CN105023865A - Large-size ground wafer surface corrosion device - Google Patents
Large-size ground wafer surface corrosion device Download PDFInfo
- Publication number
- CN105023865A CN105023865A CN201510420064.1A CN201510420064A CN105023865A CN 105023865 A CN105023865 A CN 105023865A CN 201510420064 A CN201510420064 A CN 201510420064A CN 105023865 A CN105023865 A CN 105023865A
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- China
- Prior art keywords
- sucker
- set bolt
- sucker stand
- guide rail
- surface corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to a large-size ground wafer surface corrosion device and belongs to the semiconductor manufacturing equipment technical field. The large-size ground wafer surface corrosion device is simple in structure and convenient to operate. The large-size ground wafer surface corrosion device includes supporting feet, a recycling groove, a sucking disc support, a sucking disc and a liquid carrying part; guide rails, a vacuum control switch and a waste liquid discharge outlet are arranged on the recycling groove; a vacuumizing pipeline is arranged in the sucking disc support; and the liquid carrying part comprises sliders, supporting columns, crossbeams, guide rail beams, a mobile plate, an acid liquid containing groove, a clean water containing groove, a liquid discharging control valve and liquid containing groove fixing bolts. With the large-size ground wafer surface corrosion device of the invention adopted, any position of the surface of a ground wafer can be accurately positioned and corroded. Compared with manual operation, the large-size ground wafer surface corrosion device is convenient and efficient, and can assist in avoiding hand corrosion in manual operation.
Description
Technical field
The present invention relates to semiconductor processing equipment technical field, be specially a kind of large scale grinding crystal column surface corrosion device.
Background technology
Electronic Encapsulating Technology development promotes Electronic Packaging product gradually to thin, little, light and high integrated future development.Silicon Wafer, as the base material of Electronic Packaging, for meeting package thickness requirement, needs before encapsulation to carry out thinning to wafer.Because low damage, high efficiency advantage wafer spin turn the main flow skilled worker technology that grinding technique has become wafer grinding.But mechanical grinding will cause into crystal column surface damage and produce residual stress, residual stress will make wafer produce buckling deformation even to break, and be therefore crucial to the measurement of grinding residual stress and sign.Residual stress exists within the scope of crystal column surface layer certain depth, makes cross-section samples at present to the main cutting crystal wafer of the test of sub-surface residual stress, then detection sectional plane residual stress.But this method can be introduced new cutting stress and discharge part grinding residual stress simultaneously.Chemical solution substep etch more accurately can obtain the residual-stress value of different depth in conjunction with Raman spectrum, but due to wafer size comparatively large, corrode comparatively loaded down with trivial details manually, corrosive liquid has strong corrosivity in addition, if splash human body to there will be dangerous situation.Therefore, need a kind of special device to improve corrosion efficiency, avoid the generation of dangerous situation.
Summary of the invention
The present invention proposes a kind of large scale grinding crystal column surface corrosion device, by regulating slip pin and sliding beam, crystal column surface is treated that corrosion sites positions, fast erosion, experimentation only need transfer discharge opeing by-pass valve control can realize corrosion to wafer and cleaning, safe and reliable.
The present invention adopts following technical scheme:
A kind of large scale grinding crystal column surface corrosion device, is characterized in that: comprising: leg, accumulator tank part, sucker stand part, sucker and liquid bearing part; Described leg 101 is connected with accumulator tank 102 by leg set bolt 404; Described accumulator tank part comprises: guide rail 103, bail 206, vacuum switch 401, discard solution discharge port 201, discard solution discharge port set bolt 402, pipeline opening 202, pipeline opening set bolt; Guide rail 103 is located at bilateral symmetry position, accumulator tank 102 top; Guide rail 103 end is provided with bail 206 limit slippage pin 205 and de-orbits; Vacuum switch 401, discard solution discharge port 201, pipeline opening 202 are positioned at accumulator tank 102 bottom, vacuum switch 401 controls sucker 105 and vacuumizes, and discard solution discharge port 201 is fixed on accumulator tank 102, pipeline opening set bolt 403 stationary pipes road junction 202 by discard solution discharge port set bolt 402; Described sucker stand part comprises: sucker stand base 704, sucker stand base screw 705, sucker stand post 703, sucker stand cushion cap 104, sucker stand cushion cap screw, sucker stand post 703 inside are provided with hollow pipeline 702; Sucker stand base 704 and accumulator tank 102 bottom centre joint area, sucker stand base screw 705 aligns with accumulator tank 102 screw, sucker stand post 703 connecting sucker bracket base 704 and sucker stand cushion cap 104, sucker stand post 703 arranges the chamber of pipeline 702 and sucker, and sucker 105 and sucker stand cushion cap 104 are by bolt consolidation; Liquid bearing part comprises: pillar 106, crossbeam 107, crossbeam set bolt 108, guide rail beam set bolt 109, guide rail beam 110, acid solution containing tank 111, acid solution containing tank set bolt 903, clear water containing tank set bolt 902, clear water containing tank 112, slip pin 205, drip nozzle 207, drip nozzle set bolt 901, discharge opeing by-pass valve control 301, sliding beam 302, clear water outlet 1001, acid solution outlet 1002; Slip pin 205 and pillar 106 consolidation, pillar 106 is connected by crossbeam set bolt 108 with crossbeam 107, crossbeam 107 is connected by guide rail beam set bolt 109 with guide rail beam 110, acid solution containing tank 111 and clear water containing tank 112 are bolted with sliding beam 302, and discharge opeing by-pass valve control 301 controls acid solution and clear water discharge.
Further, sealing gasket is had between sucker 105 and sucker stand cushion cap 104.
Further, discharge opeing by-pass valve control (301) control clear water outlet 1001, acid solution outlet 1002 one of them be communicated with drip nozzle 207, or all to close both making.
Further, drip nozzle 207 is positioned at sliding beam 302 center.
The present invention can obtain following beneficial effect:
1, to crystal column surface, the present invention treats that corrosion sites positions, fast erosion by regulating slip pin and sliding beam.
2, the present invention only need transfer discharge opeing by-pass valve control and can realize corrosion to wafer and cleaning, avoids the situation that manual hand manipulation causes danger.
3, structure of the present invention is simple, easy to use, safe and reliable.
Accompanying drawing illustrates:
Fig. 1 is overall structure schematic diagram of the present invention.
Fig. 2 is side-looking structural representation of the present invention.
Fig. 3 is top structure schematic diagram of the present invention.
Fig. 4 is polycrystalline substance schematic diagram of the present invention.
Fig. 5 is accumulator tank structural representation of the present invention.
Fig. 6 is accumulator tank cross-sectional view of the present invention.
Fig. 7 is sucker stand structural representation of the present invention.
Fig. 8 is liquid bearing part of the present invention structural representation.
Fig. 9 is liquid bearing part of the present invention bottom surface structure schematic diagram.
Figure 10 is liquid bearing part of the present invention cross-sectional view.
In figure:
101-leg, 102-accumulator tank, 103-guide rail, 104-sucker stand, 105-sucker, 106-pillar, 107-crossbeam, 108-crossbeam set bolt, 109-guide rail set bolt, 110-guide rail beam, 111-acid solution containing tank, 112-clear water containing tank, 201-discard solution discharge port, 202-pipeline opening, 203-alignment pin, 204-sucker set bolt, 205-slip pin, 206-bail, 207-drip nozzle, 301-discharge opeing by-pass valve control, 302-sliding beam, 401-vacuum switch, 402-discard solution discharge port set bolt, 403-pipeline opening set bolt, 404-leg set bolt, 601-control flume, 701-sucker stand cushion cap screw, 702-pipeline, 703-sucker stand post, 704-sucker stand base, 705-sucker stand base screw, 901-drip nozzle set bolt, 902-clear water containing tank set bolt, 903-acid solution containing tank set bolt, 1001-clear water outlet, 1002-acid solution outlet, 1003-control flume.
Embodiment:
Below in conjunction with accompanying drawing, the present invention is described in detail:
Fig. 1 is overall structure schematic diagram of the present invention, and Fig. 2 is side-looking structural representation of the present invention, and Fig. 3 is top structure schematic diagram of the present invention, and Fig. 4 is polycrystalline substance schematic diagram of the present invention; Leg 101 is connected with accumulator tank 102 by leg set bolt 404, during experiment, can be fixed support to device.Described accumulator tank part comprises: guide rail 103, bail 206, vacuum switch 401, discard solution discharge port 201, discard solution discharge port set bolt 402, pipeline opening 202, pipeline opening set bolt 403.Guide rail 103 can be obtained by mechanical turning, is located at bilateral symmetry position, accumulator tank 102 top; Guide rail 103 end is provided with bail 206 with limit slippage pin 205 in order to avoid slip pin 205 de-orbits; Vacuum switch 401, discard solution discharge port 201, pipeline opening 202 are positioned at accumulator tank 102 bottom; Vacuum switch 401 controls sucker 105 vacuum; Discard solution discharge port 201 is fixed on accumulator tank 102 bottom by discard solution discharge port set bolt 402, and discard solution discharge port 201 and exterior line are connected and drained waste liquid; Pipeline opening set bolt 403 stationary pipes road junction 202, pipeline opening 202 is connected with vacuum pump by pipeline.
Fig. 5 is accumulator tank structural representation of the present invention, and Fig. 6 is accumulator tank cross-sectional view of the present invention; Devil liquor recovery groove is provided with in the middle part of accumulator tank 201, waste liquid is discharged by the discard solution discharge port 201 of groove bottom, vacuum switch 401 is positioned at control flume 601, control flume 601 can be obtained by mechanical tapping mode, and vacuum switch 401 end diameter is identical with control flume 601 diameter and be greater than pipeline opening 202 diameter.
Fig. 7 is sucker stand structural representation of the present invention, comprising: sucker stand base 704, sucker stand base screw 705, sucker stand post 703, sucker stand cushion cap 104, sucker stand cushion cap screw 701, sucker stand post 703 inside are provided with hollow pipeline 702; Sucker stand base 704 and accumulator tank 102 bottom centre joint area, sucker stand base screw 705 aligns with accumulator tank 102 screw, sucker stand post 703 connecting sucker bracket base 704 and sucker stand cushion cap 104, sucker stand post 703 arranges the chamber of pipeline 702 and sucker, sucker 105 and sucker stand cushion cap 104, by bolt consolidation, are provided with sealing gasket between sucker 105 and sucker stand cushion cap 104.
Fig. 8 is liquid bearing part of the present invention structural representation, and Fig. 9 is liquid bearing part of the present invention bottom surface structure schematic diagram, and Figure 10 is liquid bearing part of the present invention cross-sectional view;
Comprise: pillar 106, crossbeam 107, crossbeam set bolt 108, guide rail beam set bolt 109, guide rail beam 110, acid solution containing tank 111, acid solution containing tank set bolt 903, clear water containing tank set bolt 902, clear water containing tank 112, slip pin 205, drip nozzle 207, drip nozzle set bolt 901, discharge opeing by-pass valve control 301, sliding beam 302, clear water outlet 1001, acid solution outlet 1002, slip pin 205 and pillar 106 consolidation, pillar 106 is connected by crossbeam set bolt 108 with crossbeam 107, crossbeam 107 is connected by guide rail beam set bolt 109 with guide rail beam 110, acid solution containing tank 111 is fixed by acid solution containing tank set bolt 903 and sliding beam 302, clear water containing tank 112 is fixed by clear water containing tank set bolt 903 and sliding beam 302, discharge opeing by-pass valve control 301 is positioned at control flume 1003, discharge opeing by-pass valve control 301 end diameter is greater than clear water outlet 1001, acid solution outlet 1002 diameter, clear water outlet 1001 can be controlled, acid solution outlet 1002 one of them be communicated with drip nozzle 207, or make both be in closed condition simultaneously, drip nozzle 207 is positioned at sliding beam 302 central area by drip nozzle set bolt 901 and sliding beam 302 consolidation.
Claims (4)
1. a large scale grinding crystal column surface corrosion device, is characterized in that: comprising: leg, accumulator tank part, sucker stand part, sucker and liquid bearing part, described leg (101) is connected with accumulator tank (102) by leg set bolt (404), described accumulator tank part comprises: guide rail (103), bail (206), vacuum switch (401), discard solution discharge port (201), discard solution discharge port set bolt (402), pipeline opening (202), pipeline opening set bolt, guide rail (103) is located at bilateral symmetry position, accumulator tank (102) top, guide rail (103) end is provided with bail (206) limit slippage pin (205) and de-orbits, vacuum switch (401), discard solution discharge port (201), pipeline opening (202) are positioned at accumulator tank (102) bottom, vacuum switch (401) controls sucker (105) and vacuumizes, and discard solution discharge port (201) is fixed on accumulator tank (102), pipeline opening set bolt (403) stationary pipes road junction (202) by discard solution discharge port set bolt (402), described sucker stand part comprises: sucker stand base (704), sucker stand base screw (705), sucker stand post (703), sucker stand cushion cap (104), sucker stand cushion cap screw, sucker stand post (703) inside are provided with hollow pipeline (702), sucker stand base (704) and accumulator tank (102) bottom centre joint area, sucker stand base screw (705) aligns with accumulator tank (102) screw, sucker stand post (703) connecting sucker bracket base (704) and sucker stand cushion cap (104), sucker stand post (703) arranges the chamber of pipeline (702) and sucker, and sucker (105) and sucker stand cushion cap (104) are by bolt consolidation, liquid bearing part comprises: pillar (106), crossbeam (107), crossbeam set bolt (108), guide rail beam set bolt (109), guide rail beam (110), acid solution containing tank (111), acid solution containing tank set bolt (903), clear water containing tank set bolt (902), clear water containing tank (112), slip pin (205), drip nozzle (207), drip nozzle set bolt (901), discharge opeing by-pass valve control (301), sliding beam (302), clear water outlet (1001), acid solution outlet (1002), slip pin (205) and pillar (106) consolidation, pillar (106) is connected by crossbeam set bolt (108) with crossbeam (107), crossbeam (107) is connected by guide rail beam set bolt (109) with guide rail beam (110), acid solution containing tank (111) and clear water containing tank (112) are bolted with sliding beam (302), and discharge opeing by-pass valve control (301) controls acid solution and clear water discharge.
2. a kind of large scale grinding crystal column surface corrosion device according to claim 1, is characterized in that there is sealing gasket between sucker (105) and sucker stand cushion cap (104).
3. a kind of large scale grinding crystal column surface corrosion device according to claim 1, it is characterized in that, discharge opeing by-pass valve control (301) control clear water outlet (1001), acid solution outlet (1002) one of them be communicated with drip nozzle (207), or all to close both making.
4. a kind of large scale grinding crystal column surface corrosion device according to claim 1, it is characterized in that, drip nozzle (207) is positioned at sliding beam (302) center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420064.1A CN105023865B (en) | 2015-07-16 | 2015-07-16 | One kind grinding crystal column surface corrosion device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420064.1A CN105023865B (en) | 2015-07-16 | 2015-07-16 | One kind grinding crystal column surface corrosion device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105023865A true CN105023865A (en) | 2015-11-04 |
| CN105023865B CN105023865B (en) | 2017-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510420064.1A Expired - Fee Related CN105023865B (en) | 2015-07-16 | 2015-07-16 | One kind grinding crystal column surface corrosion device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5439547A (en) * | 1991-05-29 | 1995-08-08 | Tokyo Electron Kabushiki Kaisha | Semiconductor manufacturing apparatus with a spare vacuum chamber |
| US20030213560A1 (en) * | 2002-05-16 | 2003-11-20 | Yaxin Wang | Tandem wafer processing system and process |
| JP3607143B2 (en) * | 1999-11-19 | 2005-01-05 | 株式会社タカトリ | Method and apparatus for attaching protective tape to semiconductor wafer |
| CN101842889A (en) * | 2007-10-29 | 2010-09-22 | 综合制造科技有限公司 | The device that is used for supporting workpiece |
| CN203737648U (en) * | 2013-12-24 | 2014-07-30 | 北京七星华创电子股份有限公司 | Substrate single-face rinsing device |
-
2015
- 2015-07-16 CN CN201510420064.1A patent/CN105023865B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5439547A (en) * | 1991-05-29 | 1995-08-08 | Tokyo Electron Kabushiki Kaisha | Semiconductor manufacturing apparatus with a spare vacuum chamber |
| JP3607143B2 (en) * | 1999-11-19 | 2005-01-05 | 株式会社タカトリ | Method and apparatus for attaching protective tape to semiconductor wafer |
| US20030213560A1 (en) * | 2002-05-16 | 2003-11-20 | Yaxin Wang | Tandem wafer processing system and process |
| CN101842889A (en) * | 2007-10-29 | 2010-09-22 | 综合制造科技有限公司 | The device that is used for supporting workpiece |
| CN203737648U (en) * | 2013-12-24 | 2014-07-30 | 北京七星华创电子股份有限公司 | Substrate single-face rinsing device |
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| Publication number | Publication date |
|---|---|
| CN105023865B (en) | 2017-10-10 |
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