CN103781284A - Circuit-board manufacturing method - Google Patents
Circuit-board manufacturing method Download PDFInfo
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- CN103781284A CN103781284A CN201210400684.5A CN201210400684A CN103781284A CN 103781284 A CN103781284 A CN 103781284A CN 201210400684 A CN201210400684 A CN 201210400684A CN 103781284 A CN103781284 A CN 103781284A
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Abstract
The invention discloses a circuit-board manufacturing method and provides a circuit-board manufacturing method capable of manufacturing at least one large-cross-section circuit hidden in a board body on a circuit-board substrate. In the circuit-board manufacturing method, basically on a first circuit-board substrate provided with a copper-foil circuit layer, a circuit groove which is at least capable of making a copper-foil circuit layer at the other side exposed at the bottom part of the groove is formed through processing; then thick copper is filled into the circuit groove in an electrocoppering method until projecting out of the first circuit-board substrate for a preset height and thus the large-cross-section circuit which is distributed along the circuit groove is formed; and then the first circuit-board substrate exposed by the large-cross-section circuit is covered with at least one semi-cured adhesive layer and through a hot-melting laminating method, the semi-cured adhesive layer is made cover the large-cross-section circuit and flatness of the surface is maintained so that a circuit board, in which at least one thin circuit and least one large-cross-section circuit can be manufactured on the same first circuit-board substrate, can be obtained. Therefore, objectives of saving material cost, preventing waste of high-price metals and reducing pollution sources are achieved.
Description
Technical field
The present invention, about the circuit production technique of printed panel, refers to that one is adapted on same board substrate especially especially, makes the circuit board manufacturing method of the long-pending circuit at least one thin circuits and at least one heavy in section.
Background technology
As everyone knows, printed circuit board (PCB) (Printed Circuit Board, the circuit of PCB) being played the part of between each electronic component by the circuit layer (copper film) that transmits telecommunication connects, and by required circuit network integrated planar and be distributed in the plate face of printed circuit board (PCB) or three-dimensional circuit layer, to form the network connecting between diverse location element.
In principle, the basic material (being referred to as below substrate) of general printed circuit board (PCB), utilize insulating paper, glass fabric or other fiber material through the adhesive film (Prepreg) of resin impregnated repeatedly and the laminated plates forming more, under HTHP, cover and add copper film and form in single or double; As for, can form through electro-coppering guide hole structure in order to the conductor that forms each layer of circuit of printed circuit board (PCB).
Along with the fast lifting of material, process technology, the performance of printed circuit board (PCB) is also comparatively reliable, and can be used in more widely in the middle of different fields, even becomes one of key part and component using object; For example, in the middle of the electric carrier being caught people's attention gradually, many relevant circuit layout designs that utilize printed circuit board (PCB) to integrate control signal and drive current are seen, its key technology is mainly made the circuit of different-thickness on the substrate of a printed circuit board (PCB), for utilizing the circuit that thickness is relatively thin to form the transmission of controlling signal, and utilize the circuit that thickness is thicker to transmit powerful drive current, make to be minimized the impedance of drive current, avoid reducing because printed circuit board (PCB) is overheated operational effectiveness.
Be known at present on board substrate and make the manufacturing technology of commonly using two kinds of different-thickness circuit, the main board substrate of selecting a surface to there is copper foil layer, and the height of this copper foil layer must be greater than the thickest circuit thickness, and after the copper foil layer completing circuit etching operation on board substrate surface, again part circuit is considered to unnecessary Copper Foil height and removes, begin to obtain the circuit of different-thickness.
Only, above-mentioned production method belongs to the subtraction process technology that industry is commonly called as, and it not only wastes a large amount of high-valency metals making in the course of processing of differing heights, and the wet process of repeatedly carrying out need expend the more energy, also can produce a large amount of pollutant sources; Especially, the circuit of different-thickness can form obvious high low head in printed circuit board surface, affects follow-up surface-treated processing effect, even can cause element assembling crooked, is difficult for controlling processing quality.
Summary of the invention
Technical problem solved by the invention provide a kind of can be with relatively low material cost, on same board substrate, make the long-pending circuit at least one thin circuits and at least one heavy in section, be especially hidden in the circuit board manufacturing method of the long-pending circuit in heavy in section of plate body inside.
The technology used in the present invention means are as follows.
For reaching above-mentioned purpose, circuit board manufacturing method of the present invention, consists essentially of the following step: a provides a first circuit board base material that is provided with at least one copper foil circuit layer; B with respect to the another face of copper foil circuit layer, is processed to form the circuit groove that at least can make the copper foil circuit layer of another side appear at bottom portion of groove in first circuit board base material; C inserts thick copper in electro-coppering mode until protrude first circuit board backing material plate face to predetermined altitude in circuit groove, and on first circuit board base material, forms the long-pending circuit at least one heavy in section of following circuit groove to distribute; The d first circuit board backing material plate face that long-pending circuit exposes in heavy in section arranges at least one semi-solid preparation glue-line; E makes semi-solid preparation glue-line that long-pending heavy in section circuit is covered via hot melt pressing mode, and maintains the smooth of surface; The circuit board that completes above-mentioned steps and obtain after cooling and shaping, on same first circuit board base material, form the thin circuits that at least one is made up of copper foil circuit layer, and at least one is overlying in circuit groove and is relatively hidden in the long-pending circuit in heavy in section in plate body by filling out.
Utilize above-mentioned technical characterictic, can the first circuit board base material under the circuit base framework of the copper foil circuit layer of thinner thickness on, make the long-pending circuit at least one thin circuits and at least one heavy in section, be especially hidden in the long-pending circuit in heavy in section of plate body inside.Save material cost, the high-valency metal that avoids waste in order to do reaching, and reduce the object of pollutant sources.
According to above-mentioned technical characteristics, circuit board manufacturing method of the present invention, further by the overlapped pressing of first circuit board base material of at least two completing steps a ~ e procedure for processing, and between each first circuit board, be provided with at least one conductor connecting in order to form predetermining circuit.
According to above-mentioned technical characteristics, circuit board manufacturing method of the present invention, further the first circuit board base material of two completing steps a ~ d procedure for processing is amassed to the corresponding overlapped pressing of mode of circuit with heavy in section, and between each first circuit board base material, be provided with at least one conductor connecting in order to form predetermining circuit.
According to above-mentioned technical characteristics, circuit board manufacturing method of the present invention, at least one second circuit plate substrate that is provided with at least one copper foil circuit layer is further provided, by the first circuit board base material of at least one completing steps a ~ e procedure for processing and the overlapped pressing of this at least one second circuit plate substrate, and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor connecting in order to form predetermining circuit.
According to above-mentioned technical characteristics, circuit board manufacturing method of the present invention, at least one second circuit plate substrate that is provided with at least one copper foil circuit layer is further provided, the first circuit board base material of at least one completing steps a ~ d procedure for processing is amassed to the mode of circuit corresponding to second circuit plate substrate with its heavy in section, by the first circuit board base material of at least one completing steps a ~ d procedure for processing and the overlapped pressing of at least one second circuit plate substrate, and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor connecting in order to form predetermining circuit.
Described circuit board manufacturing method after first circuit board base material completing steps b, in the metallic film of circuit groove inwall construction predetermined thickness, is inserted thick copper afterwards again in circuit groove in electro-coppering mode.
Described circuit board manufacturing method, after first circuit board base material completing steps b, in copper foil circuit layer surface coverage one shielding layer, in circuit groove, insert again afterwards thick copper in electro-coppering mode, and after completing steps c, worn-out the screening on copper foil circuit layer surface layer is removed.
Described circuit board manufacturing method, is located at copper foil circuit layer on the plate face of first circuit board base material via electro-coppering mode.
Described circuit board manufacturing method, is located at copper foil circuit layer on the plate face of first circuit board base material via pressing mode.
Particularly, circuit board manufacturing method of the present invention has following advantages.
1. on can the first circuit board base material under the circuit base framework of the copper foil circuit layer of thinner thickness, make the long-pending circuit in heavy in section that at least one thickness is greater than copper foil circuit layer, relatively save material cost.
2. the circuit that utilizes addition process technology that thickness is greater than to copper foil circuit layer builds on first circuit board base material, and high-valency metal effectively avoids waste.
3. the circuit that utilizes addition process technology that thickness is greater than to copper foil circuit layer builds on first circuit board base material, but not is completed by the etching operation via repeatedly, therefore can reduce pollutant sources.
4. the long-pending circuit in heavy in section that is greater than copper foil circuit layer due to thickness is hidden in plate body inside, therefore in the time being applied to multi-layer sheet pressing, not prepreg (semi-solid preparation film) filler in a large number, while being not easy pressing occurs, because resin flows is too much or not enough slide plate and the cavity problem of causing, also can not make glass directly contact reliability or CAF problem that copper layer causes because a large amount of resins flow into thick copper space.
5. the long-pending circuit in heavy in section that is greater than copper foil circuit layer due to thickness is hidden in plate body inside, and the circuit board plate face completing is without obvious high low head, causes green paint (solder mask) to be difficult for covering or word is difficult for the problem of printing and be unlikely.
Accompanying drawing explanation
Fig. 1 is basic flow sheet of the present invention.
The structure cutaway view of the first circuit board base material that Fig. 2 uses for first embodiment of the invention.
Fig. 3 is the present invention forms circuit groove structure cutaway view in the plate face of first circuit board base material.
Fig. 4 is that the present invention fills out the structure cutaway view that covers thick copper in the circuit groove of first circuit board base material.
Fig. 5 is the present invention arranges semi-solid preparation glue-line structure cutaway view in first circuit board backing material plate face.
Fig. 6 is that the present invention arranges semi-solid preparation glue-line in first circuit board backing material plate face, and through pressing solidify after structure cutaway view.
Fig. 7 is that the present invention is by the action schematic diagram of the overlapped pressing of plural first circuit board base material.
Fig. 8 is that the present invention has completed by the structure cutaway view of the overlapped pressing of plural first circuit board base material.
Fig. 9 is that another real example of losing of the present invention is by the action schematic diagram of the overlapped pressing of plural first circuit board base material.
Figure 10 is that the present invention is by the action schematic diagram of first circuit board base material and the overlapped pressing of second circuit plate substrate.
Figure 11 is that the present invention has completed by the structure cutaway view of first circuit board base material and the overlapped pressing of second circuit plate substrate.
Figure 12 is that another embodiment of the present invention is by the action schematic diagram of first circuit board base material and the overlapped pressing of second circuit plate substrate.
Figure 13 is the structure cutaway view of with pressing mode, copper foil circuit layer being located to first circuit board backing material plate face in the present invention.
The structure cutaway view of the first circuit board base material that Figure 14 uses for another embodiment of the present invention.
Figure 15 is that the present invention is in the structure cutaway view of the circuit groove wall construction predetermined thickness metallic film of first circuit board base material.
Figure 16 be the present invention after the circuit groove wall construction predetermined thickness metallic film of first circuit board base material, and fill out the structure cutaway view that covers thick copper in the circuit groove of first circuit board base material.
Figure number explanation:
10 first circuit board base materials
11 copper foil circuit layers
12 circuit grooves
13 thick copper
131 metallic films
14 semi-solid preparation glue-lines
15 conductors
20 second circuit plate substrates
21 copper foil circuit layers
30 semi-solid preparation films.
Embodiment
As shown in basic flow sheet as of the present invention in Fig. 1, circuit board manufacturing method of the present invention, has consisted essentially of the following step.
A., the one first circuit board base material 10 that is provided with at least one copper foil circuit layer 11 is as shown in Figure 2 provided; In the time implementing, this first circuit board base material 10 therein plate face is provided with copper foil circuit layer 11, or is all provided with copper foil circuit layer at two plate faces.
B. in first circuit board base material 10 with respect to the another face of copper foil circuit layer 11 (if graphic middle first circuit board base material 10 is with respect to another plate face of copper foil circuit layer 11), be processed to form the circuit groove 12 that at least can make the copper foil circuit layer 11 of another side appear at bottom portion of groove.
C. as shown in Figure 4, in circuit groove 12, insert thick copper 13 in electro-coppering mode until protrude first circuit board base material 10 plate faces to predetermined altitude, and on first circuit board base material 10, form the long-pending circuit at least one heavy in section of following circuit groove 12 to distribute.
D. the first circuit board base material 10 plate faces that as shown in Figure 5, long-pending circuit exposes in heavy in section arrange at least one semi-solid preparation glue-line 14.
E. make semi-solid preparation glue-line 14 that long-pending heavy in section circuit is covered via hot melt pressing mode, and maintain surperficial smooth (as shown in Figure 6); The circuit board that completes above-mentioned steps and obtain after cooling and shaping, on same first circuit board base material 10, form the thin circuits that at least one is made up of copper foil circuit layer 11, and at least one is overlying on by filling out the long-pending circuit in heavy in section that the thick copper 13 of circuit groove 12 forms.
Take off in embodiment upper, the first circuit board base material 10 plate faces that long-pending circuit exposes in heavy in section arrange one and amass the semi-solid preparation glue-line 14 of circuit both sides around heavy in section, make in follow-up hot melt pressing process, can long-pending heavy in section circuit be filled out and cover covering by the semi-solid preparation glue-line 14 of melting, and become the plate body of circuit board by the semi-solid preparation glue-line after cooling curing, reach the object that long-pending heavy in section circuit is hidden in to plate body inside.
Certainly, except the first circuit board base material 10 plate faces that expose in the long-pending circuit in heavy in section arrange one around the semi-solid preparation glue-line 14 of long-pending circuit both sides, heavy in section, also can further be provided with the semi-solid preparation glue-line that at least one deck covers first circuit board backing material plate face, to reach the object of regulating circuit plate plate body thickness; The semi-solid preparation glue-line even can profit by one deck at least, first circuit board backing material plate face being covered is by first circuit board base material and another first circuit board base material, or another is provided with the mutually overlapped pressing of second circuit plate substrate of at least one copper foil circuit layer, make to obtain a kind of circuit board presenting with multi-layer sheet kenel.
In principle, circuit board manufacturing method of the present invention, the circuit board of obtaining through completing above-mentioned steps a ~ e, can on same board substrate 10, form the circuit (wherein a kind of thin circuits being formed by copper foil circuit layer 11, another kind is overlying in circuit groove 12 and is relatively hidden in the long-pending circuit in the heavy in section being made up of thick copper 13 in plate body by filling out) of at least two kinds of different-thickness (different cross-sectional); In the time of application, can be for utilizing the thin circuits that thickness is thinner (circuit being formed by copper foil circuit layer 11) as controlling signal (numerical digit control signal) transmission, and utilize the long-pending circuit in heavy in section that thickness is thicker (being hidden in the long-pending circuit in heavy in section in plate body) to transmit powerful drive current, make to be minimized the impedance of drive current, avoid circuit burnout or reduce operational effectiveness because printed circuit board (PCB) is overheated.
The circuit board that the present invention completes, in the time using, also can utilize the waste heat discharge passage of the long-pending circuit in the heavy in section being hidden in plate body as circuit board, makes circuit board be able to normal effect and maintains due task performance.Especially, the present invention mainly utilizes above-mentioned technical characterictic, makes with on the first circuit board base material under the copper foil circuit layer architecture at thinner thickness, makes the long-pending circuit in heavy in section that at least one thickness is greater than copper foil circuit layer.Save material cost, the high-valency metal that avoids waste in order to do reaching, and reduce the object of pollutant sources.
When the present invention takes off the circuit board presenting with multi-layer sheet kenel on making, can be as shown in Figure 7, further by the overlapped pressing of first circuit board base material 10 of at least two completing steps a ~ e procedure for processing (in graphic equally with semi-solid preparation film 14 by the overlapped pressing of plural first circuit board base material 10), and between each first circuit board base material 10, be provided with as shown in Figure 8 at least one conductor 15 connecting in order to form predetermining circuit, make to obtain a kind of circuit board of multi-layer sheet kenel, reach the object that increases Circnit Layout density.
Certainly, also can the first circuit board base material 10 of at least two completing steps a ~ d procedure for processing be amassed to the corresponding overlapped pressing of mode (can add in addition at least one semi-solid preparation glue-line 14 in graphic by the overlapped pressing of plural first circuit board base material 10 between two first circuit boards 10) of circuit with heavy in section as Fig. 9, and between each first circuit board base material, be provided with at least one conductor connecting in order to form predetermining circuit, make to become a kind of circuit board of multi-layer sheet kenel, and can utilize the semi-solid preparation film 14 of clipping between two first circuit board base materials 10 directly long-pending the heavy in section of otherwise exposed circuit to be covered and hides us.
When the present invention takes off the circuit board presenting with multi-layer sheet kenel on making, also can be as shown in figure 10, at least one second circuit plate substrate 20 that is provided with at least one copper foil circuit layer 21 is further provided, by the first circuit board base material 10 of at least one completing steps a ~ d procedure for processing and the overlapped pressing of this at least one second circuit plate substrate 20 (in graphic same with semi-solid preparation film 14 by least one first circuit board base material 10 and the overlapped pressing of at least one second circuit plate substrate 20), and as shown in figure 11, between this at least one first circuit board 10 and this at least one second circuit plate substrate 20, be provided with at least one conductor 15 connecting in order to form predetermining circuit, the object that reaches increase Circnit Layout density reaches the object that increases Circnit Layout density.
Same, also can be as shown in figure 12, at least one second circuit plate substrate 20 that is provided with at least one copper foil circuit layer 21 is provided, the first circuit board base material 10 of at least one completing steps a ~ d procedure for processing is amassed to the mode of circuit corresponding to second circuit plate substrate 20 with its heavy in section, the first circuit board base material 10 of at least one completing steps a ~ d procedure for processing and the overlapped pressing of at least one second circuit plate substrate 20 (can be added at least one semi-solid preparation glue-line 14 in graphic in addition between first circuit board 10 and second circuit plate substrate 20, by at least one first circuit board base material 10 and the overlapped pressing of at least one second circuit plate substrate 20), and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor connecting in order to form predetermining circuit, make to become a kind of circuit board of multi-layer sheet kenel, and can utilize the semi-solid preparation film 14 of clipping between two first circuit board base materials 10 directly long-pending the heavy in section of otherwise exposed circuit to be covered and hides us.
The long-pending circuit in heavy in section that thickness is greater than to copper foil circuit layer 11 due to the present invention is hidden in plate body inside, therefore in the time being applied to multi-layer sheet pressing, not prepreg (semi-solid preparation film) filler in a large number, while being not easy pressing occurs, because resin flows is too much or not enough slide plate and the cavity problem of causing, also can not make glass directly contact reliability or CAF problem that copper layer causes because a large amount of resins flow into thick copper space.In other words, first circuit board base material 10 used in the present invention is except can copper foil circuit layer 11 being located on the plate face of first circuit board base material 10 via electro-coppering mode, also as shown in figure 13, via pressing mode, copper foil circuit layer 11 is located on the plate face of first circuit board base material 10 (copper foil circuit layer 11 being fixedly arranged on first circuit board base material 10 with the semi-solid preparation film 14 shown in scheming), also can be obtained the circuit quality of high stability.
It is worth mentioning that, the present invention is in the time implementing, the first circuit board base material 10 using can be as shown in figure 14, all be provided with copper foil circuit layer 11 at two plate face, the circuit board that the present invention completes can be presented for the circuit board kenel with plural copper foil circuit layer 11, use and increase Circnit Layout density.Moreover, the first circuit board base material 10 that is all provided with copper foil circuit layer 11 take two plate faces shown in Figure 13 is as example, first circuit board base material 10 used in the present invention, no matter be that a plate face is provided with copper foil circuit layer therein, or be all provided with copper foil circuit layer 11 at two plate face, the present invention carry out above-mentioned thick copper is filled out to the flow process that is overlying on circuit groove before, its first circuit board base material 10 is after completing steps b, first as shown in figure 15, in the metallic film 131 of circuit groove 12 inwall construction predetermined thickness, in circuit groove 12, insert again afterwards thick copper 13 (as shown in figure 16) in electro-coppering mode, cover quality to promote filling out of thick copper 13.
Same; no matter first circuit board base material used in the present invention is the design that single or double is provided with copper foil circuit layer; its first circuit board base material is after completing steps b; also can be further in copper foil circuit layer surface coverage one shielding layer; in circuit groove, insert again afterwards thick copper in electro-coppering mode; and after completing steps c, worn-out the screening on copper foil circuit layer surface layer is removed, can protect copper foil circuit layer electric conducting material fill out the process of covering in unlikelyly increase thickness for the metal of electroplating covers.
Compare with the existing known techniques of tradition, circuit board manufacturing method of the present invention has following advantages.
1. on can the first circuit board base material under the copper foil circuit layer architecture of thinner thickness, make the long-pending circuit in heavy in section that at least one thickness is greater than copper foil circuit layer, relatively save material cost.
2. the circuit that utilizes addition process technology that thickness is greater than to copper foil circuit layer builds on first circuit board base material, and high-valency metal effectively avoids waste.
3. the circuit that utilizes addition process technology that thickness is greater than to copper foil circuit layer builds on first circuit board base material, but not is completed by the etching operation via repeatedly, therefore can reduce pollutant sources.
4. the long-pending circuit in heavy in section that is greater than copper foil circuit layer due to thickness is hidden in plate body inside, therefore in the time being applied to multi-layer sheet pressing, not prepreg (semi-solid preparation film) filler in a large number, while being not easy pressing occurs, because resin flows is too much or not enough slide plate and the cavity problem of causing, also can not make glass directly contact reliability or CAF problem that copper layer causes because a large amount of resins flow into thick copper space.
5. the long-pending circuit in heavy in section that is greater than copper foil circuit layer due to thickness is hidden in plate body inside, and the circuit board plate face completing is without obvious high low head, causes green paint (solder mask) to be difficult for covering or word is difficult for the problem of printing and be unlikely.
Claims (9)
1. a circuit board manufacturing method, is characterized in that, includes the following step:
A., the one first circuit board base material that is provided with at least one copper foil circuit layer is provided;
B. in first circuit board base material with respect to the another face of copper foil circuit layer, be processed to form the circuit groove that at least can make the copper foil circuit layer of another side appear at bottom portion of groove;
C. in circuit groove, insert thick copper in electro-coppering mode until protrude first circuit board backing material plate face to predetermined altitude, and on first circuit board base material, form the long-pending circuit at least one heavy in section of following circuit groove to distribute;
D. the first circuit board backing material plate face that long-pending circuit exposes in heavy in section arranges at least one semi-solid preparation glue-line;
E. make semi-solid preparation glue-line that long-pending heavy in section circuit is covered via hot melt pressing mode, and maintain the smooth of surface;
The circuit board that completes above-mentioned steps and obtain after cooling and shaping, on same first circuit board base material, form the thin circuits that at least one is made up of copper foil circuit layer, and at least one is overlying in circuit groove and is relatively hidden in the long-pending circuit in heavy in section in plate body by filling out.
2. a kind of circuit board manufacturing method as claimed in claim 1, it is characterized in that, this circuit board manufacturing method, further by the overlapped pressing of first circuit board base material of at least two completing steps a ~ e procedure for processing, and between each first circuit board, be provided with at least one conductor connecting in order to form predetermining circuit.
3. a kind of circuit board manufacturing method as claimed in claim 1, it is characterized in that, this circuit board manufacturing method, further the first circuit board base material of two completing steps a ~ d procedure for processing is amassed to the corresponding overlapped pressing of mode of circuit with heavy in section, and between each first circuit board base material, be provided with at least one conductor connecting in order to form predetermining circuit.
4. a kind of circuit board manufacturing method as claimed in claim 1, it is characterized in that, this circuit board manufacturing method, at least one second circuit plate substrate that is provided with at least one copper foil circuit layer is further provided, by the first circuit board base material of at least one completing steps a ~ e procedure for processing and the overlapped pressing of this at least one second circuit plate substrate, and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor connecting in order to form predetermining circuit.
5. a kind of circuit board manufacturing method as claimed in claim 1, it is characterized in that, this circuit board manufacturing method, at least one second circuit plate substrate that is provided with at least one copper foil circuit layer is further provided, the first circuit board base material of at least one completing steps a ~ d procedure for processing is amassed to the mode of circuit corresponding to second circuit plate substrate with its heavy in section, by the first circuit board base material of at least one completing steps a ~ d procedure for processing and the overlapped pressing of at least one second circuit plate substrate, and between this at least one first circuit board and this at least one second circuit plate substrate, be provided with at least one conductor connecting in order to form predetermining circuit.
6. as a kind of circuit board manufacturing method as described in arbitrary in claim 1 to 5, it is characterized in that, this circuit board manufacturing method, after first circuit board base material completing steps b, in the metallic film of circuit groove inwall construction predetermined thickness, in circuit groove, insert again afterwards thick copper in electro-coppering mode.
7. as a kind of circuit board manufacturing method as described in arbitrary in claim 1 to 5, it is characterized in that, this circuit board manufacturing method, after first circuit board base material completing steps b, in copper foil circuit layer surface coverage one shielding layer, in circuit groove, insert again afterwards thick copper in electro-coppering mode, and after completing steps c, worn-out the screening on copper foil circuit layer surface layer is removed.
8. as a kind of circuit board manufacturing method as described in arbitrary in claim 1 to 5, it is characterized in that this circuit board manufacturing method is located at copper foil circuit layer on the plate face of first circuit board base material via electro-coppering mode.
9. as a kind of circuit board manufacturing method as described in arbitrary in claim 1 to 5, it is characterized in that this circuit board manufacturing method is located at copper foil circuit layer on the plate face of first circuit board base material via pressing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210400684.5A CN103781284A (en) | 2012-10-19 | 2012-10-19 | Circuit-board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210400684.5A CN103781284A (en) | 2012-10-19 | 2012-10-19 | Circuit-board manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN103781284A true CN103781284A (en) | 2014-05-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210400684.5A Pending CN103781284A (en) | 2012-10-19 | 2012-10-19 | Circuit-board manufacturing method |
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| CN (1) | CN103781284A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332461A (en) * | 2015-07-02 | 2017-01-11 | 先丰通讯股份有限公司 | Circuit board and manufacturing method thereof |
| CN111246684A (en) * | 2018-11-28 | 2020-06-05 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5830563A (en) * | 1995-11-29 | 1998-11-03 | Nec Corporation | Interconnection structures and method of making same |
| TW200539772A (en) * | 2004-05-24 | 2005-12-01 | Phoenix Prec Technology Corp | Circuit board with multi circuit layers and method for fabricating the same |
| CN102325431A (en) * | 2011-09-09 | 2012-01-18 | 深南电路有限公司 | Method for making copper cylinder on circuit board and circuit board with surface copper cylinders |
-
2012
- 2012-10-19 CN CN201210400684.5A patent/CN103781284A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5830563A (en) * | 1995-11-29 | 1998-11-03 | Nec Corporation | Interconnection structures and method of making same |
| TW200539772A (en) * | 2004-05-24 | 2005-12-01 | Phoenix Prec Technology Corp | Circuit board with multi circuit layers and method for fabricating the same |
| CN102325431A (en) * | 2011-09-09 | 2012-01-18 | 深南电路有限公司 | Method for making copper cylinder on circuit board and circuit board with surface copper cylinders |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106332461A (en) * | 2015-07-02 | 2017-01-11 | 先丰通讯股份有限公司 | Circuit board and manufacturing method thereof |
| CN106332461B (en) * | 2015-07-02 | 2019-05-07 | 先丰通讯股份有限公司 | Circuit board and preparation method thereof |
| CN111246684A (en) * | 2018-11-28 | 2020-06-05 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
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Application publication date: 20140507 |