CN105081497A - Preparation method for producing BGA plant balls in batches on basis of SMT process - Google Patents
Preparation method for producing BGA plant balls in batches on basis of SMT process Download PDFInfo
- Publication number
- CN105081497A CN105081497A CN201510420478.4A CN201510420478A CN105081497A CN 105081497 A CN105081497 A CN 105081497A CN 201510420478 A CN201510420478 A CN 201510420478A CN 105081497 A CN105081497 A CN 105081497A
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- China
- Prior art keywords
- ball
- bga
- scaling powder
- printing
- preparation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a preparation method for producing BGA plant balls in batches on the basis of the SMT process. The preparation method includes the following specific steps that a, materials are prepared; b, scaling powder printing is conducted; c, welding ball printing is conducted; d, automatic optical inspection is conducted before the materials enter a furnace; e, inspection is conducted before the materials enter the furnace; f, reflowing soldering is conducted; g, automatic optical detection is conducted after the materials come out of the furnace; and h, visual inspection is conducted after reflowing soldering. By means of the mode, according to the preparation method for producing the BGA plant balls in batches on the basis of the SMT process, printing scaling powder and printing solder balls are automatically aligned, free switching is achieved, small-batch production or large-batch production can be achieved, the product delivery time is short, the BGA (ball grid array) product changes are adjusted in time according to test results of clients, and the method can better serve the clients.
Description
Technical field
The present invention relates to the field of SMT (surface mounting technology) manufacturing process, particularly relate to a kind of preparation method planting ball based on SMT process lot production BGA.
Background technology
Current OEM client has new concept in device manufacturing method face, especially for the production of small lot or the many BGA(ball grid array of product variations) product, the production cost of semiconductor is higher, and product hands over the phase longer, very flexible.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of preparation method planting ball based on SMT process lot production BGA, automatic aligning print fluxing and printing soldered ball, freely change, can small lot batch manufacture or production in enormous quantities, product hands over the phase short, BGA(ball grid array can be adjusted in time according to client's test result) change of product, better services client.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of preparation method planting ball based on SMT process lot production BGA, comprise following concrete steps:
A, material prepare, and the pad according to BGA selects soldered ball; Require to select scaling powder according to BGA; According to the pad of BGA and jigsaw sized data design scaling powder printing stencil and soldered ball printing stencil;
B, scaling powder printing, put into automatically to enter trigger and carry out scaling powder printing by BAG jigsaw, adopts cockscomb and rubber flap and record scaling powder printing time during scaling powder printing;
C, soldered ball printing, adopt and plant bulb and make soldered ball with minimum frictional force by soldered ball printing stencil opening, and plant bulb and impose certain placement power and soldered ball is placed on be coated with the pad of scaling powder is formed to plant ball;
D, stokehold automatic visual inspection, adopt AOI Equipment Inspection to plant ball whether defectiveness, if defective words are reprocessed planting ball;
E, stokehold check, check whether the jigsaw printing tin ball enters reflow ovens in official hour, again verify simultaneously for stokehold automatic optics inspection is doubt;
F, reflow soldering, according to the requirement of the feature definitions furnace temperature of soldered ball, and monitor;
Automatic visual inspection after g, stove, detects again with AOI equipment after Reflow Soldering, is recorded in automatic optics inspection data logger by defective bad dot information;
Visual inspection after h, Reflow Soldering, verifies again for by automatic visual inspection after stove is doubt, checks that the BGA passed through plants chou bundle.
In a preferred embodiment of the present invention, alloy Sn98.5Ag1Cu0.5 selected by described soldered ball.
In a preferred embodiment of the present invention, semisolid scaling powder selected by described scaling powder.
In a preferred embodiment of the present invention, described cockscomb is rear scraper; Described rubber flap is front scraper.
In a preferred embodiment of the present invention, the described defect of planting ball comprises soldered ball dislocation and soldered ball disappearance.
In a preferred embodiment of the present invention, the preparation method that described BGA plants ball also comprises BGA soldered ball shearing force testing, and the BGA passed through visual inspection after Reflow Soldering plants ball and carries out sampling thrust test.
The invention has the beneficial effects as follows: the preparation method planting ball based on SMT process lot production BGA of the present invention, automatic aligning print fluxing and printing soldered ball, freely change, can small lot batch manufacture or production in enormous quantities, product hands over the phase short, BGA(ball grid array can be adjusted in time according to client's test result) change of product, better services client.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 the present invention is based on SMT process lot to produce the flow chart that BGA plants a preferred embodiment of the preparation method of ball;
Fig. 2 is the coupling part in A portion in Fig. 1.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
As illustrated in fig. 1 and 2, the embodiment of the present invention comprises:
Produce based on SMT process lot the preparation method that BGA plants ball, comprise following concrete steps:
A, material prepare, and the pad according to BGA selects soldered ball; Require to select scaling powder according to BGA; According to the pad of BGA and jigsaw sized data design scaling powder printing stencil and soldered ball printing stencil;
B, scaling powder printing, put into automatically to enter trigger and carry out scaling powder printing by BAG jigsaw, adopts cockscomb and rubber flap and record scaling powder printing time during scaling powder printing;
C, soldered ball printing, adopt and plant bulb and make soldered ball with minimum frictional force by soldered ball printing stencil opening, and plant bulb and impose certain placement power and soldered ball is placed on be coated with the pad of scaling powder is formed to plant ball;
D, stokehold automatic visual inspection, adopt AOI Equipment Inspection to plant ball whether defectiveness, if defective words are reprocessed planting ball;
E, stokehold check, check whether the jigsaw printing tin ball enters reflow ovens in official hour, again verify simultaneously for stokehold automatic optics inspection is doubt;
F, reflow soldering, according to the requirement of the feature definitions furnace temperature of soldered ball, and monitor;
Automatic visual inspection after g, stove, detects again with AOI equipment after Reflow Soldering, is recorded in automatic optics inspection data logger by defective bad dot information;
Visual inspection after h, Reflow Soldering, verifies again for by automatic visual inspection after stove is doubt, checks that the BGA passed through plants chou bundle.
In above-mentioned, the preparation method that described BGA plants ball also comprises BGA soldered ball shearing force testing, and the BGA passed through visual inspection after Reflow Soldering plants ball and carries out sampling thrust test.
Further, alloy Sn98.5Ag1Cu0.5 selected by described soldered ball; Semisolid scaling powder selected by described scaling powder.
Embodiment:
1, solder ball is selected according to the pad of BGA
For lead-free product, the soldered ball alloy generally selected is Sn98.5Ag1Cu0.5.
2, scaling powder is selected according to the requirement of BGA
The semisolid scaling powder be applicable to is selected according to the characteristic of BGA.
3, according to the pad of BGA and the printing stencil of jigsaw sized data design scaling powder
4, according to the pad of BGA and the printing stencil of jigsaw sized data design soldered ball
5, scaling powder printing
In scaling powder typography, apply two kinds of different front and back scrapers:
Rear scraper----metal scraping blade, the scaling powder layer that precoating layer is thin on silk screen
Front scraper----rubber scraper, is printed onto scaling powder on PCB pad
The advantage of this scaling powder typography design is that the soldering flux quantity of printing is very even, and effectively prevention silk screen is dry or by foreign matter plug-hole etc.
6, soldered ball printing
The planting bulb and can make soldered ball with minimum frictional force by template opening of particular design, and plant bulb and impose certain placement power and soldered ball is placed on be coated with on the pad of scaling powder.
7, stokehold automatic visual inspection
Usual AOI(automated optical inspection) equipment can be easy to the defect of planting ball be detected, major defect is that soldered ball dislocation and soldered ball lack.
8, stokehold visual inspection
Whether the jigsaw that main inspection prints tin ball enters reflow ovens in official hour.Again verify for automatic optics inspection is doubt.
9, reflow soldering
According to the requirement of the feature definitions furnace temperature of soldered ball, and monitor.
10, automatic visual inspection
Need after Reflow Soldering to use AOI(automated optical inspection) check, in this step, consider that this product is BGA type, if having any few ball or dislocation, this single BGA(ball grid array) circuit board will be scrapped.The inefficacy that all may cause element in next step assembling process is reprocessed because of any mode.
11, visual inspection after Reflow Soldering
Again verify for automatic optics inspection is doubt.
In sum, the preparation method planting ball based on SMT process lot production BGA of the present invention, automatic aligning print fluxing and printing soldered ball, freely change, can small lot batch manufacture or production in enormous quantities, product hands over the phase short, can adjust BGA(ball grid array in time according to client's test result) change of product, better services client.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. produce based on SMT process lot the preparation method that BGA plants ball, it is characterized in that, comprise following concrete steps:
A, material prepare, and the pad according to BGA selects soldered ball; Require to select scaling powder according to BGA; According to the pad of BGA and jigsaw sized data design scaling powder printing stencil and soldered ball printing stencil;
B, scaling powder printing, put into automatically to enter trigger and carry out scaling powder printing by BAG jigsaw, adopts cockscomb and rubber flap and record scaling powder printing time during scaling powder printing;
C, soldered ball printing, adopt and plant bulb and make soldered ball with minimum frictional force by soldered ball printing stencil opening, and plant bulb and impose certain placement power and soldered ball is placed on be coated with the pad of scaling powder is formed to plant ball;
D, stokehold automatic visual inspection, adopt AOI Equipment Inspection to plant ball whether defectiveness, if defective words are reprocessed planting ball;
E, stokehold check, check whether the jigsaw printing tin ball enters reflow ovens in official hour, again verify simultaneously for stokehold automatic optics inspection is doubt;
F, reflow soldering, according to the requirement of the feature definitions furnace temperature of soldered ball, and monitor;
Automatic visual inspection after g, stove, detects again with AOI equipment after Reflow Soldering, is recorded in automatic optics inspection data logger by defective bad dot information;
Visual inspection after h, Reflow Soldering, verifies again for by automatic visual inspection after stove is doubt, checks that the BGA passed through plants chou bundle.
2. the preparation method planting ball based on SMT process lot production BGA according to claim 1, it is characterized in that, alloy Sn98.5Ag1Cu0.5 selected by described soldered ball.
3. the preparation method planting ball based on SMT process lot production BGA according to claim 1, it is characterized in that, semisolid scaling powder selected by described scaling powder.
4. the preparation method planting ball based on SMT process lot production BGA according to claim 1, it is characterized in that, described cockscomb is rear scraper; Described rubber flap is front scraper.
5. the preparation method planting ball based on SMT process lot production BGA according to claim 1, is characterized in that, the described defect of planting ball comprises soldered ball dislocation and soldered ball disappearance.
6. the preparation method planting ball based on SMT process lot production BGA according to claim 1, it is characterized in that, the preparation method that described BGA plants ball also comprises BGA soldered ball shearing force testing, and the BGA passed through visual inspection after Reflow Soldering plants ball and carries out sampling thrust test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420478.4A CN105081497A (en) | 2015-07-17 | 2015-07-17 | Preparation method for producing BGA plant balls in batches on basis of SMT process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510420478.4A CN105081497A (en) | 2015-07-17 | 2015-07-17 | Preparation method for producing BGA plant balls in batches on basis of SMT process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105081497A true CN105081497A (en) | 2015-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510420478.4A Pending CN105081497A (en) | 2015-07-17 | 2015-07-17 | Preparation method for producing BGA plant balls in batches on basis of SMT process |
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| Country | Link |
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| CN (1) | CN105081497A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117219517A (en) * | 2023-09-26 | 2023-12-12 | 上海世禹精密设备股份有限公司 | Ball planting method based on screen printing |
Citations (8)
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| JP2001094002A (en) * | 1999-09-21 | 2001-04-06 | Nec Corp | Method and structure for mounting bga |
| US20040108937A1 (en) * | 2002-12-04 | 2004-06-10 | Craig Ernsberger | Ball grid array resistor network |
| US20060263929A1 (en) * | 2005-05-17 | 2006-11-23 | Texas Instruments Inc. | Method and apparatus for attaching an IC package to a PCB assembly |
| WO2008033708A2 (en) * | 2006-09-11 | 2008-03-20 | Texas Instruments Incorporated | Methods and apparatus for bonding electrical member to substrate |
| CN102881599A (en) * | 2012-09-18 | 2013-01-16 | 奈电软性科技电子(珠海)有限公司 | Ball attachment process for ball grid array |
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| CN103929897A (en) * | 2014-04-22 | 2014-07-16 | 无锡市同步电子制造有限公司 | Method for manually planting welded balls of BGA device |
| GB2519991A (en) * | 2013-11-04 | 2015-05-13 | Dave Hall Entpr Ltd | Apparatus and method |
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2015
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001094002A (en) * | 1999-09-21 | 2001-04-06 | Nec Corp | Method and structure for mounting bga |
| US20040108937A1 (en) * | 2002-12-04 | 2004-06-10 | Craig Ernsberger | Ball grid array resistor network |
| US20060263929A1 (en) * | 2005-05-17 | 2006-11-23 | Texas Instruments Inc. | Method and apparatus for attaching an IC package to a PCB assembly |
| WO2008033708A2 (en) * | 2006-09-11 | 2008-03-20 | Texas Instruments Incorporated | Methods and apparatus for bonding electrical member to substrate |
| CN102881599A (en) * | 2012-09-18 | 2013-01-16 | 奈电软性科技电子(珠海)有限公司 | Ball attachment process for ball grid array |
| GB2519991A (en) * | 2013-11-04 | 2015-05-13 | Dave Hall Entpr Ltd | Apparatus and method |
| CN103769707A (en) * | 2014-01-23 | 2014-05-07 | 无锡江南计算技术研究所 | BGA (ball grid array) ball-mounting method |
| CN103929897A (en) * | 2014-04-22 | 2014-07-16 | 无锡市同步电子制造有限公司 | Method for manually planting welded balls of BGA device |
Non-Patent Citations (3)
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|---|
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117219517A (en) * | 2023-09-26 | 2023-12-12 | 上海世禹精密设备股份有限公司 | Ball planting method based on screen printing |
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Application publication date: 20151125 |
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