CN105328344B - A kind of laser removing glue device and method for ball bar array architecture PCB - Google Patents
A kind of laser removing glue device and method for ball bar array architecture PCB Download PDFInfo
- Publication number
- CN105328344B CN105328344B CN201510778274.8A CN201510778274A CN105328344B CN 105328344 B CN105328344 B CN 105328344B CN 201510778274 A CN201510778274 A CN 201510778274A CN 105328344 B CN105328344 B CN 105328344B
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- laser
- pair
- plate
- crossbeam
- removing glue
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
Abstract
The invention discloses a kind of laser removing glue device and method for ball bar array architecture PCB, the laser includes removing glue mechanism, material pulling mechanism, accommodating mechanism except adhesive dispenser.The removing glue mechanism includes that being provided with image determines device, Thickness Measurement by Microwave induction installation, the laser module of laser aid；The charging tray for being positioned with pcb board is placed in accommodating mechanism in the way of levels；The material pulling mechanism is delivered to base plate is processed on the processing base plate of removing glue mechanism, after the volume of image measure measurement device pcb board is to carry out image positioning, the epoxy resin coating thickness and epoxy resin coating scope of the BGA package on Thickness Measurement by Microwave induction installation detecting pcb board, laser aid are fully erased by the epoxy resin of different-thickness.By above-mentioned technical proposal, automatically can be loaded onto pcb board to be processed on the processing base plate of removing glue mechanism by the present invention, to improve the efficiency of the laser removing glue of ball bar array architecture PCB.
Description
Technical field：
The present invention relates to the processing technique field of ball bar array architecture PCB, displayed for ball bar in particular to one kind
The laser removing glue device and method of structure PCB.
Background technology：
Due to being improved with the epoch, the volume of mobile phone is often all less and less, and function also variation, as present
Intelligent mobile phone, but therefore the electronic instrument of precision is frequently used down that barrier rate will be higher, and intolerant to falling, and mobile phone master now
Machine plate is all using BGA package technology.
Ball form encapsulation (Ball Grid Array, BGA, also referred to as tin ball array are encapsulated or tin pin packaging body), BGA envelopes
Dress technology is commonly applied to the encapsulation field of the large scale integrated circuits such as the internal memory of mobile computer, hand-set host board chip group,
And have the characteristics of BGA package technology：Although I/O number of lead wires increases, but wire pitch is not small, thus improves assembling yield；
Although power increases, BGA can improve electric heating property；Concentration and weight encapsulation technology all than before have been reduced, and signal is passed
Defeated delay is small, and frequency of use is greatly promoted, and reliability is high, but BGA package still takes the larger problem of substrate area.
In the prior art, often using epoxy resin to reach fixed effect in BGA package technology, and epoxy resin be for
Thermosetting plastics, quickly need to can just remove epoxy resin by high temperature, but temperature is too high can destroy Mobile phone PCB, so working as
Mobile phone breaks down and send when repairing, and is often manually to strike off the epoxy resin on BGA, and this processing mode often results in tin ball and scraping
Be scraped during removing, or finding around struck off, cause electronic building brick to be damaged, and the artificial cost time struck off also compared with
Often easily cause fatigue.
In order to solve the above-mentioned technical problem, the patent of invention of Application No. CN201110437631.6 utilizes laser by PCB
Epoxy resin removal in the BGA package of plate, and using comparing in database, the relative heat resisting temperature of tin ball is found out, keep away
Exempt from laser damage tin ball, and more rapidly can be removed epoxy resin using laser, and improve the laser of maintenance pcb board yield
Except adhesive process.
The content of the invention：
Technical problem solved by the invention：How pcb board to be processed to be automatically loaded onto laser except adhesive dispenser
Processing platform.
In order to solve the above technical problems, the present invention provides following technical scheme：
A kind of laser for ball bar array architecture PCB removes adhesive dispenser, including removing glue mechanism, material pulling mechanism, accommodating mechanism；
The removing glue mechanism includes a pair or so setting frame plates, the processing base plate between a pair of frame plate, horizontal strokes
Crossbeam across a pair of frame plate, the laser module on crossbeam；The pair of frame plate is provided with Y-direction slideway, the horizontal stroke
Beam is provided with X to slideway, and the both ends of the crossbeam are slidably fitted on the Y-direction slideway of a pair of frame plate, the laser module
The X of crossbeam is slidably fitted in on slideway；The laser module includes that image determines device, Thickness Measurement by Microwave induction installation, laser dress
Put；
The accommodating mechanism includes support, containing box, a pair of elevating mechanisms；
The support is provided with a pair of limiting plates, and limiting plate is in angle bar shape, and limiting plate is vertically arranged on support, a pair of limits
Position plate is located at the left and right sides of support；
The containing box is in rectangular-shape, and containing box includes a pair of side plates, the top board of connection a pair of side plates；In a pair of side plates
Be provided with multipair parting bead, it is any to parting bead in two parting beads be oppositely arranged in a pair of side plates, it is any to parting bead in two every
Bar is contour, and multipair parting bead is with being set in sequence in a pair of side plates from bottom to up；It is any to being placed with charging tray on parting bead, charging tray
Front side is provided with cylindrical by draw piece, and pcb board is positioned with the charging tray；
The pair of elevating mechanism be arranged on support both sides, each elevating mechanism include rack-mount bearing,
The lift block that the servomotor and threaded rod that the threaded rod for being articulated on bearing and being vertically arranged couples with threaded rod are spirally connected；Institute
State bearing and open up the gathering sill for moving towards up and down, the lift block is slidably fastened in the gathering sill of elevating mechanism；
The containing box is placed on a pair of lift blocks, and a pair vertical seamed edges of the rear end face both sides of containing box are close to limit
On the plate of position；
The material pulling mechanism is located at the front of accommodating mechanism；The material pulling mechanism includes drawing material frame platform, is slidably fitted in
Draw drawing material module, being drawn for driving on drawing material frame platform and expect what module level was moved back and forth on the table top of material frame platform
Drive device, a pair of charging tray guide rails on the table top for drawing material frame platform；It is described to draw material module to be located at a pair of charging tray guide rails
Between, draw material module include being slidably fitted on the table top for drawing material frame platform draw flitch, installed in draw on flitch top surface the
One draws material cylinder, the first plug-in unit for expecting cylinder piston rod top is drawn installed in first, and the first plug-in unit is cylindrical, and described first inserts
The external diameter of part is less than by the internal diameter of draw piece；
In material pulling mechanism, described to draw material frame platform to open up lifting through hole and guide through hole, lifting through hole and guide through hole connect
It is near to draw the front end for expecting frame platform, elevating lever is plugged in the lifting through hole, guide post is plugged in guide through hole, the elevating lever
Top is provided with lifting plate, and the guide post is connected to the bottom of lifting plate, the bottom connection lifting air of the elevating lever
Cylinder, lift cylinder is fixed on the bottom for drawing material frame platform；
In removing glue mechanism, it is described processing base plate be located at lifting plate top, processing base plate on open up one can supply disk lead to
The square gap crossed, is provided with positioning telescopic cylinder on processing base plate, positioning telescopic cylinder is distributed in four sides of square gap.
By above-mentioned technical proposal, the laser for ball bar array architecture PCB of the present invention is except the operation principle of adhesive dispenser
It is as follows：
First, it is positioned with the charging tray of pcb board and is successively placed on the parting bead of the containing box of accommodating mechanism；In material pulling mechanism
Drive device drives the side for drawing flitch to move to accommodating mechanism, charging tray guide rail to be alignd with parting bead, i.e. charging tray guide rail is held in the mouth with parting bead
Connect；Draw the first drawing material cylinder on flitch to stretch, in the first plug-in unit insertion accommodating mechanism on charging tray by draw piece；Afterwards, exist
Under the driving of drive device, draw material module that charging tray is pulled at the front end of material frame platform from the rear end of drawing material frame platform, this
When, charging tray is located at the underface of processing base plate；Afterwards, lift cylinder drives lifting plate that charging tray is supported to the side of processing base plate
In shape gap, multiple positioning telescopic cylinder clamping and positioning charging tray.
Second, the volume of measurement device pcb board is determined to carry out image positioning using image；Afterwards, using Thickness Measurement by Microwave sense
Device is answered to detect epoxy resin coating thickness and epoxy resin the coating scope of the BGA package on pcb board；By image positioning and
Number in the epoxy resin coating thickness of the BGA package on detecting pcb board and the result and database of epoxy resin coating scope
Value is compared, and with energy is 1~100% or frequency is 1~100KHZ or number of times for 1 using laser aid and the result that detects
The laser of~10 times compares out data by database, and the epoxy resin of different-thickness is fully erased；After removing totally
Can be by pcb board blanking.
3rd, in accommodating mechanism, a pair of elevating mechanisms drive a pair of lift blocks to rise, and a pair of lift blocks are upward by containing box
The certain height of lifting, makes lower a pair of parting beads be flushed and tandem array with a pair of charging tray guide rails；Afterwards, material module is drawn under described
A pair of parting beads pull up feeding disk；In this way, gradually rising with containing box, the charging tray being placed in containing box is successively taken away.
By above-mentioned technical proposal, pcb board to be processed automatically can be loaded onto the present invention processing bottom of removing glue mechanism
On plate, to improve the efficiency of the laser removing glue of ball bar array architecture PCB.
One kind explanation as the present invention to removing glue mechanism, the pair of frame plate includes left frame plate and right frame plate,
The left frame plate is provided with the first Y-direction slideway, and right frame plate is provided with the second Y-direction slideway；Opened up on the first Y-direction slideway
The first trapezoidal Y-direction chute of cross section, opens up the second trapezoidal Y-direction chute of cross section on the second Y-direction slideway；It is described
The left part of crossbeam is provided with the first trapezoidal sliding block of cross section, and the right part of crossbeam is provided with the second trapezoidal cunning of cross section
Block；First sliding block and the first Y-direction chute coordinate, and the second sliding block and the second Y-direction chute coordinate；The left part of the crossbeam sets
There is the first Y-direction drive device, the first Y-direction drive device includes being arranged on the first side plate of crossbeam left part, is articulated in the
The first drive gear on side plate, the first motor coupled on the first side plate and with the first drive gear；Institute
State and the first groove is opened up on the side wall of left frame plate, the roof of the first groove is provided with the first tooth bar, first drive gear
In the first groove, the first drive gear is engaged with the first tooth bar；The right part of the crossbeam is provided with the second Y-direction and drives dress
Put, the second Y-direction drive device includes being arranged on the second side plate of crossbeam right part, the second drive being articulated on the second side plate
Moving gear, the second motor coupled on the second side plate and with the second drive gear；The side wall of the right frame plate
On open up the second groove, the roof of the second groove is provided with the second tooth bar, and second drive gear is located in the second groove, the
Two drive gears are engaged with the second tooth bar.
As described above, the first motor drives the rotation of the first drive gear, due to the first drive gear and the first tooth
Bar is engaged, and the first tooth bar is arranged in the first groove of left frame plate, therefore, the first driving gear drives crossbeam of rotation
Left part is moved along the first Y-direction slideway on left frame plate, specifically, the first sliding block on crossbeam in the first Y-direction slideway the
Moved in one Y-direction chute；Similarly, the right part edge of the second driving gear drives crossbeam for being driven by the second motor and being rotated
The second Y-direction slideway movement on right frame plate, specifically, the second Y-direction chute of the second sliding block on crossbeam in the second Y-direction slideway
Interior movement.In this way, action can synchronously drive crossbeam on left frame plate and the right side while the first motor and the second motor
Make Y-direction movement on frame plate.
One kind explanation as the present invention to removing glue mechanism, the X is to opening up the trapezoidal X in cross section to cunning on slideway
Groove, the laser module is provided with the 3rd trapezoidal sliding block of cross section；3rd sliding block coordinates with X to chute；It is described to swash
Optical module is provided with X to drive device, and the X includes the 3rd side plate being arranged on the 3rd sliding block, is articulated in drive device
The 3rd drive gear on 3rd side plate, the 3rd motor coupled on the 3rd side plate and with the 3rd drive gear；
The 3rd groove is opened up on the side wall of the crossbeam, the roof of the 3rd groove is provided with the 3rd tooth bar, the 3rd drive gear position
In in the 3rd groove, the 3rd drive gear is engaged with the 3rd tooth bar.
As described above, the 3rd motor drives the rotation of the 3rd drive gear, due to the 3rd drive gear and the 3rd tooth
Bar is engaged, and the 3rd tooth bar is arranged in the 3rd groove of crossbeam, therefore, the 3rd driving gear drives the 3rd of rotation are slided
(the 3rd sliding block drives laser module) moves along the X on crossbeam to slideway.
One kind explanation as the present invention to removing glue mechanism, the laser module includes the rotation on the 3rd sliding block
Mechanism, the image determines device, Thickness Measurement by Microwave induction installation, laser aid and is installed on rotating mechanism；The image is determined
Device is CCD scope interpretation locators；The Thickness Measurement by Microwave induction installation is red laser sensor；The laser aid swashs for CO
Electro-optical device.The rotating mechanism can be fixed on the motor on the 3rd sliding block for rotary shaft, and the image determines device, Thickness Measurement by Microwave
Induction installation, laser aid are arranged on the bottom of motor；Certainly, the rotating mechanism also can be general in the prior art have
The mechanism of spinfunction.
One kind explanation as the present invention to material pulling mechanism, described drawing expects that the table top of frame platform is provided with a pair of drawing material and leads
Rail, the bottom surface of the drawing flitch is provided with and the drawing material sliding block for drawing material guide rail to coordinate.The drawing flitch top surface is provided with the second drawing
Material cylinder, second draws the piston rod top of material cylinder to be provided with the second plug-in unit, and the second plug-in unit is cylindrical, the external diameter of the second plug-in unit
Less than by the internal diameter of draw piece；First plug-in unit and the second plug-in unit are oppositely arranged.As described above, material pulling mechanism charging tray to be drawn
When, the first plug-in unit and the second plug-in unit are located at charging tray by the both sides of draw piece, and under the first driving for drawing material cylinder, the first plug-in unit is from quilt
By draw piece, under the second driving for drawing material cylinder, the second plug-in unit is inserted by draw piece from by the right-hand member of draw piece for the left end insertion of draw piece.
One kind explanation as the present invention to material pulling mechanism, the drive device includes the second motor, is articulated in drawing material machine
The 3rd Timing Belt wheel shaft on the table top of pallet, the 3rd synchronous pulley on the 3rd Timing Belt wheel shaft, be articulated in drawing material
The 4th Timing Belt wheel shaft on the table top of frame platform, the 4th synchronous pulley on the 4th Timing Belt wheel shaft, connection the 3rd
Second Timing Belt of synchronous pulley and the 4th synchronous pulley；Second motor and the 3rd Timing Belt wheel shaft or the 4th synchronous pulley
Axle couples, and the 3rd Timing Belt wheel shaft and the 4th Timing Belt wheel shaft are vertically arranged on the table top for drawing material frame platform；The drawing
Flitch is located at the top of the second Timing Belt, draws the bottom of flitch to be fixedly connected with the second Timing Belt；3rd synchronous pulley and
It is arranged on before and after 4th synchronous pulley on drawing material frame platform, the lifting plate is located at the 3rd synchronous pulley and the 4th synchronous pulley
Between.The level of material pulling mechanism draws material to be completed using synchronous pulley mechanism, simple structure, reduces cost.
Brief description of the drawings：
The present invention is described further below in conjunction with the accompanying drawings：
Fig. 1 is a kind of laser for ball bar array architecture PCB of the invention except the structural representation of adhesive dispenser；
Fig. 2 is the structural representation of Tu1Zhong removing glues mechanism 10；
Fig. 3 is the structural representation in Fig. 2 from the gained of another view removing glue mechanism 10；
Fig. 4 is the structural representation of material pulling mechanism 20 in Fig. 1；
Fig. 5 is the structural representation in Fig. 4 from the gained of another view material pulling mechanism 20；
Fig. 6 is the structural representation of accommodating mechanism 80 in Fig. 1.
Symbol description in figure：
10th, removing glue mechanism；11st, base plate is processed；12nd, frame plate；121st, the first Y-direction slideway；122nd, the first Y-direction chute；
123rd, the first groove；124th, the first tooth bar；13rd, crossbeam；131st, the first sliding block；132nd, X is to chute；133rd, the 3rd groove；134、
3rd tooth bar；14th, laser module；141st, the 3rd sliding block；143rd, Thickness Measurement by Microwave induction installation；144th, laser aid；145th, whirler
Structure；
16th, the first Y-direction drive device；161st, the first side plate；162nd, the first drive gear；163rd, the first motor；17、
X is to drive device；171st, the 3rd side plate；172nd, the 3rd drive gear；173rd, the 3rd motor；
20th, material pulling mechanism；21st, material frame platform is drawn；212nd, material guide rail is drawn；22nd, material module is drawn；221st, flitch is drawn；223rd,
One draws material cylinder；225th, the first plug-in unit；226th, second material cylinder is drawn；23rd, drive device；231st, the 3rd synchronous pulley；232nd,
Two Timing Belts；24th, charging tray guide rail；251st, elevating lever；252nd, guide post；253rd, plate is lifted；254th, lift cylinder；110th, it is square
Gap；112nd, telescopic cylinder is positioned；
30th, transfer mechanism；31st, column；32nd, straight line lift cylinder；33rd, straight line Rodless cylinder；34th, rod member；35th, the 5th inhales
Disk；36th, strip base；37th, the first threaded rod；
40th, charging tray；41st, by draw piece；
80th, accommodating mechanism；81st, support；810th, limiting plate；82nd, containing box；821st, side plate；822nd, top board；823rd, parting bead；
84th, elevating mechanism；841st, bearing；842nd, threaded rod；843rd, lift block；844th, gathering sill.
Specific embodiment：
Such as Fig. 1, a kind of laser for ball bar array architecture PCB is except adhesive dispenser, including removing glue mechanism 10, material pulling mechanism
20th, accommodating mechanism 80.
With reference to Fig. 2, Fig. 3, the removing glue mechanism 10 include a pair or so set frame plates 12, installed in a pair of frame plate it
Between processing base plate 11, the crossbeam 13 across a pair of frame plate, the laser module 14 on crossbeam；The pair of frame plate
Y-direction slideway is provided with, the crossbeam is provided with X to slideway, and the both ends of the crossbeam are slidably fitted in the Y-direction of a pair of frame plate
On slideway, the laser module is slidably fitted in the X of crossbeam on slideway；The laser module includes that image determines device, surveys
Thickness induction installation 143, laser aid 144.
In removing glue mechanism 10, the processing base plate is located at the top of lifting plate, and opening up one on processing base plate can supply disk
The square gap 110 for passing through, is provided with positioning telescopic cylinder 112 on processing base plate, positioning telescopic cylinder is distributed in square gap
Four sides.
In removing glue mechanism 10, the pair of frame plate 12 includes left frame plate and right frame plate, is set on the left frame plate
There is the first Y-direction slideway 121, right frame plate is provided with the second Y-direction slideway；It is trapezoidal cross section to be opened up on the first Y-direction slideway
The first Y-direction chute 122, the second trapezoidal Y-direction chute of cross section is opened up on the second Y-direction slideway；The crossbeam 13
Left part is provided with the first trapezoidal sliding block 131 of cross section, and the right part of crossbeam is provided with the second trapezoidal sliding block of cross section；Institute
State the first sliding block and the first Y-direction chute coordinates, the second sliding block and the second Y-direction chute coordinate.The left part of the crossbeam is provided with
One Y-direction drive device 16, the first Y-direction drive device includes being arranged on the first side plate 161 of crossbeam left part, is articulated in the
The first drive gear 162 on side plate, the first motor coupled on the first side plate and with the first drive gear
163；The first groove 123 is opened up on the side wall of the left frame plate, the roof of the first groove is provided with the first tooth bar 124, described
First drive gear is located in the first groove, and the first drive gear is engaged with the first tooth bar.The right part of the crossbeam is provided with
Two Y-direction drive devices, the second Y-direction drive device includes being arranged on the second side plate of crossbeam right part, is articulated in the second side
The second drive gear on plate, the second motor coupled on the second side plate and with the second drive gear；The right side
The second groove is opened up on the side wall of frame plate, the roof of the second groove is provided with the second tooth bar, and second drive gear is located at
In second groove, the second drive gear is engaged with the second tooth bar.
In removing glue mechanism 10, the X is to opening up the trapezoidal X in cross section to chute 132, the laser module 14 on slideway
It is provided with the 3rd trapezoidal sliding block 141 of cross section；3rd sliding block coordinates with X to chute；The laser module is provided with X
To drive device 17, the X includes the 3rd side plate 171 being arranged on the 3rd sliding block, is articulated in the 3rd side plate to drive device
On the 3rd drive gear 172, the 3rd motor 173 that couples on the 3rd side plate and with the 3rd drive gear；Institute
State and the 3rd groove 133 is opened up on the side wall of crossbeam 13, the roof of the 3rd groove is provided with the 3rd tooth bar 134, and the described 3rd drives
Gear is located in the 3rd groove, and the 3rd drive gear is engaged with the 3rd tooth bar.
In removing glue mechanism 10, the laser module 14 includes the rotating mechanism 145 on the 3rd sliding block 141, described
Image determines device, Thickness Measurement by Microwave induction installation 143, laser aid 144 and is installed on rotating mechanism；The image determines device
It is CCD scope interpretation locators；The Thickness Measurement by Microwave induction installation is red laser sensor；The laser aid is CO2 laser
Device.
Such as Fig. 6, the accommodating mechanism 80 includes support 81, containing box 82, a pair of elevating mechanisms 84；The support is provided with
A pair of limiting plates 810, limiting plate is in angle bar shape, and limiting plate is vertically arranged on support, and a pair of limiting plates are located at the left and right of support
Both sides；The containing box is in rectangular-shape, and containing box includes a pair of side plates 821, the top board 822 of connection a pair of side plates；One offside
Plate is provided with multipair parting bead 823, it is any to parting bead in two parting beads be oppositely arranged in a pair of side plates, it is any in parting bead
Two parting beads are contour, and multipair parting bead is with being set in sequence in a pair of side plates from bottom to up；It is any to being placed with charging tray on parting bead
40, it is provided with cylindrical by draw piece 41 on front side of charging tray, it is positioned with pcb board in the charging tray.
In accommodating mechanism 80, the pair of elevating mechanism is arranged on the both sides of support, and each elevating mechanism includes being arranged on
Servomotor and spiral shell that bearing 841 on support, the threaded rod 842 for being articulated on bearing and being vertically arranged couple with threaded rod
The lift block 843 that rasp bar is spirally connected；The bearing opens up the gathering sill 844 for moving towards up and down, and the lift block is slidably fastened in lifting
In the gathering sill of mechanism.The containing box is placed on a pair of lift blocks, a pair vertical seamed edges of the rear end face both sides of containing box
It is close on limiting plate.
With reference to Fig. 4, Fig. 5, the material pulling mechanism 20 is located at the front of accommodating mechanism；The material pulling mechanism includes drawing material frame
Platform 21, be slidably fitted in draw material frame platform table top on drawing material module 22, installed in draw material frame platform on for drive draw material
Drive device 23, a pair of charging tray guide rails 24 on the table top for drawing material frame platform that module level is moved back and forth；The drawing
Material module is located between a pair of charging tray guide rails, draws material module to include the drawing flitch being slidably fitted on the table top for drawing material frame platform
221st, installed in the first drawing material cylinder 223 drawn on flitch top surface, installed in first the first of material cylinder piston rod top is drawn to insert
Part 225, the first plug-in unit is cylindrical, and the external diameter of first plug-in unit is less than by the internal diameter of draw piece.
It is described to draw material frame platform to open up lifting through hole and guide through hole in material pulling mechanism 20, lift through hole and guide through hole
Close to the front end for drawing material frame platform, elevating lever 251 is plugged in the lifting through hole, guide post 252 is plugged in guide through hole, it is described
The top of elevating lever is provided with lifting plate 253, and the guide post is connected to the bottom of lifting plate, the bottom of the elevating lever
Connection lift cylinder 254, lift cylinder is fixed on the bottom for drawing material frame platform.
In material pulling mechanism 20, the table top for drawing material frame platform 21 is provided with a pair of drawing material guide rails 212, the drawing flitch
221 bottom surface is provided with and the drawing material sliding block for drawing material guide rail to coordinate；The drawing top surface of flitch 221 is provided with the second drawing material cylinder
226, second draws the piston rod top of material cylinder to be provided with the second plug-in unit, and the second plug-in unit is cylindrical, and the external diameter of the second plug-in unit is small
In by the internal diameter of draw piece 41；The plug-in unit of first plug-in unit 225 and second is oppositely arranged.
In material pulling mechanism 20, the drive device 23 includes the second motor, is articulated in and draws on the table top for expecting frame platform 21
3rd Timing Belt wheel shaft, the 3rd synchronous pulley 231 on the 3rd Timing Belt wheel shaft, the table top for being articulated in drawing material frame platform
On the 4th Timing Belt wheel shaft, the 4th synchronous pulley on the 4th Timing Belt wheel shaft, the 3rd synchronous pulley of connection and the
Second Timing Belt 232 of four synchronous pulleys；Second motor couples with the 3rd Timing Belt wheel shaft or the 4th Timing Belt wheel shaft, institute
State the 3rd Timing Belt wheel shaft and the 4th Timing Belt wheel shaft is vertically arranged on the table top for drawing material frame platform；The drawing flitch 221
In the top of the second Timing Belt, the bottom of flitch is drawn to be fixedly connected with the second Timing Belt；3rd synchronous pulley and the 4th same
Be arranged on before and after step belt wheel on drawing material frame platform, the lifting plate 253 be located at the 3rd synchronous pulley and the 4th synchronous pulley it
Between.
A kind of method that laser for ball bar array architecture PCB carries out laser removing glue except adhesive dispenser, comprises the following steps：
First, feeding：Drive device 23 in material pulling mechanism 20 drives the side for drawing flitch 221 to move to accommodating mechanism 80,
Draw the on flitch first drawing material cylinder 223 to stretch, in the insertion accommodating mechanism of the first plug-in unit 225 on charging tray 40 by draw piece 41；
Afterwards, under the driving of drive device, draw material module 22 that charging tray is pulled into material frame platform from the rear end of drawing material frame platform 21
Front end at, now, charging tray be located at processing base plate 11 underface；Afterwards, lift cylinder 254 drives lifting plate 253 by material
Pan arrest is risen in the square gap 110 of processing base plate, the multiple positioning clamping and positioning charging tray of telescopic cylinder 112；
Second, image positioning：The volume of measurement device pcb board is determined using image；
3rd, Thickness Measurement by Microwave sensing：Applied using the epoxy resin of the BGA package on the detecting pcb board of Thickness Measurement by Microwave induction installation 143
Cloth thickness and epoxy resin coating scope；
4th, laser removing glue：By numeric ratio pair in second step and third step detecting result and database, using laser
Device 144 and the result for detecting, the laser that with energy be 1~100% or frequency is 1~100KHZ or number of times is 1~10 time
Data are compared out by database, the epoxy resin of different-thickness is fully erased；
5th, blanking：Can be by pcb board blanking after removing totally.
Above content is only better embodiment of the invention, for one of ordinary skill in the art, according to the present invention
Thought, will change in specific embodiments and applications, this specification content should not be construed as to this hair
Bright limitation.
Claims (7)
1. a kind of laser for ball bar array architecture PCB removes adhesive dispenser, including removing glue mechanism (10), material pulling mechanism (20), receipts
Receive mechanism (80)；
The removing glue mechanism (10) sets frame plate (12), the processing base plate between a pair of frame plate including a pair or so
(11) crossbeam (13), across a pair of frame plate, the laser module (14) on crossbeam；The pair of frame plate is provided with
Y-direction slideway, the crossbeam is provided with X to slideway, and the both ends of the crossbeam are slidably fitted in the Y-direction slideway of a pair of frame plate
On, the laser module is slidably fitted in the X of crossbeam on slideway；The laser module includes that image determines device, Thickness Measurement by Microwave
Induction installation (143), laser aid (144)；It is characterized in that：
The accommodating mechanism includes support (81), containing box (82), a pair of elevating mechanisms (84)；
The support is provided with a pair of limiting plates (810), and limiting plate is in angle bar shape, and limiting plate is vertically arranged on support, a pair
Limiting plate is located at the left and right sides of support；
The containing box is in rectangular-shape, and containing box includes a pair of side plates (821), the top board (822) of connection a pair of side plates；A pair
Side plate is provided with multipair parting bead (823), it is any to parting bead in two parting beads be oppositely arranged in a pair of side plates, it is any to parting bead
In two parting beads it is contour, multipair parting bead is with being set in sequence in a pair of side plates from bottom to up；It is any to being placed with parting bead
Charging tray (40), is provided with cylindrical by draw piece (41) on front side of charging tray, pcb board is positioned with the charging tray；
The pair of elevating mechanism be arranged on support both sides, each elevating mechanism include rack-mount bearing (841),
The lifting that the servomotor and threaded rod that the threaded rod (842) for being articulated on bearing and being vertically arranged couples with threaded rod are spirally connected
Block (843)；The bearing opens up the gathering sill (844) for moving towards up and down, and the lift block is slidably fastened in the guiding of elevating mechanism
In groove；
The containing box is placed on a pair of lift blocks, and a pair vertical seamed edges of the rear end face both sides of containing box are close to limiting plate
On；
The material pulling mechanism is located at the front of accommodating mechanism；The material pulling mechanism includes drawing material frame platform (21), is slidably fitted in
Drawing material module (22) on the table top of material frame platform is drawn, is used to drive to draw on drawing material frame platform and is expected that module level is back and forth moved
Dynamic drive device (23), a pair of charging tray guide rails (24) on the table top for drawing material frame platform；It is described to draw material module to be located at
Between a pair of charging tray guide rails, material module is drawn to include the drawing flitch (221) being slidably fitted on the table top for drawing material frame platform, be arranged on
Draw the first drawing material cylinder (223) on flitch top surface, the first plug-in unit (225) for expecting cylinder piston rod top drawn installed in first,
First plug-in unit is cylindrical, and the external diameter of first plug-in unit is less than by the internal diameter of draw piece；
In material pulling mechanism, the drawing material frame platform opens up lifting through hole and guide through hole, lifting through hole and the close drawing of guide through hole
Expect the front end of frame platform, elevating lever (251) is plugged in the lifting through hole, guide post (252), the liter are plugged in guide through hole
The top for dropping bar is provided with lifting plate (253), and the guide post is connected to the bottom of lifting plate, the bottom of the elevating lever
Connection lift cylinder (254), lift cylinder is fixed on the bottom for drawing material frame platform；
In removing glue mechanism, the processing base plate is located at the top of lifting plate, opened up on processing base plate one can supply disk pass through
Square gap (110), is provided with positioning telescopic cylinder (112) on processing base plate, positioning telescopic cylinder is distributed in square gap
Four sides.
2. a kind of laser for ball bar array architecture PCB as claimed in claim 1 removes adhesive dispenser, it is characterised in that：Removing glue
In mechanism (10), the pair of frame plate (12) includes left frame plate and right frame plate, and the left frame plate is provided with the first Y-direction
Slideway (121), right frame plate is provided with the second Y-direction slideway；The trapezoidal Y in cross section is opened up on the first Y-direction slideway
To chute (122), the second trapezoidal Y-direction chute of cross section is opened up on the second Y-direction slideway；The left end of the crossbeam (13)
Portion is provided with trapezoidal the first sliding block (131) in cross section, and the right part of crossbeam is provided with the second trapezoidal sliding block of cross section；It is described
First sliding block and the first Y-direction chute coordinate, and the second sliding block and the second Y-direction chute coordinate；
The left part of the crossbeam is provided with the first Y-direction drive device (16), and the first Y-direction drive device includes being arranged on crossbeam
First side plate (161) of left part, the first drive gear (162) being articulated on the first side plate, on the first side plate and
The first motor (163) coupled with the first drive gear；The first groove (123) is opened up on the side wall of the left frame plate,
The roof of the first groove is provided with the first tooth bar (124), and first drive gear is located in the first groove, the first drive gear
Engaged with the first tooth bar；
The right part of the crossbeam is provided with the second Y-direction drive device, and the second Y-direction drive device includes being arranged on crossbeam right-hand member
Second side plate in portion, the second drive gear being articulated on the second side plate, on the second side plate and with the second drive gear
Second motor of connection；The second groove is opened up on the side wall of the right frame plate, the roof of the second groove is provided with second
Tooth bar, second drive gear is located in the second groove, and the second drive gear is engaged with the second tooth bar.
3. a kind of laser for ball bar array architecture PCB as claimed in claim 1 removes adhesive dispenser, it is characterised in that：
In removing glue mechanism (10), the X is to opening up the trapezoidal X in cross section to chute (132), the laser module on slideway
(14) it is provided with the 3rd trapezoidal sliding block (141) of cross section；3rd sliding block coordinates with X to chute；
The laser module is provided with X to drive device (17), and the X includes being arranged on the on the 3rd sliding block to drive device
Three side plates (171), the 3rd drive gear (172) being articulated on the 3rd side plate, on the 3rd side plate and with the 3rd drive
3rd motor (173) of gear connection；The 3rd groove (133) is opened up on the side wall of the crossbeam (13), the 3rd groove
Roof is provided with the 3rd tooth bar (134), and the 3rd drive gear is located in the 3rd groove, the 3rd drive gear and the 3rd tooth bar
Engagement.
4. a kind of laser for ball bar array architecture PCB as claimed in claim 3 removes adhesive dispenser, it is characterised in that：It is described
Laser module (14) includes the rotating mechanism (145) on the 3rd sliding block (141), and the image determines device, Thickness Measurement by Microwave
Induction installation (143), laser aid (144) are installed on rotating mechanism；The image determines device for CCD scope interpretations are fixed
Position device；The Thickness Measurement by Microwave induction installation is red laser sensor；The laser aid is CO2 laser aids.
5. a kind of laser for ball bar array architecture PCB as claimed in claim 1 removes adhesive dispenser, it is characterised in that：Draw material
In mechanism (20), the table top for drawing material frame platform (21) is provided with a pair of drawing material guide rail (212), drawing flitch (221)
Bottom surface is provided with and the drawing material sliding block for drawing material guide rail to coordinate；
Described drawing flitch (221) top surface is provided with the second drawing material cylinder (226), and second draws the piston rod top of material cylinder to be provided with
Second plug-in unit, the second plug-in unit is cylindrical, and the external diameter of the second plug-in unit is less than by the internal diameter of draw piece (41)；First plug-in unit
(225) it is oppositely arranged with the second plug-in unit.
6. a kind of laser for ball bar array architecture PCB as claimed in claim 1 removes adhesive dispenser, it is characterised in that：
In material pulling mechanism (20), the drive device (23) including the second motor, be articulated in draw material frame platform (21) table top on
The 3rd Timing Belt wheel shaft, the 3rd synchronous pulley (231) on the 3rd Timing Belt wheel shaft, be articulated in and draw material frame platform
The 4th Timing Belt wheel shaft on table top, the 4th synchronous pulley on the 4th Timing Belt wheel shaft, the 3rd synchronous pulley of connection
With second Timing Belt (232) of the 4th synchronous pulley；Second motor and the 3rd Timing Belt wheel shaft or the 4th Timing Belt wheel shaft
Connection, the 3rd Timing Belt wheel shaft and the 4th Timing Belt wheel shaft are vertically arranged on the table top for drawing material frame platform；It is described to draw material
Plate (221) draws the bottom of flitch to be fixedly connected with the second Timing Belt positioned at the top of the second Timing Belt；
It is arranged on before and after 3rd synchronous pulley and the 4th synchronous pulley on drawing material frame platform, described lifting plate (253) position
Between the 3rd synchronous pulley and the 4th synchronous pulley.
7. a kind of laser for ball bar array architecture PCB of a kind of utilization claim 1 any one of claim 6
The method that laser removing glue is carried out except adhesive dispenser, it is characterised in that：Methods described comprises the following steps：
First, feeding：Drive device (23) in material pulling mechanism (20) drives the side for drawing flitch (221) to move to accommodating mechanism (80)
Side, draws the first drawing material cylinder (223) on flitch to stretch, the quilt in the first plug-in unit (225) insertion accommodating mechanism on charging tray (40)
In draw piece (41)；Afterwards, under the driving of drive device, material module (22) is drawn by charging tray from the rear end for drawing material frame platform (21)
It is pulled at the front end of material frame platform, now, charging tray is located at the underface of processing base plate (11)；Afterwards, lift cylinder (254) drives
Dynamic lifting plate (253) supports in the square gap (110) of processing base plate charging tray, multiple positioning telescopic cylinder (112) folder
Tightening position charging tray；
Second, image positioning：The volume of measurement device pcb board is determined using image；
3rd, Thickness Measurement by Microwave sensing：It is coated with using the epoxy resin of the BGA package on Thickness Measurement by Microwave induction installation (143) detecting pcb board
Thickness and epoxy resin coating scope；
4th, laser removing glue：By numeric ratio pair in second step and third step detecting result and database, using laser aid
(144) and the result that detects, the laser that with energy be 1~100% or frequency is 1~100KHZ or number of times is 1~10 time is borrowed
Data are compared out by database, the epoxy resin of different-thickness is fully erased；
5th, blanking：Can be by pcb board blanking after removing totally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510778274.8A CN105328344B (en) | 2015-11-14 | 2015-11-14 | A kind of laser removing glue device and method for ball bar array architecture PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510778274.8A CN105328344B (en) | 2015-11-14 | 2015-11-14 | A kind of laser removing glue device and method for ball bar array architecture PCB |
Publications (2)
| Publication Number | Publication Date |
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| CN105328344A CN105328344A (en) | 2016-02-17 |
| CN105328344B true CN105328344B (en) | 2017-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510778274.8A Active CN105328344B (en) | 2015-11-14 | 2015-11-14 | A kind of laser removing glue device and method for ball bar array architecture PCB |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107900520A (en) * | 2017-12-20 | 2018-04-13 | 广东国玉科技有限公司 | A kind of bar code dispels equipment |
| CN111344103B (en) * | 2018-10-24 | 2022-03-25 | 合刃科技（深圳）有限公司 | Coating area positioning method and device based on hyperspectral optical sensor and glue removing system |
| CN111300253B (en) * | 2020-04-11 | 2021-03-30 | 成都四吉达新材料科技有限公司 | Surface processing method of aluminum veneer |
| CN112620029B (en) * | 2020-12-25 | 2022-05-13 | 普科(清新)电路板有限公司 | Electrical engineering is with removing mucilage binding fast and puts to locating hole of PCB board |
| CN115007564B (en) * | 2022-06-16 | 2024-04-09 | 深圳泰德半导体装备有限公司 | Adhesive removing equipment |
| CN117444489B (en) * | 2023-12-20 | 2024-03-15 | 甘肃三阳仓储设备制造有限公司 | Welding device for shelf laminate molding |
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| JP5093850B2 (en) * | 2008-06-26 | 2012-12-12 | リンテック株式会社 | Sheet peeling apparatus and peeling method |
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| US6448108B1 (en) * | 2000-10-02 | 2002-09-10 | Charles W. C. Lin | Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment |
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| CN105328344A (en) | 2016-02-17 |
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