CN104105817B - 金属氧化膜的制造方法和金属氧化膜 - Google Patents
金属氧化膜的制造方法和金属氧化膜 Download PDFInfo
- Publication number
- CN104105817B CN104105817B CN201280069377.1A CN201280069377A CN104105817B CN 104105817 B CN104105817 B CN 104105817B CN 201280069377 A CN201280069377 A CN 201280069377A CN 104105817 B CN104105817 B CN 104105817B
- Authority
- CN
- China
- Prior art keywords
- oxide film
- metal oxide
- ultraviolet
- thickness
- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/003—Apparatus or processes specially adapted for manufacturing conductors or cables using irradiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G9/00—Compounds of zinc
- C01G9/02—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP2012/052835 | 2012-02-08 | ||
JP2012052835 | 2012-02-08 | ||
PCT/JP2012/077416 WO2013118353A1 (ja) | 2012-02-08 | 2012-10-24 | 金属酸化膜の製造方法および金属酸化膜 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104105817A CN104105817A (zh) | 2014-10-15 |
CN104105817B true CN104105817B (zh) | 2016-02-24 |
Family
ID=48947140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280069377.1A Active CN104105817B (zh) | 2012-02-08 | 2012-10-24 | 金属氧化膜的制造方法和金属氧化膜 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150010464A1 (zh) |
KR (4) | KR20160098523A (zh) |
CN (1) | CN104105817B (zh) |
DE (1) | DE112012005843T8 (zh) |
HK (1) | HK1198183A1 (zh) |
TW (1) | TWI552204B (zh) |
WO (1) | WO2013118353A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112015006632B4 (de) | 2015-06-18 | 2023-09-21 | Kochi Prefectural Public University Corporation | Verfahren zur Bildung eines Metalloxidfilms |
US10622775B2 (en) | 2016-07-04 | 2020-04-14 | Mando Corporation | Power supply apparatus for field winding motor and field winding motor including the same |
CN112752616B (zh) | 2018-08-01 | 2023-07-14 | 株式会社尼康 | 雾发生装置以及雾成膜方法和雾成膜装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102165096A (zh) * | 2008-09-24 | 2011-08-24 | 东芝三菱电机产业系统株式会社 | 金属氧化膜的成膜方法及金属氧化膜的成膜装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0945140A (ja) | 1995-07-28 | 1997-02-14 | Sumitomo Metal Mining Co Ltd | 酸化亜鉛系透明導電性膜 |
JP4110752B2 (ja) * | 2001-06-28 | 2008-07-02 | 富士ゼロックス株式会社 | 基材上に設けた透明導電膜を低抵抗化する方法。 |
JP2005029408A (ja) * | 2003-07-09 | 2005-02-03 | Nippon Shokubai Co Ltd | 金属酸化物膜の形成方法 |
US7253125B1 (en) * | 2004-04-16 | 2007-08-07 | Novellus Systems, Inc. | Method to improve mechanical strength of low-k dielectric film using modulated UV exposure |
JP4705340B2 (ja) * | 2004-06-14 | 2011-06-22 | 日本曹達株式会社 | 酸化インジウム膜の製造方法 |
DE112008004011T5 (de) * | 2008-09-24 | 2011-07-14 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Verfahren zur Bildung von Zinkoxidfilm (ZnO) oder Magnesiumzinkoxidfilm (ZnMgO) und Anlage zur Bildung von Zinkoxidfilm oder Magnesiumzinkoxidfilm |
JP5674186B2 (ja) * | 2010-02-16 | 2015-02-25 | 国立大学法人 宮崎大学 | 酸化亜鉛薄膜製造方法、およびこの方法で製造した帯電防止薄膜、紫外線カット薄膜、透明電極薄膜 |
JP5411681B2 (ja) | 2009-12-09 | 2014-02-12 | スタンレー電気株式会社 | 酸化亜鉛系半導体の成長方法及び半導体発光素子の製造方法 |
-
2012
- 2012-10-24 KR KR1020167021468A patent/KR20160098523A/ko active Application Filing
- 2012-10-24 KR KR1020147019128A patent/KR20140101854A/ko active Search and Examination
- 2012-10-24 US US14/368,954 patent/US20150010464A1/en not_active Abandoned
- 2012-10-24 KR KR1020167014246A patent/KR20160075761A/ko not_active IP Right Cessation
- 2012-10-24 WO PCT/JP2012/077416 patent/WO2013118353A1/ja active Application Filing
- 2012-10-24 DE DE112012005843.7T patent/DE112012005843T8/de active Active
- 2012-10-24 KR KR1020187014499A patent/KR20180058856A/ko active Search and Examination
- 2012-10-24 CN CN201280069377.1A patent/CN104105817B/zh active Active
-
2013
- 2013-01-31 TW TW102103678A patent/TWI552204B/zh active
-
2014
- 2014-11-20 HK HK14111745.9A patent/HK1198183A1/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102165096A (zh) * | 2008-09-24 | 2011-08-24 | 东芝三菱电机产业系统株式会社 | 金属氧化膜的成膜方法及金属氧化膜的成膜装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201340179A (zh) | 2013-10-01 |
KR20140101854A (ko) | 2014-08-20 |
US20150010464A1 (en) | 2015-01-08 |
WO2013118353A1 (ja) | 2013-08-15 |
DE112012005843T8 (de) | 2015-02-05 |
HK1198183A1 (zh) | 2015-03-13 |
KR20160098523A (ko) | 2016-08-18 |
KR20160075761A (ko) | 2016-06-29 |
TWI552204B (zh) | 2016-10-01 |
CN104105817A (zh) | 2014-10-15 |
DE112012005843T5 (de) | 2014-10-30 |
KR20180058856A (ko) | 2018-06-01 |
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