CN104115328A - Test card for printed circuit card in the field of wireless systems - Google Patents

Test card for printed circuit card in the field of wireless systems Download PDF

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Publication number
CN104115328A
CN104115328A CN201280069919.5A CN201280069919A CN104115328A CN 104115328 A CN104115328 A CN 104115328A CN 201280069919 A CN201280069919 A CN 201280069919A CN 104115328 A CN104115328 A CN 104115328A
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China
Prior art keywords
line
antenna
test board
test
conductive region
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Granted
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CN201280069919.5A
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Chinese (zh)
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CN104115328B (en
Inventor
D.洛海恩童
P.米纳德
A.洛齐尔
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Thomson Licensing SAS
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Thomson Licensing SAS
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/02Coupling devices of the waveguide type with invariable factor of coupling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/02Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/026Transitions between lines of the same kind and shape, but with different dimensions between coaxial lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00Coupling devices of the waveguide type
    • H01P5/08Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced with unbalanced lines or devices
    • H01P5/1007Microstrip transitions to Slotline or finline

Abstract

The present invention relates to a test card for printed circuit card comprising a radiofrequency circuit linked by a transmission line (18) to an antenna (3), characterized in that the test card consists of a substrate comprising at least one dielectric substrate layer (10), said substrate being furnished on one face with a first conducting zone receiving the test connector, said first conducting zone being linked to a second conducting zone on the opposite face of the substrate, the test card comprising at least one power supply line (15) linked to the first conducting zone and forming at least one means making it possible to create at the level of the antenna an electromagnetic coupling of line/slot type and a means (16) for returning a quasi-zero impedance at the level of the coupling.

Description

Test board for the printed circuit board (PCB) in wireless system field
Technical field
The present invention relates to a kind of test board for the printed circuit board (PCB) in wireless system field.The invention still further relates to a kind of printed circuit board (PCB) that can use described test board.
Background technology
As the PCB known printed circuit board (PCB) of behaving, be used in wireless system, generally comprise two large-scale parts, be i.e. conveyer/receiver and " antenna " part.During the such system of volume production, be difficult to correctly check via antenna the performance of conveyer/acceptor circuit.As a result, use switchable test connector, it is welded in place on the circuit surface between conveyer/receiver part and antenna part.The test connector using is at present the surface mounted device of SMC type.Connector can switch by machinery, and running by this way:, under operator scheme, connector is short circuit, and the signal of arrival conveyer/receiver is directly connected to antenna, except there are some insertion loss from connector; Under test pattern, test probe is inserted in the connector of described plate, and its effect is that antenna-path and conveyer/receiver path are disconnected and recover conveyer/receiver signal.
Such test connector is widely used in all types of wireless systems, such as mobile phone, gateway, decoder and other WiFi system.Current technology can make test up to carrying out under 6GHz.
Fig. 1 a and 1b show the position of the standard testing connector in situation below: printed circuit board (PCB) comprises the antenna 3 of Vivaldi type, and antenna 3 is implemented on the substrate 1 of described plate (also referred to as motherboard).More specifically, on the substrate 1 of printed panel, be furnished with the metal level 2 that forms ground plane, wherein etching slot antenna 3, in the illustrated embodiment, slot antenna 3 is antennas of Vivaldi type.On the relative face of the face with receiving ground plane 2 of substrate, implemented the feeder line 4 of antenna, make it to carry out feed antenna by the electromagnetic coupled between line 4 and gap 3, this line extends to the conveyer/receiver part being implemented on printed circuit board (PCB) or motherboard.As shown in Fig. 1 a and 1b, on this line 5, switchable test connector 5 has been installed.
Yet this known prior art solution has two major defects.First, such connector cost is high, wireless system is more and more with MIMO (Multiple Input Multiple Output, multiple-input and multiple-output) be this, therefore the antenna amount that is connected to transmission/reception device part in WiFi system significantly increases, this has caused using the changeable test connector of remarkable quantity, result, and the cost of connector presents approximately 20% of printed circuit board (PCB) or motherboard cost at present.Therefore there is the demand that finds solution in manufacturer, makes it to limit the use of these changeable test connectors.
Secondly, these changeable test connectors have impact to the performance of system.In fact, these connectors are placed on the output of conveyer/receiver part, and insertion loss has a direct impact the power output of the sensitivity of receiver and transmission.Thus, for the frequency band of about 5GHz, the insertion loss causing because of test connector is the 0.3 – 0.4dB order of magnitude conventionally.
In order to overcome these shortcomings, for the new solution of testing printed circuit board, propose.Thus, in the patent US7746062 of Hon Hai Precision Indus by name, radio frequency testing plate has been proposed, it comprises two pads, an output that is connected to conveyer/receiver part, and another pad is connected to antenna part in the distance that equals λ/4 apart from the first pad, wherein λ is operative wavelength.The second pad is electrically connected to ground, and open circuit is achieved at the first pad place, result, and conveyer/receiver signal is only directed to the test probe being placed on pad 1.This solution only can operate with limited frequency bandwidth, and cannot be applied to the WiFi system of operation under 5GHz band, or still more under two different frequency bands 2.4 and 5GHz band under the WiFi system of operation.
Summary of the invention
The object of the invention is to overcome problem mentioned above by proposing a kind of test board, described test board operates and has an alap cost under wide frequency band.
Therefore, the object of the invention is a kind of test board for printed circuit board (PCB), described printed circuit board (PCB) comprises the radio circuit that is connected to antenna by conveyer line, it is characterized in that, described test board consists of the substrate that comprises at least one dielectric substrate layer, described substrate is provided on a face with the first conductive region that receives test connector, described conductive region is connected to the second conductive region on the reverse side of described substrate, described test board comprises: at least one feeder line, described at least one feeder line is connected to described the first conductive region and forms and can form at described antenna place at least one parts of the electromagnetic coupled of line/gap type, and for online/interface place, gap provides the parts of nearly zero impedance.
And according to the first embodiment, the described parts of nearly zero impedance that provide for online/interface place, gap consist of the insulated wire that is parallel to described feeder line location.According to another embodiment, describedly for online/two sections of earth connections that interface place, gap provides the parts of nearly zero impedance to be positioned on motherboard by the every side of the excitation line at described antenna, form.
The described insulated wire that is used for making the field short circuit at described antenna aperature place is the track of two ends open circuits.When described antenna is the antenna of gap type, described feeder line is that an end is connected to described the first conductive region and the microstrip line (microstrip line) of one end open circuit.In this case, described feeder line may be implemented within on the surface relative with surface described test connector described substrate, or be embodied on the surface that receives described test connector, or be embodied in one of intermediate surface in the situation that of multilager base plate.
In order to make the field short circuit at described antenna aperature place, described insulated wire is positioned in the distance apart from described feeder line k λ/4 in this embodiment, and wherein k is integer, and λ is the wavelength of conveyer line under system operation mid-band frequency.
According to another embodiment, when described antenna is when being connected to the printed antenna of described radio circuit or being connected to the monopole type antenna of described radio circuit by complanar line or microstrip line by microstrip line, described substrate is multilager base plate, and described feeder line consists of the slot line being implemented in intermediate conductive layer.In this case, described feeder line is connected to described the first conductive region by the transition of the second line/gap, and described insulated wire is positioned in the distance apart from described feeder line k λ/2, and wherein k is integer, and λ is the wavelength of conveyer line under system operation mid-band frequency.
The invention still further relates to a kind of printed circuit board (PCB), comprise the radio circuit that is connected to antenna by conveyer line, it is characterized in that, it comprises at described conveyer line and described antenna side at least one conductive region that forms grounding parts.Can be preferably, described plate comprises at least one pattern being implemented on described circuit board on described antenna side.
Described printed circuit board (PCB) can be implemented test board described above.
Thus, the present invention relates to a kind ofly can implement test board, comprise the printed circuit board (PCB) that is connected to the radio circuit of antenna by conveyer line, it is characterized in that it comprises at described conveyer line and described antenna side at least one conductive region that forms grounding parts, for forming and contact with the second conductive region of described test board.
Accompanying drawing explanation
Based on reading the detailed description of making below with reference to accompanying drawing, other features and advantages of the present invention will appear, wherein:
Fig. 1 a having described and 1b show respectively top plan view and the general perspective of the antenna part of printed circuit board (PCB) or motherboard, and it is equipped with the changeable test connector according to prior art.
Fig. 2 a and 2b are shown schematically in that (Fig. 2 a) and top view (Fig. 2 b) according to the bottom view of test board of the present invention.
Fig. 3 is the diagrammatic, cross-sectional figure of the test board of Fig. 2 a and 2b, and printed circuit board (PCB) is used for receiving test board.
Fig. 4 a and 4b are respectively that (Fig. 4 a) and be equipped with the general view of the motherboard (Fig. 4 b) of test board shown in Fig. 2 for printed circuit board (PCB) or motherboard.
Fig. 5 shows the transmission of signal and the chart of reflection transmitting between conveyer at the analog test board according to Fig. 2 a and 2b/receiver part and test probe.
Fig. 6 is the diagrammatic, cross-sectional figure according to another embodiment of test board of the present invention, and motherboard receives this test board.
Fig. 7 is the diagrammatic, cross-sectional figure according to the another embodiment of test board of the present invention and associated motherboard.
Fig. 8 a and 8b are positioned at the plane graph of an embodiment again of the test board on motherboard according to the present invention (Fig. 8 a) and the diagrammatic, cross-sectional figure of test board and associated motherboard (Fig. 8 b).
Fig. 9 a and 9b are positioned at the top plan view of the another embodiment of the test board on motherboard according to the present invention (Fig. 9 a) and the diagrammatic, cross-sectional figure (Fig. 9 b) of test board and the motherboard that uses thereof.
Figure 10 a and 10b are respectively that (Figure 10 a) and the diagrammatic, cross-sectional figure of test board shown in Figure 10 a and associated motherboard (Figure 10 b) for the also summary top plan view of an embodiment according to test board of the present invention and associated motherboard.
Embodiment
First it should be pointed out that of the invention process is operation to test board, and the electromagnetic coupled of gap/line and track is known as Knorr coupling (Knorr coupling).In this case, be printed on microstrip line in multilager base plate one side across the gap-line being implemented in substrate reverse side.Microstrip line has an open circuit end, is positioned at the distance (λ is the wavelength of the line under operating frequency) apart from λ/4, crosspoint, this means that microstrip line is provided with short circuit plane at this some place.Gap-line, at the distance short circuit with λ '/4, crosspoint (λ ' be the wavelength in gap), this means that gap-line is provided with open circuit plane at place, crosspoint, and this makes it to gap pattern, effectively to transmit microwave signal from micro-band model, and vice versa.
This is noted, and first with reference to Fig. 2 to 5, provides the explanation to the first embodiment according to test board of the present invention.
As shown in Fig. 2 a and 2b, in the embodiment shown, on substrate 10 for the simple two-sided dielectric substrate printing, at lower surface, conductive region 13 and feeder line 15 have been implemented, at the free end 15a place of feeder line 15, form open circuit and the other end 15b is connected to the region 12 on the upper surface that is positioned at test board 10 by the through hole 14 of plating, for receiving test probe.
And, at the upper surface of test board 10, implemented conductive region 11, this conductive region 11 is for example electrically connected to region 13 by the through hole of plating, and this region 11 is used to form the ground area of standard testing connector.These are in fact for solder connector, to come the region of ground connection, and region 12 is soldered to the signal area of connector.
As shown in Figure 2 a, the insulated wire 16 of printing is implemented in the lower surface of test board.This line 16 is embodied as and is parallel to the feeder line 15 that receives test signal, and apart from the distance of line 15k λ/4, wherein k is integer, the wavelength that λ is conveyer line.
As briefly showed with reference to figure 3 and Fig. 4 a and 4b, when we wish to test, test board 10 starts to contact with motherboard 1.
In the embodiment shown in Fig. 4 a, in reception, be fed to the upper surface of substrate of the conveyer line 18 of Vivaldi antenna 3, implemented ground area 17, the shape of ground area 17 is basic identical with the region 13 being implemented on plate 10.This region 17 is connected to ground plane 2 by the through hole of plating, and ground plane 2 is formed on substrate 1 lower surface that forms motherboard.Thus, as shown in Fig. 3 and Fig. 4 b, test board is applied to Vivaldi antenna 3, makes 17 contacts of 13Yu region, region, to the earth terminal of motherboard is connected to the earth terminal of test board.The insulated wire 16 in each end with open circuit is placed with the gap perpendicular to Vivaldi type antenna 3, and symmetrical with respect to the axis of symmetry of described antenna.As a result, feeder line 15 is placed with the gap perpendicular to Vivaldi type antenna, forms the electromagnetic coupled of the line-gap type operating as noted abovely.Test board can be implemented with the pattern being printed on motherboard with respect to the accurate location of motherboard, and this operates in optics control equipment of volume production stage use and automatically completes.
When test board positions as shown in Figure 4 b, test can be carried out according to the mode of standard via the test connector 19 that is soldered to motherboard region 11 and 12.Due to its according to Knorr operate the position with respect to line 15, the effect of insulated wire 16 is to make the gap short circuit of the gap-antenna 3 of Vivaldi type when operational frequency bands, make it nearly zero impedance can be set in the plane of feeder line 15, to limit as much as possible the radiation in gap.The length of this line 16 is determined, and to can form short circuit, it is about as much as λ/2, and wherein λ is the wavelength of described line under micro-band model.Insulated wire 16 arrange thus nearly zero impedance corresponding to the short circuit at feeder line 15 places for test signal, the line 15 of result from the excitation line 18 of Vivaldi antenna to test board can transmit maximum power.
Above-described concept is used the gap-antenna of Vivaldi type to simulate, and it is printed on the dielectric substrate of the RO4003 that is known as thickness 0.81mm and dielectric constant 3.38, and the antenna of Vivaldi type operates under 5GHz band.In order to verify described concept, use the Electromagnetic Simulation of IE3D software to carry out on according to the structure shown in Fig. 4 a.About the analog result from conveyer/receiver part to the signal delivery quality of test probe, be illustrated in Fig. 5, for curve dB[S (2,1)] provided the response to transmitting; For curve dB[S (1,1)] provided to reflection response.These curves have provided following performance: the low insertion loss of 0.8 to the 1.6dB order of magnitude from 4.9 to 6GHz is easy to the good impedance match that is greater than 18dB of overlapping operation band in very wide band.
Referring now to Fig. 6 and 7 describe according to the present invention and with two other embodiment of the test board of motherboard operation, motherboard comprises the antenna of gap type in antenna part.As shown in Figures 6 and 7, in this case, gap-antenna is implemented in the top of substrate 1, and in conductive layer 2a, and this gap-antenna is in gap be implemented between the feeder line 18a of substrate 1 lower surface and be fed to by electromagnetic coupled.Two different embodiment that in this case can use test plate.
According to the first embodiment shown in Fig. 6, test board 10 comprises conductive region 11 on surface thereon, and conductive region 11 is connected to conductive region 13 by the through hole of plating, to form the ground area of welding test connector 19 thereon.Feeder line 15a is implemented in the top of the substrate 10 of test board, to form with line-gap not shown and that be implemented in the gap in mother board metal layer 2a, connects.As the situation of the first embodiment, make the insulated wire 16 of gap short circuit be implemented in the lower surface of substrate 10.The region 11,13 of motherboard and the transmission of the ground connection between region 17 are carried out in the same manner with previous embodiment.
According to variation, the test board shown in Fig. 7 for multilager base plate for test board, comprise that the substrate of first substrate 10a and second substrate 10b implements.In this case, for and the magnetic-coupled feeder line 15c of motherboard gap-antenna electric be implemented in the conductive layer between two substrate 10a and 10b.This feeder line 15c is connected to an end that is connected to test connector 19 of feeder line 15b by the through hole of plating.
In this embodiment, two substrate 10a and 10b can have special aspect thickness and dielectric constant identical or different feature, for the feeder line of test signal 15c, be printed on intermediate conductive layer.First substrate, be that the effect of infrabasal plate 10b is between feeder line 15c and the gap of gap-antenna, to connect as required, and second substrate, be that the intention of upper substrate 10a is to guarantee the mechanical rigid of assembly consistent with the conventional design rule of multilayer circuit.
Referring now to Fig. 8 to 10 description especially can with printed antenna other embodiment such as the test board of " paster (the patch) " antenna of type or the antenna applications of monopolar type.
Fig. 8 a shows the top view that is positioned at the test board on motherboard, motherboard comprises paster antenna 20, paster antenna 20 is connected to the excitation line 21 of being implemented by the microstrip line that is printed on substrate 22 upper surfaces, forms the motherboard that is equipped with conductive layer 23 (formation ground plane).
In this embodiment and as shown in Figure 8 b, test board is implemented with multilager base plate, multilager base plate comprises two dielectric layer 24a and 24b and three conductive layers that are denoted as C1, C2, C3 in this situation.In order to use line-gap electromagnetic coupled that the excitation line of paster antenna 20 21 is connected with the feeder line 30 of test connector 29, gap 25 is implemented in intermediate conductive layer C2.
As shown in Figure 8 a, gap-line 25 ends at short-circuit end 25a, and short-circuit end 25a equals the length place of λ/4 (λ is the wavelength in gap) substantially at the crosspoint A apart between excitation line 21 and feeder line 25.
And as shown in Figure 8 b, test board also comprises conductive region, conductive region forms grounding parts 26, and grounding parts 26 is implemented in conductive layer C1 and by the plating through hole through two substrates and is connected to and is implemented in the conductive region that forms grounding parts 27 in conductive region C3.Region 26 is formed for the ground connection welding region of test connector 29.Equally, as previous embodiment, insulated wire 28 is implemented in lower conductiving layer C3.Insulated wire 28 in excitation line 21 and be fed to crossing plane between gap-line 25, through short circuit or nearly zero impedance are set in the plane of crosspoint A.In order to accomplish this point, insulated wire 23 is positioned at the distance of k λ/2 order of magnitude, and wherein k is integer, and λ is the wavelength of excitation line 21.
In the embodiment shown in Fig. 8 a, in order to recover the test signal from slot line 25 at test connector 29 places, the transition of the second line-gap is implemented between gap 25 and microstrip feed line 30, and microstrip feed line 30 is implemented in conductive layer C1.An end of microstrip line 30 is connected to a 30a, and some 30a is formed for the signal welding region of test connector 29; The other end 30b of microstrip line 30 forms open circuit, and be positioned in the distance of B λ '/4, anomaly face crosspoint (λ ' be the wavelength of microstrip line), and gap/line 25 ends in short circuit 25b, short circuit 25b is in the distance of (λ is the wavelength of gap-line) apart from B λ/4, crosspoint.
Referring now to Fig. 9 a and 9b, another variant embodiment is described, the situation that it is applied to antenna 40, is encouraged by complanar line 41 such as the antenna of monopolar type.
In the embodiment shown in Fig. 9 b, test board is the plate being implemented on multilager base plate, and multilager base plate comprises two dielectric layer 42a, 42b and three conductive layer C1, C2, C3.In this case, test board is similar to the test board of Fig. 8 b.In intermediate conductive layer C2, implemented gap-line 43, be formed for the feeder line of test signal.At test board lower surface, ground connection transmission region 44 and insulated wire 45 have been implemented in conductive layer C3.Through hole by plating is connected to the ground connection transmission region 46 of ground connection transmission region 44 and the conductive layer C1 that has been implemented in test board upper surface for the feeder line 47 of test connector 48.
As shown in Fig. 9 a, test board is positioned at complanar line top, and as the embodiment of Fig. 8 a, excitation line 41 has formed and can by electromagnetic coupled, transmit at an A place line-gap transition of test signal with gap 43.And, for the second line-gap transition that test signal is sent to the tie point 47a with test connector 48 from gap-line 43, be implemented in a B.Different elements 47,43 and 45 as the same in the embodiment of Fig. 8 a and 8b the carrying out of size design.
Referring now to the variant embodiment of the test board of antenna 50 operation of Figure 10 a and 10b description and monopolar type or " paster " type, as shown in Figure 10 b, antenna 50 is implemented in motherboard lower surface.In this case, excitation line 51 is complanar lines.
In this embodiment, test board is implemented on substrate, and substrate has single dielectric layer 53, and dielectric layer 53 has two conductive layer C1 and C2.In order to implement electromagnetic coupled between the excitation line 51 at antenna and the feeder line 57 of test connector 55, gap-line 54 has been etched in conductive layer C2, and its size is according to size mentioned above.And, receiving on the upper conductive layer C1 of test connector 55, implemented conductive region 56, conductive region 56 is connected to lower conductiving layer C2 so that obtaining ground connection transmits by the through hole of plating, and test connector 55 is connected to gap-line 54 by the line 57 being implemented in conductive layer C1 by the transition of the second line-gap.
In this embodiment, as shown in Figure 10 a, formed two line-gap transition, respectively at an A and B place, as noted above, being dimensioned to of different lines and gap meets Knorr principle.
In this case, the parts that short circuit plane can be set at A place, crosspoint consist of two elements of line 52a, 52b, line 52a, 52b are implemented in the upper surface of base plate of motherboard in the every side of excitation line of antenna 51, apart from the distance of crosspoint A, be calculated as and when test board starts to contact with circuit to be tested, apply short circuit plane.

Claims (13)

1. for the test board of printed circuit board (PCB), described printed circuit board (PCB) comprises by conveyer line (18,18a, 21,41,51) be connected to antenna (3,20,40,50) radio circuit, is characterized in that, described test board is by comprising at least one dielectric substrate layer (10; 10a, 10b; 24a, 24b; 42a, 42b; 53) substrate forms, described substrate is provided in has reception test connector (19,29,48,55) the first conductive region (11,26,46,56), on a surface, described the first conductive region is connected to the second conductive region (13 on the reverse side of described substrate, 27,44), described test board comprises: at least one feeder line (15,25,43,54), described at least one feeder line (15,25,43,54) be connected to described the first conductive region and formation and can form at described antenna place at least one parts of the electromagnetic coupled of line/gap type; And for online/interface place, gap provides the parts (16,28,45,52a, 52b) of nearly zero impedance.
2. test board according to claim 1, is characterized in that, described for provide the parts of nearly zero impedance to consist of the insulated wire (16,28,45) that is parallel to described feeder line location at interface place.
3. test board according to claim 2, is characterized in that, described insulated wire is the track of two end open circuits.
4. according to the test board one of claims 1 to 3 Suo Shu, it is characterized in that, when described antenna is the antenna of gap type, described feeder line is that an end is connected to described the first conductive region and the microstrip line (15) of its other end open circuit.
5. test board according to claim 4, it is characterized in that, described feeder line is embodied on relative surface, the surface with receiving described test connector of described substrate, or be embodied on the surface that receives described test connector, or be embodied in one of intermediate surface in the situation that of multilager base plate.
6. according to the test board one of claim 4 or 5 Suo Shu, it is characterized in that, described insulated wire is positioned in the distance apart from described feeder line k λ/4, and wherein k is integer, and λ is the wavelength of conveyer line.
7. according to the test board one of claim 1 to 2 Suo Shu, it is characterized in that, when described antenna is when being connected to the printed antenna of described radio circuit or being connected to the monopole type antenna of described radio circuit by complanar line or microstrip line by microstrip line, described substrate is multilager base plate, and described feeder line is by the slot line (25 being implemented in intermediate conductive layer, 43,54) form.
8. test board according to claim 7, is characterized in that, described feeder line is connected to described the first conductive region by the transition of the second line/gap.
9. according to the test board one of claim 7 or 8 Suo Shu, it is characterized in that, described insulated wire (28,45) is positioned in the distance apart from described feeder line k λ/2, and wherein k is integer, and λ is the wavelength of conveyer line.
10. printed circuit board (PCB), comprises the radio circuit that is connected to antenna by conveyer line, it is characterized in that, it comprises at described conveyer line and described antenna side at least one conductive region that forms grounding parts.
11. printed circuit board (PCB)s according to claim 10, is characterized in that, it comprises at least one pattern being implemented on described printed circuit on described antenna side.
12. according to the printed circuit board (PCB) one of claim 10 and 11 Suo Shu, it is characterized in that, it can be implemented according to the test board one of claim 1 to 9 Suo Shu.
13. can implement according to the test board one of claim 1 to 9 Suo Shu, comprise the printed circuit board (PCB) that is connected to the radio circuit of antenna by conveyer line, it is characterized in that, it comprises at described conveyer line and described antenna side at least one conductive region that forms grounding parts, for forming and contact with the second conductive region of described test board.
CN201280069919.5A 2011-12-22 2012-12-12 The test board of the printed circuit board (PCB) in wireless system field Expired - Fee Related CN104115328B (en)

Applications Claiming Priority (3)

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FR1162257 2011-12-22
FR1162257A FR2976146A1 (en) 2011-12-22 2011-12-22 Test card for testing printed circuit board utilized in e.g. wireless system, has supply line connected to conductive area of substrate for creating electromagnetic coupling type line/slot at antenna of printed circuit board
PCT/EP2012/075290 WO2013092356A1 (en) 2011-12-22 2012-12-12 Test card for printed circuit card in the field of wireless systems

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CN104115328A true CN104115328A (en) 2014-10-22
CN104115328B CN104115328B (en) 2016-12-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113471718A (en) * 2021-05-17 2021-10-01 西安电子科技大学 Different-frequency self-decoupling millimeter wave array antenna

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10193639B2 (en) 2016-01-29 2019-01-29 Rohde & Schwarz Gmbh & Co. Kg Over the air measurement module
EP3199957B1 (en) * 2016-01-29 2020-12-30 Rohde & Schwarz GmbH & Co. KG Over the air measurement module
CN112954101B (en) * 2021-01-29 2024-03-26 维沃移动通信有限公司 Radio frequency test assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0455493A2 (en) * 1990-05-04 1991-11-06 Motorola, Inc. Tapered notch antenna
US6021315A (en) * 1997-11-19 2000-02-01 Cellular Technical Services Co., Inc. System and method for testing of wireless communication devices
US6900771B1 (en) * 2000-12-15 2005-05-31 Broadcom Corporation Wide-band tapered-slot antenna for RF testing
CN201207715Y (en) * 2008-03-07 2009-03-11 鸿富锦精密工业(深圳)有限公司 RF test system and RF test circuit thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0455493A2 (en) * 1990-05-04 1991-11-06 Motorola, Inc. Tapered notch antenna
US6021315A (en) * 1997-11-19 2000-02-01 Cellular Technical Services Co., Inc. System and method for testing of wireless communication devices
US6900771B1 (en) * 2000-12-15 2005-05-31 Broadcom Corporation Wide-band tapered-slot antenna for RF testing
CN201207715Y (en) * 2008-03-07 2009-03-11 鸿富锦精密工业(深圳)有限公司 RF test system and RF test circuit thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113471718A (en) * 2021-05-17 2021-10-01 西安电子科技大学 Different-frequency self-decoupling millimeter wave array antenna

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FR2976146A1 (en) 2012-12-07
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BR112014014915A2 (en) 2017-06-13
CN104115328B (en) 2016-12-21

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