CN104427793B - The preparation method of multilayer circuit board - Google Patents
The preparation method of multilayer circuit board Download PDFInfo
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- CN104427793B CN104427793B CN201310403680.7A CN201310403680A CN104427793B CN 104427793 B CN104427793 B CN 104427793B CN 201310403680 A CN201310403680 A CN 201310403680A CN 104427793 B CN104427793 B CN 104427793B
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- concentric circles
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Abstract
The present invention discloses a kind of preparation method of multilayer circuit board, and it comprises the following steps.First, there is provided base material, it includes the first through hole through base material.Then it is that contraposition target forms the first patterned line layer on the surface of base material with first through hole.First patterned line layer includes the first concentric circles around first through hole.Then, the first stack layer is formed on surface.The first perforation is re-formed, it runs through the first concentric circles by the internal diameter orthographic projection of outside first concentric circles in center to the first stack layer and the region of base material.Then, the second stack layer is formed on the first stack layer.Afterwards, the second perforation is formed, it runs through the first concentric circles by the internal diameter orthographic projection of outside second concentric circles in center to the region of the second stack layer, the first stack layer and base material.
Description
Technical field
The present invention relates to a kind of preparation method of circuit board, and more particularly to a kind of preparation method of multilayer circuit board.
Background technology
Due to the integrated level of electronic product（integration）More and more higher, is applied to the electronic product of high integration
Circuit board, its line layer also from individual layer, 2 layers and be changed into 6 layers, 8 layers, or even to more than 10 layers, so that electronic component can be closeer
What is collected is installed on printed circuit board (PCB).In general, most common process for manufacturing circuit board is lay-up method（lamination
process）, when using lay-up method to make circuit board, the aligning accuracy between each line layer and insulating barrier must be obtained
Good control.Therefore, in process for manufacturing circuit board, typically form multiple right by lithographic fabrication process in previous lamination
Position target, and again after increasing layer, the contraposition target of previous lamination is found by X-ray and milling target manufacture craft is carried out to be formed subsequently
Another contraposition target of manufacture craft.
However, by the contraposition target of previous lamination is formed by lithographic fabrication process, itself is existing system
Make fabrication error, and when carrying out milling target using X-ray, can also produce the error in milling target manufacture craft.In this way, the register guide of each layer
Bit errors produced by target will constantly accumulate.If the circuit number of layers of circuit board increases, these contraposition targets are accumulated
Error can also increase, cause level to level alignment degree offset excessive and via cannot be miniaturized with the design of bottom connection pad.
The content of the invention
It is an object of the invention to provide a kind of preparation method of multilayer circuit board, its interlayer that can lift multilayer circuit board
Contraposition precision, lifts the wiring density and ability of line layer, and via is carried with the design of bottom connection pad because aligning precision
Gao Erke tends to miniaturization, can more make design of the unilateral Aligning degree less than 50 μm.
It is that, up to above-mentioned purpose, a kind of preparation method of multilayer circuit board of the invention comprises the following steps：First, there is provided base
Material, it includes the first through hole through base material.Then, the first patterned line layer is formed in base by contraposition target of first through hole
On one upper surface of material.First patterned line layer includes the first concentric circles around first through hole.Then, first is formed
Stack layer on upper surface and cover the first patterned line layer.First stack layer include the first dielectric layer and cover this first
The first line layer of dielectric layer.Afterwards, the first perforation is formed.First perforation is through the first concentric circles by center outside first
The internal diameter orthographic projection of individual concentric circles is to the first stack layer and the region of base material.Then, the second stack layer is formed in the first stacking
On layer.Second stack layer includes the second line layer of the second dielectric layer of the second dielectric layer and covering.Afterwards, second is formed to pass through
Hole.Second perforation through the first concentric circles by outside second concentric circles in center internal diameter orthographic projection to the second stack layer,
The region of the first stack layer and base material.
Based on above-mentioned, manufacturing method of multi-layer circuit board of the invention is to form concentric circle diagram prior to the substrate surface of innermost layer
Case, and each layer stack layer afterwards is all to do contraposition target with this concentric circles to form corresponding contraposition perforation, then with each
The contraposition perforation of layer carries out the subsequent manufacturing processes of corresponding stack layer respectively, such as to align perforation as contraposition reference is formed respectively
Patterned line layer and via of layer etc..Therefore, preparation method of the invention can reduce it is existing in each interlayer alignment error
Accumulation, can more reduce multilayer circuit board has the inclined problem of layer to produce.Therefore, the present invention can improve the contraposition of multilayer circuit board really
The design of precision, the wiring density and ability of lifting line layer, and via and bottom connection pad is because of the improve of contraposition precision
And miniaturization can be tended to, can more make design of the unilateral Aligning degree less than 50 μm.
It is that features described above of the invention and advantage can be become apparent, special embodiment below, and coordinate appended accompanying drawing
It is described in detail below.
Brief description of the drawings
Figure 1A to Fig. 1 G is illustrated according to a kind of flow of the preparation method of multilayer circuit board of one embodiment of the invention
Figure；
Fig. 2 is the schematic top plan view of base material according to one embodiment of the invention and the first patterned line layer；
Fig. 3 is the schematic top plan view of first concentric circles of Fig. 1 E；
Fig. 4 is the schematic top plan view of first concentric circles of Fig. 1 G；
Fig. 5 is the schematic top plan view of base material according to another embodiment of the present invention and the first patterned line layer；
Fig. 6 A to Fig. 6 D are flowed according to a kind of part of the preparation method of multilayer circuit board of another embodiment of the present invention
Journey schematic diagram.
Symbol description
110：Base material
112、114：Surface
116：First through hole
118：Second through hole
120：First patterned line layer
122：First concentric circles
122a、124a：First concentric circles
122b、124b：Second concentric circles
124：Second concentric circles
130：First stack layer
132：First dielectric layer
134：First line layer
134a：First opening
140：First perforation
150：Second stack layer
152：Second dielectric layer
154：Second line layer
154a：Second opening
160：Second perforation
170：6th stack layer
172：6th dielectric layer
174：6th line layer
174a、194a：Opening
180：6th perforation
182：Blind hole
190：7th stack layer
192：7th dielectric layer
194：7th line layer
195：7th perforation
D1：Through hole external diameter
D2：Concentric circles external diameter
G1：Spacing
Specific embodiment
Figure 1A to Fig. 1 G is illustrated according to a kind of flow of the preparation method of multilayer circuit board of one embodiment of the invention
Figure.Fig. 2 is the schematic top plan view of base material according to one embodiment of the invention and the first patterned line layer.In the present embodiment
In, the preparation method of multilayer circuit board comprises the following steps：First, as shown in Figure 1A, there is provided base material 110, it includes relative two
Surface 112,114 and the first through hole 116 through base material 110.Then, referring to Figure 1B and Fig. 2, with first through hole 116
For contraposition target forms the first patterned line layer 120 on surface 112.In the present embodiment, as shown in Fig. 2 first through hole
116 outer diameter D 1 is substantially between 0.5 millimeter（mm）To between 0.8 millimeter.Herein it should be noted that, depicted in Figure 1A to Fig. 1 G
Making programme be the sectional view of the Making programme of region A in Fig. 2.First patterned line layer 120 has circular as shown in Figure 2
First concentric circles 122 of first through hole 116.First concentric circles 122 include multiple concentric circles, and concentric circles is to each other
Spacing G1 substantially between 50 microns（μm）To between 100 microns, certainly, the present invention is not limited thereto, and this area tool is logical
Normal skill is worked as and can voluntarily be adjusted according to the design of actual product and layout requirements.
Then, as shown in Figure 1 C, the first stack layer 130 is formed on surface 112, wherein, the first stack layer 130 includes the
One dielectric layer 132 and first line layer 134, and first line layer 134 covers the first dielectric layer 132.Afterwards, referring to
Fig. 1 D and Fig. 1 E, using such as carbon dioxide laser（CO2laser）The mode of drilling forms the first perforation 140.First perforation
140 as referring to figure 1E through the first concentric circles 122 by the internal diameter orthographic projection of the outside first concentric circles 122a in center to the
The region of one stack layer 130 and base material 110.Fig. 3 is to depict the first concentric circles after being run through by the first perforation 140
122 top view.
In the present embodiment, the material of the first patterned line layer 120 and first line layer 134 is copper, because copper is only right
Ultraviolet region（0.3 μm of ＜）Following short wavelength region absorptivity is higher, and the optical wavelength of carbon dioxide laser is more long（About 10 is micro-
It is more than rice）, belong to infrared light district, therefore less likely absorbed and by copper ablation pore-forming by copper.Therefore, the concentric circle diagram of copper material
Case 122 can be considered a copper mask of carbon dioxide laser, be used to limit carbon dioxide laser to the first stack layer 130 and base
The scope of the cutting of material 110.That is, outwards drilled by center using carbon dioxide laser, then can be with first concentric circles
The internal diameter of 122a drills the first perforation 140 of formation for border.If it is noted that being formed using carbon dioxide laser
First perforation 140, needs first be patterned to form as shown in figure iD to the first line layer 134 of Fig. 1 C first to be open
134a, makes the first opening 134a expose the orthographic projection of the first concentric circles 122 to the region of the first dielectric layer 132, then carry out
Follow-up drilling program.
Certainly, the invention is not limited in this.In other embodiments of the invention, Direct Laser drilling can also be used
（Direct Laser Drill,DLD）Mode form the first perforation 140.If being formed using the mode that Direct Laser drills
First perforation 140, then need not form opening 134a as shown in figure iD, and can form the layer of the first line shown in Fig. 1 C 134
Direct Laser drilling is carried out afterwards to form the first perforation 140.In the present embodiment, the formation of the first perforation 140 can for example divide
Do not drilled from the outer surface of the first stack layer 130 toward the direction of base material 110.
Afterwards, you can with the first perforation 140 for contraposition target carries out subsequent manufacturing processes to the first stack layer 130, for example
With the first perforation 140 as the contraposition target of lithographic fabrication process, first line layer 134 is patterned, to form multilayer
Second patterned line layer of circuit board, or with the first perforation 140 for contraposition target forms the first via in the first stacking
On layer 130.
Afterwards, then as shown in fig. 1F, the second stack layer 150 is formed on the first stack layer 130.Second stack layer 150 is wrapped
The second dielectric layer 152 and the second line layer 154 are included, and the second line layer 154 covers the second dielectric layer 152.Afterwards, scheme for another example
The second perforation 160 is formed shown in 1G, and the second perforation 160 is concentric by outside second of center through the first concentric circles 120
The internal diameter orthographic projection of circle 122b is to the region of the second stack layer 150, the first stack layer 130 and base material 110.Fig. 4 be depict by
Second perforation 160 run through after the first concentric circles 122 top view.
As described in the forming method of the first perforation, the second perforation 160 can also be used the mode of carbon dioxide laser drilling
And formed.That is, outwards being drilled by center using carbon dioxide laser, first concentric circles as shown in Figure 3 is ablated off
After base material 110 between 122a and second concentric circles 122b, first concentric circles 122a can be shelled from concentric circles 120
From, and form the second perforation 160 as shown in Figure 4.If likewise, forming the second perforation 160 using carbon dioxide laser, needing
The second opening 154a as shown in Figure 1 F is initially formed, the second opening 154a is exposed the orthographic projection of the first concentric circles 122 extremely
The region of the second dielectric layer 152, then carry out follow-up drilling program.
Certainly, in other embodiments of the invention, Direct Laser drilling can also be used（Direct Laser Drill,
DLD）Mode form the second perforation 160, so need not then form the second opening 154a as shown in Figure 1 F, and can carry out immediately
Direct Laser drills to form the second perforation 160.In the present embodiment, the method for forming the second perforation 160 can respectively by second
The outer surface of stack layer 150 drills toward the direction of base material 110.
Afterwards, you can with the second perforation 160 for contraposition target carries out subsequent manufacturing processes to the second stack layer 150, for example
With the second perforation 160 as the contraposition target of lithographic fabrication process, the second line layer 154 is patterned, to form multilayer
3rd patterned line layer of circuit board, or with the second perforation 160 for contraposition target forms the second via in the second stacking
On layer 150, wherein, the second via connects the first via on the first stack layer 130.
The one side that the present embodiment is only illustrated in base material forms two Making programmes for being laminated structure, and certainly, the present invention is not
The concentric circles number of limitation stack layer, the number of plies of line layer and concentric circles.Those skilled in the art can voluntarily according to
Foregoing preparation method stacks other stack layers in continuation on the second stack layer, and is contraposition target shape with concentric circles 122
Into the contraposition perforation of each layer, then follow-up contraposition manufacture craft is carried out with the contraposition perforation of each layer respectively, to form the figure of each layer
Case line layer and/or via.
In this way, each layer stack layer of multilayer circuit board is all with the concentric circles 122 on the surface of base material 110 of innermost layer
Form corresponding contraposition perforation, thus can reduce it is existing in each interlayer alignment error accumulation, can more reduce multilayer circuit board has
The inclined problem of layer is produced.Additionally, more method the via for connecting each layer can be formed according to this.Because the via of each layer is all with same
The concentric circles 122 that one lithographic fabrication process is formed are formed as contraposition target, therefore can reduce via because right
Position error accumulation and cause the situation that each layer via cannot be aligned, lift the wiring density and ability of line layer, and via
Design with bottom connection pad can move towards miniaturization because interlayer alignment precision is improved, and can more make unilateral Aligning degree less than 50 μm
Design.
Additionally, if the number of plies of line layer needed for multilayer circuit board is more, need to carry out the number of times of increasing layer also with raising,
The concentric circles number of one concentric circles 122 thus increases therewith.That is, the maximum outside diameter of the first concentric circles 122
D2 can be directly proportional to the increasing layer number of times of multilayer circuit board.However, the image sensor based on production equipment（Charge-Coupled
Device,CCD）Image capture form can read full-size limitation, the maximum outside diameter D2 realities of the first concentric circles 122
Be should be less than in matter or equal to 3.175 millimeters（mm）.Therefore, if the increasing layer number of times of multilayer circuit board is more than a predetermined value（For example
Equal to or more than 5 times）, and make the first concentric circles 122 maximum outside diameter D2 level off to 3.175 millimeters when, shape after this
Into stack layer then need to do contraposition target by another concentric circles and carry out contraposition manufacture craft.
Fig. 5 is the schematic top plan view of base material according to another embodiment of the present invention and the first patterned line layer.Fig. 6 A
It is the part schematic flow sheet of the preparation method according to a kind of multilayer circuit board of another embodiment of the present invention to Fig. 6 D.Please join
According to Fig. 5, as it was previously stated, when the increasing layer number of times that multilayer circuit board to be carried out is more than a predetermined value, then needing design two with one heart
Circle diagram case.That is, in the present embodiment, the increasing layer number of times of multilayer circuit board is more than predetermined value（It is greater than M times, M is big
In 2 positive integer）, and base material 110 can have the second through hole through base material in addition to foregoing first through hole 116, more
118.Then, then respectively with the through hole 118 of first through hole 116 and second for contraposition target formed the first patterned line layer 120 in
On surface 112.Each first patterned line layer 120 except including around first through hole 116 the first concentric circles 122, more
Including the second concentric circles 124 around the second through hole 118.Due to the first concentric circles 122 and the second concentric circles
124 are formed by same patterning manufacture craft, therefore the bit errors that multiple tracks patterns manufacture craft can be avoided to tire out
Product.In this way, the stack layer since M layers all does contraposition target to carry out follow-up contraposition system with the second concentric circles 124
Make technique, Making programme of its Making programme substantially with Figure 1A to 1G is identical.
Specifically, referring to Fig. 5 and Fig. 6 A, after the second concentric circles 124 are formed, M heaps can be formed
The top of the second stack layer 150 is stacked on, in the present embodiment, M is, for example, 6, that is to say, that multilayer circuit board has utilized first
Concentric circles 122 do contraposition target and have sequentially formed the first to the 5th stack layer, and the 6th stack layer 170（Namely M heaps
Lamination）Correspondence includes the 6th line layer 174 of the 6th dielectric layer 172 of the 6th dielectric layer 172 and covering.Then, such as Fig. 5 and 6B
It is shown, the 6th perforation 180 is formed, it runs through internal diameter of second concentric circles 124 by the outside first concentric circles 124a in center
The region of the stack layer of orthographic projection to first to the 6th and base material 110.
It should be noted that, form each layer dielectric layer contraposition target is done with the first concentric circles 122（Such as first to
Five stack layers）Perforation while, can respectively at the orthographic projection of the second through hole 118 of the second concentric circles 124 to correspondence dielectric
Blind hole 182 is formed on the position of layer, that is, in each layer dielectric layer（Such as first to the 5th stack layer）Corresponding to the second through hole
Blind hole 182 is formed on 118 position respectively, wherein, the external diameter of blind hole 182 is less than first internal diameter of concentric circles 124a.In this way,
Because each stack layer has been pre-formed blind hole, the gross thickness of dielectric layer is reduced, therefore, in follow-up manufacture craft, laser is
The 6th perforation 180 can be formed without once burning the thicker dielectric layer of gross thickness.
Afterwards, you can with the 6th perforation 180 for contraposition target carries out subsequent manufacturing processes to the 6th stack layer 170, for example
With the 6th perforation 180 as the contraposition target of lithographic fabrication process, the 6th line layer 174 is patterned, to form multilayer
The patterned line layer of circuit board, or with the 6th perforation 180 for contraposition target forms the 6th via in the 6th stack layer 170
On.
The reference picture that please continue 6C, forms the 7th stack layer 190（Namely M+1 stack layers）In on the 6th stack layer 170.
7th stack layer 190 includes the 7th line layer 194 of the 7th dielectric layer 192 of the 7th dielectric layer 192 and covering.Afterwards, for another example
Shown in Fig. 5 and Fig. 6 D, the 7th perforation 195 is formed, it runs through the second concentric circles 124 by outside second concentric circles in center
The stack layer of internal diameter orthographic projection to first to the 7th of 124b and the region of base material 110.
Afterwards, you can with the 7th perforation 195 for contraposition target carries out subsequent manufacturing processes to the 7th stack layer 190, for example
With the 7th perforation 195 as the contraposition target of lithographic fabrication process, the 7th line layer 194 is patterned, to form multilayer
The patterned line layer of circuit board, or with the 7th perforation 195 for contraposition target forms the 7th via in the 7th stack layer 190
On, wherein, the 7th via connects the 6th via on the 6th stack layer 170, and the via of each layer is all connected to each other.
As it was previously stated, the 6th perforation 180 and the 7th perforation 195 can also be used carbon dioxide laser drilling or Direct Laser
The mode of drilling and formed.If likewise, forming the 6th perforation 180 and the 7th perforation 195 using carbon dioxide laser, needing elder generation
Opening 174a, the 194a as shown in Fig. 6 A and Fig. 6 C are formed, to expose the orthographic projection of the second concentric circles 124 to the 6th respectively
The region of the dielectric layer 192 of dielectric layer 172 and second, then carry out drilling program.If using Direct Laser drill mode, then without
Palpiform can immediately carry out Direct Laser drilling into opening 174a, 194a.
In sum, manufacturing method of multi-layer circuit board of the invention is to form concentric circle diagram prior to the substrate surface of innermost layer
Case, and each layer stack layer afterwards is all to do contraposition target with this concentric circles to form corresponding contraposition perforation, then with each
The contraposition perforation of layer carries out the subsequent manufacturing processes of corresponding stack layer respectively, such as to align perforation as contraposition reference is formed respectively
Patterned line layer and via of layer etc..Therefore, preparation method of the invention can reduce it is existing in each interlayer alignment error
Accumulation, can more reduce multilayer circuit board has the inclined problem of layer to produce.Further, since the via of each layer is all with same optical graving
Make concentric circles that technique formed to be formed as contraposition target, via can be reduced because the bit errors of each interlayer are tired out
Situation that is long-pending and causing via skew.Therefore, the present invention can improve the contraposition precision of multilayer circuit board really, lift circuit
The wiring density and ability of layer, and via can move towards miniaturization with the design of connection pad because aligning the raising of precision, more may be used
Make design of the unilateral Aligning degree less than 50 μm.
Although disclosing the present invention with reference to above example, but it is not limited to the present invention, any affiliated skill
Skilled person in art field, without departing from the spirit and scope of the present invention, can make a little change with retouching, therefore this hair
Bright protection domain should be by being defined that the claim enclosed is defined.
Claims (14)
1. a kind of preparation method of multilayer circuit board, it is characterised in that including：
Base material is provided, including through the first through hole of the base material；
It is that contraposition target forms the first patterned line layer on the surface of the base material with the first through hole, first patterned lines
Road floor includes the first concentric circles around the first through hole；
The first stack layer is formed in the surface and first patterned line layer is covered, first stack layer includes the first dielectric layer
And cover the first line layer of first dielectric layer；
Form the first perforation, first perforation through first concentric circles by outside first concentric circles in center internal diameter just
Project to first stack layer and the region of the base material；
The second stack layer is formed on first stack layer, second stack layer includes the second dielectric layer and covers second Jie
Second line layer of electric layer；And
Form the second perforation, second perforation through first concentric circles by outside second concentric circles in center internal diameter just
Project to the region of second stack layer, first stack layer and the base material.
2. the preparation method of multilayer circuit board as claimed in claim 1, also includes：
After forming first perforation, first line layer is patterned by contraposition target of first perforation；And
After forming second perforation, second line layer is patterned by contraposition target of second perforation.
3. the preparation method of multilayer circuit board as claimed in claim 1, also includes：
After forming first perforation, the first via is formed on first stack layer by contraposition target of first perforation；With
And
After forming second perforation, the second via is formed on second stack layer by contraposition target of second perforation, be somebody's turn to do
Second via connects corresponding first via.
4. the preparation method of multilayer circuit board as claimed in claim 1, wherein forming first perforation and second perforation
Method include carbon dioxide laser drilling.
5. the preparation method of multilayer circuit board as claimed in claim 4, also includes：
Formed first perforation before, formed first be opened on the first line layer on, this first opening expose this first
Concentric circles orthographic projection is to the region of first dielectric layer；And
Before second perforation is formed, formed and second be opened on second line layer, second opening expose this first
Concentric circles orthographic projection is to the region of second dielectric layer.
6. the preparation method of multilayer circuit board as claimed in claim 4, wherein the method for forming first perforation is included by this
The outer surface of the first stack layer drills toward the direction of the base material, and the method for forming second perforation is included by second stack layer
Outer surface drills toward the direction of the base material.
7. the preparation method of multilayer circuit board as claimed in claim 4, wherein first patterned line layer, the first line
The material of layer and second line layer is copper.
8. the preparation method of multilayer circuit board as claimed in claim 1, wherein forming first perforation and second perforation
Method include Direct Laser drilling.
9. the preparation method of multilayer circuit board as claimed in claim 8, wherein the method for forming first perforation is included by this
The outer surface of the first stack layer drills toward the direction of the base material, and the method for forming second perforation is included by second stack layer
Outer surface drills toward the direction of the base material.
10. the preparation method of multilayer circuit board as claimed in claim 1, the wherein base material also include second through the base material
Through hole, first patterned line layer also includes the second concentric circles around second through hole, described multilayer circuit board
Preparation method also include：
M stack layers are formed in second stack layer top, it includes M dielectric layers and covers the M lines of the M dielectric layers
Road floor, wherein M are the positive integer more than 2；
M perforations are formed, the M perforations are just thrown through second concentric circles by the internal diameter of outside first concentric circles in center
Shadow to this first to the M stack layers and the region of the base material；
M+1 stack layers are formed on the M stack layers, the M+1 stack layers include M+1 dielectric layers and cover the M+
The M+1 line layers of 1 dielectric layer；And
M+1 perforations are formed, the M+1 perforations run through internal diameter of second concentric circles by outside second concentric circles in center
Orthographic projection to this first to the M+1 stack layers and the region of the base material.
The preparation method of 11. multilayer circuit boards as claimed in claim 10, also includes：
After forming the M perforations, the M line layers are patterned to form M+1 patterned lines by contraposition target of the M perforations
Road floor；And
After forming the M+1 perforations, pattern the M+1 line layers to form M+2 figures with the M+1 perforations as contraposition target
Case line layer.
The preparation method of 12. multilayer circuit boards as claimed in claim 10, also includes：
After forming the M perforations, M vias are respectively formed on the M stack layers by contraposition target of the M perforations；And
After forming the M+1 perforations, M+1 vias are formed in the M+1 stack layers by contraposition target of the M+1 perforations
On, the M+1 vias connect the M vias.
The preparation method of 13. multilayer circuit boards as claimed in claim 10, wherein M is substantially equal to or greater than 5.
The preparation method of 14. multilayer circuit boards as claimed in claim 10, wherein forming the M perforations and the M+1 is passed through
The method in hole includes that carbon dioxide laser drills or Direct Laser drilling.
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| CN201310403680.7A CN104427793B (en) | 2013-09-06 | 2013-09-06 | The preparation method of multilayer circuit board |
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| CN201310403680.7A CN104427793B (en) | 2013-09-06 | 2013-09-06 | The preparation method of multilayer circuit board |
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| US6458514B1 (en) * | 2000-03-27 | 2002-10-01 | Chong-Ren Maa | Process for forming through holes in substrate of printed circuit board |
| TWI347809B (en) * | 2008-04-10 | 2011-08-21 | Ase Electronics Inc | Method of forming measuring target for measuring dimensions of substrate in the substrate process |
| CN102291949A (en) * | 2010-06-18 | 2011-12-21 | 富葵精密组件(深圳)有限公司 | Manufacturing method of multi-layer circuit board |
| CN102958291A (en) * | 2011-08-23 | 2013-03-06 | 北大方正集团有限公司 | Printed circuit board and manufacture method thereof |
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