CN104465560A - Circulating liquid cooling system for electronic device - Google Patents
Circulating liquid cooling system for electronic device Download PDFInfo
- Publication number
- CN104465560A CN104465560A CN201410676077.0A CN201410676077A CN104465560A CN 104465560 A CN104465560 A CN 104465560A CN 201410676077 A CN201410676077 A CN 201410676077A CN 104465560 A CN104465560 A CN 104465560A
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- CN
- China
- Prior art keywords
- electronic device
- cooling system
- circulating fluid
- coldplate
- cooling
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a circulating liquid cooling system for an electronic device. The circulating liquid cooling system comprises a circulating liquid pipeline, a gas-liquid heat exchanger, a heat exchanger fan, a circulating pump and a cooling board. The circulating liquid cooling system is characterized in that the cooling board is of a hollow-core structure, is vertically arranged and is normally of a honeycomb-shaped or convoluted structural style. The adopted liquid is water or fluorocarbon or silicone grease or hexanediol or the like normally. A circuit tube embedded on a panel is flattened partially inside the cooling board, so that the tube and the board form the same plane, and a cooling tube makes direct contact with the device.
Description
Technical field
The present invention relates to a kind of circulating fluid cooling system, particularly relate to a kind of circulating fluid cooling system used for electronic device.
Background technology
Along with the integrated level of electronic devices and components improves constantly, its heat dissipation capacity is also increasing.Although voltage, the electric current of single components and parts decline to some extent, but due to the increase of components and parts total number and the raising of packaging density, thus power dissipation density is constantly increased, the power of cpu chip doubles for every 36 months according to statistics, each components and parts or material have certain operating temperature range, the super reliability that goes beyond the scope sharply will worsen inefficacy, and the heating problem of electronic device is the key issue directly affecting its reliability; Existing cooling system simple structure does not take into full account the demand of electronic devices and components, and cooling effect is poor, uses the cooling agent costs such as freon high and possibility contaminated environment.
Summary of the invention
The invention provides a kind of circulating fluid cooling system, overcome the deficiency of above-mentioned prior art, it is poor that it effectively can solve the cooling effect caused because of design reasons that existing liquid-cooling system exists, and use more clean, cheap cooling agent to reduce costs, prevent possible problem of environmental pollution.
Technical scheme of the present invention is realized by following measures:
A kind of circulating fluid cooling system used for electronic device, comprises circulating fluid pipeline, gas-liquid heat-exchange, heat exchanger fan, circulating pump and coldplate.
Here is the further optimization and/or improvements to foregoing invention technical scheme:
Described coldplate coldplate adopts hollow core structures vertically to arrange, interior is cellular or convoluted structure, what adopt is large entrance multi-channel parallel reducing runner, the cooling tube sections of inlaying on the cooling plate divides flattening, cooling water pipe and plate is made to form same plane, cooling water pipe directly can contact with electronic device, liquid normally water, fluorocarbon, silicone grease or the hexylene glycol adopted in circulating fluid pipeline.
Accompanying drawing explanation
Fig. 1 is circulating fluid cooling system schematic diagram, wherein comprises:
1, circulating fluid pipeline, 2, gas-liquid heat-exchange, 3, heat exchanger fan, 4, circulating pump, 5, coldplate;
Fig. 2 is the inner large entrance multi-channel parallel reducing flow passage configuration schematic diagram of coldplate.
Embodiment
The present invention by the restriction of following embodiment, can not determine concrete execution mode according to technical scheme of the present invention and actual conditions.
In the present invention, as accompanying drawing 1, one shown in 2 circulating fluid cooling system used for electronic device, this cooling system comprises and comprises circulating fluid pipeline, gas-liquid heat-exchange, heat exchanger fan, circulating pump and coldplate, coldplate coldplate adopts hollow core structures vertically to arrange, interior is cellular or convoluted structure, what adopt is large entrance multi-channel parallel reducing runner, the cooling tube sections of inlaying on the cooling plate divides flattening, cooling water pipe and plate is made to form same plane, cooling water pipe directly can contact with electronic device, the liquid normally water adopted in circulating fluid pipeline, fluorocarbon, silicone grease or hexylene glycol.
The heat of electronic device taken away by cooling agent in coldplate by large entrance multi-channel parallel reducing flow passage structure, enter gas-liquid heat-exchange by circulating fluid pipeline, heat exchanger fan cooling band walks heat, reenters in coldplate again through circulating pump.
Claims (5)
1. the invention discloses a kind of circulating fluid cooling system used for electronic device, comprise circulating fluid pipeline, gas-liquid heat-exchange, heat exchanger fan, circulating pump and coldplate, is characterized in that, coldplate adopts hollow core structures vertically to arrange.
2. a kind of circulating fluid cooling system used for electronic device as claimed in claim 1, is characterized in that, is cellular or convoluted structure in described coldplate.
3. a kind of circulating fluid cooling system used for electronic device as claimed in claim 2, is characterized in that, what adopt in described coldplate is large entrance multi-channel parallel reducing runner.
4. a kind of circulating fluid cooling system used for electronic device as claimed in claim 1, it is characterized in that, in described coldplate, the cooling tube sections of inlaying on the cooling plate divides flattening, make cooling water pipe and plate form same plane, cooling water pipe directly can contact with electronic device.
5. a kind of circulating fluid cooling system used for electronic device as claimed in claim 1, is characterized in that, liquid normally water, fluorocarbon, silicone grease or the hexylene glycol adopted in described circulating fluid pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410676077.0A CN104465560A (en) | 2014-11-21 | 2014-11-21 | Circulating liquid cooling system for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410676077.0A CN104465560A (en) | 2014-11-21 | 2014-11-21 | Circulating liquid cooling system for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104465560A true CN104465560A (en) | 2015-03-25 |
Family
ID=52911382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410676077.0A Pending CN104465560A (en) | 2014-11-21 | 2014-11-21 | Circulating liquid cooling system for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465560A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110972442A (en) * | 2018-09-28 | 2020-04-07 | 株洲中车时代电气股份有限公司 | Refrigerant phase change radiator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5966957A (en) * | 1995-03-17 | 1999-10-19 | Telefonaktiebolaget Lm Ericsson | Cooling system for electronics |
| CN2847531Y (en) * | 2005-11-24 | 2006-12-13 | 讯凯国际股份有限公司 | Water cooling type parallel flow path heat radiation structure |
| CN201156539Y (en) * | 2007-12-24 | 2008-11-26 | 中国西电电气股份有限公司 | Radiator for DC power transmission thyristor converter valve component |
| CN101483173A (en) * | 2008-01-10 | 2009-07-15 | 株式会社电装 | Semiconductor cooling structure |
| CN101894812A (en) * | 2010-06-13 | 2010-11-24 | 华东理工大学 | Evaporator for cooling chip and manufacture method thereof |
-
2014
- 2014-11-21 CN CN201410676077.0A patent/CN104465560A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5966957A (en) * | 1995-03-17 | 1999-10-19 | Telefonaktiebolaget Lm Ericsson | Cooling system for electronics |
| CN2847531Y (en) * | 2005-11-24 | 2006-12-13 | 讯凯国际股份有限公司 | Water cooling type parallel flow path heat radiation structure |
| CN201156539Y (en) * | 2007-12-24 | 2008-11-26 | 中国西电电气股份有限公司 | Radiator for DC power transmission thyristor converter valve component |
| CN101483173A (en) * | 2008-01-10 | 2009-07-15 | 株式会社电装 | Semiconductor cooling structure |
| CN101894812A (en) * | 2010-06-13 | 2010-11-24 | 华东理工大学 | Evaporator for cooling chip and manufacture method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110972442A (en) * | 2018-09-28 | 2020-04-07 | 株洲中车时代电气股份有限公司 | Refrigerant phase change radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |
|
| WD01 | Invention patent application deemed withdrawn after publication |