CN104220648B - Substrate plating fixture and utilize its plating apparatus - Google Patents
Substrate plating fixture and utilize its plating apparatus Download PDFInfo
- Publication number
- CN104220648B CN104220648B CN201280072382.8A CN201280072382A CN104220648B CN 104220648 B CN104220648 B CN 104220648B CN 201280072382 A CN201280072382 A CN 201280072382A CN 104220648 B CN104220648 B CN 104220648B
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- China
- Prior art keywords
- plating
- substrate holder
- substrate
- fixture
- holding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims abstract description 157
- 239000000758 substrate Substances 0.000 title claims abstract description 95
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- NOQGZXFMHARMLW-UHFFFAOYSA-N Daminozide Chemical group CN(C)NC(=O)CCC(O)=O NOQGZXFMHARMLW-UHFFFAOYSA-N 0.000 claims description 20
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 32
- 239000000243 solution Substances 0.000 description 29
- 239000004065 semiconductor Substances 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000010276 construction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005868 electrolysis reaction Methods 0.000 description 5
- 230000001788 irregular Effects 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
Abstract
The present invention relates to a kind of plating fixture and plating apparatus used in the plating processing of substrate, its object is to provide a kind of rotary drive unit with substrate holder and with support integratedly relative to the removable plating fixture of plating coating groove, and utilize the plating apparatus of the plating fixture.The plating fixture is characterised by, including is formed as the support of mode that can be mounted in plating groove sidewall and the support is arranged into the substrate holder of vertical rotary freely, and possesses the rotary unit of the substrate holder.
Description
Technical field
The present invention relates to a kind of plating fixture and plating apparatus used in the plating processing of substrate, more particularly to one
Kind be used to be arranged at semiconductor wafer etc. be plated process face trickle wiring groove or hole, resist opening portion formed plating
Applying film or to form the projection for electrically connecting semiconductor chip with substrate in process face in being plated for semiconductor wafer
The plating fixture of (overshooting shape electrode) and the plating apparatus using the plating fixture.
Background technology
In general, electrolysis plating can be roughly divided into：Make the substrates such as semiconductor wafer is plated processing down
(face down) and flatly place and spray from below the jet flow or cup type that plating solution imposes plating；And by substrate
Vertically it is erected in plating coating groove, while injecting plating solution from the lower section of plating coating groove and making its overflow, while being impregnated in substrate
The impregnated of plating is imposed in plating solution.Wherein, in the electrolysis plating of impregnation method, substrate is vertically erect and entered
Row plating is, in order to easily remove the bubble produced in process face that is plated in substrate, and to make particulate matter (particle) etc.
It is difficult to be attached to being plated in process face for substrate.So, according to the electrolysis plating that substrate is vertically erect to and carried out plating
Method, easily can carry out deaeration, so being suitable for by the bubble produced by violent reduction reaction when carrying out high speed plating
High speed plating.
But, possessed using the electrolysis plating apparatus of above-mentioned conventional impregnation method by the periphery of the substrates such as semiconductor wafer
End face and sealing backside and expose surface (being plated process face) and detachably keep the base of the substrate such as semiconductor wafer
Board mount, aforesaid substrate support is immersed in plating solution together with each substrate, to carry out the process face that is plated of substrate
Plating.
However, in the electrolysis plating using this conventional impregnation method, keeping substrate being vertically erected in
Impregnated in the state of in the plating solution of plating coating groove, and plating solution is flowed upward from the bottom of plating coating groove, therefore, injection
Plating solution all the time from the lower to upper part for the being plated process face supply of substrate, and on the top for being plated process face of substrate
The flow velocity for producing plating solution with bottom is irregular, can cause according to the position for being plated process face of substrate is different and the thickness of plating
Produce small difference the problem of point.In addition, current density it is irregular also turn into plating inhomogeneities the reason for.
Then, in order to solve involved the problem of, disclosed in patent document 1,2 makes semiconductor die using driver element
The substrate holder of piece etc. is irregular, current density irregular in the flow velocity that plating coating groove inward turning transfers elimination plating solution, and can improve
The method for plating and plating apparatus of the uniformity of plating thickness.
However, as described in patent document 1, the driver element from the outside for being arranged at plating coating groove is with insertion plating groove sidewall
Form makes the structure that axle is connected with substrate holder so that the encapsulation process of breakthrough part turns into problem.Then, disclosed in patent document 1
Method be not implement encapsulation process to breakthrough part, and be configured to axle and plating groove sidewall being formed as noncontact, so as to from its
Between flow out plating solution, but according to this structure, then need to be improved plating coating groove.In addition, in the method for patent document 2
In, due to setting drive shaft, therefore the side wall of not insertion plating coating groove with defined angle, but in order that positive plate is with being plated
Thing is opposed and be arranged to defined angle or bottom of plating coating groove etc. is formed along the angle of axle, it is still desirable to plating
Groove is improved in itself.
Patent document 1：Japanese Unexamined Patent Publication 2004-300462
Patent document 2：Japanese Unexamined Patent Publication 2002-327291
The content of the invention
(problems to be solved by the invention)
Then, the problem to be solved in the present invention is to provide a kind of shortcoming overcome in conventional plating apparatus, with base
The rotary drive unit of board mount, plating coating groove is not applied improve and simply relative to the removable plating fixture of plating coating groove and
Utilize the plating apparatus of the plating fixture.
(measure for solving problem)
The present invention is a kind of plating fixture for solving the above problems, it is characterised in that with being formed as being mounted on
The support of mode in plating groove sidewall and the support is arranged to the substrate holder of vertical rotary freely, and possessed
The rotary unit of the substrate holder.
In addition, the plating apparatus of the present invention is characterised by, the plating fixture is mounted on the side wall of plating coating groove,
The substrate holder and with the substrate holder be opposed to set positive plate between be provided with the oar reciprocated in the horizontal
Leaf.
(The effect of invention)
According to the plating fixture of the present invention, it is easy with being arranged on plating dress as long as being mounted on the side wall of plating coating groove
Put, as the rotary drive unit of substrate holder, what is utilized is plating solution stream or will be driven via rotary shaft or geared parts
The power in dynamic portion passes to substrate holder, and which kind of mode need not be all improved to plating coating groove.
In addition, in the plating apparatus of plating fixture of the present invention is mounted with, being set between substrate holder and positive plate
The structure of the blade of stirring also utilizes the stirring of blade in addition to using the rotation of fixture, and the quilt along substrate can be made accordingly
The plating solution stream of plating process face is uniform, thus can form the more uniform electroplated film of thickness.
In addition, in the plating apparatus of plating fixture of the present invention is mounted with, the plating coating groove in the lower section of substrate holder
Bottom sets the structure of plating solution ejiction opening the intensity of plating solution stream is had difference in the left and right of substrate holder, accordingly can be more
Effectively produce revolving force.
Brief description of the drawings
Fig. 1 is the exploded perspective view of the plating fixture of the present invention.
Fig. 2 is the summary construction diagram for the plating apparatus for being mounted with the plating fixture of the present invention.
Fig. 3 (a) is the side view of the housing part of the plating fixture of the present invention.
(b) be the present invention plating fixture housing part front view.
Fig. 4 (a) is the side view of the housing part of the plating fixture of the present invention.
(b) be the present invention plating fixture housing part front view.
Fig. 5 (a) is the side view of the housing part of the plating fixture of the present invention.
(b) be the present invention plating fixture housing part front view.
Fig. 6 (a) is the figure of the different modes of the alar part for the housing part for representing the plating fixture of the present invention.
(b) be represent the present invention plating fixture housing part alar part different modes figure.
Fig. 7 is the summary construction diagram for the plating apparatus for being mounted with the plating fixture of the present invention.
Fig. 8 is the summary construction diagram for the plating apparatus for being mounted with the plating fixture of the present invention.
Fig. 9 is the close-up sectional view of the substrate holder of the plating fixture of the present invention.
Embodiment
Hereinafter, enter based on accompanying drawing to the plating fixture of the present invention and using the embodiment of the plating apparatus of the plating fixture
Row specific description.In addition, the present invention is not by any limitation of these embodiments.
Fig. 1 is the exploded perspective view of the plating fixture of the present invention, and Fig. 2 is the plating dress for being mounted with the plating fixture of the present invention
The summary construction diagram put.Reference in figure is expressed as follows respectively：1 is plating apparatus, and 2 be plating fixture, and 10 be plating coating groove,
11 be side wall, and 12 be ejiction opening, and 20 be overflow launder, and 30 be substrate holder, and 31 are to maintain part, and 32 be seal member, and 33 be outer
Frame part, 34 be axle portion, and 35 be fixing bolt, and 36 be fixing bolt, and 37 be fixing bolt, and 40 be support, and 41 be hole portion, 50
It is positive plate, 60 be blade, and 70 be power supply, and 71 are switched on path, and 80 be pipe arrangement, and 81 be pump, and 82 be filter, and 311 be base portion,
312 be substrate loading surface, and 313 be hole portion, and 314 be the first energized components, and 321 be opening portion, and 331 be linking part, and 332 be the wing
Portion, W is substrate.
As illustrated, the plating fixture 2 of the present invention includes：Be formed as the branch of mode that can be mounted on the side wall of plating coating groove
Bearing portion 40；And rotatably it is arranged on the substrate holder 30 on support 40.The details in each portion is carried out using Fig. 1
Explanation.Support 40 is the part of column, and top is formed as hook-shaped can to mount in the upper end of the side wall of plating coating groove, and at it
Bottom, which is run through, the hole portion 41 for being available for axle portion 34 to insert.In the hole portion 41, via axle portion 34 by discoideus substrate holder 30
It is kept into rotatable in vertical direction.
Substrate holder 30 by holding member 31, seal member 32, housing part 33, axle portion 34 and fixing bolt 35,
36th, 37 constitute.Wherein, holding member 31 protrudes in the upper surface for being formed as discoideus base portion 311 and is provided with diameter and compares base portion
311 small substrate loading surfaces 312.The substrate loading surface 312 is formed as the shape roughly the same with the substrate W for being plated processing
Shape/size.In addition, the base portion 311 around substrate loading surface 312, which is protruded above, is provided with multiple first energized components 314.This
Outside, running through in the center of substrate loading surface 312 has the hole portion 313 for being available for axle portion 34 to insert.
Seal member 32 is formed as the ring-type with the diameter roughly the same with holding member 31, and its opening portion 321 is formed
For the internal diameter that the external diameter than substrate W is smaller.Be provided with the face opposite with holding member 31 gasket seal 322 of ring-type with
And second energized components 323 (not shown in Fig. 1), clamp substrate together with holding member 31 in the assembling of substrate holder 30
W, and be powered while the first energized components 314 on base portion 311 are sealed to substrate W.
Housing part 33 is made up of the part of left and right 2 for being formed as semicircular.The cross sectional shape shape of the housing part 33
As substantially "U" shape, the periphery for being installed on holding member 31 and seal member 32 is fitted in the assembling of substrate holder 30
Edge.Specifically, 2 housing parts 33 are installed on the outer peripheral edge of holding member 31 and seal member 32 from left and right, and utilized
The linking part 331 above and below such as bolt is combined fixation.In addition, in Fig. 1, protrusion is set on the outer peripheral face of outer frame part 33
Multiple alar parts 332 are equipped with, but are discussed further below, when using other rotary units, the alar part 332 is not essential.
The installation of substrate holder 30 to support 40 is inserted to the hole portion 313 of holding member 31 and the hole portion 41 of support 40
The logical axle portion 34 with threaded portion, and fixing bolt 35,36,37 is screwed with the threaded portion of axle portion 34 respectively and consolidated
It is fixed.Now, the fixing bolt 36 being preferably exposed in plating solution applies coating etc. after fixation and sealed.In addition, fixed
Bolt 37 is similarly exposed in plating solution, as shown in figure 1, it is preferred that fixing bolt 37 can be buried by being set at the back side of support 40
Depth recess, and opening portion is covered with polyvinyl chloride panel, adhesive tape etc..Moreover it is preferred that to one at axle portion 34
The part being partially exposed in plating solution also utilizes teflon (Teflon：Registration mark) or epoxylite etc. apply coating.
In addition, the different installation methods that substrate holder 30 is installed to support 40 are as follows.First, support 40 is formed
For that can be divided into left and right two from front, and the recess of axle portion 34 or fixing bolt 37 can be buried by being set inside it.Will be advance
It is mounted with that the axle portion 34 of fixing bolt 37 configures the recess in any one part of the left and right of support 40 of segmentation, and matches another
The part of one support 40 is fixed, accordingly installation from completing substrate support 30 to support 40.According to above-mentioned installation
Method, can make the overall length of axle portion 34 shorter, and as described above, the opening portion without the dorsal part to support 40 is entered
Row sealing.
Next, the method that opposite substrate W is powered is illustrated.Using outside power supply 70, be embedded in support 40 or
The electrical path 71 that person introduces from the back side is powered via power supply brush (not shown) etc. to axle portion 34.Axle portion 34 is blue or green by titanium material, phosphorus
The electric conductivity raw material such as copper product, pure copper material are formed, and are powered to the fixing bolt 35 formed in the same manner by electric conductivity raw material.
From the fixing bolt 35,36 of fixed holding member 31 via the electrical path (not shown) being embedded in holding member 31 to first
Energized components 314 are powered.
Fig. 9 is the partial enlarged drawing for representing to be assembled with the form being powered in the state of substrate holder 30 in clamping substrate W.
As illustrated, being provided with the gasket seal 322 and second of ring-type on the face opposed with the holding member 31 of seal member 32
Energized components 323.The cross sectional shape of gasket seal 322 is formed as the different substantially "U" shape of upper following length, and second leads to
Electric part 323 is formed as the discoideus of flat board, and multiple prominent contacts 324 have been provided projectingly on its inner peripheral.In substrate holder
During 30 assembling, the flat part of the second energized components 323 is contacted with the first energized components 314 on base portion 311, and protrusion connects
Point 324 is contacted with substrate W plated surface application.Accordingly, can from the first energized components 314 via the second energized components 323 to base
Plate W is powered.In addition, according to more than electrifying method, using gasket seal 322 can make the first energized components 314 and
Second energized components 323 are not exposed in plating solution and are reliably powered to substrate W, thus preferably, but the plating folder of the present invention
The electrifying method of tool is not limited to this.
Next, being illustrated to the rotary unit of substrate holder 30.It is used as the substrate holder of the plating fixture 2 of the present invention
30 rotary unit, the outer peripheral face that can be used in outer frame part alar part or recess be set and utilize plating solution stream method or
Person makes the method that it rotates using drive division.Fig. 3 (a), (b) are to be provided projectingly alar part on the outer peripheral face of outer frame part 33
332 structure.As illustrated, in the present embodiment, multiple shapes have been equally spaced on the outer peripheral face of outer frame part 33
Alar part 332 as rectangular plate-like.Above-mentioned alar part 332 is protruded in the way of generally perpendicularly being erect from outer peripheral face, and wing quilt
It is arranged to be viewed as level from side.So, the structure that alar part is provided with outer frame part 33 utilizes plating solution stream and the wing
Portion 332 collides and produces revolving force, hereby it is possible to rotate substrate holder 30.
Fig. 4 (a), (b) represent the alar part 333 of different modes.As illustrated, alar part 333 is with outer with housing part 33
The mode that side face is generally perpendicularly erect is protruded, and the wing is not level, and is configured to additional angle so as to after front direction
Side is downwardly inclined.So, by the additional angle of alar part 333, can more effectively catch the plating solution stream from front.Separately
Outside, as shown in Fig. 6 (a), (b), alar part is not formed as rectangular plate-like, but is shaped generally as "U" shape or substantially " V " word
The structure of shape can more easily catch plating solution stream.
Fig. 5 (a), (b) are the recessed modes for being provided with recess 334 on the outer peripheral face of outer frame part 33.As illustrated,
In present embodiment, the recess 334 of multiple rectangles is equally spaced on the outer peripheral face of outer frame part 33.By so existing
Recess 334 is set on outer peripheral face, and recess catches plating solution stream in the same manner as alar part and produces revolving force, hereby it is possible to make substrate
Support 30 rotates.
Fig. 7 is to make the first method that substrate holder 30 rotates using drive division.As illustrated, from drive divisions such as electro-motors
90 transmit revolving force via axle 91 to the gear 93 in axle portion 34.The revolving force of axle 91 is converted into axle portion 34 by gear 93
Rotation and transmit.Hereby it is possible to rotate substrate holder 30.In addition, drive division 90 can be arranged directly on support 40,
Or can be arranged to dismantle from installation portion 92 and support is set in addition outside plating coating groove.Furthermore, from drive division 90 to
The transmission of the revolving force of axle portion 34 can be as in the present embodiment by axle and gear combination, additionally can be by multiple gear parts
Part is combined or transmitted by transmission belt.
Fig. 8 is to make the second method that substrate holder 30 rotates using drive division.As illustrated, on the top of substrate holder 30
Gear part 94 is provided with, the gear of tooth pitch identical with the gear of gear part 94 is provided with the housing part of substrate holder 30
95.The gear 95 that the outside frame part of gear part 94 of revolving force is transmitted from drive division 90 transmits revolving force, hereby it is possible to make substrate
Support 30 rotates.In addition, the transmission from drive division 90 to the revolving force of gear part 94 is as first method, can be by axle and tooth
Wheel combines or can also combine multiple geared parts or be transmitted by transmission belt.
In addition, the rotary unit on substrate holder 30, is not limited to set the wing on the outer peripheral face of above-mentioned housing part 33
Portion or recess and method using plating solution stream and make any one in the method that it rotates using drive division, may be used also
So that they to be mutually combined.I.e., it is possible to which the outer peripheral face in outer frame part 33 sets alar part or recess, and then the drive outside
Dynamic portion applies revolving force.So, make rotation more stable using two kinds of different revolving forces, power consumption can be suppressed.
Next, being illustrated to the plating apparatus of the plating fixture 2 using the present invention.Fig. 2 is mounted with the present invention
The summary construction diagram of the plating apparatus 1 of plating fixture 2.As illustrated, the plating apparatus 1 of the present invention possesses plating coating groove 10 and setting
Overflow launder 20 in the periphery of plating coating groove 10, installs plating fixture 2 on the side wall 11 of plating coating groove 10, in plating coating groove 10 with
The opposite position of plated surface application for being held in the substrate W of substrate holder 30 is provided with positive plate 50.In addition, positive plate 50 with
Blade 60 can be set as in the present embodiment between substrate holder 30.Above-mentioned blade 60 is plated place relative to substrate W
Reason face is abreast reciprocated, can make accordingly it is uniform along the plating solution stream for being plated process face of substrate, therefore can be with tool
The substrate holder 30 for having rotary unit complements each other, and forms the more uniform electroplated film of thickness, thus preferably.
In addition, the ejiction opening 12 of connecting pipings 80 is provided with the bottom of plating coating groove 10, from the ejiction opening 12 to plating
Supply plating solution in groove 10.Alar part or recess are set on the outer peripheral face using the housing part as shown in Fig. 1, Fig. 3 to Fig. 6
And in the case of utilizing the fixture of the mode of plating solution stream, preferably ejiction opening 12 is arranged on housing part 33 is flowed to plating solution
Alar part or recess transmission revolving force effective position on.Specifically, the lower section of substrate holder 30, and edge are preferably configured in
The direction parallel with substrate holder 30.Now, in the different mode of the intensity of the plating solution stream of the left and right of substrate holder 30, it will spray
Head piece 12 is formed unilateral or the spray volume from ejiction opening 12 is formed difference in left and right, accordingly can more effective real estate
Raw revolving force, thus preferably.
(explanation of reference)
1 ... plating apparatus；2 ... plating fixtures；10 ... plating coating grooves；11 ... side walls；12 ... ejiction openings；20 ... overflow launders；
30 ... substrate holders；31 ... holding members；32 ... seal members；33 ... housing parts；34 ... axle portions；35 ... fixing bolts；
36 ... fixing bolts；37 ... fixing bolts；40 ... supports；41 ... hole portions；50 ... positive plates；60 ... blades；70 ... power supplys；
71 ... electrical paths；80 ... pipe arrangements；81 ... pumps；82 ... filters；90 ... drive divisions；91 ... axles；92 ... installation portions；93 ... teeth
Wheel；94 ... gear parts；95 ... housing parts；311 ... base portions；312 ... substrate loading surfaces；313 ... hole portions；314 ... first are powered
Part；321 ... opening portions；322 ... gasket seals；323 ... second energized components；324 ... prominent contacts；331 ... linking parts；
332 ... alar parts；333 ... alar parts；334 ... recesses；W ... substrates.
Claims (4)
1. a kind of plating fixture, it is characterised in that
Vertical rotary is kept into including the support being removably mounted in plating groove sidewall and by the support freely
Substrate holder, and possess using plating solution stream the substrate holder rotary unit,
Wherein, the rotary unit of the substrate holder is provided projectingly on the outer peripheral face of the housing part of the substrate holder
Alar part, or the recessed recess being arranged on the outer peripheral face of the housing part of the substrate holder, or combinations thereof.
2. plating fixture according to claim 1, it is characterised in that
The substrate holder includes：Possesses the holding member of substrate loading surface；The ring of substrate is clamped together with the holding member
The seal member of shape；The chimeric housing part on the periphery of the holding member and seal member；And insertion is set
It is placed in the axle portion for the central hole portion for being arranged on the holding member.
3. a kind of plating apparatus, it is characterised in that
Plating fixture described in claim 1 or 2 is mounted on the side wall of plating coating groove, the substrate holder and with the base
Board mount is opposed to be provided with the blade reciprocated in the horizontal between the positive plate of setting.
4. a kind of plating apparatus, it is characterised in that
Plating fixture described in claim 1 or 2 is mounted on the side wall of plating coating groove, the plating in the lower section of the substrate holder
The bottom of groove is provided with plating solution ejiction opening.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/060655 WO2013157129A1 (en) | 2012-04-20 | 2012-04-20 | Substrate plating jig and plating device using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104220648A CN104220648A (en) | 2014-12-17 |
| CN104220648B true CN104220648B (en) | 2017-09-05 |
Family
ID=49383111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280072382.8A Expired - Fee Related CN104220648B (en) | 2012-04-20 | 2012-04-20 | Substrate plating fixture and utilize its plating apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150068890A1 (en) |
| JP (1) | JP5981534B2 (en) |
| CN (1) | CN104220648B (en) |
| TW (1) | TWI586852B (en) |
| WO (1) | WO2013157129A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6472693B2 (en) | 2015-03-24 | 2019-02-20 | 株式会社荏原製作所 | Substrate processing equipment |
| JP6596372B2 (en) * | 2016-03-22 | 2019-10-23 | 株式会社荏原製作所 | Substrate holder and plating apparatus |
| JP6709727B2 (en) * | 2016-12-14 | 2020-06-17 | 株式会社荏原製作所 | Electrolytic plating equipment |
| WO2019204512A1 (en) * | 2018-04-20 | 2019-10-24 | Applied Materials, Inc. | Seal apparatus for an electroplating system |
| JP7256027B2 (en) * | 2019-02-20 | 2023-04-11 | 株式会社荏原製作所 | Substrate holder and plating apparatus equipped with the substrate holder |
| WO2020169439A1 (en) | 2019-02-21 | 2020-08-27 | Markus Hacksteiner | Assembly for electrically contacting a microchip substrate |
| CN211479988U (en) * | 2019-10-14 | 2020-09-11 | Pyxis Cf私人有限公司 | Wet processing equipment |
| JP7354020B2 (en) * | 2020-03-04 | 2023-10-02 | 株式会社荏原製作所 | Plating equipment and resistors |
| CN111705355A (en) * | 2020-07-02 | 2020-09-25 | 上海戴丰科技有限公司 | Vertical rotary electroplating jig for wafer and electroplating device |
| KR102333344B1 (en) * | 2020-12-21 | 2021-12-01 | 가부시키가이샤 에바라 세이사꾸쇼 | Plating apparatus and stirring method of plating solution |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5670034A (en) * | 1995-07-11 | 1997-09-23 | American Plating Systems | Reciprocating anode electrolytic plating apparatus and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5472592A (en) * | 1994-07-19 | 1995-12-05 | American Plating Systems | Electrolytic plating apparatus and method |
| JP2000239898A (en) * | 1999-02-22 | 2000-09-05 | Ebara Corp | Plating device |
| JP3629396B2 (en) * | 2000-03-07 | 2005-03-16 | 株式会社荏原製作所 | Substrate plating jig |
| JP2002327291A (en) * | 2001-04-26 | 2002-11-15 | Yamamoto Mekki Shikenki:Kk | Electroplating device |
| JP2002363794A (en) * | 2001-06-01 | 2002-12-18 | Ebara Corp | Substrate holder and plating device |
| US20040028837A1 (en) * | 2002-06-28 | 2004-02-12 | Tokyo Electron Limited | Method and apparatus for plasma processing |
| JP2004300462A (en) * | 2003-03-28 | 2004-10-28 | Ebara Corp | Plating method and plating apparatus |
| JP5184308B2 (en) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | Plating apparatus and plating method |
| TWI414640B (en) * | 2010-09-06 | 2013-11-11 | Grand Plastic Technology Co Ltd | Wafer clamping apparatus with vertical haning arm for plating |
-
2012
- 2012-04-20 JP JP2014511052A patent/JP5981534B2/en not_active Expired - Fee Related
- 2012-04-20 CN CN201280072382.8A patent/CN104220648B/en not_active Expired - Fee Related
- 2012-04-20 WO PCT/JP2012/060655 patent/WO2013157129A1/en active Application Filing
- 2012-04-20 US US14/394,806 patent/US20150068890A1/en not_active Abandoned
-
2013
- 2013-03-12 TW TW102108660A patent/TWI586852B/en not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5670034A (en) * | 1995-07-11 | 1997-09-23 | American Plating Systems | Reciprocating anode electrolytic plating apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| US20150068890A1 (en) | 2015-03-12 |
| TWI586852B (en) | 2017-06-11 |
| JPWO2013157129A1 (en) | 2015-12-21 |
| TW201348528A (en) | 2013-12-01 |
| WO2013157129A1 (en) | 2013-10-24 |
| CN104220648A (en) | 2014-12-17 |
| JP5981534B2 (en) | 2016-08-31 |
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