CN104538326A - Detection device for wafer cutting notches - Google Patents
Detection device for wafer cutting notches Download PDFInfo
- Publication number
- CN104538326A CN104538326A CN201410782043.XA CN201410782043A CN104538326A CN 104538326 A CN104538326 A CN 104538326A CN 201410782043 A CN201410782043 A CN 201410782043A CN 104538326 A CN104538326 A CN 104538326A
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- CN
- China
- Prior art keywords
- camera bellows
- wafer
- described camera
- unit
- wafer cut
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Abstract
The invention provides a detection device for wafer cutting notches. The detection device is characterized in that the detection device comprises a dark box used for bearing a wafer, a bearing platform is arranged at the center of the bottom of the dark box, an infrared sensor is arranged over the bearing platform and located on the top of the dark box, and the infrared sensor is connected with a data display unit. The detection device is used for detecting the wafer cutting notches, and is simple in structure and convenient to operate.
Description
Technical field
The present invention relates to a kind of checkout equipment, especially relate to a kind of wafer cut checkout gear.
Background technology
In integrated circuit (IC) wafer manufacture process, because Product Precision high size is little, environmental factor, technique not step, technological parameter and human factor all likely cause defect or harmful effect to product.In order to objects such as the monitoring of Product Process and the yields of guarantee product, in technological process, be provided with numerous website carry out defects detection.The steps such as the optical detection after the optical detection such as after development, etching, electron-microscope scanning, probe test, reliability testing and wafer final test.
But in these tests due to considering process efficiency or examine repair, Scanning Detction not to wafer notch part, often in the last step of technological process, adopt light microscope to carry out last Manual Visual Inspection to wafer in prior art, comprise in this course and visual inspection is carried out to the cut out portion of wafer.Like this, the opportunity of disfigurement discovery is more late on the one hand, cannot in technical process, defect be detected in time and remedy, and on the other hand owing to adopting Manual Visual Inspection, inevitably the errors such as omission occurs, affects the yield of product.
Summary of the invention
The present invention, in order to solve the above-mentioned defect and deficiency that exist in prior art, provides a kind of wafer cut checkout gear, and for detecting the otch of wafer cutting, structure is simple, easy to operate.
For solving the problems of the technologies described above, the invention provides a kind of wafer cut checkout gear, it is characterized in that: comprise the camera bellows for carrying wafer, place of described camera bellows bottom centre is provided with plummer, directly over described plummer, described camera bellows top is provided with infrared sensor, and described infrared sensor is connected with data display unit.
Preferably, described infrared sensor comprises for launching ultrared infra-red ray transmitting unit and the infrared receiver unit for receiving infrared-ray reverberation, and described infrared receiver unit is connected with CPU.
Preferably, described CPU comprises signal amplification unit, filter unit.
Preferably, the wall of described camera bellows is made up of lucifuge glass.
Preferably, described camera bellows comprises the chamber door for described camera bellows being opened cut out, and described chamber door is horizontally slipped by the chute bottom described camera bellows, and described camera bellows bottom right side is provided with chute, and described camera bellows right side wall to be placed on chute and along slide.
Preferably, described plummer is provided with diaphragm, and diaphragm is provided with wafer.
The Advantageous Effects that the present invention reaches:
Compared with prior art, structure of the present invention is simple, easy to operate, infrared ray sensor is utilized to detect otch, by infrared data display unit, wafer reflected wave amount is received, by signal amplification unit and filter unit, signal is inputted CPU control unit, by CPU control unit, result is sent to data display unit.If reflected wave is even, then illustrate that otch is intact, if fluctuation appears in reflected wave, then says otch defectiveness.
Accompanying drawing explanation
Fig. 1 structural representation of the present invention.
Wherein: 1 camera bellows; 2 infrared sensors; 3 wafers; 4 diaphragms; 5 plummers; 6 data display unit.
Embodiment
In order to the technique effect that auditor can better understand technical characteristic of the present invention, technology contents and reach, now accompanying drawing of the present invention is described in detail in conjunction with the embodiments.But shown accompanying drawing, just in order to technical scheme of the present invention is better described, is not actual proportions of the present invention and best configuration, so, auditor please not arrange and configuration with regard to the ratio of accompanying drawing, limit claims of the present invention.
Below in conjunction with drawings and Examples, patent of the present invention is further illustrated.
As shown in Figure 1, the invention provides a kind of wafer cut checkout gear and comprise camera bellows 1 for carrying wafer, place of described camera bellows 1 bottom centre is provided with plummer 5, directly over described plummer 5, described camera bellows top is provided with infrared sensor 2, and described infrared sensor 2 is connected with data display unit 6.Described infrared sensor 2 comprises for launching ultrared infra-red ray transmitting unit and the infrared receiver unit for receiving infrared-ray reverberation, and described infrared receiver unit is connected with CPU.Described CPU comprises signal amplification unit, filter unit.Structure is simple, easy to operate, utilize infrared ray sensor to detect otch, by infrared data display unit, wafer reflected wave amount is received, by signal amplification unit and filter unit, signal is inputted CPU control unit, by CPU control unit, result is sent to data display unit.If reflected wave is even, then illustrate that otch is intact, if fluctuation appears in reflected wave, then says otch defectiveness.
The problem of available light interference is often there is in wafer testing process, therefore in order to avoid the interference of light in environment, the wall of described camera bellows 1 is made up of lucifuge glass, in the course of the work, only have infrared ray Ray Of Light in camera bellows, substantially increase accuracy of the present invention.
Described camera bellows 1 comprises the chamber door for described camera bellows being opened cut out, and described chamber door is horizontally slipped by the chute bottom described camera bellows, and described camera bellows bottom right side is provided with chute, and described camera bellows right side wall to be placed on chute and along slide.During use, can conveniently camera bellows chamber door be opened, and wafer 3 of conveniently taking.
Below disclose the present invention with preferred embodiment, so it is not intended to limiting the invention, and all technical schemes taking the scheme of equivalent replacement or equivalent transformation to obtain, all drop in protection scope of the present invention.
Claims (6)
1. a wafer cut checkout gear, it is characterized in that: comprise the camera bellows for carrying wafer, place of described camera bellows bottom centre is provided with plummer, and directly over described plummer, described camera bellows top is provided with infrared sensor, and described infrared sensor is connected with data display unit.
2. wafer cut checkout gear according to claim 1, it is characterized in that: described infrared sensor comprises for launching ultrared infra-red ray transmitting unit and the infrared receiver unit for receiving infrared-ray reverberation, and described infrared receiver unit is connected with CPU.
3. wafer cut checkout gear according to claim 2, is characterized in that: described CPU comprises signal amplification unit and filter unit.
4. wafer cut checkout equipment according to claim 1, is characterized in that: the wall of described camera bellows is made up of lucifuge glass.
5. wafer cut checkout equipment according to claim 4, it is characterized in that: described camera bellows comprises the chamber door for described camera bellows being opened cut out, described chamber door is horizontally slipped by the chute bottom described camera bellows, described camera bellows bottom right side is provided with chute, and described camera bellows right side wall to be placed on chute and along slide.
6. the wafer cut checkout equipment according to claim 1-5 any one, is characterized in that: described plummer is provided with diaphragm, and diaphragm is provided with wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410782043.XA CN104538326A (en) | 2014-12-16 | 2014-12-16 | Detection device for wafer cutting notches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410782043.XA CN104538326A (en) | 2014-12-16 | 2014-12-16 | Detection device for wafer cutting notches |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104538326A true CN104538326A (en) | 2015-04-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410782043.XA Pending CN104538326A (en) | 2014-12-16 | 2014-12-16 | Detection device for wafer cutting notches |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104538326A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109443437A (en) * | 2018-12-08 | 2019-03-08 | 宁波宏志机器人科技有限公司 | A kind of outer detection device of bend pipe line |
| CN116148642A (en) * | 2023-04-21 | 2023-05-23 | 上海聚跃检测技术有限公司 | Chip failure analysis method and device |
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| US6508990B1 (en) * | 1998-07-16 | 2003-01-21 | Advantest Corp. | Substrate treating method and apparatus |
| CN101019061A (en) * | 2004-06-16 | 2007-08-15 | 比斯泰克半导体系统股份有限公司 | Apparatus and method for inspecting microstructures in reflected or transmitted infrared light |
| CN102072909A (en) * | 2009-10-15 | 2011-05-25 | 卡姆特有限公司 | Systems and methods for near infra-red optical inspection |
| CN102156106A (en) * | 2010-02-11 | 2011-08-17 | 致茂电子(苏州)有限公司 | Rapid solar wafer detection system |
| CN103522434A (en) * | 2013-10-30 | 2014-01-22 | 华进半导体封装先导技术研发中心有限公司 | Infrared technology based wafer cutting online detecting system |
| CN204332913U (en) * | 2014-12-16 | 2015-05-13 | 苏州凯锝微电子有限公司 | A kind of wafer cut checkout gear |
-
2014
- 2014-12-16 CN CN201410782043.XA patent/CN104538326A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6508990B1 (en) * | 1998-07-16 | 2003-01-21 | Advantest Corp. | Substrate treating method and apparatus |
| CN101019061A (en) * | 2004-06-16 | 2007-08-15 | 比斯泰克半导体系统股份有限公司 | Apparatus and method for inspecting microstructures in reflected or transmitted infrared light |
| CN102072909A (en) * | 2009-10-15 | 2011-05-25 | 卡姆特有限公司 | Systems and methods for near infra-red optical inspection |
| CN102156106A (en) * | 2010-02-11 | 2011-08-17 | 致茂电子(苏州)有限公司 | Rapid solar wafer detection system |
| CN103522434A (en) * | 2013-10-30 | 2014-01-22 | 华进半导体封装先导技术研发中心有限公司 | Infrared technology based wafer cutting online detecting system |
| CN204332913U (en) * | 2014-12-16 | 2015-05-13 | 苏州凯锝微电子有限公司 | A kind of wafer cut checkout gear |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109443437A (en) * | 2018-12-08 | 2019-03-08 | 宁波宏志机器人科技有限公司 | A kind of outer detection device of bend pipe line |
| CN109443437B (en) * | 2018-12-08 | 2023-11-14 | 宁波宏志机器人科技有限公司 | Outside-line detection equipment for bent pipe |
| CN116148642A (en) * | 2023-04-21 | 2023-05-23 | 上海聚跃检测技术有限公司 | Chip failure analysis method and device |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150422 |