptron pad on silicon substrate.
As preferably, described card extender comprises card extender substrate, on card extender substrate, have light hole, the periphery of described light hole is coating area, described pad is the routing pad that is arranged on coating area periphery, and described MEMS micro mirror is fixed on coating area and by routing mode, MEMS micro mirror is connected with routing pad.
As preferably, described card extender comprises card extender substrate, on card extender substrate, has light hole, and the periphery of described light hole is MEMS rest area, described pad is that pad is welded in the stake of falling that is arranged on inside, MEMS rest area, and described MEMS micro mirror utilizes the mode of flip chip bonding to be fixed on MEMS rest area.
As preferably, described the second catoptron is MEMS micro mirror, on described silicon substrate, offer the second catoptron draw-in groove, described the second catoptron draw-in groove sidewall is connected with the second catoptron draw-in groove pad, and the direct or indirect mode of passing through slot of described MEMS micro mirror is fixed in the second catoptron draw-in groove.
As preferably, described MEMS micro mirror is indirectly fixed in the second catoptron draw-in groove by card extender, described card extender comprises card extender substrate, described MEMS micro mirror is fixed on the MEMS rest area of card extender substrate, described card extender substrate lower end is provided with pad, and described pad inserts in the second catoptron draw-in groove.
As preferably, the MEMS pad that described MEMS micro mirror comprises MEMS pedestal and is arranged on MEMS pedestal lower end, described MEMS micro mirror is directly fixed in the second catoptron draw-in groove.
As preferably, described the first catoptron is fixed pan mirror.
As preferably, described the first catoptron is MEMS micro mirror.
As preferably, on described silicon substrate, have the first catoptron draw-in groove, described the first catoptron draw-in groove sidewall is connected with the first catoptron draw-in groove pad, and the mode of described MEMS micro mirror by slot is fixed on silicon substrate in the first catoptron draw-in groove.
Beneficial effect of the present invention is: the present invention is by providing a kind of micro-interference platform based on MEMS (micro electro mechanical system), this interference platform comprises silicon substrate, on silicon substrate, be provided with the first catoptron, movable the second catoptron, spectroscope and the second catoptron pad, the second catoptron pad is for being connected with the external control circuit of controlling described the second mirror motion, and the light being radiated on described spectroscope can be divided into two-way and from the first catoptron, the second catoptron, reflecting, at spectroscope, produce interference fringe respectively by spectroscope.Utilize the present invention can reduce greatly to interfere platform size, greatly reduced to interfere the volume of platform; Utilize semiconductor processing method simultaneously, the optical elements such as index glass, fixed mirror, spectroscope accurately can be alignd, reduced assembly error; Optical device can be accomplished on same silicon chip, realize the modularization of interfering platform; After volume production, utilize the resulting interference platform of semiconductor machining more much lower than traditional platform cost.
Accompanying drawing explanation
Fig. 1 is micro-interference platform vertical view that the specific embodiment of the invention one provides;
Fig. 2 is the first card extender vertical view that the specific embodiment of the invention one provides;
Fig. 3 is the another kind of card extender vertical view that the specific embodiment of the invention one provides;
Fig. 4 is micro-interference platform vertical view that the specific embodiment of the invention two provides;
Fig. 5 is a kind of card extender vertical view that the specific embodiment of the invention two provides;
Fig. 6 is the MEMS micro-mirror structure schematic diagram that the specific embodiment of the invention two provides.
Wherein:
1: silicon substrate; 2: the first catoptrons; 3: the second catoptrons; 4: spectroscope; 5: the first catoptron pads; 6: the second catoptron pads;
31: card extender; 32: card extender;
311: card extender substrate; 312: coating area; 313: light hole; 314: routing pad; 315: electrical lead pad;
321: card extender substrate; 322:MEMS rest area; 323: light hole; 324: pad is welded in the stake of falling; 325: electrical lead pad;
1 ': silicon substrate; 4 ': spectroscope; The 5 ': the first catoptron pad; The 6 ': the second catoptron pad; The 7 ': the first catoptron draw-in groove; The 8 ': the second catoptron draw-in groove;
31 ': card extender; 32 ': MEMS micro mirror;
The 71 ': the first catoptron draw-in groove pad;
The 81 ': the second catoptron draw-in groove pad;
311 ': card extender substrate; 312 ': MEMS rest area; 313 ': light hole; 314 ': pad;
321 ': MEMS pedestal; 322 ': MEMS micro mirror minute surface; 323 ': MEMS pad.
Embodiment
Below in conjunction with accompanying drawing and by embodiment, further illustrate technical scheme of the present invention.
Fig. 1 is micro-interference platform vertical view that the specific embodiment of the invention one provides.The present invention utilizes semiconducter process to make micro-interference platform, and as shown in Figure 1, the base of microfluidic platform is semiconductor machining silicon chip, and namely silicon substrate 1, is provided with the first catoptron 2, movable the second catoptron 3, spectroscope 4 on described silicon substrate 1.In the present embodiment, described spectroscope 4 is block prism, described the first catoptron 2 as fixed mirror, movable the second catoptron 3 as index glass.Silicon substrate 1 integral body is more smooth, is conducive to the assembling of the first catoptron 2, the second catoptron 3 and spectroscope 4.Silicon substrate 1 edge is provided with the second catoptron pad 6, for being connected with external control circuit and then controlling the motion of described the second catoptron 3.On silicon substrate 1, there is the telltale mark of placing block prism simultaneously, for accurately locating block prism, block prism is fixed on to silicon substrate 1.The light being radiated on described spectroscope 4 can be divided into two-way and from the first catoptron 2, the second catoptron 3, reflecting, at spectroscope 4, produce interference fringe respectively by spectroscope 4.
In the present embodiment, described the second catoptron 3 is MEMS micro mirror, and described MEMS micro mirror is fixedly installed on the card extender 31 of little silicon materials.Fig. 2 is the first card extender vertical view that the specific embodiment of the invention one provides, as shown in Figure 2, described card extender 31 comprises card extender substrate 311, on card extender substrate 311, have light hole 313, the periphery of described light hole 313 is coating area 312, described pad is the routing pad 314 that is arranged on coating area 312 peripheries, coating area 312 gluings shown in the figure, afterwards MEMS micro mirror is placed into the position location shown in figure, after MEMS micro mirror and card extender are fixing, utilize routing mode that MEMS micro mirror is connected with routing pad 314.And on the edge of card extender substrate 311, be also provided with electrical lead pad 315, electrical lead pad 315 is connected by electrical lead with the second catoptron pad 6 on silicon substrate 1.The second catoptron pad 6 that silicon substrate 1 edge arranges, can be connected with MEMS micro mirror with outside electric connection line, and then utilize external electric signal to drive MEMS micromirror movements.The described card extender 31 with MEMS can directly stick on the limit of block prism of silicon substrate 1, can guarantee the equivalent optical path between index glass and fixed mirror like this, is conducive to whole assembling, regulates more simple and convenient simultaneously.
In the present embodiment, described the first catoptron 2 can be also index glass for fixed mirror.While selecting fixed mirror, can be level crossing, while selecting index glass, can for the same with index glass be MEMS micro mirror.Select MEMS micro mirror, during assembling, can directly MEMS micro mirror be attached on the limit of block prism, its installation process can be identical with the installation process of silicon substrate 1 with the second catoptron 3.Now, the coboundary of silicon substrate 1 is provided with the first catoptron pad 5, can be connected with MEMS micro mirror with outside electric connection line, and then utilize external electric signal to drive MEMS micromirror movements.During use, can, by adding the direction of motion that different voltage changes two MEMS micro mirrors to two MEMS micro mirrors, make two MEMS micro mirror minute surface move toward one another, thereby increase the optical path difference of interference system.To fixed mirror, add a regulation voltage simultaneously, can carry out some fine settings to minute surface, thus the error that correcting system brings due to assembling.
In the present embodiment, described card extender 32 can be also another kind of structure, as shown in Figure 3, described card extender 32 comprises card extender substrate 321, on card extender substrate 321, have light hole 323, the periphery of described light hole 323 is MEMS rest area 322, and described pad is that pad 324 is welded in the stake of falling that is arranged on 312 inside, MEMS rest area, also has the electrical lead pad 325 being connected with outside electrical lead on this card extender.The stake of falling that conducting resinl is coated with is in the drawings welded on pad 324, the MEMS micro mirror utilization mode that stake is welded is placed into the MEMS rest area 322 shown in figure, after MEMS micro mirror and card extender are fixing, by electrical lead pad 325, utilize electrical lead to be connected with the second catoptron pad 6 on silicon substrate 1 afterwards, be connected with outside MEMS control circuit more afterwards.Identical with the connection procedure of silicon substrate 1 with the card extender of MEMS micro mirror and the card extender of the connection procedure of silicon substrate 1 and the first structure.
Fig. 4 is micro-interference platform vertical view that the specific embodiment of the invention two provides.As shown in Figure 4, card extender 31 ' adopts slot mode to be connected with silicon substrate 1 '.Concrete, described the second catoptron 3 is MEMS micro mirror, on described silicon substrate 1 ', spectroscope 4 ' is installed, and offers the second catoptron draw-in groove 8 ' near spectroscope 4 ', described the second catoptron draw-in groove 8 ' sidewall is connected with the second catoptron draw-in groove pad 81 '.The direct or indirect mode of passing through slot of described MEMS micro mirror is fixed in the second catoptron draw-in groove 8 '.The edge of upper the second catoptron draw-in groove 8 ' the place side of silicon substrate 1 ' is provided with the second catoptron pad 6 '.
Fig. 5 is a kind of card extender vertical view that the specific embodiment of the invention two provides.Card extender 31 ' is made form as shown in Figure 5, described card extender 31 ' comprises card extender substrate 311 ', on card extender substrate 311 ', be provided with light hole 313 ', the surrounding of light hole 313 ' is MEMS rest area 312 ', described MEMS micro mirror is fixed on the MEMS rest area 312 ' of card extender substrate 311 ', described card extender substrate 311 ' lower end is provided with pad 314 ', described pad 314 ' inserts in the second catoptron draw-in groove 8 ', and described MEMS micro mirror is indirectly fixed in the second catoptron draw-in groove 8 ' by card extender 31 '.As mentioned above, directly card extender 31 ' is put in the second catoptron draw-in groove 8 ' on silicon substrate 1 ', afterwards, can utilize outside electric connection line that the second catoptron pad 6 ' is connected with MEMS micro mirror, and then utilize external electric signal to drive MEMS micromirror movements.Together with card extender 31 ' is directly connected to the second catoptron draw-in groove 8 ', card extender 31 ' is directly connected with silicon substrate 1 ' like this, does not need electrical lead to connect.Card extender 31 ' is put into the second catoptron draw-in groove 8 ' afterwards, more firm in order to guarantee that card extender 31 ' is connected with silicon substrate 1 ', can utilize glue to reinforce.
Fig. 6 is the MEMS micro-mirror structure schematic diagram that the specific embodiment of the invention two provides.Utilize semiconducter process directly to process the MEMS micro mirror 32 ' with draw-in groove, structure as shown in the figure, described MEMS micro mirror comprises MEMS pedestal 321 ', is arranged on the MEMS micro mirror minute surface 322 ' of MEMS pedestal 321 ' middle and upper part and the MEMS pad 323 ' that is arranged on MEMS pedestal 321 ' lower end.Can directly by the MEMS pad 323 ' of MEMS micro mirror 32 ' lower end, the mode by slot be fixed in the second catoptron draw-in groove 8 ' of silicon substrate 1 ', now, described MEMS micro mirror 32 ' is also just directly fixed in the second catoptron draw-in groove 8 '.Afterwards, can utilize outside electric connection line that the second catoptron pad 6 ' is connected with MEMS micro mirror 32 ', and then utilize external electric signal to drive the 32 ' motion of MEMS micro mirror.MEMS micro mirror 32 ' now does not need card extender, avoids routing or this operation of stake weldering, makes micro-interference platform assembly precision higher, processes simpler.
In the present embodiment, identical with specific embodiment one, described the first catoptron 2 can be also index glass for fixed mirror.While selecting fixed mirror, can be level crossing, while selecting index glass, can for the same with index glass be MEMS micro mirror.Select MEMS micro mirror, during assembling, can adopt the mode of slot to be connected with silicon substrate 1 '.While adopting slot mode, on described silicon substrate 1 ', have the first catoptron draw-in groove 7 ', described the first catoptron draw-in groove 7 ' sidewall is connected with the first catoptron draw-in groove pad 71 ', and described MEMS micro mirror is fixed in upper the first catoptron draw-in groove 7 ' of silicon substrate 1 ' by the mode of slot.Silicon substrate 1 ' coboundary is provided with the first catoptron pad 5 ', can the first catoptron pad 5 ' be connected with MEMS micro mirror with outside electric connection line, and then utilize external electric signal to drive MEMS micromirror movements.Certainly, also can directly MEMS micro mirror be attached on the limit of block prism, its installation process can be identical with the installation process of silicon substrate 1 with the second catoptron 3 in specific embodiment one.
Certainly, in specific embodiment one, when the first catoptron 2 is selected MEMS micro mirror, also can adopt slot mode to be connected with described silicon substrate 1.
First the present invention utilizes semiconducter process processing bulk silicon substrate, can guarantee the flatness of silicon substrate.On silicon substrate, groove or the position line of block prism placed in processing, can guarantee block prism placement location accurately.Secondly MEMS micro mirror is fixed on the card extender of silicon processing, card extender is directly attached on block prism, can guarantee assembly precision like this.Recycling afterwards electrical lead is connected with silicon substrate.Fixed mirror can be selected level crossing or MEMS micro mirror, while selecting MEMS micro mirror, and can be by adding the optical path difference that different driving signals increases whole system to the MEMS micro mirror of index glass and fixed mirror.By semiconducter process and corresponding assemble method, can improve the assembly precision of micro-interference platform, reduce assembling difficulty, reduce the cost of micro-interference platform simultaneously.
The present invention utilizes semiconducter process in conjunction with MEMS micro mirror, can guarantee that spectroscope and two MEMS minute surfaces accurately locate.Can on semi-conductor silicon chip, carry out technology processing, index glass, fixed mirror and spectroscope are put on same silicon chip, thereby form a miniature intervention module, in application afterwards, can greatly reduce the difficulty of assembling, improve the precision of assembling simultaneously.Because MEMS micro mirror is smaller, the interference platform by volume obtaining is little, is easy to carry.Utilize semiconductor technology, design accuracy is high, and it is even less that precision can reach 1-2 micron.The MEMS micro mirror cost utilizing is low, thereby greatly reduces the cost of manufacture of interfering platform.By MEMS, control the movement that MEMS index glass can be accurately controlled in design, thereby observe interference.
Know-why of the present invention has below been described in conjunction with specific embodiments.These are described is in order to explain principle of the present invention, and can not be interpreted as by any way limiting the scope of the invention.Explanation based on herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, within these modes all will fall into protection scope of the present invention.
Claims (10)
1. the micro-interference platform based on MEMS (micro electro mechanical system), it is characterized in that, comprise silicon substrate (1, 1 '), described silicon substrate (1, 1 ') on, be provided with the first catoptron (2), movable the second catoptron (3), spectroscope (4, 4 ') and the second catoptron pad (6, 6 '), described the second catoptron pad (6, 6 ') for being connected with the external control circuit of controlling described the second catoptron (3) motion, be radiated at described spectroscope (4, 4 ') light on can be by spectroscope (4, 4 ') be divided into two-way also respectively from the first catoptron (2), after the second catoptron (3) reflects at spectroscope (4, 4 ') the upper interference fringe that produces.
2. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 1, it is characterized in that, described the second catoptron (3) is MEMS micro mirror, described MEMS micro mirror is fixedly installed on card extender (31,32) above and connects with the pad on card extender (31,32), described card extender (31,32) fixedly stick on silicon substrate (1) above, and the electrical lead pad (315,325) on it is connected with the second catoptron pad (6) on silicon substrate (1).
3. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 2, it is characterized in that, described card extender (31) comprises card extender substrate (311), on card extender substrate (311), have light hole (313), the periphery of described light hole (313) is coating area (312), described pad is for being arranged on the routing pad (314) of coating area (312) periphery, and described MEMS micro mirror is fixed on coating area (312) and by routing mode, MEMS micro mirror is connected with routing pad (314).
4. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 2, it is characterized in that, described card extender (32) comprises card extender substrate (321), on card extender substrate (321), have light hole (323), the periphery of described light hole (323) is MEMS rest area (322), described pad welds pad (324) for being arranged on the inner stake of falling in MEMS rest area (312), and described MEMS micro mirror utilizes the mode of flip chip bonding to be fixed on MEMS rest area (322).
5. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 1, it is characterized in that, described the second catoptron (3) is MEMS micro mirror, on described silicon substrate (1 '), offer the second catoptron draw-in groove (8 '), described the second catoptron draw-in groove (8 ') sidewall is connected with the second catoptron draw-in groove pad (81 '), and the direct or indirect mode of passing through slot of described MEMS micro mirror is fixed in the second catoptron draw-in groove (8 ').
6. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 5, it is characterized in that, described MEMS micro mirror is indirectly fixed in the second catoptron draw-in groove (8 ') by card extender (31 '), described card extender (31 ') comprises card extender substrate (311 '), described MEMS micro mirror is fixed on the MEMS rest area (312 ') of card extender substrate (311 '), described card extender substrate (311 ') lower end is provided with pad (314 '), and described pad (314 ') inserts in the second catoptron draw-in groove (8 ').
7. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 5, it is characterized in that, the MEMS pad (323 ') that described MEMS micro mirror comprises MEMS pedestal (321 ') and is arranged on MEMS pedestal (321 ') lower end, described MEMS micro mirror is directly fixed in the second catoptron draw-in groove (8 ').
8. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 1, is characterized in that, described the first catoptron (2) is fixed pan mirror.
9. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 1, is characterized in that, described the first catoptron (2) is MEMS micro mirror.
10. the micro-interference platform based on MEMS (micro electro mechanical system) according to claim 9, it is characterized in that, on described silicon substrate (1 '), have the first catoptron draw-in groove (7 '), described the first catoptron draw-in groove (7 ') sidewall is connected with the first catoptron draw-in groove pad (71 '), and described MEMS micro mirror is fixed in upper the first catoptron draw-in groove (7 ') of silicon substrate (1 ') by the mode of slot.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110275288A (en) * | 2019-06-21 | 2019-09-24 | 无锡迅杰光远科技有限公司 | A kind of multidirectional MEMS scanning means |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7027203B2 (en) * | 2002-03-19 | 2006-04-11 | Xanoptix Inc. | Combination micromachine and optical device array |
| US7710574B2 (en) * | 2007-01-23 | 2010-05-04 | Board Of Regents, The University Of Texas System | Devices in miniature for interferometric use and fabrication thereof |
| CN102439509A (en) * | 2009-05-05 | 2012-05-02 | 雷模特斯有限公司 | Passive alignment method and its application in micro projection devices |
| CN203350529U (en) * | 2013-06-18 | 2013-12-18 | 无锡微奥科技有限公司 | Micro-electro-mechanical interference platform with closed-loop control system |
-
2014
- 2014-01-23 CN CN201410032346.XA patent/CN103759633B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7027203B2 (en) * | 2002-03-19 | 2006-04-11 | Xanoptix Inc. | Combination micromachine and optical device array |
| US7710574B2 (en) * | 2007-01-23 | 2010-05-04 | Board Of Regents, The University Of Texas System | Devices in miniature for interferometric use and fabrication thereof |
| CN102439509A (en) * | 2009-05-05 | 2012-05-02 | 雷模特斯有限公司 | Passive alignment method and its application in micro projection devices |
| CN203350529U (en) * | 2013-06-18 | 2013-12-18 | 无锡微奥科技有限公司 | Micro-electro-mechanical interference platform with closed-loop control system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110275288A (en) * | 2019-06-21 | 2019-09-24 | 无锡迅杰光远科技有限公司 | A kind of multidirectional MEMS scanning means |
| CN110275288B (en) * | 2019-06-21 | 2021-06-22 | 无锡迅杰光远科技有限公司 | Multidirectional MEMS scanning device |
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