CN105355625A - Light emitting device package - Google Patents

Light emitting device package Download PDF

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Publication number
CN105355625A
CN105355625A CN201510784661.2A CN201510784661A CN105355625A CN 105355625 A CN105355625 A CN 105355625A CN 201510784661 A CN201510784661 A CN 201510784661A CN 105355625 A CN105355625 A CN 105355625A
Authority
CN
China
Prior art keywords
reflector
luminescent device
light emitting
emitting device
reflection subassembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510784661.2A
Other languages
Chinese (zh)
Inventor
闵凤杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100051840A external-priority patent/KR101103674B1/en
Priority claimed from KR1020110034720A external-priority patent/KR101859149B1/en
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN105355625A publication Critical patent/CN105355625A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Abstract

This invention discloses a light emitting device package, which includes a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.

Description

Light emitting device package
The application is the application number submitted on June 1st, 2011 is 201110152173.1, and denomination of invention is the divisional application of the patent application of " light emitting device package ".
the cross reference of related application
This application claims the priority of the korean patent application No.10-2010-0051840 that on June 1st, 2010 submits to, by reference its entirety is incorporated to here, as set forth completely at this.
This application claims the priority of the korean patent application No.10-2011-0034720 that on April 14th, 2011 submits to, by reference its entirety is incorporated to here, as set forth completely at this.
Technical field
The present invention relates to a kind of light emitting device package.
Background technology
The luminescent device of such as light-emitting diode can comprise the semiconductor device converting electrical energy into light.Such light-emitting diode can use such semiconductor device to produce light, thus compared with such as incandescent lamp or fluorescent lamp, consumes relatively few energy.Light-emitting diode can use the gesture gap of semiconductor device to produce light, thus provides relatively long life-span and fast response time, and is environmental protection.
Summary of the invention
Light emitting device package comprises: main body, and this main body has the cavity be formed in wherein, and this cavity comprises side surface and bottom; First reflector and the second reflector, this first reflector and the second reflector to be arranged in the bottom of cavity and to be separated from each other by a part for the bottom of cavity; First luminescent device, this first luminescent device is arranged in the first reflector; And second luminescent device, this second luminescent device is arranged in the second reflector.
First reflector and the second reflector form depression in the bottom of cavity.The part of each in first reflector and the second reflector can be exposed to the outside of main body by main body.The shape and size of the first reflector and the second reflector can almost symmetry.Each side surface of each in first reflector and the second reflector can be between 90 ° and 160 ° relative to the inclination angle of its each basal surface.
Light emitting device package can comprise step edge further, and this step edge is formed between the upper surface of main body and the upper end being formed in the cavity in main body, and the upper surface of this step edge and main body has the difference in height of regulation and is parallel to the upper surface of main body.The upper surface of the first reflector is parallel to the upper surface of the first luminescent device and the upper surface of the second reflector can be parallel to the upper surface of the second luminescent device.The height of the first reflector is greater than the height of the first luminescent device and the height of the second reflector can be greater than the height of the second luminescent device.The degree of depth of the first reflector can be greater than the height of the first luminescent device and can be less than the twice of the height of the first luminescent device, and the degree of depth of the second reflector can be greater than the height of the second luminescent device and can be less than the twice of the height of the second luminescent device.The height of the first reflector can be less than the height of the first luminescent device and the height of the second reflector can be less than the height of the second luminescent device.The degree of depth of the first reflector can be less than the height of the first luminescent device and can be greater than the half of the height of the first luminescent device, and the degree of depth of the second reflector can be less than the height of the second luminescent device and can be greater than the half of the height of the second luminescent device.
Light emitting device package can comprise encapsulating material further, this encapsulating material fill the cavity of main body inside, the inside of the first reflector of the first luminescent device is wherein set and the inside of the second reflector of the second luminescent device is wherein set, with by the first luminescent device and the second luminescent device and external isolation.
Light emitting device package comprises: main body, and this main body has the cavity be formed in wherein; First reflector and the second reflector, this first reflector and the second reflector are arranged in the bottom of cavity; First luminescent device, this first luminescent device is arranged in the first reflector; Second luminescent device, this second luminescent device is arranged in the second reflector; And connection pad, this connection pad to be arranged in the bottom of cavity and to be separated with the second reflector with the first reflector.
First and second reflectors can be separated from each other by a part for the bottom of cavity, and are wherein electrically connected the first luminescent device and the second luminescent device via connection pad.
Light emitting device package can comprise further: the first wiring, this first wiring connection first reflector and first luminescent device; Second wiring, this second wiring connection first luminescent device be connected pad; 3rd wiring, the 3rd wiring connects pad and the second luminescent device; And the 4th connects up, the 4th wiring connection second luminescent device and the second reflector, wherein the first luminescent device and the second luminescent device pass through the first wiring, the second wiring, the 3rd is connected up and the 4th wiring series ground is connected.
Light emitting device package can comprise the first wiring further, this first wiring connection first reflector and first luminescent device; Second wiring, this second wiring connection first luminescent device and second reflector; 3rd wiring, the 3rd wiring connection first reflector and the second luminescent device; And the 4th connects up, the 4th wiring connection second luminescent device and the second reflector, wherein the first luminescent device and the second luminescent device are connected up be connected in parallel by the first wiring, the second wiring, the 3rd wirings and the 4th.
Light emitting device package can comprise the first wiring further, this first wiring connection first reflector and first luminescent device; Second wiring, this second wiring connection first luminescent device and second luminescent device; And the 3rd connects up, the 3rd wiring connection second luminescent device and the second reflector, wherein the first luminescent device and the second luminescent device are connected by the first wiring, the second wiring and the 3rd wiring series.
Light emitting device package comprises: the first and second reflectors, and this first and second reflector is orientated as located adjacent one another, and wherein the profile of the first and second reflectors forms the first and second cavitys respectively; First and second luminescent devices, this first and second luminescent device is separately positioned in the first and second cavitys be formed in the first and second reflectors; Sidewall, the periphery of this side walls enclose first and second reflector; And partition wall, this partition wall is arranged between the first and second reflectors, and wherein the height of partition wall is less than the height of sidewall.
Sidewall upwards can extend to limit the 3rd cavity from the top surface of the first and second reflectors.First and second reflectors can form depression in the bottom of the 3rd cavity.The Part I of the first reflector and the Part I of the second reflector can be exposed to the outside of light emitting device package by each opening in the bottom of the 3rd cavity.The Part II of the first reflector and the Part II of the second reflector can extend to the outside of light emitting device package by the various piece of sidewall.
Light emitting device package can comprise further: connect pad, this connection pad is arranged on the bottom of the 3rd cavity, is separated with the second reflector with the first reflector, is wherein electrically connected the first luminescent device and the second luminescent device via connection pad.Light emitting device package can comprise many wirings further, the wiring of every bar have the first end that is connected to the first or second luminescent device with one that is connected respectively in the first or second reflector or be connected the second end of pad.
Below the top edge that the top surface of the first luminescent device can be positioned at the first reflector and the top surface of the second luminescent device can be positioned at below the top edge of the second reflector.The top surface of the first luminescent device can extend beyond the top edge of the first reflector, and the top surface of the second luminescent device can extend beyond the top edge of the second reflector.The top surface of the first luminescent device can be arranged essentially parallel to the top surface of the first reflector, and the top surface of the second luminescent device can be arranged essentially parallel to the top surface of the second reflector.
The degree of depth of the first reflector can be greater than the height of the first luminescent device and can be less than the twice of the height of the first luminescent device, and the degree of depth of the second reflector can be greater than the height of the second luminescent device and can be less than the twice of the height of the second luminescent device.The degree of depth of the first reflector can be less than the height of the first luminescent device and can be greater than the half of the height of the first luminescent device, and the degree of depth of the second reflector can be less than the height of the second luminescent device and can be greater than the half of the height of the second luminescent device.
Light emitting device package comprises: main body; First reflector and the second reflector, this first reflector and the second reflector are arranged in main body, and are separated from each other by a part for main body; First luminescent device, this first luminescent device is arranged in the first reflector; And second luminescent device, this second luminescent device is arranged in the second reflector, and wherein the first reflector and the second reflector are made up of the material being different from main body.
Light emitting device package can comprise connection pad further, and this connection pad is arranged in main body, and is separated with the second reflector with the first reflector, wherein connects pad and is made up of the material being different from main body.The first luminescent device and the second luminescent device can be electrically connected via connection pad.Main body can by such as polyphthalamide (PPA) or silicon (Si), photosensitive glass (PSG) or sapphire (Al 2o 3) material make.
Light emitting device package comprises main body; First reflector and the second reflector, this first reflector and the second reflector are arranged in main body; First luminescent device, this first luminescent device is arranged in the first reflector, and wherein the first luminescent device comprises the first electrode and the second electrode; And second luminescent device, this second luminescent device is arranged in the second reflector, wherein the second luminescent device comprises third electrode and the 4th electrode, wherein the first electrode be electrically connected to the first reflector and the 4th Electrode connection to the second reflector, and the first electrode and the 4th electrode have polarity different from each other.
Second electrode can be electrically connected to the second reflector, and third electrode is electrically connected to the first reflector.Second electrode is electrically connected to third electrode.
Light emitting device package can comprise connection pad further, and this connection pad to be arranged in main body and to be separated with the second reflector with the first reflector, wherein connects pad and is electrically connected the second electrode and third electrode.First electrode and third electrode can be mutually the same polarity.
Light emitting device package comprises: bottom section body; First reflector, this first reflector is arranged in bottom section body; Second reflector, this second reflector be arranged on bottom in and be separated with the first reflector by a part for bottom section body; First luminescent device, this first luminescent device is arranged in the first reflector; Second luminescent device, this second luminescent device is arranged in the second reflector; And the side surface in bottom section body, this side surface surrounds the first reflector and the second reflector.Light emitting device package can be included in connection pad in bottom section body further and this connection pad is separated with the second reflector with the first reflector by another part of bottom section body.
Accompanying drawing explanation
Describe embodiment in detail with reference to accompanying drawing, wherein identical Reference numeral represents identical element, wherein:
Fig. 1 is according to the perspective view at the light emitting device package of this embodiment broadly described;
Fig. 2 is the bottom view of the light emitting device package shown in Fig. 1;
Fig. 3 is the first end view of the light emitting device package shown in Fig. 1;
Fig. 4 is the second end view of the light emitting device package shown in Fig. 1;
Fig. 5 is the 3rd end view of the light emitting device package shown in Fig. 1;
Fig. 6 is the 4th end view of the light emitting device package shown in Fig. 1;
Fig. 7 is the plane graph of the light emitting device package shown in Fig. 1;
Fig. 8 is the sectional view intercepted along the line A-A ' of the light emitting device package shown in Fig. 7;
Fig. 9 is the sectional view intercepted along the line B-B ' of the light emitting device package shown in Fig. 7;
Figure 10 illustrates being connected in series according to the luminescent device at the light emitting device package of this embodiment broadly described;
Figure 11 illustrates being connected in parallel according to the luminescent device at the light emitting device package of this another embodiment broadly described;
Figure 12 illustrates being connected in series according to the luminescent device at the light emitting device package of this another embodiment broadly described;
Figure 13 a illustrates according to the degree of depth at the first reflector of this embodiment broadly described;
Figure 13 b illustrates according to the degree of depth at the first reflector of this another embodiment broadly described;
Figure 13 c illustrates according to the degree of depth at the first reflector of this another embodiment broadly described;
Figure 14 is according at the first luminescent device of this embodiment broadly described and the second luminescent device;
Figure 15 connects according to first, second, third and the 4th first between the electrode in this embodiment broadly described;
Figure 16 connects according to first, second, third and the 4th second between the electrode in this embodiment broadly described;
Figure 17 is according to first, second, third and the 4th the 3rd connection between electrode in this embodiment broadly described;
Figure 18 is according to the decomposition diagram comprising the lighting apparatus of light emitting device package in this embodiment broadly described; And
Figure 19 is according to the decomposition diagram comprising the display device of light emitting device package in this embodiment broadly described.
Embodiment
In description detailed below, with reference to the accompanying drawing forming its part, and exemplify by means of the illustrative particular implementation broadly described at this.In the accompanying drawings, for convenience of description and clear for the purpose of, the thickness of each layer or size can be exaggerated, omitted or schematically shown.In addition, the size of each element does not need to represent its actual size.In addition, as possible, identical or similar element is represented by identical Reference numeral, although may be described in different drawings.
As shown in fig. 1, can comprise according to the light emitting device package 100 of the embodiment broadly described at this: main body 110, first reflector 122, second reflector 124, connection pad 126, luminescent device 132 and 134, Zener diode 150 and wiring 152,154,156,158 and 159.
Main body 110 can by resin, silicon (Si), metal, photosensitive glass (PSG), the sapphire (Al of such as such as polyphthalamide (PPA) 2o 3) and printed circuit board (PCB) (PCB) in the material of make.In certain embodiments, main body 110 is made up of the resin of such as polyphthalamide (PPA).Main body 110 can be made of a conductor.If main body 110 is made up of electric conducting material, so dielectric film can be formed in main body 110 surface on to prevent main body 110 with the first reflector 122, second reflector 124 and to be connected pad 126 electrical short.
When viewed in top view, according to purposes and the design of specific light emitting device package, the upper surface 106 of main body 110 can have the various shapes of such as triangle, rectangle, polygon, circle or other suitable shape.Such as, as shown in fig. 1, light emitting device package 100 can be used in edge type backlight unit (BLU).Such as, if light emitting device package 100 is applied to portable flash lamp or domestic lighting equipment, so main body 110 can be revised as the size and dimension having and can easily be arranged in portable flash lamp or domestic lighting equipment.
Main body 110 can comprise cavity 105 (hereinafter, being called as " body cavity ").The top of cavity 105 can be unlimited, and can comprise side surface 102 and bottom 103.Body cavity 105 can have cup-shaped or depression container shapes, and the side surface 102 of body cavity 105 can the vertical or inclination relative to bottom 103.Other layout also can be applicable.
When viewed in top view, the shape of body cavity 105 can be circular, ellipse, polygon (such as, rectangle) or other suitable shape.In certain embodiments, the bight of body cavity 105 can become curve.In the embodiment shown in fig. 1, when viewed in top view, the shape of body cavity 105 is in fact octagonal, and the side surface 102 of body cavity 105 comprises eight planes.Four in eight planes each bights that can be called as agent-oriention 110 and form the first plane of the side surface 102 of body cavity 105, and four remaining planes can be called as and to extend between the first plane and to form the second plane of the side surface 102 of the elongation of body cavity 105.The area of the first plane is less than the area of the second plane.First plane can be identical with the shape of the opposite planar in the middle of the second plane.The area of the opposite planar in the middle of the first plane and the second plane can be equal.In another embodiment, the side surface 102 of body cavity 105 can comprise the plane being less than eight, and some of them plane can be can be mutually relative curved surface.
In main body 110 below the bottom 103 that first reflector 122 and the second reflector 124 can be positioned at body cavity 105, thus the first and second reflectors 122 and 124 are separated from each other by a part for the bottom 103 of body cavity 105.The bottom 103 of the first reflector 122 from body cavity 105 can be pressed down, the top of the first reflector 122 is unlimited simultaneously.
Such as, the first cavity 162 can be formed in the bottom 103 of body cavity 105, and the top of the first cavity 162 is unlimited.First cavity 162 can comprise side surface and bottom, and the first reflector 122 can be positioned in the first cavity 162.
Second reflector 124 can be separated with the first cavity 162 and also press down from the bottom 103 of body cavity 105, and the top of the second reflector 124 is unlimited.Such as, the second cavity 164 can be formed in the bottom 103 of body cavity 105, and the top of the second cavity 164 is unlimited.Second cavity 164 can comprise side surface and bottom, and the second reflector 124 can be positioned in the second cavity 164.Second cavity 164 can be separated with the first cavity 162 by the part of bottom 103 between the first reflector 122 and the second reflector 124 for body cavity 105, this part makes the first reflector 122 and the second reflector 124 be separated from each other and isolate.
Time viewed from top, the first cavity 162 and the second cavity 164 can have cup-shaped or depression container shapes, and its side surface can relative to its bottom vertical or inclination.Other layout also can be suitable.
In first reflector 122 and the second reflector 124 each can be exposed to the outside of main body 110 through main body 110 at least partially.Because the outside being exposed to main body 110 at least partially of each in the first reflector 122 and the second reflector 124, so the heat emission that the first luminescent device 132 and the second luminescence chip 134 the produced efficiency to the outside of main body 110 can be improved.
Such as, one end 142 of the first reflector 122 can be exposed to outside through the first side surface of main body 110.Similarly, one end 144 of the second reflector 142 can be exposed to outside through the second side surface of main body 110.First side surface and second side surface of main body 110 can toward each other, or otherwise suitably be located.
First reflector 122 and the second reflector 124 can be made up of the metal material of such as silver, gold, copper or other material, or can be made by plating.First reflector 122 can be made up of the material identical with main body 110 with the second reflector 124, and forms with main body 110.Alternatively, the first reflector 122 and the second reflector 124 can be made up of the material being different from main body 110, and are formed discretely with main body 110.In certain embodiments, the first reflector 122 can be symmetrical relative to being connected pad 126 with the shape and size of the second reflector 124.Connect in the main body 110 below bottom 103 that pad 126 can be formed in body cavity 105, thus connect pad 126 and be separated with the second reflector 124 with the first reflector 122.Connect pad 126 to be made up of electric conducting material.
As shown in fig. 1, connect pad 126 can be positioned between the first reflector 122 and the second reflector 124.Such as, connect pad 126 and can be positioned at the inside of the bottom 103 of body cavity 105, adjacent with the 3rd side surface of body cavity 105 and between the first reflector 122 and the second reflector 124.Other layout also can be suitable.
What connect pad 126 can be exposed to the outside of main body 110 through main body 110 at least partially.Such as, the one end 146 connecting pad 126 can be exposed to outside through the 3rd side surface of body cavity 105.In the present example embodiment, the 3rd side surface of main body 110 can be vertical from the first and second side surfaces of the main body 110 of its process with 144 with the end 142 of 124 relative to the first and second reflectors 122.
Zener diode 150 can be arranged on in the first reflector 122 or the second reflector 124, to improve the puncture voltage of light emitting device package 100.As shown in fig. 1, Zener diode 150 can be arranged on the upper surface 124-1 of the second reflector 124.Other layout also can be suitable.
Fig. 2 is the bottom view of the light emitting device package shown in Fig. 1, and Fig. 3-6 is various end views of the light emitting device package shown in Fig. 1.Referring to figs. 2 to Fig. 6, by the opening wherein formed, the lower surface 202 of the first reflector 122 is exposed on lower surface 107 place of main body 110, and the end 142 of the first reflector 122 is given prominence to from the first side surface 210 of main body 110 and is exposed to the outside of main body 110.By another opening wherein formed, the lower surface 204 of the second reflector 124 is also exposed on lower surface 107 place of main body 110, and the end 144 of the second reflector 124 is given prominence to from the second side surface 220 of main body 110 and is exposed to the outside of main body 110.The end 146 of coupling part 126 is given prominence to from the 3rd side surface 230 of main body 110 and is exposed to the outside of main body 110.The lower surface 202 and 204 of the exposure of the first and second reflectors 122 and 124 and end 142 and 144 can allow the heat trnasfer that the first luminescent device 132 and the second luminescent device 134 produced to the outside of main body 110 and distribute, and allow more effectively to cool light emitting device package.
First and second reflectors 122 can have the various shapes of such as rectangle, circle, U-shaped or other suitable shape with end 142 and 144 and the end 146 of exposure that is connected pad 126 of the exposure of 124.Each thickness of the first reflector 122, second reflector 124 and connection pad 126 can be 200 μm ~ 300 μm.Each thickness of the end 142,144,146 exposed can be 0.2mm ~ 0.3mm.
First luminescent device 132 can be arranged in the first cavity 162 of the first reflector 122, and the second luminescent device 134 can be arranged in the second cavity 164 of the second reflector 124.That is, the first luminescent device 132 can be positioned at the first cavity 162 of the first reflector 122 bottom on and the second luminescent device 134 can be positioned on the bottom of the second cavity 164 of the second reflector 124.First luminescent device 132 can be separated with the side surface of the first cavity 162, and the second luminescent device 134 can be separated with the side surface of the second cavity 164.The length of the first luminescent device 132 and the length of the second luminescent device 134 can be 400 μm ~ 1200 μm respectively.The width of the first luminescent device 132 and the width of the second luminescent device 134 can be 400 μm ~ 1200 μm respectively.The thickness of the first luminescent device 132 and the thickness of the second luminescent device 134 can be 100 μm ~ 200 μm respectively.Such as, the chip size of the first luminescent device 132 and the chip size of the second luminescent device can be 800 μm × 400 μm.The thickness of the first luminescent device 132 and the thickness of the second luminescent device can be 100 μm ~ 150 μm.
Wiring 152,154,156 and 158 can connect the first luminescent device 132 and the second luminescent device 134 via connection pad 126.In the embodiment shown in fig. 1, first wiring 152 connects the first luminescent device 132 and the second reflector 122, second wiring 154 connects the first luminescent device 132 and is connected pad 126,3rd wiring 156 connects pad 126 and the second luminescent device 134, and the 4th wiring 158 connects the second luminescent device 134 and the second reflector 124.Second wiring 154 can be combined in and connect between pad 126 and the first luminescent device 132, and the 3rd wiring 156 can be combined between connection pad 126 and the second luminescent device 134, thus electrical connection the first luminescent device 132 and the second luminescent device 134.
As shown in fig. 1, Zener diode 150 can be arranged on the upper surface 124-1 of the second reflector 124, and can be electrically connected to the first reflector 122 by the 5th wiring 159.Such as, one end of the 5th wiring 159 can be incorporated into Zener diode 150, and the other end of the 5th wiring 159 can be incorporated into the upper surface 122-1 of the first reflector 122.In alternative embodiments, Zener diode 150 can be arranged on the upper surface 122-1 of the first reflector 122, and one end of the 5th wiring 159 can be incorporated into Zener diode 150 and the other end of the 5th wiring 159 can be incorporated into the upper surface 124-1 of the second reflector 124.
Connect pad 126 to be separated with the second reflector 124 with the first reflector 122, therefore independent of the first luminescent device 132 and the second luminescent device 134.This can allow to connect pad 126 and stably be electrically connected in series the first luminescent device 132 and the second luminescent device 134, thus improves electric reliability.
When the first luminescent device 132 and the second luminescent device 134 utilizing emitted light, they can also produce heat in the process of operation.First reflector 122 can prevent the heat that produced by the first luminescent device 132 by radiation or be delivered to main body 110, and the second reflector 124 can prevent the heat that produced by the second luminescent device 134 by radiation or be delivered to main body 110.That is, the first reflector 122 and the second reflector 124 can make the first luminescent device 132 and the second luminescent device 134 thermal release.In addition, the first reflector 122 and the second reflector 124 can prevent the light launched from the first luminescent device 132 from mutually interfering with the light launched from the second luminescent device 134.In addition, because the first reflector 122 and the second reflector 124 are positioned at the inner bottom part place of main body 110, therefore can improve the thermal release between the first reflector 122 and the second reflector 124, and preventing of the interference of light between the first luminescent device 132 and the second luminescent device 134 can be improved.
Therefore, in the present embodiment, first luminescent device 132 is positioned in the first cavity 162 of the first reflector 122, and the second luminescent device 134 is positioned in the second cavity 164 of the second reflector 124, thus the first luminescent device 132 and the mutual light and heat of the second luminescent device 134 are separated.
Resin injection hole 240 in resin injection main body 110 can be able to be formed on the lower surface 107 of main body 110 by it.Resin injection hole 240 can position between the first reflector 122 and the second reflector 124.
Fig. 7 is the plane graph of the light emitting device package shown in Fig. 1.In the figure 7, only in order to knowing conveniently of describing, the wiring 152,154,156,158 and 159 of Fig. 1 is eliminated.As shown in Figure 7, the first reflector 122 and the second reflector 124 can separation finger set a distance D1, and a part for the bottom of the main body 110 can be made up of polyphthalamide (PPA) can be therebetween.
In order to be separated thermal source (heat produced by the operation of the first and second chips 132 and 134) and effectively prevent the interference of light between luminescent device 132 and 134, separating distance D1 between first reflector 122 and the second reflector 124 can be such as, 100 μm or more.Based on the relative size of associated component, other separating distance also can be suitable.
In addition, in order to effectively prevent the interference of light between luminescent device 132 and 134 and increase reflection efficiency, on the bottom that first luminescent device 132 can be positioned at the first reflector 124 and with the side surface separation finger set a distance of the first reflector 122, and the second luminescent device 134 can be positioned at the second reflector 124 bottom on and with the side surface separation finger set a distance of the second reflector 124.Can be equal or unequal from the separating distance of the contralateral surface of the first luminescent device 132 to the first reflector 122.Can be equal or unequal from the separating distance of the contralateral surface of the second luminescent device 134 to the second reflector 124.
Such as, the first luminescent device 132 on the first reflector 122 is arranged on and the pitch be arranged between the second luminescent device 134 on the second reflector 124 can be 2mm ~ 3mm.
Such as, the first luminescent device 132 can be arranged on the center of the bottom of the first reflector 122, and the second luminescent device 134 can be arranged on the center of the bottom of the second reflector 124.
In further detail, the separating distance D2 from the short side surfaces of the first reflector 122 to the first luminescent device 132 can be such as 200 μm, and the separating distance D3 from the surface, long limit of the first reflector 122 to the first luminescent device 132 can be such as 500 μm.Based on the chip size relevant with reflector size, other separating distance also can be suitable.
Connect pad 126 can with the first reflector 122 and the second reflector 124 separation finger set a distance D4, and a part for the bottom of the main body 110 can be made up of polyphthalamide (PPA) can be therebetween.
Such as, the first reflector 122 and the separating distance D4 connected between pad 126 can equal the separating distance D1 between the first reflector 122 and the second reflector 124.Based on the relative size of associated component, other separating distance also can be suitable.
Fig. 8 is the sectional view intercepted along the line A-A ' of the light emitting device package shown in Fig. 7.In fig. 8, only for the sake of clarity, wiring 152,154,156,158 and 159 is eliminated.
As shown in Figure 8, the tiltangleθ 1 of the side surface of the first reflector 122 can be different from the inclination angle of the side surface of body cavity 105.Such as, the side surface of the first reflector 122 can be 90 ~ 160 ° relative to the tiltangleθ 1 of the bottom of the first reflector 122.Other orientation also can be suitable.The side surface 102 of body cavity 105 can be 140 ~ 170 ° relative to the tiltangleθ 2 of the bottom 103 of body cavity 105.
The upper end of the side surface of body cavity 105 can comprise curved edge.That is, the side surface of the upper end of body cavity 105 can be bending.In further detail, body cavity 105 can have the marginal portion 804 between the upper surface 802 and bottom 103 of main body 110.Marginal portion 804 can have difference in height K1 with the upper surface 802 of main body 110, and can be parallel to the upper surface 802 of main body 110.Such as, marginal portion 804 can be formed in the upper end of the side surface 102 of body cavity 105.
Difference in height K1 between the upper surface 802 of body cavity 105 and marginal portion 804 can be such as 50 ~ 80 μm, and the length K2 of marginal portion 804 can be 50 ~ 130 μm.Based on the size of associated component, other height/length also can be suitable.In addition, the upper end of the side surface 102 of body cavity 105 can have the marginal portion more than two, and each marginal portion has difference in height to form a series of step.Can gas leak path be extended in the formation that there is the marginal portion 804 of difference in height K1 with upper surface 802 of the upper end of the side surface 102 of body cavity 105, thus prevent extraneous gas from penetrating into the inside of light emitting device package 100 and therefore improving the air-tightness of light emitting device package 100.
In order to prevent the interference of light between luminescent device 132 and 134 and improve light reflection efficiency, by considering that the height of luminescent device 132 and 134 can determine the depth H of the first reflector 122 and the second reflector 124.
Such as, as shown in Figure 13 a, the upper surface 122-1 of the first reflector 122 can be parallel to be arranged on the first reflector 122 bottom 122-2 on the upper surface of the first luminescent device 132.The depth H 1 of the first reflector 122 can equal the height a1 (H1=a1) of the first luminescent device 132.Depth H 1 can be the distance between the upper surface 122-1 of the first reflector 122 and bottom 122-2.The degree of depth of the second reflector 124 relevant with the height of luminescence chip 134 in the present embodiment can be determined in a similar fashion.In certain embodiments, the degree of depth of the first reflector 122 can equal the degree of depth of the second reflector 124.Reflector 122 and 124 other height and luminescent device 132 and 134 corresponding height and combine also can be suitable.
In the embodiment shown in Figure 13 b, the upper surface 122-1 of the first reflector 122 is higher than the upper surface of the first luminescent device 132 be arranged on the bottom 122-2 of the first reflector 122.That is, the depth H 2 of the first reflector 122 is greater than the height a1 (H2>a1) of the first luminescent device 132.In certain embodiments, the depth H 2 of the first reflector 122 can be greater than the height a1 of the first luminescent device 132 and be less than the twice (a1<H2<2a1) of the height a1 of the first luminescent device 132.The degree of depth of the second reflector 124 relevant with luminescence chip 134 in the present embodiment can be determined in a similar fashion.
In the embodiment shown in Figure 13 c, the upper surface 122-1 of the first reflector 122 is lower than the upper surface of the first luminescent device 132 be arranged on the bottom 122-2 of the first reflector 122.The depth H 3 of the first reflector 122 is less than the height a1 (H3<a1) of the first luminescent device 132.In certain embodiments, the depth H 3 of the first reflector 122 can be less than the height a1 of the first luminescent device 132 and be greater than the half (a1/2<H3<a1) of the height a1 of the first luminescent device 132.The height of the second reflector 124 relevant with luminescence chip 134 in the present embodiment can be determined in a similar fashion.
Fig. 9 is the sectional view intercepted along the line B-B ' of the light emitting device package shown in Fig. 7.In fig .9, only for the sake of clarity, wiring 152,154,156,158 and 159 is eliminated.As shown in Figure 9, the upper surface connecting pad 126 can be basically parallel to the upper surface of the first reflector 122 and the second reflector 124, and when it is through the 3rd side surface 230 of main body 110 and when being exposed to main body 110 outside, the end 146 connecting pad 126 can form a part for the bottom of main body 110.
According in the light emitting device package 100 of the present embodiment, as shown in Figure 8, the inside of body cavity 105 can be filled with encapsulating material 820, so that sealing and protection the first luminescent device 132 and the second luminescent device 134.
Encapsulating material 820 can be filled the inside of the first reflector 122 wherein installing the first luminescent device 132 and wherein be installed the inside of the second reflector 124 and the inside of body cavity 105 of the second luminescent device 134, with by the first luminescent device 132 and the second luminescent device 134 and external isolation.Such as, encapsulating material 820 can be silicon, resin or other such material.By the inside using silicon or resin material to fill body cavity 105, and then suitably curing materials can realize the formation of encapsulating material 820.Encapsulating material 820 can be other material be filled in by rights in cavity 105.
Encapsulating material 820 can comprise fluorophor to change the characteristic of the light launched from the first luminescent device 132 and the second luminescent device 134, and can encourage the light from the first and second luminescent devices 132 and 134 transmittings by fluorophor thus realize different colors.Such as, if luminescent device 132 and 134 is blue LED and encapsulating material 820 comprises yellow fluorophor, so by yellow phosphor stimulation blue light, thus produce white light.If luminescent device 132 and 134 launches ultraviolet (UV) light, so encapsulating material 820 can comprise red (R), green (G) and blue (B) fluorophor to produce white light.In addition, lens also can be arranged on encapsulating material 820 to regulate the distribution of the light launched by light emitting device package 100.
Figure 10 illustrates being connected in series according to the luminescent device at the light emitting device package of this embodiment broadly described.As shown in Figure 10, one end of the first wiring 1052 can be incorporated into the upper surface 122-1 of the first reflector 122, and the other end of the first wiring 1052 can be incorporated into the first luminescent device 132.In addition, one end of the second wiring 1054 can be incorporated into the first luminescent device 132, and the other end of the second wiring 1054 can be incorporated into connection pad 126.One end of 3rd wiring 1056 can be incorporated into and connects pad 126, and the other end of the 3rd wiring 1056 can be incorporated into the second luminescent device 134.In addition, one end of the 4th wiring 1058 can be incorporated into the second luminescent device 134, and the other end of the 4th wiring 1058 can be incorporated into the upper surface 124-1 of the second reflector 124.
Luminescent device 132 and 134 shown in Figure 10 can be in series electrically connected by first to fourth wiring 1052,1054,1056 and 1058.Because realize being connected in series between the luminescent device 132 and 134 shown in Figure 10 via the connection pad 126 independent of luminescent device 132 and 134, so the first luminescent device 132 and the second luminescent device 134 stably can be electrically connected in series, thus improve the electric reliability of light emitting device package.
Figure 11 illustrates being connected in parallel according to the luminescent device at the light emitting device package of this another embodiment broadly described.As shown in Figure 11, one end of the first wiring 1152 can be incorporated into the upper surface 122-1 of the first reflector 122, and the other end of the first wiring 1152 can be incorporated into the first luminescent device 132.One end of second wiring 1154 can be incorporated into the first luminescent device 132, and the other end of the second wiring 1154 can be incorporated into the upper surface 124-1 of the second reflector 124.One end of 3rd wiring 1156 can be incorporated into the upper surface 122-1 of the first reflector 122, and the other end of the 3rd wiring 1156 can be incorporated into the second luminescent device 134.Finally, one end of the 4th wiring 1158 can be incorporated into the second luminescent device 134, and the other end of the 4th wiring 1158 can be incorporated into the upper surface 124-1 of the second reflector 124.Therefore, luminescent device 132 and 134 can be electrically connected in parallel by first to fourth wiring 1152,1154,1156 and 1158.
Figure 12 illustrates being connected in series according to the luminescent device at the light emitting device package of this another embodiment broadly described.As shown in Figure 12, one end of the first wiring 1252 can be incorporated into the upper surface 122-1 of the first reflector 122, and the other end of the first wiring 1252 can be incorporated into the first luminescent device 132.In addition, one end of the second wiring 1254 can be incorporated into the first luminescent device 132, and the other end of the second wiring 1254 directly can be attached to the second luminescent device 134.One end of 3rd wiring 1256 can be incorporated into the second luminescent device 134, and the other end of the 3rd wiring 1256 can be incorporated into the upper surface 124-1 of the second reflector 124.
In series the luminescent device 132 and 134 shown in Figure 12 can be electrically connected by the first to the 3rd wiring 1252,1254 and 1256.Be different from Figure 10, the first luminescent device 132 and the second luminescent device 134 are not carried out connecting via being connected pad 126 but directly being connected by the second wiring 1254.
The above-mentioned wiring being attached to the first reflector 122, second reflector 124, first luminescent device 132, second luminescent device 134 and Zener diode 150 respectively can be positioned at below the upper surface 106 of body cavity 105.
Above-described embodiment does not describe the light emitting device package of a cup type, and depicts wherein luminescent device 132 and 134 and be arranged on light emitting device package 100 in the independent reflector 122 and 124 of in main body 110 two respectively.By such structure, the luminescent device 132 and 134 producing heat during operation can be separated from each other, and the heat produced by luminescent device 132 and 134 can be stopped by reflector 122 and 124, thus prevent the variable color and extend life-span of light emitting device package 100 due to heat of the main body 110 of light emitting device package 100.In addition, two independent reflectors 122 and 124 can prevent the interference of light between luminescent device 132 and 134.
Figure 14 is according at the first luminescent device of this embodiment broadly described and the second luminescent device.As shown in Figure 14, the first luminescent device 132 comprises substrate 20, ray structure 30, conductive layer 40, first electrode 12 and the second electrode 14.Second luminescent device 134 comprises substrate 20, ray structure 30, conductive layer 40, third electrode 16 and the 4th electrode 18.Second luminescent device 134 can comprise the assembly identical with the first luminescent device.
Substrate 20 support ray structure 30 and can be Sapphire Substrate, silicon Si substrate, zinc oxide ZnO substrate and there is stacking GaN, InGaN, AlInGaN, SiC, GaP, InP, Ga thereon 2o 3, and GaAs in the nitride semiconductor substrate of at least one or any one in template substrate.
Ray structure 130 comprises the first conductive type semiconductor layer 32, active layer 33 and second conductive type semiconductor layer 34.Such as, ray structure 30 can be the wherein sequentially stacking structure on a substrate 20 of the first conductive type semiconductor layer 32, active layer 33 and second conductive type semiconductor layer 34.
First conductive type semiconductor layer 32 is arranged on a substrate 20.Such as, the first conductive type semiconductor layer 32 can comprise from having In xal yga 1-x-yn (0≤x≤1,0≤y≤1,0≤x+y≤1) the semi-conducting material of composition, such as, the n-type semiconductor layer selected in GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and the N-shaped alloy that can be doped such as Si, Ge, Sn, Se, Te.
Active layer 22 is arranged on conduction type first semiconductor layer 32.Such as, active layer 33 can comprise and has In xal yga 1-x-ythe semi-conducting material of the composition of N (0≤x≤1,0≤y≤1,0≤x+y≤1), and at least one that select from quantum wire structure, quantum-dot structure, single quantum and multi-quantum pit structure MQW can be comprised.
Second conductive type semiconductor layer 34 is arranged on active layer 33.Such as, second conductive type semiconductor layer 34 can be from having In xal yga 1-x-yn (0≤x≤1,0≤y≤1,0≤x+y≤1) the semi-conducting material of composition, such as, the p-type semiconductor layer selected in GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and the p-type alloy that can be doped such as Mg, Zn, Ca, Sr, Ba.
Ray structure 30 can be wherein carry out mesa etch to expose the structure in the region of the first conductive type semiconductor layer 32 to a part for second conductive type semiconductor layer 34, active layer 33 and the first conductive type semiconductor layer 32.
Conductive layer 40 is arranged on second conductive type semiconductor layer 34.Because conductive layer 40 not only reduces total reflection, and have outstanding transmitance, therefore conductive layer 40 increases the extraction efficiency of the light being transmitted into second conductive type semiconductor layer 34 from active layer 33.Conductive layer 40 can be formed by the transparent oxide race material on the wavelength of light with high-transmission rate.Such as, transparent oxide race material can be ITO (indium tin oxide), TO (tin oxide), IZO (indium-zinc oxide) and ZnO (zinc oxide).
First electrode 12 or third electrode 16 can be arranged on the exposed region of the first conductive type semiconductor layer 32.Second electrode 14 or the 4th electrode 18 can be arranged on conductive layer 40.First electrode 12 and the second electrode 14 are types different from each other.Third electrode 16 and the 4th electrode 14 are types different from each other.First electrode 12 and third electrode 18 are mutually the same types.Second electrode 14 and the 4th electrode 18 are mutually the same types.Such as, the first electrode 12 and third electrode 16 can be n-type electrode, and the second electrode 14 and the 4th electrode 18 can be p-type electrodes.First to fourth electrode 12,14,16,18 can be the individual layer or the multilayer that comprise the alloy of at least one or the material selected from Ti, Al, Al alloy, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Ag alloy, Au, Hf, Pt, Ru and Au.
Figure 15 connects according to first, second, third and the 4th first between the electrode in this embodiment broadly described.As shown in Figure 15, one in the first electrode 12 and the second electrode 14 is electrically connected to the first reflector 122, and in third electrode 16 and the 4th electrode 18 one is electrically connected to the second reflector 124.Connect pad 126 and be electrically connected another and third electrode 16 in the first electrode 12 and the second electrode 14 and another in the 4th electrode 18.
Such as, the first electrode 12 of the first luminescent device 132 can be electrically connected to the first reflector 122 by the first wiring 1052, and the 4th electrode 18 of the second luminescent device 134 can be electrically connected to the second reflector 124 by the 4th wiring 1058.Connect pad 126 by second and the 3rd wiring 1054 and 1056 electrical connection the second electrode 14 of the first luminescent device 132 and the third electrodes 16 of the second luminescent device 134.Second electrode 14 of the first luminescent device can be electrically connected to by the second wiring 1054 and connect pad 126, and the third electrode 16 of the second electrode 134 can be electrically connected to connection pad 126 by the 3rd wiring 1056.
Figure 16 connects according to first, second, third and the 4th second between the electrode in this embodiment broadly described.As shown in Figure 16, one in the first electrode 12 and the second electrode 14 is electrically connected to the first reflector 122, and in third electrode 16 and the 4th electrode 18 one is electrically connected to the second reflector 124.Another in first electrode 12 and the second electrode 14 is electrically connected to the second reflector 124.Another in third electrode 16 and the 4th electrode 18 is electrically connected to the first reflector 122.
Such as, the first electrode 12 of the first luminescent device 132 can be electrically connected to the first reflector 122 by the first wiring 1152, and the 4th electrode 18 of the second luminescent device 134 can be electrically connected to the second reflector 124 by the 4th wiring 1158.Second electrode 14 of the first luminescent device can be electrically connected to the second reflector 124 by the second wiring 1154, and the third electrode 16 of the second luminescent device 134 can be electrically connected to the first reflector 122 by the 3rd wiring 1156.
Figure 17 is according to first, second, third and the 4th the 3rd connection between electrode in this embodiment broadly described.As shown in Figure 17, one in the first electrode 12 and the second electrode 14 is electrically connected to the first reflector 122, and in third electrode 16 and the 4th electrode 18 one is electrically connected to the second reflector 124.Another in first electrode 12 and the second electrode 14 be electrically connected in third electrode 16 and the 4th electrode 18 another.
Such as, the first electrode 12 of the first luminescent device 132 can be electrically connected to the first reflector 122 by the first wiring 1252, and the 4th electrode 18 of the second luminescent device 134 can be electrically connected to the second reflector 124 by the 4th wiring 1258.Second electrode 14 of the first luminescent device can be electrically connected to the third electrode 16 of the second luminescent device 134 by the 3rd wiring 1254.
Figure 18 is included in this to specialize and the decomposition diagram of the lighting apparatus of the light emitting device package broadly described.Lighting apparatus can comprise: light source 750, this light source 750 utilizing emitted light; Shell 700, light source 750 is arranged on wherein; Heat abstractor 740, this heat abstractor 740 distributes the heat of light source 750; And retainer 760, light source 750 and heat abstractor 740 are connected to shell 700 by this retainer 760.
Shell 700 comprises socket connector 710, and this socket connector 710 is for being connected to electrical socket; With main body 730, this main body 730 is connected with socket connector 710.Air flow hole 720 can be formed through main body 730.
Alternatively, multiple air flow hole 720 can be formed through main body 730.That is, an air flow hole 720 can be formed through main body 730, or can be formed through main body 730 with multiple air flow hole of radial arrangements.Other layout of multiple air flow hole 730 also can be suitable.
Multiple light emitting device packages 752 that light source 750 can comprise substrate 754 and be arranged on substrate 754.Substrate 754 can have the shape in the opening that can be inserted into shell 700, and can be made up of the material with relatively high thermal conductivity to transfer heat to heat abstractor 740.
Retainer 760 can be arranged in below light source 750.Retainer 760 can comprise framework and extra air flow hole.Optical component also can be arranged in light source 750 below with diffusion, scattering or the concentrated light launched from the light emitting device package 752 of light source 750.Can adopt according to the light emitting device package in this embodiment broadly described according to the lighting apparatus of the present embodiment, thus extend the life-span of the light emitting device package be arranged on lighting apparatus and prevent the interference of light.
Figure 19 is included in this to specialize and the decomposition diagram of the display device of the light emitting device package broadly described.
Display device 800 can comprise: light source module; Reflecting plate 820, this reflecting plate 820 is arranged on above bottom 810; Light guide plate 840, this light guide plate 840 is positioned at before reflecting plate 820 with the front portion of the photoconduction will launched from light source module to display device 800; Optical sheet, comprises such as prismatic lens 850 and 860, and is positioned at before light guide plate 840; Panel 870, this panel 870 is positioned at before prismatic lens 850 and 860; And colour filter 880, this colour filter 880 is positioned at before panel 870.Bottom 810, reflecting plate 820, light source module, light guide plate 840 and optical sheet can form back light unit.
The light emitting device package 835 that light source module can comprise substrate 830 and be arranged on substrate 830.Printed circuit board (PCB) (PCB) can be used as substrate 830, and the light emitting device package 100 shown in Fig. 1 can be used as light emitting device package 835.Other combination also can be suitable.
Bottom 810 can hold the assembly in display device 800.Reflecting plate 820 can be set to independent element, as shown in Figure 19, or can provide reflecting plate 820 by the front surface of the rear surface or bottom 810 that use the material with high reflectance to apply light guide plate 840.Such as, reflecting plate 820 can having relative high reflectance and can be used for/can carry out under ultra-thin state the material that manufactures by such as polyethylene terephthalate (PET), or other such material is made.
Light guide plate 840 can the light launched from light source module of scattering light to be evenly distributed in difference/all regions of display device 800.Therefore, such as, light guide plate 840 can by the material with high index of refraction and transmissivity of such as polymethyl methacrylate (PMMA), Merlon (PC), polyethylene (PE), or other such material is made.
By using the surface representing light transmission and flexible polymer-coated basilar memebrane can form the first prismatic lens 850, and polymer can comprise the layers of prisms wherein repeating multiple three-dimensional structure with the pattern of specifying.Such as, pattern can be the stripe of wherein replicated ridges and paddy, as shown in Figure 19, or other suitable pattern.
Second prismatic lens 860 can be so constructed, and the ridge that a surface of the basilar memebrane of the second prismatic lens 860 is formed is vertical with the arranged direction of paddy relative to the ridge that a surface of the basilar memebrane at the first prismatic lens 850 is formed with the arranged direction of paddy.Such structure can make the light launched from light source module and reflector plate uniformly distribute towards the whole of panel 870.
Screening glass can be arranged on the top of each in prismatic lens 850 and 860.Screening glass can comprise the protective layer on two surfaces of basilar memebrane, and it comprises light granule proliferation and adhesive.In addition, such as, layers of prisms can be made up of the polymer of such as polyurethane, styrenebutadiene copolymer body, polyacrylate, polymethacrylates, polymethyl methacrylate, polyethylene terephthalate elastomer, polyisoprene, polysilicon etc.
Diffusion sheet can be arranged between light guide plate 840 and the first prismatic lens 850.Diffusion sheet can be made up of polyester or polycarbonate-base material, and can by maximally increasing light projectional angle from the refraction of the light of back light unit incidence and scattering.In addition, diffusion sheet can comprise the supporting layer with light diffusing agent, the ground floor being formed in (on the direction of the first prismatic lens) on light-emitting area and be formed in the second layer in light incident surface (on the direction of reflector plate).First and second layers can not comprise light diffusing agent.
In the present embodiment, optical sheet can comprise the combination of diffusion sheet, the first prismatic lens 850 and the second prismatic lens 860.But such as, optical sheet can comprise other combination of the combination of such as microlens array, diffusion sheet and microlens array or the combination of prismatic lens and microlens array.
Display panels can be used as panel 870.But, also can adopt the display unit of other kind requiring light source.Display floater 870 can be so constructed, and liquid crystal layer is between glass substrate, and polarization plates is arranged on above glass substrate in order to the polarization properties used up.Such liquid crystal layer can have the character between liquid and solid.That is, in liquid crystal layer, the liquid crystal being the organic molecule with the mobility being similar to liquid is aimed at regularly, and use the change of molecular alignment to show image due to the reason liquid crystal layer of external electrical field.
The such display panels used in the display device can be active array type, and transistor can be used as switch to regulate the voltage being applied to each pixel.In addition, colour filter 880 can be arranged on the front surface of panel 870, and can only each pixel of transmission from panel 870 project R, G and B light, thus display image.
Can adopt according to the display device of the present embodiment and specialize and the light emitting device package broadly described at this, thus prevent the interference of light between luminescent device 132 and 134.
To specialize and the light emitting device package broadly described can prevent the variable color of main body to extend the life-span of light emitting device package at this, and can the interference of light be prevented.
This specialize and the light emitting device package broadly described can comprise: main body, this main body has the cavity comprising side surface and bottom; First reflector and the second reflector, this first reflector and the second reflector to be arranged in the bottom of the cavity of main body and to be separated from each other; First luminescent device, this first luminescent device is arranged in the first reflector; And second luminescent device, this second luminescent device is arranged in the second reflector.The first reflector and the second reflector can be pressed down from the bottom of the cavity of main body.First reflector and the second reflector can be made up of of selecting from the group comprising silver, gold and copper.
First reflector and the second reflector can prevent the thermal radiation produced by the first luminescent device and the second luminescent device to main body.
In first reflector and the second reflector each can be exposed to the outside of main body through main body at least partially.The shape and size of the first reflector and the second reflector can be symmetrical.The side surface of each in first reflector and the second reflector can be 90 ~ 160 ° relative to the inclination angle bottom it.
Light emitting device package also can comprise the marginal portion between the upper surface of main body and the bottom of the cavity of main body, and the upper surface of itself and main body has difference in height and is parallel to the upper surface of main body.The upper surface of the first reflector can be parallel to the upper surface of the first luminescent device and the upper surface of the second reflector can be parallel to the upper surface of the second luminescent device.
In another embodiment that this broadly describes, light emitting device package can comprise: main body, and this main body has the cavity comprising side surface and bottom; First reflector and the second reflector, this first reflector and the second reflector to be arranged in the bottom of the cavity of main body and to be separated from each other; First luminescent device, this first luminescent device is arranged in the first reflector; Second luminescent device, this second luminescent device is arranged in the second reflector; And coupling part, this coupling part to be formed in the bottom of the cavity of main body and to be separated with the second reflector with the first reflector, is wherein electrically connected the first luminescent device and the second luminescent device by coupling part.The first reflector and the second reflector can be pressed down from the bottom of the cavity of main body.
Light emitting device package also can comprise the first wiring, this first wiring connection first reflector and first luminescent device; Second wiring, this second wiring connection first luminescent device and coupling part; 3rd wiring, the 3rd wiring connects coupling part and the second luminescent device; And the 4th connects up, the 4th wiring connection second luminescent device and the second reflector, wherein the first luminescent device and the second luminescent device pass through the first wiring, the second wiring, the 3rd is connected up and the 4th wiring series ground is connected.
Light emitting device package can also comprise the first wiring, this first wiring connection first reflector and first luminescent device; Second wiring, this second wiring connection first luminescent device and second reflector; 3rd wiring, the 3rd wiring connection first reflector and the second luminescent device; And the 4th connects up, the 4th wiring connection second luminescent device and the second reflector, wherein the first luminescent device and the second luminescent device are connected up be connected in parallel by the first wiring, the second wiring, the 3rd wirings and the 4th.
Light emitting device package can also comprise the first wiring, this first wiring connection first reflector and first luminescent device; Second wiring, this second wiring connection first luminescent device and second luminescent device; And the 3rd connects up, the 3rd wiring connection second luminescent device and the second reflector, wherein the first luminescent device and the second luminescent device are connected by the first wiring, the second wiring and the 3rd wiring series.
In first reflector, the second reflector and coupling part each can be exposed to the outside of main body through main body at least partially.
In this manual quoting of " embodiment ", " embodiment ", " exemplary embodiment " etc. is meaned that special characteristic, structure or the characteristic in conjunction with the embodiments described is included at least one embodiment of the present invention.In the description, this kind of phrase occurred throughout need not all represent identical embodiment.In addition, when describing special characteristic, structure or characteristic in conjunction with any embodiment, it is also that those skilled in the art can expect that other embodiment all thinking in conjunction with the embodiments realizes such feature, structure or characteristic.
Although describe embodiment with reference to multiple exemplary embodiment of the present invention, should be appreciated that, those skilled in the art can expect other amendment and embodiment in many spirit and scope falling into disclosure principle.More specifically, in the scope of the disclosure, accompanying drawing and appended claims, the variations and modifications of the building block that subject combination is arranged and/or layout aspect are all possibilities.Except the change of building block and/or layout aspect and amendment, for a person skilled in the art, alternative use also will be apparent.

Claims (17)

1. a light emitting device package, comprising:
Bottom section body;
First reflection subassembly, described first reflection subassembly is arranged in described bottom section body;
Second reflection subassembly, described second reflection subassembly is arranged in described bottom section body and by a part for described bottom section body and is separated with described first reflection subassembly;
First luminescent device, described first luminescent device is arranged in described first reflection subassembly; And
Second luminescent device, described second luminescent device is arranged in described second reflection subassembly,
The lower surface of wherein said first reflection subassembly and the lower surface of described second reflection subassembly are exposed to the lower surface of described bottom section body, and the lower surface of the lower surface of wherein said first reflection subassembly and described second reflection subassembly flushes with the lower surface of described bottom section body.
2. light emitting device package according to claim 1, comprises further:
Zener diode, described Zener diode is arranged on the top surface of described second reflection subassembly, and
Wiring, between the top surface that described wiring is connected to described first reflection subassembly and described Zener diode.
3. light emitting device package according to claim 1, wherein, the lower surface of the lower surface of the exposure of described first reflection subassembly and the exposure of described second reflection subassembly is separated from each other.
4. light emitting device package according to claim 3, wherein, a part for the lower surface of described bottom section body is arranged between the lower surface of the lower surface of the exposure of described first reflection subassembly and the exposure of described second reflection subassembly.
5. light emitting device package according to claim 4, wherein, the lower surface of the exposure of a part for the lower surface of described bottom section body and the lower surface of the exposure of described first reflection subassembly and described second reflection subassembly flushes.
6. light emitting device package according to claim 1, wherein, the thickness of each in described first reflection subassembly and described second reflection subassembly is 200 μm ~ 300 μm.
7. light emitting device package according to claim 1, wherein, described bottom section body comprises the first cavity had bottom the first side surface and first, and described first reflection subassembly comprises the second cavity of the first top surface having bottom the second side surface and second and be connected to described second side surface, and described second reflection subassembly comprises the 3rd cavity of the second top surface having bottom the 3rd side surface and the 3rd and be connected to described 3rd side surface.
8. light emitting device package according to claim 7, wherein, flushes bottom described first top surface and described second top surface and first of described bottom section body.
9. light emitting device package according to claim 7, comprises further: be filled in the encapsulating material in described first cavity, described second cavity and described 3rd cavity, and wherein said encapsulating material comprises fluorophor.
10. light emitting device package according to claim 7, wherein, bottom described second side surface is parallel to described second or relative to described second bottom angled, and described 3rd side surface be parallel to the described 3rd bottom or relative to described 3rd bottom angled.
11. light emitting device packages according to any one in claim 1 to 10, wherein, described bottom section body is formed from a resin, and described first reflection subassembly and described second reflection subassembly and described connection pad are made of metal.
12. light emitting device packages according to any one in claim 1 to 10, wherein, the shape and size of described first reflection subassembly and described second reflection subassembly are symmetrical.
13. light emitting device packages according to any one in claim 1 to 10, wherein, each in one end of described first reflection subassembly and one end of described second reflection subassembly is divided into two parts.
14. light emitting device packages according to claim 7, wherein, the second side surface of described first reflection subassembly relative to described second bottom inclination angle be between 90 ° and 160 °.
15. light emitting device packages according to claim 7, wherein, the 3rd side surface of described second reflection subassembly relative to the described 3rd bottom inclination angle be between 90 ° and 160 °.
16. light emitting device packages according to claim 7, comprise step edge further, between bottom the upper surface and described first that described step edge is located at described bottom section body, the upper surface of described step edge and described bottom section body has the difference in height of regulation and is parallel to the upper surface of described bottom section body.
17. light emitting device packages according to claim 7, wherein, the spacing distance between described first reflection subassembly and described second reflection subassembly is 100 μm or more.
CN201510784661.2A 2010-06-01 2011-06-01 Light emitting device package Pending CN105355625A (en)

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TWI594464B (en) 2017-08-01
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TW201624772A (en) 2016-07-01
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TWI634677B (en) 2018-09-01
CN102270630A (en) 2011-12-07
TWI557951B (en) 2016-11-11
CN105448905B (en) 2019-03-05
TW201701504A (en) 2017-01-01
CN105355624B (en) 2019-12-03
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TWI531090B (en) 2016-04-21
CN102270630B (en) 2016-01-20

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