CN104269386A - Multi-chip packaging bonding layer heat-conducting tooth structure - Google Patents
Multi-chip packaging bonding layer heat-conducting tooth structure Download PDFInfo
- Publication number
- CN104269386A CN104269386A CN201410428872.8A CN201410428872A CN104269386A CN 104269386 A CN104269386 A CN 104269386A CN 201410428872 A CN201410428872 A CN 201410428872A CN 104269386 A CN104269386 A CN 104269386A
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- tack coat
- packaging
- chip package
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a multi-chip packaging bonding layer heat-conducting tooth structure. The multi-chip packaging bonding layer heat-conducting tooth structure comprises cooling fins (3). The upper surfaces of the cooling fins (3) are connected with a packaging substrate (2) through a bonding agent layer (4), heat-conducting teeth (6) are arranged on the upper surface of the packaging substrate (2) and welded to the packaging substrate (2) through a welding bonding layer (5), and a plurality of semiconductor chips (1) arranged at intervals are fixed to the heat-conducting teeth (6). The multi-chip packaging bonding layer heat-conducting tooth structure is simple; a fast channel for heat conduction is formed between the semiconductor chips and the cooling fins, all the chips can be well cooled, and therefore the chips can be protected and can also be effectively cooled.
Description
Technical field
The present invention relates to semiconductor heat-dissipating technical field, be specifically related to a kind of multi-chip package tack coat heat conduction toothing.
Background technology
The manufacture of modern integrated circuits comprises some steps.First on a semiconductor wafer manufacture integrated circuit, this semiconductor crystal wafer comprises the semiconductor chip of multiple repetition, eachly comprises semiconductor integrated circuit.Then it is encapsulated from wafer cutting semiconductor chip.
The thermal reliability of chip package and thermal stability have become one of chip design problem demanding prompt solution, and for chip cooling, except utilizing hardware (radiator) to realize except chip cooling, the design of chip itself also can produce obviously impact to heat radiation.And chip itself produce heat, except outwards dispelling the heat at least partially through chip surface and solder joint, major heat by chip bottom to heat-radiating substrate heat loss through conduction.Therefore, chip design now generally has two kinds of thinkings, and one adopts high heat conductance novel semiconductor material as carborundum (SiC), and its thermal conductivity is the three-to-four-fold of traditional silicon device, to improve the performance that chip is applied high temperature; Another kind adopts the different Heat Conduction Materials of different structure sticky design radiator to dispel the heat to chip.But owing to needing to consider the reliable bond of chip to substrate, the general bonding solder adopted can not carry out delivered heat effectively, limit above two kinds of thinkings and improving the effect on heat sinking function.Therefore, can not effectively dispel the heat to chip for chip-packaging structure, chip occurs that heat is run quickly, risk of rupture is very high.
Summary of the invention
The object of the invention is to provide a kind of multi-chip package tack coat heat conduction toothing, and it can solve problem existing in background technology effectively.
In order to solve problem existing in background technology, it comprises fin-shaped fin 3, the upper surface of this fin-shaped fin 3 is connected with base plate for packaging 2 by adhesive phase 4, the upper surface of described base plate for packaging 2 is provided with heat conduction tooth 6, this heat conduction tooth 6 is welded on base plate for packaging 2 by welding adhesive linkage 5, described heat conduction tooth 6 is fixed with the semiconductor chip 1 of multiple interval arrangement.
The semi-conducting material of described semiconductor chip 1 is be selected from least one in silicon, germanium, carborundum and gallium nitride.
Described welding adhesive linkage 5 is that at least one solder in the plumbous silver solder of plumber's solder or tin is welded.
Described welding adhesive linkage 5 is at least one in silver slurry adhesive technology, low-melting glass adhesive technology, conductive adhesive technology, adhering with epoxy resin technology or eutectic welding technology.
Described base plate for packaging 2 is copper base, aluminium oxide (Al
2o
3) pottery, beryllium oxide (BeO) pottery, at least one in aluminium nitride (AlN) pottery.
Described adhesive phase 4 is at least one in heat conductive silica gel, silver slurry, aluminum paste or glass putty slurry.
Described fin-shaped fin 3 is that at least one processing and fabricating in copper, copper alloy or diamond forms.
Owing to have employed above technical scheme; the present invention has following beneficial effect: structure is simple; heat conduction express passway can be opened between semiconductor chip and fin-shaped fin; each chip can both well be dispelled the heat; thus can either protect IC, effectively can dispel the heat to chip again.
Accompanying drawing explanation
In order to be illustrated more clearly in the present invention, below in conjunction with accompanying drawing, embodiment is briefly described.
Fig. 1 is structural representation of the present invention;
Fig. 2 is the vertical view of embodiment 2 in the present invention;
Fig. 3 is the vertical view of embodiment 3 in the present invention;
Fig. 4 is the vertical view of embodiment 4 in the present invention.
Embodiment
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention being clearly and completely described.
Embodiment 1
Referring to Fig. 1, it comprises fin-shaped fin 3, the upper surface of this fin-shaped fin 3 is connected with base plate for packaging 2 by adhesive phase 4, the upper surface of described base plate for packaging 2 is provided with heat conduction tooth 6, this heat conduction tooth 6 is welded on base plate for packaging 2 by welding adhesive linkage 5, described heat conduction tooth 6 is fixed with the semiconductor chip 1 of multiple interval arrangement.
The semi-conducting material of described semiconductor chip 1 is be selected from least one in silicon, germanium, carborundum and gallium nitride.
Described welding adhesive linkage 5 is that at least one solder in the plumbous silver solder of plumber's solder or tin is welded.
Described welding adhesive linkage 5 is at least one in silver slurry adhesive technology, low-melting glass adhesive technology, conductive adhesive technology, adhering with epoxy resin technology or eutectic welding technology.
Described base plate for packaging 2 is copper base, aluminium oxide (Al
2o
3) pottery, beryllium oxide (BeO) pottery, at least one in aluminium nitride (AlN) pottery.
Described adhesive phase 4 is at least one in heat conductive silica gel, silver slurry, aluminum paste or glass putty slurry.
Described fin-shaped fin 3 is that at least one processing and fabricating in copper, copper alloy or diamond forms.
Embodiment 2
Referring to Fig. 2, the heat conduction tooth 6 be fixed on base plate for packaging 2 by welding adhesive linkage 5 is made up of through the sub-heat conduction tooth bar of cutting several, each independently sub-heat conduction tooth bar head and the tail are fixed on bottom two adjacent semiconductor chips 1 respectively by welding adhesive linkage 5, and the setting of staggering for being parallel to each other between the sub-heat conduction tooth of both sides bottom semiconductor chip 1.
Embodiment 3
Referring to Fig. 3, be fixed on heat conduction tooth 6 on base plate for packaging 2 by welding adhesive linkage 5 to be made up of two complete sub-heat conduction tooth bars, two independently sub-heat conduction tooth bar in the back-shaped bending in the bottom of semiconductor chip 1, mutually the setting of staggering of mirror image each other, extends to after having bent and continues to bend with the bottom of adjacent next semiconductor chip 1.
Embodiment 4
Referring to Fig. 4, the heat conduction tooth 6 be fixed on base plate for packaging 2 by welding adhesive linkage 5 is made up of the two leading hot teeth and sub-heat conduction tooth being positioned at semiconductor chip about 1 both sides, one end of described sub-heat conduction tooth be welded to connect with leading hot tooth, its other end extends to the bottom of semiconductor chip 1, is setting of mutually staggering between the sub-heat conduction tooth on two leading hot teeth.
Owing to have employed above technical scheme; the present invention has following beneficial effect: structure is simple; heat conduction express passway can be opened between semiconductor chip and fin-shaped fin; each chip can both well be dispelled the heat; thus can either protect IC, effectively can dispel the heat to chip again.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art should be appreciated that it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (7)
1. a multi-chip package tack coat heat conduction toothing, it is characterized in that it comprises fin-shaped fin (3), the upper surface of this fin-shaped fin (3) is connected with base plate for packaging (2) by adhesive phase (4), the upper surface of described base plate for packaging (2) is provided with heat conduction tooth (6), this heat conduction tooth (6) is welded on base plate for packaging (2) by welding adhesive linkage (5), described heat conduction tooth (6) is fixed with the semiconductor chip (1) of multiple interval arrangement.
2. a kind of multi-chip package tack coat heat conduction toothing according to claim 1, is characterized in that the semi-conducting material of described semiconductor chip (1) is be selected from least one in silicon, germanium, carborundum and gallium nitride.
3. a kind of multi-chip package tack coat heat conduction toothing according to claim 1, is characterized in that described welding adhesive linkage (5) is welded at least one solder in the plumbous silver solder of plumber's solder or tin.
4. a kind of multi-chip package tack coat heat conduction toothing according to claim 1, is characterized in that described welding adhesive linkage (5) is at least one in silver slurry adhesive technology, low-melting glass adhesive technology, conductive adhesive technology, adhering with epoxy resin technology or eutectic welding technology.
5. a kind of multi-chip package tack coat heat conduction toothing according to claim 1, is characterized in that described base plate for packaging (2) is copper base, aluminium oxide (Al
2o
3) pottery, beryllium oxide (BeO) pottery, at least one in aluminium nitride (AlN) pottery.
6. a kind of multi-chip package tack coat heat conduction toothing according to claim 1, it is characterized in that described adhesive phase (4) be heat conductive silica gel, silver slurry, aluminum paste or glass putty slurry at least one.
7. a kind of multi-chip package tack coat heat conduction toothing according to claim 1, is characterized in that described fin-shaped fin (3) is copper, at least one processing and fabricating in copper alloy or diamond forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410428872.8A CN104269386A (en) | 2014-08-28 | 2014-08-28 | Multi-chip packaging bonding layer heat-conducting tooth structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410428872.8A CN104269386A (en) | 2014-08-28 | 2014-08-28 | Multi-chip packaging bonding layer heat-conducting tooth structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104269386A true CN104269386A (en) | 2015-01-07 |
Family
ID=52160896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410428872.8A Pending CN104269386A (en) | 2014-08-28 | 2014-08-28 | Multi-chip packaging bonding layer heat-conducting tooth structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104269386A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660678A (en) * | 2019-10-11 | 2020-01-07 | 广州安波通信科技有限公司 | Chip structure assembling method and chip structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08111568A (en) * | 1994-10-07 | 1996-04-30 | Mitsubishi Electric Corp | Printed wiring board provided with heat sink |
| US5661902A (en) * | 1993-10-08 | 1997-09-02 | Northern Telecom Limited | Methods of making printed circuit boards and heat sink structures |
| US5990550A (en) * | 1997-03-28 | 1999-11-23 | Nec Corporation | Integrated circuit device cooling structure |
| CN103782381A (en) * | 2011-07-11 | 2014-05-07 | 德克萨斯仪器股份有限公司 | Electronic assembly including die on substrate with heat spreader having an open window on the die |
-
2014
- 2014-08-28 CN CN201410428872.8A patent/CN104269386A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5661902A (en) * | 1993-10-08 | 1997-09-02 | Northern Telecom Limited | Methods of making printed circuit boards and heat sink structures |
| JPH08111568A (en) * | 1994-10-07 | 1996-04-30 | Mitsubishi Electric Corp | Printed wiring board provided with heat sink |
| US5990550A (en) * | 1997-03-28 | 1999-11-23 | Nec Corporation | Integrated circuit device cooling structure |
| CN103782381A (en) * | 2011-07-11 | 2014-05-07 | 德克萨斯仪器股份有限公司 | Electronic assembly including die on substrate with heat spreader having an open window on the die |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110660678A (en) * | 2019-10-11 | 2020-01-07 | 广州安波通信科技有限公司 | Chip structure assembling method and chip structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010219524A (en) | Millichannel substrate, cooling device using the same, and method of manufacturing device | |
| US8053876B2 (en) | Multi lead frame power package | |
| US10366938B2 (en) | Silicon nitride circuit board and electronic component module using the same | |
| TWI743449B (en) | Monolithic microwave integrated circuit (mmic) cooling structure | |
| JP7000544B2 (en) | Manufacturing method of semiconductor module | |
| JP6336138B2 (en) | Semiconductor device | |
| JP6394810B1 (en) | Semiconductor device | |
| JP7204637B2 (en) | CERAMIC METAL CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME | |
| TW202005010A (en) | Semiconductor package structure and method for manufacturing the same | |
| KR20190137086A (en) | Circuit cooled on two sides | |
| TW510158B (en) | Heat dissipation structure for semiconductor device | |
| JP2015090965A (en) | Semiconductor device | |
| JP5957866B2 (en) | Semiconductor device | |
| JP6139329B2 (en) | Ceramic circuit board and electronic device | |
| CN104269386A (en) | Multi-chip packaging bonding layer heat-conducting tooth structure | |
| TWI660471B (en) | Chip package | |
| EP3751603A3 (en) | Semiconductor package with a heat sink bonded to a semiconductor chip with a bonding layer and to a molding material with a thermal interface material | |
| CN110911365A (en) | Flip-chip packaging heat dissipation structure and manufacturing method thereof | |
| TWI317547B (en) | Substrate with heat-dissipating dummy pattern for semiconductor packages | |
| TWI746391B (en) | Integrated cirsuit pacakge system | |
| JP7082506B2 (en) | Thermally conductive inorganic substrates and semiconductor devices | |
| JPH08222670A (en) | Package for mounting semiconductor element | |
| JP7261602B2 (en) | Semiconductor device and power conversion device | |
| TWI701747B (en) | Semiconductor device and manufacturing method thereof | |
| CN104157621A (en) | Power semiconductor chip packaging heat conduction cover |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150107 |