CN104582302B - A kind of method and apparatus for making step trough - Google Patents
A kind of method and apparatus for making step trough Download PDFInfo
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- CN104582302B CN104582302B CN201310470769.5A CN201310470769A CN104582302B CN 104582302 B CN104582302 B CN 104582302B CN 201310470769 A CN201310470769 A CN 201310470769A CN 104582302 B CN104582302 B CN 104582302B
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- metal layer
- layer
- printed circuit
- pcb
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Abstract
The invention discloses a kind of method and apparatus for making step trough, method is applied to a printed circuit board (PCB), and printed circuit board (PCB) comprises at least three-layer metal layer, is provided with insulation material layer between the first metal layer and second metal layer in three-layer metal layer, this method includes：Before printed circuit board (PCB) pressing, between second metal layer and insulation material layer, setting one separation layer in region corresponding to step trough, after printed circuit board (PCB) pressing, separation layer separates with second metal layer, and is combined with insulation material layer；After printed circuit board (PCB) pressing, one drill bit of control drills out the profile of step trough on the first metal layer, and is drilled into the first position away from the distance of second metal layer first；By laser drill mode, the insulating materials between first position and second metal layer is removed；The part to be removed on printed circuit board (PCB) is removed, part to be removed is high cube for the difference in height bottom of by of the internal diameter of profile, between the first metal layer and second metal layer, so as to the step trough that completes.
Description
Technical field
The present invention relates to art of printed circuit boards, more particularly to a kind of method and apparatus for making step trough.
Background technology
At present, electronic product has become indispensable dominant role in people's life.As people are to electronic product
The increasingly raising of demand, to the printed circuit board (PCB) of one of the important component in electronic product（Printed Circuit
Board, PCB）It is also proposed higher requirement, for example, for the ease of install on a printed circuit special functional devices or
The device to sink is needed, and reduces the cross talk effects to signal transmission, realizes that overall package volume minimizes, usually using rank
Terraced groove etc. designs.
Fig. 1 is refer to, Fig. 1 is the diagrammatic cross-section of the printed circuit board (PCB) with step trough in the prior art, such as Fig. 1 institutes
Show, the printed circuit board (PCB) includes four layers of metal level, is the first metal layer, second metal layer, the 3rd metal level and the 4th gold medal respectively
Belong to layer, the step trough on the printed circuit board (PCB) exposes the groove of second metal layer to drill the first metal layer.
Please continue to refer to Fig. 2, Fig. 2 is the diagrammatic cross-section for making the printed circuit board (PCB) with step trough in the prior art,
As shown in Fig. 2 will resistance glue material such as PTFE in pressing（Polytetrafluoroethylene, polytetrafluoroethylene (PTFE)）Material, silicon
The pad that glue material etc. is made inserts the core plate of printed circuit board (PCB), by controlling the side such as deep drilling or controlled depth milling after pressing
Formula removes resistance glue material upper section, then takes out resistance glue material, then completes the making of step trough.
But in the prior art, core plate fluting surrounding corresponding part can be thicker than please continue to refer to Fig. 2, the thickness of pad
Thickness, to cause pad to be deformed upon in pressing, it is in close contact with the side wall of core plate slotting position, avoids plate shape into printing
The material of the prepreg of the insulation material layer of circuit board enters ladder trench bottom, so as to cause ladder trench bottom to pollute, if pad
The thickness of piece is too small, will result in the defects of ladder trench bottom pollutes, and influences the reliability of printed circuit board (PCB).
Please continue to refer to Fig. 2, due to being needed by way of inserting pad when in pressing to the prepreg between core plate
（Also known as PP pieces）Slotted, while the thickness of pad is thicker than the thickness of part corresponding to around core plate fluting, so pressing
Pressure suffered by the position that plate prepreg is slotted during conjunction reduces, so as to which the bubble of printed circuit intralamellar part can not be discharged,
The defects of causing printed circuit board (PCB) pressing empty, influences the reliability of printed circuit board (PCB), further, since being slotted on prepreg
The structure of position be broken, the easy discontinuity of resin in pressing on prepreg and mix everywhere it is dynamic, so as to lead
There is the defects of thickness of dielectric layers is uneven in the step trough for causing finally to complete, further influences the reliable of printed circuit board (PCB)
Property.
Therefore, step trough be present in the mode that the step trough for making printed circuit board (PCB) by pad mode in the prior art be present
Bottom pollution, pressing cavity and thickness of dielectric layers are uneven, influence the technical problem of the reliability of printed circuit board (PCB).
The content of the invention
The embodiment of the present invention is solved present in prior art by providing a kind of method and apparatus for making step trough
The pollution of ladder trench bottom, pressing cavity and medium thickness be present in the mode that the step trough of printed circuit board (PCB) is made by pad mode
Spend uneven, influence the technical problem of the reliability of printed circuit board (PCB).
On the one hand the embodiment of the present invention provides a kind of method for making step trough, described applied to a printed circuit board (PCB)
Printed circuit board (PCB) comprises at least three-layer metal layer, is set between the first metal layer and second metal layer in the three-layer metal layer
There is an insulation material layer, the step trough is the groove for drilling the first metal layer and exposing the second metal layer, methods described
Including：Before printed circuit board (PCB) pressing, between the second metal layer and the insulation material layer, the step trough
Corresponding region sets a separation layer, wherein, after printed circuit board (PCB) pressing, the separation layer and the second metal layer
Separation, and combined with the insulation material layer；After printed circuit board (PCB) pressing, one drill bit of control is in first metal
The profile of the step trough is drilled out on layer, and is drilled into the first position away from the distance of second metal layer first；Pass through laser drilling
Hole mode, remove the insulating materials between the first position and the second metal layer；Remove on the printed circuit board (PCB)
Part to be removed, the part to be removed be the bottom of by of the internal diameter of the profile, the first metal layer and second metal
Difference in height between layer is high cube, so as to the step trough that completes.
Alternatively, it is described between the second metal layer and the insulation material layer, region corresponding to the step trough
One separation layer is set, is specially：In the second metal layer, region coating corresponding to the step trough has preset thickness
One layer of photosensitive-ink；One layer of photosensitive-ink is toasted and exposed, one layer of photosensitive-ink is solidificated in described
In second metal layer.
Alternatively, it is described control one drill bit the profile of the step trough is drilled out on the first metal layer, and be drilled into away from
The first position of the distance of second metal layer first is specially：Deep drilling mode is controlled by machinery, controls the drill bit to drill out institute
Profile is stated, and is drilled into the first position away from the distance of second metal layer first, wherein, the numerical value tool of first distance
Body controls the tolerance values of deep drilling mode for the machinery.
Alternatively, by laser drill mode, the insulation between the first position and the second metal layer is removed
During material, methods described also includes：The energy of control laser is less than a predetermined threshold value.
On the other hand the embodiment of the present invention provides a kind of device for making step trough, for being made on a printed circuit board (PCB)
One step trough, the printed circuit board (PCB) comprise at least three-layer metal layer, the first metal layer and second in the three-layer metal layer
It is provided with insulation material layer between metal level, the step trough is drills the first metal layer and expose second metal
The groove of layer, including：Separation layer setting unit, for before printed circuit board (PCB) pressing, in the second metal layer and
Between the insulation material layer, corresponding to the step trough region set a separation layer, wherein, the printed circuit board (PCB) press
Afterwards, the separation layer separates with the second metal layer, and is combined with the insulation material layer；Shape fabricating unit, for
After the printed circuit board (PCB) pressing, one drill bit of control drills out the profile of the step trough on the first metal layer, and bores
To the first position away from the distance of second metal layer first；Laser cell, for by laser drill mode, removing described the
Insulating materials between one position and the second metal layer；Removal unit, treated for removing on the printed circuit board (PCB)
Except part, the part to be removed be the bottom of by of the internal diameter of the profile, the first metal layer and the second metal layer it
Between difference in height be high cube, so as to the step trough that completes.
Alternatively, the separation layer setting unit is specifically used in the second metal layer, corresponding to the step trough
Region coating has one layer of photosensitive-ink of preset thickness, and one layer of photosensitive-ink is toasted and exposed, by institute
One layer of photosensitive-ink is stated to be solidificated in the second metal layer.
Alternatively, the shape fabricating unit is specifically used for controlling deep drilling mode by machinery, controls the drill bit to drill out institute
Profile is stated, and is drilled into the first position away from the distance of second metal layer first, wherein, the numerical value tool of first distance
Body controls the tolerance values of deep drilling mode for the machinery.
Alternatively, the laser cell is specifically additionally operable to, by laser drill mode, remove the first position and institute
When stating the insulating materials between second metal layer, the energy of laser is controlled to be less than a predetermined threshold value.
The one or more technical schemes provided in the embodiment of the present invention, have at least the following technical effects or advantages：
1st, as a result of before printed circuit board (PCB) presses, between second metal layer and insulation material layer, step trough
Corresponding region sets a separation layer, and after printed circuit board (PCB) pressing, ladder is drilled out on the first metal layer by drill bit
The profile of groove, and the first position away from the distance of second metal layer first is drilled into, and by laser drill mode, remove first position
Insulating materials between second metal layer, and the part to be removed on printed circuit board (PCB) is removed, so as to the ladder that completes
The technical scheme of groove, avoid because spacer thickness can not be not enough in close contact with the side wall of step trough so that the tree of prepreg
The defects of fat flows into ladder trench bottom and causes ladder trench bottom to pollute, while it also avoid because spacer thickness is more than printed circuit
The thickness of part corresponding to around the core plate fluting of plate so that the bubble of printed circuit intralamellar part can not be discharged and led in pressing
The defects of causing pressing bubble, and the structure of position that prepreg is slotted are broken so that the numerical value on prepreg
Easy discontinuity and mix the dynamic step trough for then causing finally to complete everywhere and occur that thickness of dielectric layers is uneven to be lacked
Fall into, so solving the mode for making the step trough of printed circuit board (PCB) by pad mode present in prior art has ladder
Trench bottom pollution, pressing cavity and thickness of dielectric layers are uneven, influence the technical problem of the reliability of printed circuit board (PCB), realize
Improve the technique effect of the reliability of printed circuit board (PCB).
2nd, because the method for making step trough provided in an embodiment of the present invention reduces in the prior art by pad mode
Make and pad, the step to the core plate of prepreg and printed circuit board (PCB) fluting are made in the mode of the step trough of printed circuit board (PCB)
Suddenly, substitute to set separation layer between second metal layer and insulation material layer, and pass through machine drilling mode and laser
Bore mode removes part to be removed with the technical scheme for the step trough that completes, easy to operate and easily realization, so real
Show and simplified the step of making step trough, improved the technique effect of the production efficiency of printed circuit board (PCB).
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section of the printed circuit board (PCB) with step trough in the prior art；
Fig. 2 is the diagrammatic cross-section for making the printed circuit board (PCB) with step trough in the prior art；
Fig. 3 is the diagrammatic cross-section of the printed circuit board (PCB) provided in an embodiment of the present invention with step trough；
Fig. 4 is the flow chart of the method for making step trough provided in an embodiment of the present invention；
Fig. 5 is the schematic diagram of making step trough provided in an embodiment of the present invention；
Fig. 6 is the functional block diagram of the device of making step trough provided in an embodiment of the present invention.
Embodiment
The embodiment of the present invention is solved and passed through present in prior art by providing the method and apparatus for making step trough
The pollution of ladder trench bottom, pressing cavity and thickness of dielectric layers be present not in the mode that pad mode makes the step trough of printed circuit board (PCB)
Uniformly, the technical problem of the reliability of printed circuit board (PCB) is influenceed.
Technical scheme in the embodiment of the present invention is in order to solve the above technical problems, general thought is as follows：
The embodiment of the present invention provides a kind of method for making step trough, and the printed circuit board (PCB) of this method one, printed circuit board (PCB) is extremely
Include three-layer metal layer less, insulation material layer, rank are provided between the first metal layer and second metal layer in three-layer metal layer
Terraced groove is the groove for drilling the first metal layer and exposing second metal layer, and this method includes：
First, before printed circuit board (PCB) pressing, between second metal layer and insulation material layer, area corresponding to step trough
Domain sets a separation layer, wherein, after printed circuit board (PCB) pressing, separation layer separates with second metal layer, and and insulation material layer
With reference to；
Then, after printed circuit board (PCB) pressing, one drill bit of control drills out the profile of step trough on the first metal layer, and
It is drilled into the first position away from the distance of second metal layer first；
Then, by laser drill mode, the insulating materials between first position and second metal layer is removed；
Finally, remove printed circuit board (PCB) on part to be removed, part to be removed be the bottom of by of the internal diameter of profile, the first gold medal
The difference in height belonged between layer and second metal layer is high cube, so as to the step trough that completes.
It is can be seen that by above-mentioned part as a result of before printed circuit board (PCB) presses, in second metal layer and absolutely
Between edge material layer, region corresponding to step trough one separation layer is set, and after printed circuit board (PCB) pressing, by drill bit the
The profile of step trough is drilled out on one metal level, and is drilled into the first position away from the distance of second metal layer first, and passes through laser drilling
Hole mode, the insulating materials between first position and second metal layer is removed, and removes the part to be removed on printed circuit board (PCB),
So as to the technical scheme for the step trough that completes, avoid because spacer thickness not enough can not closely connect with the side wall of step trough
Touch so that the defects of resin of prepreg flows into step trough bottom and causes ladder trench bottom to pollute, while it also avoid because
Spacer thickness is more than the thickness of part corresponding to around the core plate fluting of printed circuit board (PCB) so that the bubble of printed circuit intralamellar part
The defects of can not being discharged in pressing and causing to press bubble, and the structure of position that prepreg is slotted are broken,
So that the easy discontinuity of numerical value on prepreg and mix the dynamic step trough for then causing finally to complete everywhere and occur
The defects of thickness of dielectric layers is uneven, printed circuit board (PCB) is made by pad mode present in prior art so solving
The mode of step trough has that the pollution of ladder trench bottom, pressing cavity and thickness of dielectric layers are uneven, and influence printed circuit board (PCB) can
By the technical problem of property, the technique effect for the reliability for improving printed circuit board (PCB) is realized.
In order to be better understood from above-mentioned technical proposal, below in conjunction with Figure of description and specific embodiment to upper
Technical scheme is stated to be described in detail.
The embodiment of the present invention provides a kind of method for making step trough, and this method is applied to a printed circuit board (PCB), in reality
In, the printed circuit board (PCB) can include three-layer metal layer, can also include four layers of metal level, five layers of metal level or more
Layer metal level, is not limited, the printed circuit board (PCB) is formed by pressing program making at least once herein.
, will be so that the printed circuit board (PCB) be four layer printed circuit boards as an example, to be lifted in detail in ensuing part
Example description.
Fig. 3 is refer to, Fig. 3 is the diagrammatic cross-section of the printed circuit board (PCB) provided in an embodiment of the present invention with step trough,
As shown in figure 3, the printed circuit board (PCB) includes four layers of metal level, be respectively the first metal layer, second metal layer, the 3rd metal level and
4th metal level, the step trough on the printed circuit board (PCB) are to drill the first metal layer, while expose the groove of second metal layer.
In actual applications, the step trough can be a step trough for being used for a common accommodating electronic device, of course,
It can also be the step trough for traversing whole printed circuit board (PCB), not be limited herein.
When step trough is specially to traverse the step trough of whole printed circuit board (PCB), on printed circuit board (PCB) residing for the step trough
Area thickness it is relatively thin, toughness is stronger, and whole printed circuit board (PCB) turns into Rigid Flex, can either provide printed circuit board
Supporting role, have local flexural property again, so as to meet the needs of three-dimensional assembling, can then be applied to more
Usage scenario, just repeat no more herein.
It refer to Fig. 4, Fig. 4 is the flow chart of the method for making step trough provided in an embodiment of the present invention, this method
For making step trough as shown in Figure 3, as shown in figure 4, this method includes：
S1：Before printed circuit board (PCB) pressing, between second metal layer and insulation material layer, region corresponding to step trough
One separation layer is set, wherein, printed circuit board (PCB) pressing after, separation layer separates with second metal layer, and with insulation material layer knot
Close；
S2：After printed circuit board (PCB) pressing, one drill bit of control drills out the profile of step trough on the first metal layer, and bores
To the first position away from the distance of second metal layer first；
S3：By laser drill mode, the insulating materials between first position and second metal layer is removed；
S4：Remove printed circuit board (PCB) on part to be removed, part to be removed be the bottom of by of the internal diameter of profile, the first metal
Difference in height between layer and second metal layer is high cube, so as to the step trough that completes.
In specific implementation process, Fig. 5 is refer to, Fig. 5 is the schematic diagram of making step trough provided in an embodiment of the present invention,
As shown in figure 5, in step sl, between second metal layer and insulation material layer, region corresponding to step trough sets an isolation
Layer, specifically, can be in second metal layer, region coating corresponding to the step trough have one layer of preset thickness it is photosensitive
Ink, the photosensitive-ink mainly start agent etc. composition including photoresist, thermosetting resin and light, can be specifically that river is abundant
PR-2000SA model ink, certainly, in actual applications, however it is not limited to such a ink.
In the present embodiment, will be so that insulation material layer be prepreg as an example, to carry out detailed citing description, in reality
In, prepreg has Multiple Type, and the technical staff described in this area can select suitable half admittedly according to actual conditions
Change piece, to meet the needs of actual conditions, just repeat no more herein.
It should be noted that this layer of photosensitive-ink not fills whole second metal layer, it is only necessary to coated in step trough pair
The region answered, of course, it is possible to it is more slightly larger than the size of the step trough, just repeat no more herein.
The preset thickness of this layer of photosensitive-ink can be bound according to actual conditions of the printed circuit board (PCB) in pressing,
Such as pressing time, pressing-in temp and pressure value, it is only necessary to which this layer of photosensitive-ink enables to what step trough went out after pressing
Insulating materials separates with second metal layer.
It is coated with second metal layer after the photosensitive-ink with preset thickness, then can be to this this layer photosensitive oil
Ink is toasted, such as toasts at a temperature of 70 DEG C -80 DEG C the photosensitive-ink 10 minutes or 20 minutes, then passes through exposure again
Ray machine（100 ± 20mj/ of exposure energy ㎝ 2）This layer of photosensitive-ink is exposed, so that it is solidificated in second metal layer.
Then, will have been cured the second metal layer of one layer of photosensitive-ink and prepreg, the first metal layer and its
He is pressed chip together.In embodiments of the present invention, second metal layer is isolated as a result of by photosensitive-ink
With the technical scheme of insulation material layer, so avoiding because spacer thickness can not be not enough in close contact with the side wall of step trough, make
The defects of obtaining the resin inflow step trough bottom of prepreg and causing ladder trench bottom to pollute, while it also avoid because pad is thick
Thickness of the degree more than part corresponding to the core plate fluting surrounding of printed circuit board (PCB) so that the bubble of printed circuit intralamellar part is pressing
The defects of Shi Wufa is discharged and caused to press bubble, and the structure of position that prepreg is slotted are broken so that half
The easy discontinuity of numerical value in cured sheets and mix the dynamic step trough for then causing finally to complete everywhere and dielectric layer occur
The defects of in uneven thickness.
After second metal layer is pressed together with prepreg, the first metal layer and other chips, this
The information processing method method that inventive embodiments provide enters step S2, i.e.,：A drill bit is controlled to drill out rank on the first metal layer
The profile of terraced groove, and it is drilled into the first position away from the distance of second metal layer first.
In step s 2, can be that deep drilling mode is controlled by machinery, control drill bit drills out profile, and is drilled into away from the second metal
The first position of the first distance of layer, wherein, the numerical value of the first distance is specially the tolerance values of machinery control deep drilling mode.
Specifically, in being embodied, section measurement or the mode estimated in advance can be first passed through, determines Fig. 5 institutes
The surface of the printed circuit board (PCB) shown, namely the first metal layer surface of course, section measurement to the thickness between second metal layer
Mode it is more accurate.
, can be using the drill bit of drill, in step trough when the narrow side of step trough is less than 0.6mm please continue to refer to Fig. 5
Narrow side can use the drill bit of milling cutter when being more than or equal to 0.6mm, drill bit is controlled in the first gold medal by machinery control deep drilling mode
The profile of the step trough is drilled out on category layer, and is drilled into apart from the first position of the distance of second metal layer first, the first distance can
Tolerance values in a manner of the numerical value for being is specially machinery control deep drilling, can so avoid damage to the situation of second metal layer
Under, the energy consumption that post laser bore mode removes the insulating materials between first position and second metal layer is reduced as far as possible.
The profile of step trough is being drilled out by step S2, and be drilled into the first position away from the distance of second metal layer first it
Afterwards, the method provided in an embodiment of the present invention for making step trough enters step S3, i.e.,：By laser drill mode, first is removed
Insulating materials between position and second metal layer.
Specifically, it can be by laser drill mode, use first position in laser ablation insulation material layer and the
Insulating materials between two metal levels, for example, it may be passing through CO2 laser machines（Carbon dioxide laser machine）Or UV laser machines
（Ultraviolet laser machine）, laser energy is sent, it is exhausted between first position and second metal layer in insulation material layer so as to remove
Edge material.
Certainly, if the insulating materials in insulation material layer is removed by CO2 laser machines, due to the hole wall in blind hole
On can be formed and burnt black carbonization residue, it is necessary to subsequently through PLASMA plasma cleanings（Also known as plasma-based）Mode removes the charing
Residue, just repeat no more herein.
Certainly, in specific implementation process, the insulation material between laser ablation first position and second metal layer is being used
During material, the method provided in an embodiment of the present invention for making step trough also includes：The energy of control laser is less than a predetermined threshold value, from
And reduce the loss to second metal layer.
Specifically, when removing the insulating materials between first position and second metal layer, insulation material is being removed completely
When expecting, expose second metal layer, laser energy inevitably causes certain loss to second metal layer, loss
The energy positive correlation of degree and laser, it is possible to control the energy value of laser to be less than a predetermined threshold value, can reach
The purpose of insulating materials in insulation material layer is removed, while and can enough will be reduced to suitable journey to the loss of second metal layer
Degree.
In actual applications, it is right due to the difference for producing company, model, conversion efficiency and working condition of laser machine
The energy value that all kinds of laser machines are provided is made one and accurately defined so that it meets above-mentioned described " to reach removal
The purpose of insulating materials in insulation material layer, while and can enough will be reduced to suitable degree to the loss of second metal layer " no
It is too real, but by the introduction of the present embodiment, the technical staff belonging to this area can adjust laser machine according to actual conditions
The running parameters such as operating current, pulse frequency, to meet the needs of actual conditions, just repeat no more herein.
After the insulating materials between first position and second metal layer is removed by step S3, the embodiment of the present invention carries
The method of the making step trough of confession enters step S4, i.e.,：Remove printed circuit board (PCB) on part to be removed, part to be removed be with
The internal diameter of profile is that the difference in height between bottom, the first metal layer and second metal layer is high cube, so as to the rank that completes
Terraced groove.
Specifically, due to being provided with a separation layer between second metal layer and insulation material layer, the separation layer is printing
Separate with second metal layer after press fit of circuit boards, and combined with insulation material layer, so passing through step S2 and step
After rapid S3, the difference in height bottom of by of the internal diameter of the profile of the step trough, between the first metal layer and second metal layer is high
Cube departs from from printed circuit board (PCB), after the part to be removed is removed by the mode such as mechanical or artificial, that is, makes
Step trough as shown in Figure 3 is completed, is just repeated no more herein.
By above-mentioned part can be seen that due to it is provided in an embodiment of the present invention making step trough method reduce it is existing
Made in technology by pad mode and pad is made in the mode of the step trough of printed circuit board (PCB), to prepreg and printed circuit
The step of core plate fluting of plate, and substitute to set separation layer between second metal layer and insulation material layer, and pass through machine
Tool bore mode and laser drill mode remove part to be removed with the technical scheme for the step trough that completes, easy to operate and more
Easily realize, it is achieved that simplifying the step of making step trough, improve the technology effect of the production efficiency of printed circuit board (PCB)
Fruit.
Based on same inventive concept, the embodiment of the present invention also provides a kind of device for making step trough, in a printing
A step trough is made on circuit board, the printed circuit board (PCB) comprises at least three-layer metal layer, the first metal layer in three-layer metal layer
Insulation material layer is provided between second metal layer, step trough is the groove for drilling the first metal layer and exposing second metal layer,
Fig. 6 is refer to, Fig. 6 is the functional block diagram of the device of making step trough provided in an embodiment of the present invention, as shown in fig. 6, the dress
Put including：
Separation layer setting unit 601, for before printed circuit board (PCB) presses, in second metal layer and insulation material layer
Between, corresponding to step trough region set a separation layer, wherein, printed circuit board (PCB) pressing after, separation layer and second metal layer
Separation, and combined with insulation material layer；
Shape fabricating unit 602, after being pressed in printed circuit board (PCB), one drill bit of control drills out on the first metal layer
The profile of step trough, and it is drilled into the first position away from the distance of second metal layer first；
Laser cell 603, for by laser drill mode, removing the insulation material between first position and second metal layer
Material；
Removal unit 604, for removing the part to be removed on printed circuit board (PCB), part to be removed is with the internal diameter of profile
Difference in height between bottom, the first metal layer and second metal layer is high cube, so as to the step trough that completes.
In specific implementation process, separation layer setting unit 601 is specifically used in second metal layer, corresponding to step trough
Region coating has one layer of photosensitive-ink of preset thickness, and one layer of photosensitive-ink is toasted and exposed, by one layer of sense
Ink is solidificated in second metal layer.
In specific implementation process, shape fabricating unit 602 is specifically used for controlling deep drilling mode by machinery, and control drill bit bores
Go out profile, and be drilled into the first position away from the distance of second metal layer first, wherein, the numerical value of the first distance is specially that machinery control is deep
The tolerance values of brill mode.
In specific implementation process, laser cell 603 is specifically additionally operable to, by laser drill mode, remove first position
During insulating materials between second metal layer, the energy of laser is controlled to be less than a predetermined threshold value.
The method of making step trough in electronic equipment and previous embodiment in the present embodiment is to be based on same invention structure
Two aspects under thinking, are above being described in detail to the implementation process of method, so those skilled in the art can
It is succinct for specification according to the structure and implementation process of the electronic equipment described above being apparent from the present embodiment,
Just repeat no more herein.
Technical scheme in the embodiments of the present invention, at least has the following technical effect that or advantage：
1st, as a result of before printed circuit board (PCB) presses, between second metal layer and insulation material layer, step trough
Corresponding region sets a separation layer, and after printed circuit board (PCB) pressing, ladder is drilled out on the first metal layer by drill bit
The profile of groove, and the first position away from the distance of second metal layer first is drilled into, and by laser drill mode, remove first position
Insulating materials between second metal layer, and the part to be removed on printed circuit board (PCB) is removed, so as to the ladder that completes
The technical scheme of groove, avoid because spacer thickness can not be not enough in close contact with the side wall of step trough so that the tree of prepreg
The defects of fat flows into ladder trench bottom and causes ladder trench bottom to pollute, while it also avoid because spacer thickness is more than printed circuit
The thickness of part corresponding to around the core plate fluting of plate so that the bubble of printed circuit intralamellar part can not be discharged and led in pressing
The defects of causing pressing bubble, and the structure of position that prepreg is slotted are broken so that the numerical value on prepreg
Easy discontinuity and mix the dynamic step trough for then causing finally to complete everywhere and occur that thickness of dielectric layers is uneven to be lacked
Fall into, so solving the mode for making the step trough of printed circuit board (PCB) by pad mode present in prior art has ladder
Trench bottom pollution, pressing cavity and thickness of dielectric layers are uneven, influence the technical problem of the reliability of printed circuit board (PCB), realize
Improve the technique effect of the reliability of printed circuit board (PCB).
2nd, because the method for making step trough provided in an embodiment of the present invention reduces in the prior art by pad mode
Make and pad, the step to the core plate of prepreg and printed circuit board (PCB) fluting are made in the mode of the step trough of printed circuit board (PCB)
Suddenly, substitute to set separation layer between second metal layer and insulation material layer, and pass through machine drilling mode and laser
Bore mode removes part to be removed with the technical scheme for the step trough that completes, easy to operate and easily realization, so real
Show and simplified the step of making step trough, improved the technique effect of the production efficiency of printed circuit board (PCB).
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the present invention to the present invention
God and scope.So, if these modifications and variations of the present invention belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising including these changes and modification.
Claims (8)
1. a kind of method for making step trough, applied to a printed circuit board (PCB), the printed circuit board (PCB) comprises at least three-layer metal
Layer, it is characterised in that be provided with insulation material layer between the first metal layer and second metal layer in the three-layer metal layer, institute
It is the groove for drilling the first metal layer and exposing the second metal layer to state step trough, and methods described includes：
Before printed circuit board (PCB) pressing, between the second metal layer and the insulation material layer, the step trough
Corresponding region sets a separation layer, wherein, after printed circuit board (PCB) pressing, the separation layer and the second metal layer
Separation, and combined with the insulation material layer；
After printed circuit board (PCB) pressing, one drill bit of control drills out the outer of the step trough on the first metal layer
Shape, and it is drilled into the first position away from the distance of second metal layer first；
By laser drill mode, the insulating materials between the first position and the second metal layer is removed；
Remove the part to be removed on the printed circuit board (PCB), the part to be removed for the bottom of by of the internal diameter of the profile, institute
The difference in height stated between the first metal layer and the second metal layer is high cube, so as to the step trough that completes.
2. the method as described in claim 1, it is characterised in that it is described the second metal layer and the insulation material layer it
Between, region corresponding to the step trough sets a separation layer, is specially：
In the second metal layer, region coating corresponding to the step trough has one layer of photosensitive-ink of preset thickness；
One layer of photosensitive-ink is toasted and exposed, one layer of photosensitive-ink is solidificated in the second metal layer
On.
3. the method as described in claim 1, it is characterised in that one drill bit of the control drills out institute on the first metal layer
The profile of step trough is stated, and is drilled into the first position away from the distance of second metal layer first and is specially：
By machinery control deep drilling mode, control the drill bit to drill out the profile, and be drilled into away from the second metal layer first away from
From the first position, wherein, the numerical value of first distance is specially the tolerance values of the machinery control deep drilling mode.
4. the method as described in any claim in claim 1-3, it is characterised in that by laser drill mode, remove institute
When stating the insulating materials between first position and the second metal layer, methods described also includes：
The energy of control laser is less than a predetermined threshold value.
5. a kind of device for making step trough, for making a step trough on a printed circuit board (PCB), the printed circuit board (PCB) is extremely
Include three-layer metal layer less, insulating materials is provided between the first metal layer and second metal layer in the three-layer metal layer
Layer, the step trough is the groove for drilling the first metal layer and exposing the second metal layer, it is characterised in that including：
Separation layer setting unit, for the printed circuit board (PCB) pressing before, in the second metal layer and the insulation
Between material layer, corresponding to the step trough region set a separation layer, wherein, the printed circuit board (PCB) pressing after, it is described
Separation layer separates with the second metal layer, and is combined with the insulation material layer；
Shape fabricating unit, for after printed circuit board (PCB) pressing, one drill bit of control to bore on the first metal layer
Go out the profile of the step trough, and be drilled into the first position away from the distance of second metal layer first；
Laser cell, for by laser drill mode, removing the insulation between the first position and the second metal layer
Material；
Removal unit, for removing the part to be removed on the printed circuit board (PCB), the part to be removed is with the profile
Internal diameter be that difference in height between bottom, the first metal layer and the second metal layer is high cube, so as to make
Into the step trough.
6. device as claimed in claim 5, it is characterised in that the separation layer setting unit is specifically used in second gold medal
Belonging on layer, region coating corresponding to the step trough has one layer of photosensitive-ink of preset thickness, and to one layer of photosensitive oil
Ink is toasted and exposed, and one layer of photosensitive-ink is solidificated in the second metal layer.
7. device as claimed in claim 5, it is characterised in that the shape fabricating unit is specifically used for by machinery control deep drilling
Mode, control the drill bit to drill out the profile, and be drilled into the first position away from the distance of second metal layer first, its
In, the numerical value of first distance is specially the tolerance values of the machinery control deep drilling mode.
8. the device as described in any claim in claim 5-7, it is characterised in that the laser cell is specifically additionally operable to logical
Laser drill mode is crossed, when removing the insulating materials between the first position and the second metal layer, controls the energy of laser
Amount is less than a predetermined threshold value.
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| CN201310470769.5A CN104582302B (en) | 2013-10-10 | 2013-10-10 | A kind of method and apparatus for making step trough |
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| CN105246265B (en) * | 2015-11-06 | 2018-05-01 | 高德（江苏）电子科技有限公司 | The production method that Rigid Flex light-sensitive surface protects soft board |
| CN112449478B (en) * | 2019-08-27 | 2022-03-04 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN111163597A (en) * | 2019-12-31 | 2020-05-15 | 昆山沪利微电有限公司 | Manufacturing process of PCB cavity structure |
| CN111417263A (en) * | 2020-04-30 | 2020-07-14 | 上海创功通讯技术有限公司 | Circuit board structure manufacturing method, circuit board structure and electronic equipment |
| CN111867281B (en) * | 2020-08-31 | 2021-11-05 | 生益电子股份有限公司 | Manufacturing method of PCB with efficient heat dissipation |
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|---|---|---|---|---|
| US5010232A (en) * | 1989-01-27 | 1991-04-23 | Hitachi Seiko, Ltd. | Method of and apparatus for perforating printed circuit board |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN103124469A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Step printed circuit board and manufacture method of the step printed circuit board |
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2013
- 2013-10-10 CN CN201310470769.5A patent/CN104582302B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5010232A (en) * | 1989-01-27 | 1991-04-23 | Hitachi Seiko, Ltd. | Method of and apparatus for perforating printed circuit board |
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN103124469A (en) * | 2011-11-18 | 2013-05-29 | 北大方正集团有限公司 | Step printed circuit board and manufacture method of the step printed circuit board |
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| CN104582302A (en) | 2015-04-29 |
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