CN104009146A - SMD LED panel support structure and LED chip - Google Patents
SMD LED panel support structure and LED chip Download PDFInfo
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- CN104009146A CN104009146A CN201410253709.2A CN201410253709A CN104009146A CN 104009146 A CN104009146 A CN 104009146A CN 201410253709 A CN201410253709 A CN 201410253709A CN 104009146 A CN104009146 A CN 104009146A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention relates to the technical field of encapsulating and processing of LED chips, in particular to an SMD LED panel support structure and an LED chip. The SMD LED panel support structure comprises a metal substrate. A concave pit is formed in the position, where an LED wafer is fixed, of the metal substrate, the pit depth of the concave pit is 0.05-0.2 mm, the base area of the concave pit is 0.3-5.5 mm <2>, and the LED wafer is fixed to the bottom surface of the concave pit. The depth of the concave pit is small, the base area of the concave pit is small, less glue for encapsulating the concave pit is used than that for encapsulating a traditional SMD LED bowl-shaped support, and the phenomenon of deviation of the glue face is not prone to occurring when the SMD LED panel support structure is encapsulated. The side walls of the concave pit are made of metal, light reflection capacity of the metal side walls is higher than that of the side walls, made of PPA, of the traditional SMD LED bowl-shaped support, and therefore light-emitting brightness of the LED wafer encapsulated on the SMD LED panel support structure is improved by more than 5 percent compared with an LED wafer encapsulated on the traditional SMD LED bowl-shaped support.
Description
Technical field
The present invention relates to LED chip encapsulation process technical field, relate in particular to a kind of SMD LED flat bracket structure and LED chip.
Background technology
Current SMD (Surface Mounted Devices, surface mount device) LED (Light Emitting Diode, light-emitting diode) bowl cup support, generally injection structure and metal substrate, consist of and have a bowl cup structure, the sidewall of this bowl of cup structure is the weak PPA material of light reflection ability.As depicted in figs. 1 and 2, it is that the single LEDs wafer of encapsulation is in structure vertical view and the section of structure of SMD LED bowl cup support.LED wafer 1 is bonded in a bowl metal substrate region for cup structure bottom by primer agent such as epoxy, silica gel or elargol, and by BANDING technology, draw wire 2 and be connected with the positive and negative electrode of this bowl of cup support at the electrode place above LED wafer 1, plays the effect of electrical connection.The dark 0.3mm of being about of cup of the bowl cup structure of this bowl of cup support is above, a cup floor space is about the more than 4 times of LED wafer 1 floor space.The glue amount relative consumption of this bowl of cup structure of embedding is more, and the rising angle maximum with the LED chip of such bowl of cup support can only reach 120 ° and because the weak reflection of PPA material makes its emitting brightness less.Visible, SMD LED bowl cup support is convenient to the embedding of glue and the bright dipping of LED wafer owing to being provided with bowl cup structure, but has also limited the moulding of casting glue, the rising angle of packaging and emitting brightness simultaneously.
For meeting the demand of overlay film moulding process and larger rising angle, the follow-up SMD LED flat bracket that occurred, such flat bracket does not generally have a bowl cup structure, and LED wafer is directly adhered on the metal substrate of this flat bracket.The rising angle with the LED chip of such flat bracket can reach the polarizers of big angle scope of 120 °-160 °, but the phenomenon of glue face skew easily appears during glue in point.Even and adopt some box dam glue or the special-purpose relatively high glue of viscosity, occur that the situation of glue face shift phenomenon does not improve yet.The skew of glue face is little on the impact of aobvious finger, colour temperature, angle, luminous flux and the light efficiency of LED chip, but can make the distribution curve flux gross distortion of LED chip.As shown in Figure 3 and Figure 4, it is the distribution curve flux figure of the distribution curve flux figure of a normal LED chip of glue and the LED chip of some glue skew.
Summary of the invention
The object of the invention is to propose a kind of SMD LED flat bracket structure and LED chip, the glue amount of this supporting structure of embedding consumes little, is not prone to glue face shift phenomenon during embedding, and it is large to make to have the emitting brightness of LED chip of this supporting structure.
For reaching this object, the present invention by the following technical solutions:
First aspect, provides a kind of SMD LED flat bracket structure, comprises metal substrate, in the position of described metal substrate fixed L ED wafer, offers a pit, and the hole of described pit is deeply for 0.05-0.2mm, hole floor space are 0.3-5.5mm
2.
Wherein, described pit comprises truncated cone-shaped hole, and the angle of axisymmetric two incline extended lines in described truncated cone-shaped hole is 5-60 °.
Wherein, described pit also comprises cylindrical hole, and the post height in described cylindrical hole is 0.01-0.1mm, described cylindrical hole be positioned at truncated cone-shaped hole directly over, the upper surface equal diameters in the diameter in described cylindrical hole and truncated cone-shaped hole, described truncated cone-shaped hole and cylindrical hole are one-body molded.
Wherein, the sidewall of described pit covers Cu plating Ag layer.
Wherein, described pit is punch forming or etch-forming.
Second aspect, provides a kind of LED chip, comprises LED wafer and above-mentioned SMD LED flat bracket structure, and described LED wafer is fixed on pit bottom surface.
Wherein, the LED wafer that described LED wafer is 45Mil, described hole floor space is 1.9-5.2mm
2.
Wherein, the LED wafer that described LED wafer is 20Mil, described hole floor space is 0.3-1.1mm
2.
Wherein, between described LED wafer and pit bottom surface, elargol layer is set.
Wherein, described pit directly over the casting glue coordinate with pit shape is set.
Beneficial effect of the present invention is: a kind of SMD LED flat bracket structure and LED chip, comprise metal substrate, and in the position of described metal substrate fixed L ED wafer, offer a pit, the hole of described pit is deeply for 0.05-0.2mm, hole floor space are 0.3-5.5mm
2.Described LED wafer is fixed on pit bottom surface.Depth as shallow, the floor space of pit are little, and the glue amount of this pit of embedding is fewer than the glue amount consumption of the traditional SMD LED of embedding bowl cup support, and due to the existence of pit, are not prone to glue face shift phenomenon during this flat bracket structure of embedding.On metal substrate, directly offer pit, the sidewall of pit is metal material, the luminous reflectanc of metal material sidewall is stronger than the luminous reflectanc of the PPA material sidewall of traditional SMD LED bowl cup support, makes the emitting brightness of the LED wafer of encapsulation promote more than 5% with respect to the emitting brightness that is encapsulated in the LED wafer of traditional SMD LED bowl cup support.Visible, this SMD LED flat bracket structure and LED chip, the glue amount of this supporting structure of embedding consumes little, is not prone to glue face shift phenomenon during embedding, and it is large to make to have the emitting brightness of LED chip of this supporting structure.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing of required use during the embodiment of the present invention is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to the content of the embodiment of the present invention and these accompanying drawings other accompanying drawing.
Fig. 1 is that the single LEDs wafer of encapsulation is in the structure vertical view of SMD LED bowl cup support.
Fig. 2 is that the single LEDs wafer of encapsulation is in the section of structure of SMD LED bowl cup support.
Fig. 3 is the distribution curve flux figure of a normal LED chip of glue.
Fig. 4 is a distribution curve flux figure for the LED chip of glue skew.
Fig. 5 is the LED chip structure vertical view of the SMD of being packaged in LED flat bracket structure provided by the invention.
Fig. 6 is the LED chip structural front view of the SMD of being packaged in LED flat bracket structure provided by the invention.
Fig. 7 is the LED chip structure side view of the SMD of being packaged in LED flat bracket structure provided by the invention.
Fig. 8 is the LED chip structure vertical view that flip chip provided by the invention is packaged in SMD LED flat bracket structure.
Fig. 9 is the LED chip structural front view that flip chip provided by the invention is packaged in SMD LED flat bracket structure.
Figure 10 is the LED chip structure side view that flip chip provided by the invention is packaged in SMD LED flat bracket structure.
Description of reference numerals is as follows:
1-LED wafer; 2-wire; 3-metal substrate; 4-injection structure; 5-pit; 6-casting glue.
Embodiment
For the technical scheme of technical problem that the present invention is solved, employing and the technique effect that reaches clearer, below in conjunction with accompanying drawing, the technical scheme of the embodiment of the present invention is described in further detail, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those skilled in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Please refer to Fig. 5, Fig. 6 and Fig. 7, it is respectively LED chip structure vertical view, structural front view and the structure side view of the SMD of being packaged in LED flat bracket structure provided by the invention.
A SMD LED flat bracket structure, comprises metal substrate 3, in the position of described metal substrate 3 fixed L ED wafers 1, offers a pit 5, and the hole of described pit 5 is deeply for 0.05-0.2mm, hole floor space are 0.3-5.5mm
2.
SMD LED flat bracket structure provided by the invention, depth as shallow, the floor space of pit 5 are little, the glue amount of this pit 5 of embedding is fewer than the glue amount consumption of the traditional SMD LED of embedding bowl cup support, and due to the existence of pit 5, is not prone to glue face shift phenomenon during this flat bracket structure of embedding.On metal substrate 3, directly offer pit 5, the sidewall of pit 5 is metal material, the luminous reflectanc of metal material sidewall is stronger than the luminous reflectanc of the PPA material sidewall of traditional SMDLED bowl cup support, makes the emitting brightness of the LED wafer 1 of encapsulation promote more than 5% with respect to the emitting brightness that is encapsulated in the LED wafer 1 of traditional SMD LED bowl cup support.Visible, this SMD LED flat bracket structure, the glue amount of this supporting structure of embedding consumes little, is not prone to glue face shift phenomenon during embedding, and it is large to make to have the emitting brightness of LED chip of this supporting structure.
Wherein, described pit 5 comprises truncated cone-shaped hole, and the angle of axisymmetric two incline extended lines in described truncated cone-shaped hole is 5-60 °.
According to angle and the geometrical relationship of axisymmetric two incline extended lines in truncated cone-shaped hole, can calculate the upper surface area in truncated cone-shaped hole.
The floor space of pit 5 is little, is about the 1.5-4 of fixing LED wafer 1 floor space doubly, coordinates extended line to become mutually two inclines of 5-60 ° of angle, and the rising angle that can make to have the LED chip of this supporting structure reaches 120-160 °.
Wherein, described pit 5 also comprises cylindrical hole, and the post height in described cylindrical hole is 0.01-0.1mm, described cylindrical hole be positioned at truncated cone-shaped hole directly over, the upper surface equal diameters in the diameter in described cylindrical hole and truncated cone-shaped hole, described truncated cone-shaped hole and cylindrical hole are one-body molded.
Certainly, based on technical background of the present invention and design requirement, pit 5 can also be bowl type or other shapes, as long as reach the technique effect that the present invention realizes, does not repeat herein.
For the single LEDs wafer 1 of encapsulation, in SMD LED flat bracket structure, injection structure 4 positions of cutting apart the both positive and negative polarity that this supporting structure is connected with wire 2 can be adjusted accordingly according to the actual requirements in the region of metal substrate 3.By adjusting the die bond that metal substrate 3, injection structure 4 and pit 5 sizes just can be applied to single and plurality of LEDs wafer 1 this supporting structure, encapsulate.
Wherein, the sidewall of described pit 5 covers Cu plating Ag layer.
The sidewall of pit 5 covers Cu plating Ag layer, Cu plating Ag is metal substrate 3 materials, this Cu plating Ag layer improves the light reflectivity of pit 5 sidewalls, makes the emitting brightness of LED chip of the Sapphire Substrate of encapsulation promote more than 5% with respect to the emitting brightness that is packaged in the LED chip of traditional SMD LED bowl cup support.
Wherein, described pit 5 is punch forming or etch-forming.
SMD LED flat bracket structure provided by the invention is by punching press or be etched in metal substrate 3 upper surfaces and directly offer pit 5, help the light-emitting line of LED wafer 1 side more reflex to LED wafer 1 above, promote the light efficiency of packaging LED chips, and effective control point glue amount, the shape of guarantee point glue is consistent, and Shi Se district concentration degree is higher.
Please refer to Fig. 8, Fig. 9 and Figure 10, it is respectively LED chip structure vertical view, structural front view and structure side view that flip chip provided by the invention is packaged in SMD LED flat bracket structure.
A LED chip, comprises LED wafer 1 and above-mentioned SMD LED flat bracket structure, and described LED wafer 1 is fixed on pit 5 bottom surfaces.
Above-mentioned SMD LED flat bracket structure had both been applicable to the encapsulation of traditional formal dress wafer, was also applicable to the encapsulation of flip chip, was widely used in tin cream or scaling powder prints in batches.
It is heat sink that LED wafer 1 is directly placed on metal substrate 3, shortens heat dissipation path, reduces thermal resistance, improving radiating effect, and effectively reduce the junction temperature of LED wafer 1.
Wherein, the LED wafer 1 that described LED wafer 1 is 45Mil, described hole floor space is 1.9-5.2mm
2.
The LED wafer 1 of 45Mil is the LED wafer 1 of 6 cun of silicon substrates, adopts 1W great power LED wafer 1, and stable performance, more than anti-human body and environment static reach 8000V, more than light transmittance efficiency reaches 140lm/W, is the current LED wafer 1 of maximum on the market.
Wherein, the LED wafer 1 that described LED wafer 1 is 20Mil, described hole floor space is 0.3-1.1mm
2.
Specification is lower lower than LED wafer 1 light transmittance efficiency of 20Mil, and market utility ratio is low and procurement cycle is long.
Wherein, between described LED wafer 1 and pit 5 bottom surfaces, elargol layer is set.
Wherein, described pit 5 directly over the casting glue 6 with pit 5 form fit is set.
Punching press or etch a pit 5 on the metal substrate 3 of SMD LED flat bracket structure, while making to adopt this supporting structure of some glue mode embedding, is easier to operate He Se district concentration degree higher.The depth as shallow of this pit 5, floor space is little, can the smooth shape of flexible design casting glue 6 also adjust rising angle on a large scale.Pit 5 is applicable to multiple casting glue 6 modes, as a glue, overlay film, MOLDING etc., and easy to the control of glue amount and glue face during point glue, look district concentration degree is compared does not have the higher of pit 5 structures.LED wafer 1 is placed in the bottom of pit 5, and the Cu plating Ag material sidewall of pit 5 reflects the light-emitting line of LED wafer 1 side, has improved the overall brightness of LED chip, makes light shape full.
Preferred embodiment: a kind of SMD LED flat bracket structure, comprise metal substrate 3, at described metal substrate 3, fixedly offer a pit 5 in the position of the LED wafer 1 of 45Mil, the hole of described pit 5 is deeply for 0.1mm, hole floor space are 4.5mm
2.Described pit 5 comprises truncated cone-shaped hole, and the angle of axisymmetric two incline extended lines in described truncated cone-shaped hole is 60 °.Described pit 5 also comprises cylindrical hole, the post height in described cylindrical hole is 0.01mm, described cylindrical hole be positioned at truncated cone-shaped hole directly over, the upper surface equal diameters in the diameter in described cylindrical hole and truncated cone-shaped hole, described truncated cone-shaped hole and cylindrical hole are one-body molded.The glue amount that the preferred embodiment has solved embedding tradition SMD LED bowl cup support consumes the technical problem that the skew of glue face easily appears in the lower and traditional SMD LED of the embedding flat bracket of the rising angle light reflectance less, side surface of more, to have this tradition SMD LED bowl cup support LED chip; The glue amount that has reached this SMD LED flat bracket structure of embedding consumes little, during embedding, be not prone to the technique effect of glue face shift phenomenon, the rising angle that makes to have the LED chip of this supporting structure reaches 160 °, the bowl cup structure that brightness is PPA material with respect to side promotes 6%, and light shape is full, some glue shape is consistent, look district concentration degree is high.
A kind of SMD LED flat bracket structure and LED chip, the glue amount of this supporting structure of embedding consumes little, is not prone to glue face shift phenomenon during embedding, and it is large to make to have the emitting brightness of LED chip of this supporting structure, rising angle reaches 120-160 °, good heat dissipation effect.
Above content is only preferred embodiment of the present invention, for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, and this description should not be construed as limitation of the present invention.
Claims (10)
1. a SMD LED flat bracket structure, comprise metal substrate (3), it is characterized in that: in the position of described metal substrate (3) fixed L ED wafer (1), offer a pit (5), the hole of described pit (5) is deeply for 0.05-0.2mm, hole floor space are 0.3-5.5mm
2.
2. SMD LED flat bracket structure according to claim 1, is characterized in that, described pit (5) comprises truncated cone-shaped hole, and the angle of axisymmetric two incline extended lines in described truncated cone-shaped hole is 5-60 °.
3. SMD LED flat bracket structure according to claim 2, it is characterized in that, described pit (5) also comprises cylindrical hole, the post height in described cylindrical hole is 0.01-0.1mm, described cylindrical hole be positioned at truncated cone-shaped hole directly over, the upper surface equal diameters in the diameter in described cylindrical hole and truncated cone-shaped hole, described truncated cone-shaped hole and cylindrical hole are one-body molded.
4. SMD LED flat bracket structure according to claim 1, is characterized in that, the sidewall of described pit (5) covers Cu plating Ag layer.
5. SMD LED flat bracket structure according to claim 1, is characterized in that, described pit (5) is punch forming or etch-forming.
6. a LED chip, is characterized in that, comprises LED wafer (1) and the SMD LED flat bracket structure as described in claim 1-5 any one, and described LED wafer (1) is fixed on pit (5) bottom surface.
7. LED chip according to claim 6, is characterized in that, the LED wafer (1) that described LED wafer (1) is 45Mil, and described hole floor space is 1.9-5.2mm
2.
8. LED chip according to claim 6, is characterized in that, the LED wafer (1) that described LED wafer (1) is 20Mil, and described hole floor space is 0.3-1.1mm
2.
9. LED chip according to claim 6, is characterized in that, between described LED wafer (1) and pit (5) bottom surface, elargol layer is set.
10. LED chip according to claim 6, is characterized in that, the casting glue (6) with pit (5) form fit is set directly over described pit (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410253709.2A CN104009146A (en) | 2014-06-09 | 2014-06-09 | SMD LED panel support structure and LED chip |
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|---|---|---|---|
| CN201410253709.2A CN104009146A (en) | 2014-06-09 | 2014-06-09 | SMD LED panel support structure and LED chip |
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| CN107525025A (en) * | 2017-09-22 | 2017-12-29 | 宁波升谱光电股份有限公司 | A kind of LED encapsulation method and structure |
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| CN110034223A (en) * | 2019-03-13 | 2019-07-19 | 东莞中之光电股份有限公司 | A kind of large power white light LED lamp bead |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
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Application publication date: 20140827 |