CN105118827A - Three-dimensional chip stack packaging structure based on flexible substrate and packaging method - Google Patents
Three-dimensional chip stack packaging structure based on flexible substrate and packaging method Download PDFInfo
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- CN105118827A CN105118827A CN201510487847.1A CN201510487847A CN105118827A CN 105118827 A CN105118827 A CN 105118827A CN 201510487847 A CN201510487847 A CN 201510487847A CN 105118827 A CN105118827 A CN 105118827A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92222—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92225—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Abstract
The invention provides a three-dimensional chip stack packaging structure based on a flexible substrate and a packaging method. The packaging structure comprises a strip-shaped flexible substrate and 2 (N+1) flip chips, wherein the N is greater than or equal to 1; all the flip chips are stacked; the strip-shaped flexible substrate penetrates among the flip chips and is connected to each flip chip through a bonding pad. The packaging method mainly comprises the following steps of making the flexible substrate; installing the flip chips; folding the stack; carrying out solid sealing molding. In the invention, the flexible substrate is used in a ground-breaking mode to carry out three dimensional stack on the flip chips; a technology is simple and is easy to realize; cost is low and multilayer stack (three layers or more than three layers of chip stack) can be realized; and three-dimensional multilayer stack of chips with a same size can be especially realized.
Description
Technical field
The present invention relates to microelectronics Packaging field, especially relate to a kind of three-dimensional chip stack package structure based on flexible base, board and method for packing.
Background technology
At present, several mode below the stacking usual employing of three-dimensional chip: the 1) mode of wire bonding, this mode, upper level chip scale is usually little than lower layer chip, is a kind of laminated construction of pyramid; 2) mode of flip chip bonding combined leads bonding, this mode, bottom chip is welded on substrate by the mode of flip chip bonding, and upper strata chip realizes interconnecting by the mode of wire bonding and substrate successively, and upper strata chip also presents a kind of laminated construction of pyramid; 3) add one deck pad between layers of chips, to ensure that lower layer chip has the enough height of group to realize interconnecting by lead-in wire and substrate, this mode can realize stacking with scale chips of multi-layer phase; 4) mode of three-dimensional TSV, this mode also can realize stacking with scale chips of multi-layer phase, but technics comparing is complicated, and cost of manufacture is higher.In addition, first three plants mode, and owing to limiting by lead-in wire, the chip-stacked number of plies can not be too many, is usually less than 3 layers.
Summary of the invention
The object of the invention is to: for prior art Problems existing, provide a kind of three-dimensional chip stack package structure based on flexible base, board and method for packing, the cost solving existing stack manner is higher, and the problem that stacks as high is lower.
Goal of the invention of the present invention is achieved through the following technical solutions:
A kind of three-dimensional chip stack package structure based on flexible base, board, it is characterized in that, this encapsulating structure comprises strip flexible base, board and 2 (N+1) individual flip-chip, wherein N >=1, the stacking placement of all flip-chips, strip flexible base, board interts between flip-chip, and is connected by pad with each flip-chip respectively.
As further technical scheme, the flip-chip of stacking placement, if be designated as the 1st piece of flip-chip from bottom to top successively, 2nd piece of flip-chip ... N block flip-chip, then one end of described strip flexible base, board is located between the 2nd piece of flip-chip and the 3rd piece of flip-chip, the other end of this strip flexible base, board down bends, up bend after through the lower surface of the 1st piece of flip-chip, after passing between the 4th piece of flip-chip and the 5th piece of flip-chip, up bend again, after passing between the 6th piece of flip-chip and the 7th piece of flip-chip, up bend again, after passing between the 8th piece of flip-chip and the 9th piece of flip-chip, up bend again, the rest may be inferred, until run into N block flip-chip.
As further technical scheme, when the number of flip-chip is 4, one end of described strip flexible base, board is located between the 2nd piece of flip-chip and the 3rd piece of flip-chip, the other end of this strip flexible base, board down bends, up bend after through the lower surface of the 1st piece of flip-chip, be then connected to the 4th piece of flip-chip by pad.
As further technical scheme, the two sides of described strip flexible base, board is equipped with the pad for being connected with flip-chip, is connected between strip flexible base, board and adjacent flip-chip by pad.
As further technical scheme, die bonding glue is scribbled between the flip-chip that next-door neighbour is affixed, what strip flexible base, board was connected by pad with flip-chip has been partially filled underfill, and between the part of strip flexible base, board bending and flip-chip, embedding has plastic packaging glue.
As further technical scheme, strip flexible base, board plants BGA ball being positioned at steel mesh on flip-chip lower surface bottom.
Based on a three-dimensional chip stacking encapsulation method for flexible base, board, it is characterized in that, this method for packing comprises step:
(1) flexible base, board is made: the shape of this flexible base, board is strip, and upper surface and lower surface have the pad of chip;
(2) aim at the some flip-chips of placement at the upper surface of flexible base, board, then reflux, and fill underfill between these flip-chips and flexible base, board upper surface, solidification;
(3) some flip-chips are aimed at the lower surface being placed on flexible base, board according to position relationship opposing upper and lower, wherein flexible base, board lower surface from left to right second flip-chip riding position and from right to left first flip-chip riding position do not place flip-chip, then reflux, and between these flip-chips and flexible base, board lower surface, fill underfill, solidification;
(4) die bonding glue is coated to the surface of all flip-chips, then by flexible base, board upper surface from left to right first flip-chip bending aligning be attached to upper surface from left to right on second flip-chip, from upper surface from left to right the 3rd flip-chip, bend stacking according to snakelike bending mode successively;
(5) embedding plastic packaging glue is fixed, and forms primary package body;
(6) brush solder(ing) paste on the pad being positioned at primary package body flexible base, board bottom, BGA ball planted by steel mesh, backflow, forms packaging body.
Based on a three-dimensional chip stacking encapsulation method for flexible base, board, it is characterized in that, this method for packing comprises step:
(1) flexible base, board is made: the shape of this flexible base, board is strip, and upper surface and lower surface have the pad of chip;
(2) aim at placement three pieces of flip-chips at the upper surface of flexible base, board, then reflux, and fill underfill between these flip-chips and flexible base, board upper surface, solidification;
(3) one piece of flip-chip is aimed at lower surface first the flip-chip riding position being from left to right placed on flexible base, board according to position relationship opposing upper and lower, then reflux, and between this flip-chip and flexible base, board lower surface, fill underfill, solidification;
(4) die bonding glue is coated to the surface of all flip-chips, then by flexible base, board upper surface from left to right first flip-chip bending aligning be attached to upper surface from left to right on second flip-chip, by upper surface from left to right the 3rd flip-chip bending aim at and be attached on the flip-chip of lower surface;
(5) embedding plastic packaging glue is fixed, and forms primary package body;
(6) brush solder(ing) paste on the pad being positioned at primary package body flexible base, board bottom, BGA ball planted by steel mesh, backflow, forms packaging body.
Compared with prior art, the employing flexible base, board of initiative of the present invention is by three-dimensional stacked for flip-chip, its technique is simple, easy realization, cost compare is low, multiple-level stack (more than 3 layers or 3 layers chip-stacked) can be realized, especially can realize the 3-dimensional multi-layered stacking of same size chip.
Accompanying drawing explanation
Fig. 1 is the chip stack package of four layers of same size based on flexible base, board;
Fig. 2 is the chip stack package of eight layers of same size based on flexible base, board;
Fig. 3 is the chip stack package of four layers of same size before bending;
Fig. 4 is the chip stack package of eight layers of same size before bending.
Description of reference numerals:
101 is flexible base, board, and 102 is BGA (BallGridArray, ball grid array) ball, and 103 is chip bump, and 104 is chip underfill glue, and 105 is die bonding glue, and 106 is flip-chip, and 107 is plastic packaging glue.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Embodiment 1
The invention provides a kind of three-dimensional chip stack package structure based on flexible base, board, see Fig. 1 and Fig. 2, this encapsulating structure mainly comprises the individual flip-chip 106 of strip flexible base, board 101 and 2 (N+1), wherein N >=1.All stacking placements of flip-chip 106, strip flexible base, board 101 interts between flip-chip 106, and is connected by pad with each flip-chip 106 respectively.Pad: the pad being provided with chip on the upper surface and lower surface of flexible base, board 101, pad has chip bump 103.
Concrete, the flip-chip 106 of stacking placement, if be designated as the 1st piece of flip-chip from bottom to top successively, 2nd piece of flip-chip ... N block flip-chip, then one end of strip flexible base, board 101 is located between the 2nd piece of flip-chip and the 3rd piece of flip-chip, the other end of this strip flexible base, board down bends, up bend after through the lower surface of the 1st piece of flip-chip, after passing between the 4th piece of flip-chip and the 5th piece of flip-chip, up bend again, after passing between the 6th piece of flip-chip and the 7th piece of flip-chip, up bend again, after passing between the 8th piece of flip-chip and the 9th piece of flip-chip, up bend again, the rest may be inferred, until run into N block flip-chip.
The two sides of strip flexible base, board 106 is equipped with the pad for being connected with flip-chip, be connected by pad between strip flexible base, board 106 and adjacent flip-chip, as the lower surface with the 1st piece of flip-chip, with the upper surface of the 2nd piece of flip-chip, the lower surface etc. with the 3rd piece of flip-chip.
Die bonding glue 105 is scribbled, as between the 1st piece of flip-chip and the 2nd piece of flip-chip, between the 3rd piece of flip-chip and the 4th piece of flip-chip etc. between the flip-chip that next-door neighbour is affixed.What strip flexible base, board was connected by pad with flip-chip has been partially filled underfill 104, and between the part of strip flexible base, board bending and flip-chip, embedding has plastic packaging glue 107.
Strip flexible base, board plants BGA ball 102 being positioned at steel mesh on flip-chip lower surface bottom.
Embodiment 2
The invention provides a kind of three-dimensional chip stack package structure based on flexible base, board, as shown in Figure 1, this encapsulating structure mainly comprises strip flexible base, board 101 and four flip-chips 106.All stacking placements of flip-chip 106, the flip-chip 106 of stacking placement, is designated as the 1st piece of flip-chip, the 2nd piece of flip-chip, the 3rd piece of flip-chip, the 4th piece of flip-chip from bottom to top successively.One end of strip flexible base, board 101 is located between the 2nd piece of flip-chip and the 3rd piece of flip-chip, the other end of this strip flexible base, board down bends, up bend after through the lower surface of the 1st piece of flip-chip, be then connected to the 4th piece of flip-chip by pad.
The two sides of strip flexible base, board 106 is equipped with the pad for being connected with flip-chip, strip flexible base, board 106 is connected by pad with between the upper surface of the 4th piece of flip-chip with the lower surface of the 3rd piece of flip-chip with the upper surface of the 2nd piece of flip-chip with the lower surface of the 1st piece of flip-chip, and is filled with underfill 104 in junction.
Scribble between 1st piece of flip-chip and the 2nd piece of flip-chip between die bonding glue the 105,3rd piece of flip-chip and the 4th piece of flip-chip and scribble die bonding glue 105.Between the part of strip flexible base, board bending and flip-chip, embedding has plastic packaging glue 107.
Strip flexible base, board plants BGA ball 102 being positioned at steel mesh on flip-chip lower surface bottom.
Embodiment 3
The invention provides a kind of three-dimensional chip stack package structure based on flexible base, board, as shown in Figure 2, this encapsulating structure mainly comprises strip flexible base, board 101 and eight flip-chips 106.All stacking placements of flip-chip 106, the flip-chip 106 of stacking placement, is designated as the 1st piece of flip-chip, the 2nd piece of flip-chip, the 3rd piece of flip-chip, the 4th piece of flip-chip from bottom to top successively ... 8th piece of flip-chip.One end of strip flexible base, board 101 is located between the 2nd piece of flip-chip and the 3rd piece of flip-chip, the other end of this strip flexible base, board down bends, up bend after through the lower surface of the 1st piece of flip-chip, after passing between the 4th piece of flip-chip and the 5th piece of flip-chip, up bend again, after passing between the 6th piece of flip-chip and the 7th piece of flip-chip, more up bend, be then connected to the 8th piece of flip-chip by pad.
The setting position of underfill 104, die bonding glue 105, plastic packaging glue 107 can see embodiment 1 and embodiment 2, and the present embodiment repeats no more.
Embodiment 4
The present invention also provides a kind of three-dimensional chip stacking encapsulation method based on flexible base, board, and this method for packing comprises step:
(1) flexible base, board is made: the shape of this flexible base, board is strip, and upper surface and lower surface have the pad of chip;
(2) aim at the some flip-chips of placement at the upper surface of flexible base, board, then reflux, and fill underfill between these flip-chips and flexible base, board upper surface, solidification;
(3) some flip-chips are aimed at the lower surface being placed on flexible base, board according to position relationship opposing upper and lower, wherein flexible base, board lower surface from left to right second flip-chip riding position and from right to left first flip-chip riding position do not place flip-chip, then reflux, and between these flip-chips and flexible base, board lower surface, fill underfill, solidification;
(4) die bonding glue is coated to the surface of all flip-chips, then by flexible base, board upper surface from left to right first flip-chip bending aligning be attached to upper surface from left to right on second flip-chip, from upper surface from left to right the 3rd flip-chip, bend stacking according to snakelike bending mode successively;
(5) embedding plastic packaging glue is fixed, and forms primary package body;
(6) brush solder(ing) paste on the pad being positioned at primary package body flexible base, board bottom, BGA ball planted by steel mesh, backflow, forms packaging body.
Embodiment 5
The present invention also provides a kind of three-dimensional chip stacking encapsulation method based on flexible base, board, and see Fig. 1 and Fig. 3, this method for packing comprises step:
(1) flexible base, board 101 is made: the shape of this flexible base, board is strip, and upper surface and lower surface have the pad of chip;
(2) aim at placement three pieces of flip-chips 106 at the upper surface of flexible base, board, then reflux, and fill underfill 104 between these flip-chips and flexible base, board upper surface, solidification;
(3) one piece of flip-chip is aimed at lower surface first the flip-chip riding position being from left to right placed on flexible base, board 101 according to position relationship opposing upper and lower, then reflux, and underfill is filled between this flip-chip and flexible base, board lower surface, solidification, the product after this step completes is as shown in Figure 3;
(4) die bonding glue 105 is coated to the surface of all flip-chips, then by flexible base, board upper surface from left to right first flip-chip bending aligning be attached to upper surface from left to right on second flip-chip, by upper surface from left to right the bending of the 3rd flip-chip aim at and be attached on the flip-chip of lower surface, the product structure after this step completes is as shown in Figure 1;
(5) embedding plastic packaging glue is fixed, and forms primary package body;
(6) brush solder(ing) paste on the pad being positioned at primary package body flexible base, board bottom, BGA ball planted by steel mesh, backflow, forms packaging body.
Embodiment 6
The present invention also provides a kind of three-dimensional chip stacking encapsulation method based on flexible base, board, and see Fig. 2 and Fig. 3, this method for packing comprises step:
(1) flexible base, board 101 is made: the shape of this flexible base, board is strip, and upper surface and lower surface have the pad of chip;
(2) aim at placement five pieces of flip-chips 106 at the upper surface of flexible base, board, then reflux, and fill underfill 104 between these flip-chips and flexible base, board upper surface, solidification;
(3) three pieces of flip-chips are aimed at the lower surface being placed on flexible base, board 101 according to position relationship opposing upper and lower, wherein flexible base, board lower surface from left to right second flip-chip riding position and from right to left first flip-chip riding position do not place flip-chip, then reflux, and underfill is filled between this flip-chip and flexible base, board lower surface, solidification, the product after this step completes is as shown in Figure 4;
(4) die bonding glue 105 is coated to the surface of all flip-chips, then by flexible base, board upper surface from left to right first flip-chip bending aligning be attached to upper surface from left to right on second flip-chip, from upper surface from left to right the 3rd flip-chip, bend stacking according to snakelike bending mode successively, the product structure after this step completes as shown in Figure 2;
(5) embedding plastic packaging glue is fixed, and forms primary package body;
(6) brush solder(ing) paste on the pad being positioned at primary package body flexible base, board bottom, BGA ball planted by steel mesh, backflow, forms packaging body.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, it should be pointed out that all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. the three-dimensional chip stack package structure based on flexible base, board, it is characterized in that, this encapsulating structure comprises strip flexible base, board and 2 (N+1) individual flip-chip, wherein N >=1, the stacking placement of all flip-chips, strip flexible base, board interts between flip-chip, and is connected by pad with each flip-chip respectively.
2. a kind of three-dimensional chip stack package structure based on flexible base, board according to claim 1, it is characterized in that, the flip-chip of stacking placement, if be designated as the 1st piece of flip-chip from bottom to top successively, 2nd piece of flip-chip ... N block flip-chip, then one end of described strip flexible base, board is located between the 2nd piece of flip-chip and the 3rd piece of flip-chip, the other end of this strip flexible base, board down bends, up bend after through the lower surface of the 1st piece of flip-chip, after passing between the 4th piece of flip-chip and the 5th piece of flip-chip, up bend again, after passing between the 6th piece of flip-chip and the 7th piece of flip-chip, up bend again, after passing between the 8th piece of flip-chip and the 9th piece of flip-chip, up bend again, the rest may be inferred, until run into N block flip-chip.
3. a kind of three-dimensional chip stack package structure based on flexible base, board according to claim 2, it is characterized in that, when the number of flip-chip is 4, one end of described strip flexible base, board is located between the 2nd piece of flip-chip and the 3rd piece of flip-chip, the other end of this strip flexible base, board down bends, up bend after through the lower surface of the 1st piece of flip-chip, be then connected to the 4th piece of flip-chip by pad.
4. a kind of three-dimensional chip stack package structure based on flexible base, board according to Claims 2 or 3, it is characterized in that, the two sides of described strip flexible base, board is equipped with the pad for being connected with flip-chip, is connected between strip flexible base, board and adjacent flip-chip by pad.
5. a kind of three-dimensional chip stack package structure based on flexible base, board according to Claims 2 or 3, it is characterized in that, die bonding glue is scribbled between the flip-chip that next-door neighbour is affixed, what strip flexible base, board was connected by pad with flip-chip has been partially filled underfill, and between the part of strip flexible base, board bending and flip-chip, embedding has plastic packaging glue.
6. a kind of three-dimensional chip stack package structure based on flexible base, board according to Claims 2 or 3, is characterized in that, strip flexible base, board plants BGA ball being positioned at steel mesh on flip-chip lower surface bottom.
7. based on a three-dimensional chip stacking encapsulation method for flexible base, board, it is characterized in that, this method for packing comprises step:
(1) flexible base, board is made: the shape of this flexible base, board is strip, and upper surface and lower surface have the pad of chip;
(2) aim at the some flip-chips of placement at the upper surface of flexible base, board, then reflux, and fill underfill between these flip-chips and flexible base, board upper surface, solidification;
(3) some flip-chips are aimed at the lower surface being placed on flexible base, board according to position relationship opposing upper and lower, wherein flexible base, board lower surface from left to right second flip-chip riding position and from right to left first flip-chip riding position do not place flip-chip, then reflux, and between these flip-chips and flexible base, board lower surface, fill underfill, solidification;
(4) die bonding glue is coated to the surface of all flip-chips, then by flexible base, board upper surface from left to right first flip-chip bending aligning be attached to upper surface from left to right on second flip-chip, from upper surface from left to right the 3rd flip-chip, bend stacking according to snakelike bending mode successively;
(5) embedding plastic packaging glue is fixed, and forms primary package body;
(6) brush solder(ing) paste on the pad being positioned at primary package body flexible base, board bottom, BGA ball planted by steel mesh, backflow, forms packaging body.
8. based on a three-dimensional chip stacking encapsulation method for flexible base, board, it is characterized in that, this method for packing comprises step:
(1) flexible base, board is made: the shape of this flexible base, board is strip, and upper surface and lower surface have the pad of chip;
(2) aim at placement three pieces of flip-chips at the upper surface of flexible base, board, then reflux, and fill underfill between these flip-chips and flexible base, board upper surface, solidification;
(3) one piece of flip-chip is aimed at lower surface first the flip-chip riding position being from left to right placed on flexible base, board according to position relationship opposing upper and lower, then reflux, and between this flip-chip and flexible base, board lower surface, fill underfill, solidification;
(4) die bonding glue is coated to the surface of all flip-chips, then by flexible base, board upper surface from left to right first flip-chip bending aligning be attached to upper surface from left to right on second flip-chip, by upper surface from left to right the 3rd flip-chip bending aim at and be attached on the flip-chip of lower surface;
(5) embedding plastic packaging glue is fixed, and forms primary package body;
(6) brush solder(ing) paste on the pad being positioned at primary package body flexible base, board bottom, BGA ball planted by steel mesh, backflow, forms packaging body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510487847.1A CN105118827A (en) | 2015-08-10 | 2015-08-10 | Three-dimensional chip stack packaging structure based on flexible substrate and packaging method |
| PCT/CN2015/092593 WO2017024674A1 (en) | 2015-08-10 | 2015-10-23 | Flexible substrate three-dimensional chip-stack package structure and packaging method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510487847.1A CN105118827A (en) | 2015-08-10 | 2015-08-10 | Three-dimensional chip stack packaging structure based on flexible substrate and packaging method |
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| CN105118827A true CN105118827A (en) | 2015-12-02 |
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| WO (1) | WO2017024674A1 (en) |
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| CN106409702A (en) * | 2016-11-22 | 2017-02-15 | 中国科学院微电子研究所 | Multi-chip stacked package structure and manufacture method thereof |
| CN110190035A (en) * | 2019-04-26 | 2019-08-30 | 江苏长电科技股份有限公司 | A kind of three-dimensional system level packaging structure and its process of substrate and frame mixing |
| CN110828411A (en) * | 2019-11-19 | 2020-02-21 | 江苏上达电子有限公司 | Multi-chip bonding post-bending type packaging structure and method |
| CN113851451A (en) * | 2021-11-30 | 2021-12-28 | 江苏长晶科技有限公司 | Plastic substrate based chip 3D stacked packaging structure and manufacturing method thereof |
| CN114823555A (en) * | 2022-03-04 | 2022-07-29 | 珠海越亚半导体股份有限公司 | Packaging structure and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| WO2017024674A1 (en) | 2017-02-16 |
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