CN104465635A - Plant lighting LED device and packaging method thereof - Google Patents
Plant lighting LED device and packaging method thereof Download PDFInfo
- Publication number
- CN104465635A CN104465635A CN201410778174.0A CN201410778174A CN104465635A CN 104465635 A CN104465635 A CN 104465635A CN 201410778174 A CN201410778174 A CN 201410778174A CN 104465635 A CN104465635 A CN 104465635A
- Authority
- CN
- China
- Prior art keywords
- wafer
- bowl cup
- support bowl
- die bond
- led component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The invention discloses a plant lighting LED device and a packaging method of the plant lighting LED device. The plant lighting LED device comprises a support cup, a first wafer, a second wafer and transparent gel. A wafer fixing region is arranged at the bottom in the support cup. The first wafer and the second wafer are arranged in the wafer fixing region with the area being at least two thirds that of the bottom of the support cup. During work, the first wafer and the second wafer are connected in parallel. Cooling fins are further arranged at the bottom of the support. The invention further discloses a packaging method of the plant lighting LED device. The packaging method comprises the steps that the blue wafer and the red wafer are fixed into the support, wires are welded, the blue wafer and the red wafer are coated with an adhesive, and the adhesive is baked, solidified and formed. According to the plant lighting LED device, the light quality and the light intensity adjustment can be achieved by adjusting the current, and therefore the demands for light of different plants in different growth periods can be met.
Description
Technical field
The invention belongs to LED field, be specifically related to a kind of plant illumination LED component and method for packing thereof.
Background technology
In recent years, the whole world hours of daylight constantly reduces, very unfavorable for agricultural development.Along with production technology development, and people are day by day strong to improving plant products and shortening the demand in crop cycle, and artificial light sources starts to be applied to field of plant cultivation.
The conventional light source such as traditional plant factory many employings fluorescent lamp or high-pressure sodium lamp are used as " artificial sunlight ".But because these conventional illumination sources spectrum mate undesirable with plant photosynthesis absorption spectrum, therefore, it is possible to the light of the just indivedual wave band be absorbed by plants, the light of its all band is all wasted, not energy-conservation; Moreover conventional fluorescent or high-pressure sodium lamp power consumption are large, produce a lot of thermal radiation simultaneously, can not to plant irradiation at short distance, not high to plant growth light stimulus efficiency, considerably increase artificial lighting cost; In addition also light quality and light intensity regulating can not be carried out for the different qualities of different plant.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of plant illumination LED component and method for packing thereof, solves the inefficient problem of different plant growth light stimulus in prior art.
The present invention is for solving the problems of the technologies described above by the following technical solutions:
A kind of plant illumination LED component, comprise support bowl cup, first wafer, second wafer, transparent colloid, wherein, support bowl cup inner bottom part is provided with die bond region, first wafer, second wafer is arranged at intervals in die bond region, two electrodes of the first wafer are connected with pair of pins respectively, two electrodes of the second wafer are connected with another pair of pins respectively, the coated transparent colloid in outside of the first wafer and the second wafer, the upper surface of transparent colloid and the rim of a bowl horizontal alignment of described support bowl cup, described first wafer is blue dies, second wafer is red wafer, the area in described die bond region is at least 2/3rds of support bowl cup bottom area, the bottom of support bowl cup arranges fin.
The excitation wavelength of described blue dies is 440 ~ 460 nanometers; The excitation wavelength of red wafer is 660 ~ 680 nanometers.
Described transparent colloid is the mixture of epoxy resin, silica gel or epoxy resin and silica gel.
Described first wafer, the second wafer are fixed in die bond region by die bond adhesive glue, and the electrode of the first wafer is connected by the first gold thread with between pin, and the electrode of the second wafer is connected by the second gold thread with between pin.
The material of described support bowl cup is PCT material.
A method for packing for plant illumination LED component, comprises the steps:
Step 1, fixed support bowl cup;
Step 2, bottom support bowl cup, be fixedly installed fin;
Step 3, bottom in support bowl cup arrange die bond region;
Step 4, in die bond region, interval is fixedly installed the first wafer, the second wafer successively;
Step 5, the first wafer to be connected with the electrode of the second wafer is corresponding with support bowl cup external pin respectively;
Step 6, in support bowl cup embedding transparent colloid;
Step 7, the support bowl cup after embedding transparent colloid to be cured.
Described first wafer is blue dies, and the second wafer is red wafer.
The area in described die bond region is at least 2/3rds of support bowl cup bottom area.
Transparent colloid in described step 6 is the mixture of epoxy resin, silica gel or epoxy resin and silica gel.
Compared with prior art, the present invention has following beneficial effect:
1, when plant carries out photosynthesis and blooms, red luminous energy growth promoting effects near 650nm is absorbed.And when forming pistil, the blue light near 440nm can growth promoting effects.LED of the present invention, by regulating size of current, realizes light quality and luminous intensity adjustment, with satisfied different plant different growing stages to the demand of light.
2, the support bowl cup of the present invention's employing, die bond region is comparatively large, can place two chips, realize turned in parallel, control separately.
3, be instead of the support of conventional P PA material by the support of PCT material, comparatively conventional P PA stock support, PCT stock support has good thermal stability (not easily yellow) and resistance to UV characteristic, and the LED life-span is extended greatly, and power can accomplish 0.5-1W.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Wherein, being designated in figure: 1-blue dies; The red wafer of 2-; 3-support bowl cup; 4-transparent colloid; 5-first gold thread; 6-second gold thread.
Embodiment
Below in conjunction with accompanying drawing, structure of the present invention and the course of work are described further.
As shown in Figure 1, a kind of plant illumination LED component, comprise support bowl 3, first wafer, second wafer, transparent colloid 4, wherein, outer setting two pairs of pins of support bowl cup, support bowl cup inner bottom part is provided with die bond region, first wafer, second wafer is arranged at intervals in die bond region, two electrodes of the first wafer are connected with pair of pins respectively, two electrodes of the second wafer are connected with another pair of pins respectively, the coated transparent colloid 4 in outside of the first wafer and the second wafer, the upper surface of transparent colloid 4 and the rim of a bowl horizontal alignment of described support bowl cup 3, described first wafer is blue dies 1, second wafer is red wafer 2, the area in described die bond region is at least 2/3rds of support bowl cup bottom area, the bottom of support bowl cup arranges fin.
The excitation wavelength of described blue dies 1 is 440 ~ 460 nanometers; The excitation wavelength of red wafer 2 is 660 ~ 680 nanometers.
Described transparent colloid 4 is the mixture of epoxy resin, silica gel or epoxy resin and silica gel.
Described first wafer, the second wafer are fixed in die bond region by die bond adhesive glue, and the electrode of the first wafer is connected by the first gold thread 5 with between pin, and the electrode of the second wafer is connected by the second gold thread 6 with between pin.The two ends of the first gold thread 5 are fixed with the bottom welding of blue dies 1 and support bowl cup 3 respectively, and the two ends of the second gold thread 6 are fixed with the bottom welding of red wafer 2 and support bowl cup 3 respectively.
Be provided with larger die bond region in frame bottom bowl cup, first, second wafer described is separately fixed in die bond region by die bond adhesive glue, and the conducting parallel with one another of first, second wafer, frame bottom is also provided with fin.
The material of described support bowl cup 3 is PCT material.
The method for packing of plant illumination LED component of the present invention, comprises the steps:
Step 1, fixed support bowl cup;
Step 2, bottom support bowl cup, be fixedly installed fin;
Step 3, bottom in support bowl cup arrange die bond region;
Step 4, in die bond region, interval is fixedly installed the first wafer, the second wafer successively;
Step 5, the first wafer to be connected with the electrode of the second wafer is corresponding with support bowl cup external pin respectively;
Step 6, in support bowl cup embedding transparent colloid;
Step 7, the support bowl cup after embedding transparent colloid to be cured.
Described first wafer is blue dies, and the second wafer is red wafer.
The area in described die bond region is at least 2/3rds of support bowl cup bottom area.
Transparent colloid in described step 6 is the mixture of epoxy resin, silica gel or epoxy resin and silica gel.
Manufacture method of the present invention is: be fixed in support by the first blue dies and the second red wafer, weld line, then by adhesive applicating on the first blue dies and the second red wafer, baking-curing is shaped.
In addition to the implementation, the present invention can also have other execution modes, and all employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop in the protection range of application claims.
Claims (9)
1. a plant illumination LED component, comprise support bowl cup, first wafer, second wafer, transparent colloid, wherein, support bowl cup inner bottom part is provided with die bond region, first wafer, second wafer is arranged at intervals in die bond region, two electrodes of the first wafer are connected with pair of pins respectively, two electrodes of the second wafer are connected with another pair of pins respectively, the coated transparent colloid in outside of the first wafer and the second wafer, the upper surface of transparent colloid and the rim of a bowl horizontal alignment of described support bowl cup, it is characterized in that: described first wafer is blue dies, second wafer is red wafer, the area in described die bond region is at least 2/3rds of support bowl cup bottom area, the bottom of support bowl cup arranges fin.
2. plant illumination LED component according to claim 1, is characterized in that: the excitation wavelength of described blue dies is 440 ~ 460 nanometers; The excitation wavelength of red wafer is 660 ~ 680 nanometers.
3. plant illumination LED component according to claim 1, is characterized in that: described transparent colloid is the mixture of epoxy resin, silica gel or epoxy resin and silica gel.
4. plant illumination LED component according to claim 1, it is characterized in that: described first wafer, the second wafer are fixed in die bond region by die bond adhesive glue, the electrode of the first wafer is connected by the first gold thread with between pin, and the electrode of the second wafer is connected by the second gold thread with between pin.
5. plant illumination LED component according to claim 1, is characterized in that: the material of described support bowl cup is PCT material.
6., based on the method for packing of plant illumination LED component described in claim 1, it is characterized in that: comprise the steps:
Step 1, fixed support bowl cup;
Step 2, bottom support bowl cup, be fixedly installed fin;
Step 3, bottom in support bowl cup arrange die bond region;
Step 4, in die bond region, interval is fixedly installed the first wafer, the second wafer successively;
Step 5, the first wafer to be connected with the electrode of the second wafer is corresponding with support bowl cup external pin respectively;
Step 6, in support bowl cup embedding transparent colloid;
Step 7, the support bowl cup after embedding transparent colloid to be cured.
7. the method for packing of plant illumination LED component according to claim 6, is characterized in that: described first wafer is blue dies, and the second wafer is red wafer.
8. the method for packing of plant illumination LED component according to claim 6, is characterized in that: the area in described die bond region is at least 2/3rds of support bowl cup bottom area.
9. the method for packing of plant illumination LED component according to claim 6, is characterized in that: the transparent colloid in described step 6 is the mixture of epoxy resin, silica gel or epoxy resin and silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410778174.0A CN104465635A (en) | 2014-12-17 | 2014-12-17 | Plant lighting LED device and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410778174.0A CN104465635A (en) | 2014-12-17 | 2014-12-17 | Plant lighting LED device and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104465635A true CN104465635A (en) | 2015-03-25 |
Family
ID=52911437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410778174.0A Pending CN104465635A (en) | 2014-12-17 | 2014-12-17 | Plant lighting LED device and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465635A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331658A (en) * | 2017-07-27 | 2017-11-07 | 旭宇光电（深圳）股份有限公司 | Multicarity plant illumination LED encapsulation structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5739552A (en) * | 1994-10-24 | 1998-04-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor light emitting diode producing visible light |
| CN102723325A (en) * | 2012-06-08 | 2012-10-10 | 深圳市聚智德科技有限公司 | LED (Light-Emitting Diode) light-emitting element |
| CN103486493A (en) * | 2012-06-13 | 2014-01-01 | 普罗斯电器（中国）有限公司 | Integrally packaged LED (light emitting diode) plant lighting module |
| CN203386797U (en) * | 2013-08-09 | 2014-01-08 | 安徽盛烨电子有限公司 | High-temperature-resistance LED support |
-
2014
- 2014-12-17 CN CN201410778174.0A patent/CN104465635A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5739552A (en) * | 1994-10-24 | 1998-04-14 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor light emitting diode producing visible light |
| CN102723325A (en) * | 2012-06-08 | 2012-10-10 | 深圳市聚智德科技有限公司 | LED (Light-Emitting Diode) light-emitting element |
| CN103486493A (en) * | 2012-06-13 | 2014-01-01 | 普罗斯电器（中国）有限公司 | Integrally packaged LED (light emitting diode) plant lighting module |
| CN203386797U (en) * | 2013-08-09 | 2014-01-08 | 安徽盛烨电子有限公司 | High-temperature-resistance LED support |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331658A (en) * | 2017-07-27 | 2017-11-07 | 旭宇光电（深圳）股份有限公司 | Multicarity plant illumination LED encapsulation structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106090706A (en) | The full spectrum plant growth lamp that a kind of polycrystalline excites | |
| CN206592825U (en) | Hydroponics LED light supplement lamp in a kind of full spectrum room | |
| CN210866171U (en) | LED plant growth light source with double-light gain effect | |
| CN104241501A (en) | All-direction plant growth lamp LED filament and manufacturing method thereof | |
| CN105240748A (en) | LED plant-growth lamp with continuous spectrum | |
| CN103629596B (en) | A kind of laser instrument plant lamp and preparation method thereof | |
| CN104329601B (en) | Special LED (light emitting diode) light source device for flower period regulating and control light supplementing | |
| CN105179965A (en) | Process for producing LED lamp | |
| CN202629638U (en) | COB (Chip on Board)-packaged LED (Light-Emitting Diode) plant lamp | |
| CN203823597U (en) | Circular COB (chip on board) encapsulated LED lamp for plant growth | |
| CN203351659U (en) | Adjustable color temperature COB light source module | |
| CN204494175U (en) | A kind of microscler LED illumination device for plants | |
| CN206036684U (en) | A LED light source for vegetation light filling | |
| CN104465635A (en) | Plant lighting LED device and packaging method thereof | |
| CN204943096U (en) | A kind of plant illumination light source and light fixture | |
| CN203823537U (en) | LED lamp with square COB encapsulation and used for plant growth | |
| CN103375691A (en) | COB-packaged LED plant lamp and production method thereof | |
| JP3182317U (en) | LED plant growth lamp | |
| CN104078533A (en) | COB (Chip On Board) packaging body of LED (Light-Emitting Diode) light source, and preparation method of packaging body | |
| CN102287713A (en) | Adjustable spectrum lamp for plant irradiation | |
| CN104067853A (en) | LED (Light-Emitting Diode) light-supplementing lamp for use in production of edible mushrooms | |
| CN203810181U (en) | Intelligent light-supplementing device for plants | |
| CN204481046U (en) | The encapsulating structure of plant growth LED | |
| CN202205746U (en) | Integrated LED (light-emitting diode) having combined wavelength and adjustable light and used for plant growth | |
| KR20110075386A (en) | Led lighting module for plant cultivation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150325 |
|
| RJ01 | Rejection of invention patent application after publication |