CN103805124A - Low-temperature resistant polyamide hot-melt adhesive and preparation method thereof - Google Patents

Low-temperature resistant polyamide hot-melt adhesive and preparation method thereof Download PDF

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Publication number
CN103805124A
CN103805124A CN201410017170.0A CN201410017170A CN103805124A CN 103805124 A CN103805124 A CN 103805124A CN 201410017170 A CN201410017170 A CN 201410017170A CN 103805124 A CN103805124 A CN 103805124A
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temperature resistant
rubber
parts
low temperature
resistant polyamide
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CN201410017170.0A
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CN103805124B (en
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文磊
康海杨
段金豆
刘晓播
邱光南
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Changyuan electronic (Group) Co., Ltd.
Changyuan Electronics (Dongguan) Co., Ltd.
CYG Electronics Shanghai Co Ltd
Tianjin Changyuan Electronic Material Co Ltd
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CHANGYUAN GROUP Ltd
CHANGYUAN ELECTRONIC (GROUP) Co Ltd
CYG Electronics Shanghai Co Ltd
Tianjin Changyuan Electronic Material Co Ltd
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Abstract

The invention discloses a low-temperature resistant polyamide hot-melt adhesive, comprising the following components in parts by weight: 100 parts of dimer acid polyamide and grafted derivatives, 10-50 parts of crosslinking rubber, 1-3 parts of crosslinking agents, 0-3 parts of assistant crosslinkers, and 0.5-3 parts of antioxidants. The crosslinking rubber is one or a mixture of more of the following substances: ethylene propylene terpolymer, maleic anhydride grafted ethylene propylene terpolymer, and acrylonitrile butadiene rubber; the crosslinking agent is one or a mixture of more of the following substances: dicumyl peroxide, ethylene thiourea and sulphur; the assistant crosslinker is one or a mixture of two of the following substances: triallyl cyanurate and triallyl cyanuric acid ester. The low-temperature resistant polyamide hot-melt adhesive disclosed by the invention can be applied to the industries such as electronic telecommunications, household appliances and automobiles, and is especially applicable to bonding of a polar substance and a nonpolar substance when the demands on the resistance to chemical reagents and the oil resistivity are high in a low-temperature environment.

Description

A kind of low temperature resistant polyamide thermosol and preparation method thereof
Technical field
The invention belongs to hot melt adhesive field, relate in particular to and adopt standby low temperature resistant polyamide thermosol of dynamic crosslinking legal system and preparation method thereof, improve resistance to low temperature and the adhesive property of polyamide hot.
Background technology
PA(Polyamide, polymeric amide) hot melt adhesive is take polyamide resin as matrix, has softening point range narrow, and oil-proofness and resistance are good; To polar material cementability intensity advantages of higher, it is a kind of sizing agent of excellent property.But it is poor that polyamide hot has resistance to low temperature, easily there is at low temperatures embrittlement, hot melt adhesive performance is caused to serious impact.Polyamide hot polarity is strong in addition, and very poor for the adhesive property of apolar substance (as polyethylene) etc., its range of application is limited by very large.
Dynamic crosslinking is generally used in rubber plastic blend, carries out the preparation of thermoplastic elastomer, but has no the report for hot melt adhesive field.
Summary of the invention
The technical problem to be solved in the present invention is: propose a kind of low temperature resistant polyamide thermosol and preparation method thereof, improve resistance to low temperature and the adhesive property of polyamide hot.
In order to solve the problems of the technologies described above, the present invention proposes following technical scheme: a kind of low temperature resistant polyamide thermosol, it is made up of the following component of counting by weight: 100 parts of dimer acid type polyamide and Grafted Derivatives thereof, crosslinked with rubber 10-50 part, linking agent 1-3 part, additional crosslinker 0-3 part, oxidation inhibitor 0.5-3 part;
Described crosslinked with rubber be one or more the mixture in following material: terpolymer EP rubber, maleic anhydride graft terpolymer EP rubber, nitrile rubber;
Described linking agent is one or more the mixture in following material: dicumyl peroxide, ethylene thiourea, sulphur;
Described additional crosslinker is one or both the mixture in following material: triallyl cyanurate, iso-cyanuric acid triallyl ester.
The further restriction of technique scheme is: described oxidation inhibitor is one or more the compound in following material: four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester; 2,6 ditertiary butyl p cresol; 2-mercaptobenzimidazole; Zinc salt of 2 mercaptobenzimidazole; 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer; 4.4 a pair ofs (2.2-dimethyl benzyl) pentanoic.
In order to solve the problems of the technologies described above, the present invention proposes following technical scheme: a kind of preparation method of low temperature resistant polyamide thermosol, and it comprises the following steps:
Step 1: by load weighted dimer acid type polyamide and Grafted Derivatives thereof, crosslinkedly stir with rubber, oxidation inhibitor stirrer;
Step 2: through mixer mixing, granulation;
Step 3: add linking agent and additional crosslinker in the blend obtaining in step 2, adopt twin screw extruder to carry out dynamic crosslinking after stirring, granulation, obtains the low temperature resistant polyamide thermosol of dynamic crosslinking modification;
Step 4: obtain low temperature resistant polyamide thermosol grain and proceed to drying machine drying, packing.
The further restriction of technique scheme is: first twin screw granulation Heating temperature adopts 100-120 degree Celsius, and twin-screw extrusion dynamic crosslinking Heating temperature is 140 ℃-160 ℃.
The further restriction of technique scheme is: described oxidation inhibitor is one or more the compound in following material: four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester; 2,6 ditertiary butyl p cresol; 2-mercaptobenzimidazole; Zinc salt of 2 mercaptobenzimidazole; 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer; 4.4 a pair ofs (2.2-dimethyl benzyl) pentanoic.
Compared with prior art, the present invention has following beneficial effect:
The prepared hot melt adhesive of the present invention not only has stronger improvement to its low-temperature performance, also the cohesive strength of polyamide hot and apolar substance (polyethylene) is had to obvious lifting, and PE/PE stripping strength significantly improves, and good fluidity.
The standby low temperature resistant polyamide thermosol of described dynamic crosslinking legal system can be used for electronics telecommunication, household electrical appliances, and automobile and other industries, while being particularly useful in low temperature environment resistance to chemical reagents and oil-proofness to have relatively high expectations, bonds to polar material and apolar substance.
The low temperature resistant polyamide thermosol that this dynamic crosslinking legal system is standby, make the resistance to low temperature of hot melt adhesive obtain good improvement,-40 ℃ (ASTM D3111) are reached, also make polyamide hot greatly improve the cohesive strength of non-polar material (polyethylene), reach 200N/25mm(GB/T2971PE/PE).
Embodiment
The present invention proposes a kind of low temperature resistant polyamide thermosol, and it is made up of the following component of counting by weight: 100 parts of dimer acid type polyamide and Grafted Derivatives thereof, and crosslinked with rubber 10-50 part, linking agent 1-3 part, additional crosslinker 0-3 part, oxidation inhibitor 0.5-3 part.
Described crosslinked with rubber be one or more the mixture in following material: terpolymer EP rubber, maleic anhydride graft terpolymer EP rubber, nitrile rubber.
Described linking agent is one or more the mixture in following material: dicumyl peroxide, ethylene thiourea, sulphur.
Described additional crosslinker is one or both the mixture in following material: triallyl cyanurate, iso-cyanuric acid triallyl ester.
Described oxidation inhibitor is one or more the compound in following material: four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester; 2,6 ditertiary butyl p cresol; 2-mercaptobenzimidazole (MB); Zinc salt of 2 mercaptobenzimidazole (MBZ); 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer (RD); 4.4 a pair ofs (2.2-dimethyl benzyl) pentanoic.
Above-mentioned low temperature resistant polyamide thermosol adopts dynamic crosslinking legal system standby, comprises the following steps:
Step 1: by load weighted dimer acid type polyamide and Grafted Derivatives thereof, crosslinkedly stir with rubber, oxidation inhibitor stirrer;
Step 2: through mixer mixing, granulation;
Step 3: add linking agent and additional crosslinker in the blend obtaining in step 2, adopt twin screw extruder to carry out dynamic crosslinking after stirring, granulation, obtains the low temperature resistant polyamide thermosol of dynamic crosslinking modification;
Step 4: obtain low temperature resistant polyamide thermosol grain and proceed to drying machine drying, packing.
First twin screw granulation Heating temperature adopts 100-120 degree Celsius, and twin-screw extrusion dynamic crosslinking Heating temperature is 140 ℃-160 ℃.
The low-temperature performance of the prepared low temperature resistant polyamide thermosol of above-mentioned preparation method is obviously improved than the polyamide hot of prior art, and PE/PE stripping strength significantly improves, and good fluidity.
Preparation Example 1
Take 100 parts of dimer acid type polyamide and Grafted Derivatives thereof, crosslinked with 10 parts of rubber, 1 part of linking agent, 0.5 part, oxidation inhibitor according to parts by weight.
Described crosslinkedly formed by 2 parts of 8 parts of terpolymer EP rubbers, maleic anhydride graft terpolymer EP rubber with rubber.
Described linking agent is 1 part of dicumyl peroxide.
Described oxidation inhibitor is 0.5 part of 2-mercaptobenzimidazole (MB).
By load weighted dimer acid type polyamide and Grafted Derivatives thereof, terpolymer EP rubber, maleic anhydride graft terpolymer EP rubber, oxidation inhibitor add and in Banbury mixer, carry out batch mixing, after mixing completing through single screw rod granulation.
Load weighted dicumyl peroxide, 2-mercaptobenzimidazole (MB) are dropped into stirrer with first banburying gained material grain, stir 3min; Twin screw extruder is warming up to 150 ℃, and mixture is proceeded to twin screw extruder and carry out dynamic crosslinking, cooling and dicing, drying machine drying, obtains low temperature resistant polyamide thermosol product, and the easy moisture absorption of polymeric amide stores in dehumidifying room.
Dynamic crosslinking legal system is tested for low temperature resistant polyamide thermosol, and test result is as shown in the table:
Interventions Requested Inspecting standard Measured value
Softening temperature (℃) GB/T?2294 105
Stripping strength (PE/PE, N/25mm) GB/T?2971 75
Low temperature flexibility ASTM?D3111 -40 ℃ do not rupture
Tensile strength (MPa) ASTM?D638 6.3
Elongation at break (%) ASTM?D638 637
Preparation Example 2
Take 100 parts of dimer acid type polyamide and Grafted Derivatives thereof, crosslinked with 20 parts of rubber, 2 parts of linking agents, 1 part of additional crosslinker, 1 part, oxidation inhibitor according to parts by weight.
Described crosslinkedly formed by 5 parts of 15 parts of terpolymer EP rubbers, maleic anhydride graft terpolymer EP rubber with rubber.
Described linking agent is 2 parts of dicumyl peroxides.
Described additional crosslinker is 1 part of triallyl cyanurate.
Described oxidation inhibitor is 1 part of 2-mercaptobenzimidazole (MB).
By load weighted dimer acid type polyamide and Grafted Derivatives thereof, terpolymer EP rubber, maleic anhydride graft terpolymer EP rubber, 2-mercaptobenzimidazole (MB) add and in Banbury mixer, carry out batch mixing, after mixing completing through single screw rod granulation.
Load weighted dicumyl peroxide, triallyl cyanurate and first banburying gained material grain are dropped into stirrer, stir 3min; Twin screw extruder is warming up to 150 ℃, and mixture is proceeded to twin screw extruder and carry out dynamic crosslinking, cooling and dicing, drying machine drying, obtains low temperature resistant polyamide thermosol product, and the easy moisture absorption of polymeric amide stores in dehumidifying room.
Dynamic crosslinking legal system is tested for low temperature resistant polyamide thermosol, and test result is as shown in the table:
Interventions Requested Inspecting standard Measured value
Softening temperature (℃) GB/T?2294 113
Stripping strength (PE/PE, N/25mm) GB/T?2971 92
Low temperature flexibility ASTM?D3111 -55 ℃ do not rupture
Tensile strength (MPa) ASTM?D638 5.31
Elongation at break (%) ASTM?D638 492%
Preparation Example 3
Take 100 parts of dimer acid type polyamide and Grafted Derivatives thereof, crosslinked with 30 parts of rubber, 3 parts of linking agents, 3 parts, oxidation inhibitor according to parts by weight.
Described crosslinked with rubber be 30 parts of nitrile rubbers.
Described linking agent is 3 parts of ethylene thioureas.
Described oxidation inhibitor is 2,2,4-trimethylammonium-1,3 parts of 2-dihyaroquinoline polymers.
By load weighted dimer acid type polyamide and Grafted Derivatives thereof, nitrile rubber, 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer adds and in Banbury mixer, carries out batch mixing, after mixing completing through single screw rod granulation.
Load weighted ethylene thiourea and first banburying gained material grain are dropped into stirrer, stir 3min; Twin screw extruder is warming up to 150 ℃, and mixture is proceeded to twin screw extruder and carry out dynamic crosslinking, cooling and dicing, drying machine drying, obtains low temperature resistant polyamide thermosol product, and the easy moisture absorption of polymeric amide stores in dehumidifying room.
Dynamic crosslinking legal system is tested for low temperature resistant polyamide thermosol, and test result is as shown in the table:
Interventions Requested Inspecting standard Measured value
Softening temperature (℃) GB/T?2294 122
Stripping strength (PE/PE, N/25mm) GB/T?2971 107
Low temperature flexibility ASTM?D3111 -55 ℃ do not rupture
Tensile strength (MPa) ASTM?D638 6.10
Elongation at break (%) ASTM?D638 537%
Preparation Example 4
Take 100 parts of dimer acid type polyamide and Grafted Derivatives thereof, crosslinked with 40 parts of rubber, 2 parts of linking agents, 1 part of additional crosslinker, 1 part, oxidation inhibitor according to parts by weight.
Described crosslinkedly formed by 30 parts of 10 parts of terpolymer EP rubbers, maleic anhydride graft terpolymer EP rubber with rubber.
Described linking agent is 2 parts of dicumyl peroxides.
Described additional crosslinker is 1 part of triallyl cyanurate.
Described oxidation inhibitor is 1 part of 2-mercaptobenzimidazole (MB).
By load weighted dimer acid type polyamide and Grafted Derivatives thereof, terpolymer EP rubber, maleic anhydride graft terpolymer EP rubber, 2-mercaptobenzimidazole (MB) add and in Banbury mixer, carry out batch mixing, after mixing completing through single screw rod granulation.
Load weighted dicumyl peroxide, triallyl cyanurate and first banburying gained material grain are dropped into stirrer, stir 3min; Twin screw extruder is warming up to 150 ℃, and mixture is proceeded to twin screw extruder and carry out dynamic crosslinking, cooling and dicing, drying machine drying, obtains low temperature resistant polyamide thermosol product, and the easy moisture absorption of polymeric amide stores in dehumidifying room.
Dynamic crosslinking legal system is tested for low temperature resistant polyamide thermosol, and test result is as shown in the table:
Interventions Requested Inspecting standard Measured value
Softening temperature (℃) GB/T?2294 129
Stripping strength (PE/PE, N/25mm) GB/T?2971 143
Low temperature flexibility ASTM?D3111 -55 ℃ do not rupture
Tensile strength (MPa) ASTM?D638 6.74
Elongation at break (%) ASTM?D638 471%
Preparation Example 5
Take 100 parts of dimer acid type polyamide and Grafted Derivatives thereof, crosslinked with 50 parts of rubber, 3 parts of linking agents, 3 parts of additional crosslinkers, 2 parts, oxidation inhibitor according to parts by weight.
Described crosslinkedly formed by 20 parts of 30 parts of terpolymer EP rubbers, maleic anhydride graft terpolymer EP rubber with rubber.
Described linking agent is 3 parts of dicumyl peroxides.
Described additional crosslinker is 1 part of triallyl cyanurate.
Described oxidation inhibitor is 2 parts of 2-mercaptobenzimidazoles (MB).
By load weighted dimer acid type polyamide and Grafted Derivatives thereof, terpolymer EP rubber, maleic anhydride graft terpolymer EP rubber, 2-mercaptobenzimidazole (MB) add and in Banbury mixer, carry out batch mixing, after mixing completing through single screw rod granulation.
Load weighted dicumyl peroxide, triallyl cyanurate and first banburying gained material grain are dropped into stirrer, stir 3min; Twin screw extruder is warming up to 150 ℃, and mixture is proceeded to twin screw extruder and carry out dynamic crosslinking, cooling and dicing, drying machine drying, obtains low temperature resistant polyamide thermosol product, and the easy moisture absorption of polymeric amide stores in dehumidifying room.
Dynamic crosslinking legal system is tested for low temperature resistant polyamide thermosol, and test result is as shown in the table:
Interventions Requested Inspecting standard Measured value
Softening temperature (℃) GB/T?2294 145
Stripping strength (PE/PE, N/25mm) GB/T?2971 179
Low temperature flexibility ASTM?D3111 -55 ℃ do not rupture
Tensile strength (MPa) ASTM?D638 6.52
Elongation at break (%) ASTM?D638 397%
Above content is in conjunction with concrete preferred implementation, the present invention to be illustrated; not as the restriction of assert the specific embodiment of the present invention; for those skilled in the art; on the basis of thinking of the present invention; the simple conversion of making, all should be considered as belonging to the present invention and determine scope of patent protection by submitted to claims.

Claims (5)

1. a low temperature resistant polyamide thermosol, it is made up of the following component of counting by weight: 100 parts of dimer acid type polyamide and Grafted Derivatives thereof, crosslinked with rubber 10-50 part, linking agent 1-3 part, additional crosslinker 0-3 part, oxidation inhibitor 0.5-3 part;
Described crosslinked with rubber be one or more the mixture in following material: terpolymer EP rubber, maleic anhydride graft terpolymer EP rubber, nitrile rubber;
Described linking agent is one or more the mixture in following material: dicumyl peroxide, ethylene thiourea, sulphur;
Described additional crosslinker is one or both the mixture in following material: triallyl cyanurate, iso-cyanuric acid triallyl ester.
2. a kind of low temperature resistant polyamide thermosol according to claim 1, is characterized in that: described oxidation inhibitor is one or more the compound in following material: four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester; 2,6 ditertiary butyl p cresol; 2-mercaptobenzimidazole; Zinc salt of 2 mercaptobenzimidazole; 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer; 4.4 a pair ofs (2.2-dimethyl benzyl) pentanoic.
3. a preparation method for low temperature resistant polyamide thermosol as claimed in claim 1, is characterized in that, it comprises the following steps:
Step 1: by load weighted dimer acid type polyamide and Grafted Derivatives thereof, crosslinkedly stir with rubber, oxidation inhibitor stirrer;
Step 2: through mixer mixing, granulation;
Step 3: add linking agent and additional crosslinker in the blend obtaining in step 2, adopt twin screw extruder to carry out dynamic crosslinking after stirring, granulation, obtains the low temperature resistant polyamide thermosol of dynamic crosslinking modification;
Step 4: obtain low temperature resistant polyamide thermosol grain and proceed to drying machine drying, packing.
4. the preparation method of low temperature resistant polyamide thermosol according to claim 3, is characterized in that, first twin screw granulation Heating temperature adopts 100-120 degree Celsius, and twin-screw extrusion dynamic crosslinking Heating temperature is 140 ℃-160 ℃.
5. the preparation method of low temperature resistant polyamide thermosol according to claim 3, is characterized in that, described oxidation inhibitor is one or more the compound in following material: four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester; 2,6 ditertiary butyl p cresol; 2-mercaptobenzimidazole; Zinc salt of 2 mercaptobenzimidazole; 2,2,4-trimethylammonium-1,2-dihyaroquinoline polymer; 4.4 a pair ofs (2.2-dimethyl benzyl) pentanoic.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104804672A (en) * 2015-04-22 2015-07-29 深圳市沃尔核材股份有限公司 Hot melt adhesive for electric cable accessory of nuclear power station

Citations (2)

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Publication number Priority date Publication date Assignee Title
US4359556A (en) * 1981-06-05 1982-11-16 Gulf Oil Corporation Thermoplastic polyamide hot melt adhesive composition
CN101633829A (en) * 2008-07-23 2010-01-27 上海轻工业研究所有限公司 Low temperature resistant daiamid hot melt adhesive with high air tightness and application thereof

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US4359556A (en) * 1981-06-05 1982-11-16 Gulf Oil Corporation Thermoplastic polyamide hot melt adhesive composition
CN101633829A (en) * 2008-07-23 2010-01-27 上海轻工业研究所有限公司 Low temperature resistant daiamid hot melt adhesive with high air tightness and application thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104804672A (en) * 2015-04-22 2015-07-29 深圳市沃尔核材股份有限公司 Hot melt adhesive for electric cable accessory of nuclear power station

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