CN105473218A

CN105473218A - Epicatalytic thermal diode

Info

Publication number: CN105473218A
Application number: CN201480038411.8A
Authority: CN
Inventors: D·P·希恩
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-05-29
Filing date: 2014-05-29
Publication date: 2016-04-06
Anticipated expiration: 2034-05-29
Also published as: KR20160034856A; CN105473218B; EP3003547A1; WO2014194138A1; AU2014274104A1; EP3003547A4

Abstract

An Epicatalytic Thermal Diode (ETD) includes one or more ETD cells. Each cell comprises first and second surfaces with a cavity between them, which contains a gas that is epicatalytically active with respect to the pair of surfaces. The surfaces chemically interact with the gas such that the gas dissociates at a faster rate proximate to the first surface than it does proximate to the second surface. Thus, a steady-state temperature differential between the first surface and the second surface is created and maintained. In various applications, multiple ETD cells are connected in series and/or parallel.

Description

Surface catalysis thermal diode

the cross reference of related application

This application claims and submit, be entitled as the rights and interests of the U.S. Provisional Patent Application numbers 61/828,419 of " EpicatalyticThermalDiode " on May 29th, 2013; The rights and interests of the U.S. Provisional Patent Application numbers 61/828,421 of " EpicatalyticThermalDiode " submitted, be entitled as on May 29th, 2013; And submit, be entitled as the rights and interests of U.S. Patent Application No. 14/289,322 of " EpicatalyticThermalDiode " on May 28th, 2014, all these makes its entirety be incorporated to herein by reference.

Technical field

Theme described herein is usually directed to manage hot-fluid, particularly relates to a kind of equipment producing and maintain steady state temperature difference.

Background technology

Heat, usually from hot-fluid to cold, relaxes thermograde and finally reaches by the thermodynamical equilibrium of single uniform temperature characterization to make the system isolated.Current, must do work to make equipment generation and temperature gradients.Temperature gradients such as heating, freeze, environmental Kuznets Curves, generating and mechanical movement and so on broad range technical field on practical value.

Acting also generates used heat with the existing equipment of temperature gradients.Some equipment are attempted to use this used heat (such as, the used heat generated by vehicle motor can in the winter time during month the inside of guided vehicle with heat supply) but the usual efficiency of such system is low and can not solve the initial requirement such as being provided merit by combustion of fossil fuels (such as, gasoline, coal, wet goods).

Summary of the invention

Above and other problem by surface catalysis thermal diode (ETD) and correspondence method and solve.ETD naturally i) produce and maintain ETD two independent surfaces between the temperature difference; And ii) on the direction of thermograde, (that is, on) strides across ETD.Mediate efficient stable state hot-fluid in one aspect, the structure thermomechanical of ETD and chemically optimize thermograde and hot-fluid generation and both maintaining.

In various embodiments, ETD equipment comprises one or more ETD unit of connecting and/or being connected in parallel.In a particular embodiment, the adjacent one or more parts of ETD units shared are for increase operating efficiency and/or reduce production cost.

In one aspect, ETD unit comprises first surface and second surface, has the cavity being configured to keep gas between which.When gas is present in cavity, surface and the mutual chemical action of gas, make gas close to first surface with than close to second surface speed dissociation faster.Thus, compared with close to second surface place, more substantial heat (depends on the whether each neither endothermic nor exothermic naturally of dissociation reaction) being absorbed close to first surface place or discharge.Therefore, the steady state temperature difference between first surface and second surface is produced and is maintained.

On the other hand, ETD unit comprises the first heat transfer surface and the second heat transfer surface further, and this first heat transfer surface and the second heat transfer surface are correspondingly connected to first surface and second surface and substantially parallel.Heat transfer surface is connected to the side relative with cavity, corresponding surface.Heat transfer surface is configured to the surface of heat to correspondence guide and/or guide heat from the surface of correspondence.

Accompanying drawing explanation

Figure 1A illustrates the sketch causing the surface-catalyzed reactions of the temperature difference between two surfaces according to an embodiment.

Figure 1B is the side view according to the contingent single ETD unit of the reaction of Figure 1A wherein of an embodiment.

Fig. 2 is the equidistant diagram comprising the system configuration of parallel multiple ETD unit according to an embodiment.

Fig. 3 represents according to the side view in series combining the system configuration of the ETD unit of three layers of an embodiment.

Fig. 4 illustrates according to the combination for test material and gas of an embodiment to determine the sketch of the device of the applicability that they use in ETD unit.

Fig. 5 illustrates that the determination specific gas-surface according to an embodiment is combined in the flow chart of the illustrative methods of the applicability used in ETD unit.

Fig. 6 be illustrate according to an embodiment for determining that specific gas-surface is combined in the flow chart of the alternative of the applicability used in ETD unit.

Detailed description of the invention

Accompanying drawing and following description only describe particular implementation in an illustrative manner.Those skilled in the art can adopt the alternate embodiments of structure shown in this article and method by being easy to recognize from following description and not depart from principle described herein.To carry out reference to multiple embodiment now, its example illustrates in appended accompanying drawing.As long as it should be noted that feasible, similar or identical Reference numeral can be used in the accompanying drawings, and similar or identical function can be indicated.

PROCESS OVERVIEW

The embodiment of ETD utilizes the process comprising (at least) two surfaces be spatially separated, and these two surfaces are chemically active relative to gas, and this gas stands general dissociation reaction figure 1A illustrates the embodiment of this process of use two parallel surfaces 120 and 140.These two (or more) surface 120 and 140 most characteristic of illustrating traditional heterogeneous catalysis, but depart from a standard guidelines of catalysis.Unlike the conventional catalyst of not deflected gas-phase balance, because skin effect is relative to the ascendancy of the overall characteristic of the gas in the cavity 130 between surface, surface 120 and 140 changes gas-liquid equilibriums.Thus, surface 120 and 140 is called as " surface catalyst (epicatalyst) " in this article and is called as " surface catalysis (epicatalysis) " and/or " surface catalyzes process (epicatalyticprocess) " based on the process on such surface.

First surface 140 tends to dissociation (dissociation) half-reaction (meaning AB → A+B) compared with second surface 120.On the contrary, second surface 120 compares relative to first surface 140 and tends to compound (recombination) half-reaction (meaning A+B → AB).Thus, when gas dimer is close to first surface 140, the interaction between dimer with first surface 140 causes its dissociation rate higher than the corresponding dissociation rate close to second surface 120.Use term close to being relative to gas and surface herein thus mean the monomer of gas and/or dimer within 10 dusts on surface, being included on the surface.

Cavity 130 air inclusion, it can move freely in cavity.Thus, the gas of A and the B kind than the larger flux flowing through cavity 130 is in the opposite direction there is from first surface 140 to second surface 120.On the contrary, the gas of the AB kind than the larger flux flowing through cavity 130 is in the opposite direction there is from second surface 120 to first surface 140.Therefore, in cavity 130, there is chemical cycle, wherein the net flow of the gas of AB kind 125 is in a direction, and the net flow of the gas of A and B kind 135 is at other direction.This flowing carrying net heat energy of the gas between two surfaces 120 and 140 and chemical energy, cause steady state temperature difference between two surfaces.

In one embodiment, dissociation reaction is heat absorption, and recombination reaction is heat release.Consequently, the surface 140 being conducive to dissociation naturally cools and maintains the temperature lower than the surface 120 being relatively conducive to compound.If excessive heat is provided to colder surface 140, heat is transported to another surface 120 by space 130 by thermal convection current and chemical advection, thus to produce in ETD thermal gradient net heat stream upwards between the surfaces.Heat can be gathered in the crops from comparatively warm surface 120 via standard heat transfer mechanism (that is, convection current, conduction, radiation) subsequently.Net result constitutes the thermal diode of the heat trnasfer be conducive in one direction instead of in the other directions, thus makes the clean transmission of heat to resist thermograde.Be described following although dissociation reaction is the specific embodiment of heat absorption, it should be noted that in certain embodiments, dissociation reaction is heat release.In such embodiments, the surface of dissociation 140 is conducive to by warmer than the surface being conducive to compound.

The structure of ETD unit

Figure 1B be a diagram that the cutting side view of a half structure of the ETD unit 100 according to an embodiment.Multiple ETD unit 100 can be combined the effect reaching expectation in every way, and these some examples combined are carrying out discussion specifically referring to Fig. 2 and Fig. 3.In an illustrated embodiment, ETD unit 100 comprises first surface 140 and second surface 120, and each heat transfer surface 110 by correspondence supports and generally parallel aims at each other.Separation between surface 120 and 140 is maintained by multiple separator 160, and wherein two separators are illustrated at this.Thus, cavity 130 is formed between surface 120 and 140, cavity 130 air inclusion.In other embodiments, other geometry maintaining the interval of the substantial constant between two or more surfaces is used to ETD unit 100, such as nested cylinder, nested spheroid, conveyor screw etc.In certain embodiments, the one or both in surface 120 and 140 is also used as corresponding heat transfer surface 110.In another embodiment, surface 120 and 140 is not arranged to the interval with substantial constant, such as, relative to each other with the angle of 45 degree, or makes a surface relative to another surperficial general curved.

Those gases existed as dimer AB for the gas that disclosed device is useful, but also as independently monomer A and B exist.And then, the gas that disclosed device is useful is interaction based on them and particular surface 120 and 140 and is selected.As disclosed above, be for the second surface place in two surfaces, tend to first surface place dissociation in two surfaces and compared with the gas tending to the second surface place compound in two surfaces for the first surface place in two surfaces for the gas that particular surface 120 and 140 is useful.In one embodiment, gas is based on following and selected: the independently stability of monomer A and B, the intensity of bonding between component in dimer AB, and the vapour pressure of operating temperature place (such as, or close to room temperature place) gas at ETD equipment.

In certain embodiments, gas is selected as making the vapour pressure of the gas when gas is in the operating temperature of ETD be sufficient for operating chemical circulation.In other words, must have the enough gas being in vapour phase for dissociation/combined-circulation in cavity 130, therefore the temperature difference is maintained.Thus, the gas with relatively low molecular weight (such as, being less than about 200amu) can be used to be intended to for the operation under room temperature in certain embodiments.Such gas has can clean molecular separating force compared with environment thermal energy and energy, and therefore, the dissociation of discernable amount occurs at ambient conditions.Usually, have the gas of more HMW, the molecule of remarkable ratio trends towards in room temperature liquefaction or solidification, causes cavity 130 not comprise the gas being in vapour phase of q.s for maintenance reaction cycle.

In certain embodiments, for the stability of the independently monomer of selected gas and the intensity of dimeric bonding for making when ETD equipment is top dog relative to gas-liquid equilibrium characteristic for skin effect during operating temperature caused by surface 120 and 140.In these embodiments, dimer AB by relatively weak key institute bonding, make dimer can or close to the thermal dissociation of room temperature place, cause the gas (such as 10%) locating discernable amount at any given time to exist with the kind of dissociation.In various embodiments, the gas dimer with hydrogen bond (HyB), halogen key (HaB) and Van der Waals key (vdWB) is used.In various embodiments, two homodimers (gas that monomer A is identical with B) are used with heterodimer (gas that monomer A is different with B).

The dimer of hydrogen bond is the molecule comprising two monomers utilizing one or more hydrogen bond to connect.Dissociation and recombination rate include but not limited at the hydrogen bond dimer close near surface change (thus can be used in surface catalyzes process): low-molecular-weight carboxylic acid, alcohol, aldehyde, ketone, ether, ester, acyl halide, acid amides, and amine.Usually, be attached to electronegative element hydrogen atom collaborative work, by F, O, N, the lone pair electrons sometimes selected by S will cause close to the dimer representing surface catalysis characteristic during suitable near surface.Those skilled in the art will recognize that, in various applications, based on above consideration, embodiment can adopt following as gas: formic acid, acetic acid, methyl alcohol, ethanol, formaldehyde, ammonia, dimethyl ketone, methylamine, dimethylamine, dimethyl ether, water, acetamide, first sulphur, cyanogen, hydrogen cyanide, hydrogen fluoride, hydrogen sulfide, cyanogen methane, formamide, amino azomethine, hydrogen chloride, ethyl cyanide, carbon monoxide, carbon dioxide, sulfur dioxide and nitrogen oxide, and the heterodimer combination of the monomer of these molecules.

The dimer of halogen key is the molecule comprising two monomers utilizing one or more halogen key to connect.Usually, comprise fluorine, chlorine, bromine or iodine low-molecular-weight halogen key molecule present surface catalysis characteristic.Those skilled in the art will recognize that, in various applications, based on above consideration, embodiment can adopt following as gas: single halomethane, methylene halide, haloform, tetrahalomethanes, halothane, and the halogenated form of above hydrogenation material, and the heterodimer combination of the monomer of these molecules.

The dimer of Van der Waals key is the molecule comprising two monomers utilizing one or more Van der Waals key to connect.Unlike above HyB and HaB dimer, permitted the dissociation that eurypalynous Van der Waals key dimer presents the discernable amount significantly below room temperature.Those skilled in the art will recognize that, in various applications, based on above understanding, embodiment can adopt following as gas: rare gas dimer (such as, argon gas, xenon), methane, ethane, propane, and nitrogen.

In various embodiments, depend on the selection of specific environment, application and surfacing, except above listed gas except those is used.Such as, the gas (as diborane and dinitrogen tetroxide) of some covalent bondings has the remarkable ratio of enough weak key for gas in room temperature or close to the state being in dissociation during room temperature place.Although gas is described as dimer in this article for convenience, it should be noted that in certain embodiments, gas is tripolymer or more high order molecule, comprises the multiple monomers combined by above-described one or more key type.

In certain embodiments, when selecting the gas being used for cavity 130, additional factor is put into consideration, comprises the chemical property of gas, the availability/price of gas, the toxicity etc. of gas.

Heat transfer surface 110 provides mechanical stability and support to surface 120 and 140.Heat transfer surface 110 is also impermeable for gas, and composition keeps a part for the airtight container of gas.In certain embodiments, the one or both in surface 120 and 140 is also used as corresponding heat transfer surface 110.In typical application, ETD system comprises multiple ETD unit 100, and wherein unit runs through the cavity 130 of multiple connection and common gas.Such system is describing with further details referring to Fig. 2.

In various embodiments, the outer surface on Heat transmission surface 110 comprises surface characteristics (such as, fin, roughness etc.) so that increase heat trnasfer via conduction and convection.Additionally, in certain embodiments, outer surface coated (such as blacking) is so that make the maximizes heat transfer via radiation.Such as, outer surface can comprise one or more anodised aluminium, carbon black, CNT woods etc. so that be provided to the effective radiant heat transmission in unit 100 or outside unit 100.

In certain embodiments, heat transfer surface 110 is heat conduction (such as, have high thermal conductivity and physically very thin) and mechanically strong.The example with the material of these characteristics comprises polyester film, aramid fiber, aromatic polyamides, metal forming etc.Heat conduction allows heat to enter ETD unit 100 easily through the first heat transfer surface 110A, and gathers in the crops from ETD unit at the second heat transfer surface 110B place.Mechanically allow by force heat transfer surface 110 to provide the good mechanical on surface 120 and 140 to support, thus guarantee that the functional geometry of ETD unit 100 is maintained under stress substantially.Heat transfer surface 110 by the identical or different material structure with desired characteristic, can depend on specific embodiment.Such as, the material for each heat transfer surface 110 can be selected as guaranteeing effectively to combine with corresponding surfacing.

In one embodiment, heat transfer surface 110 is macroscopically flexible, and is mechanically strong in shorter length dimension.Therefore, a slice ETD unit can be handled to be formed cylinder, conveyor screw, coiling body and other such structure, as desired for a particular application.

In another embodiment, heat transfer surface has low-E to reduce by the colder surface 140 of warmer 120 times, surface radiation heating on inside surface (such as minute surface).In another embodiment, the relation between heat transfer surface 110 and the radiance (and absorptivity) on surface 120 and 140 is optimized to reduce further only by reflecting the amount of returning radiation heating realized.

How the selection of the material for surperficial 120 and 140 at least partly based on the concrete gas in cavity 130, and is changed close to the dissociation near the material selected by effects on surface/recombination reaction speed based on by concrete gas especially.As above with reference to as described in Figure 1A, the material being conducive to the dissociation of gas is selected for first surface 140.On the contrary, the material that (comparatively speaking) is conducive to the compound of gas is selected for second surface 120.In certain embodiments, the geometry of the one or both in surface 120 and 140 is customized to and increases interactional quantity between gas and surface, therefore increases corresponding dissociation or recombination rate.Such as, surface 120 or 140 can be ripple, groove, coarse, dendritic, or be configured (such as, scribbling CNT woods) for increase can be used for gas surface interactional surface area.In one suchembodiment, the geometry of this effects on surface 120 and 140 be customized to make dissociate surface place dissociation the dimeric ratio entered with roughly equal in the ratio that the monomer of composite surface place compound is right.

In the embodiment using HyB and/or HaB gas, the material for dissociate surface 140 is competed with the monomer of the gas for attracting, and thus reduces the quantity close to the monomer of compound near dissociate surface and therefore increases total dissociation rate.But if dissociate surface 140 and monomer interact too consumingly, they may adhere to surface.If this occurs, monomer becomes and is not useable for participating in chemical cycle, and it may prevent the foundation of steady state temperature difference.Thus, material for dissociate surface 140 should be have relative to the specific dimer used the material that perceptible dissociation removes adsorption activity, means to incide dimeric discernable partial dissociation on surface and the discernable part of the monomer produced leaves region close to surface.Ideally, all dimers incided on dissociate surface 140 stand dissociation and go absorption.But the system of use usually has the dissociation being less than 100% and goes adsorption rate (incident dimer dissociation occurs and the monomer produced leaves the percentage in the region near close to dissociate surface 140).In one embodiment, dissociation goes adsorption rate between 0.01% and 90%.In another embodiment, dissociation goes adsorption rate between 0.1% and 90%.In another embodiment, dissociation goes adsorption rate between 0.1% and 50%.In a further embodiment, dissociation goes adsorption rate between 0.1% and 10%.In other embodiments, other dissociation goes adsorption rate to occur, and depends on the concrete gas of use and material and ETD operating temperature and pressure.

The examples material class representing this characteristic includes, but is not limited to: metal, pottery, metal oxide, nitride and halide, and functionalized organic polymer represents the molecule of the high molecule mass on functionalized surface with other.Those skilled in the art will recognize that, in various applications, based on above consideration, embodiment can adopt following as dissociate surface 140: noble metal (such as, gold, silver), transition metal (such as, iron, nickel, copper), refractory metal (such as, tungsten, rhenium, molybdenum), aluminium oxide (Al ₂o ₃), magnesia (MgO), titanium dioxide (TiO ₂), silica, nitrocellulose, aromatic polyamides, nylon, artificial silk, or polymethyl methacrylate (PMMA).

At vdWB gas by the embodiment that uses, dissociate surface 140 also interacts with gas, make gas close near dissociate surface with than it close to speed dissociation larger near composite surface 120.Those skilled in the art will recognize that, in various applications, based on above understanding, embodiment can adopt following as gas: surface chlorination polyethylene, the chlorinated polypropylene on surface, or teflon.

The another kind of material being used as dissociate surface 140 of vdWB, HaB or HyB is used to be the semiconductor adulterated in certain embodiments.By utilizing negative electrical charge or positive charge kind doped semiconductor, creating the strong interactional position with the monomer forming dimer, increasing absorption rate, thus increase the speed of absorption.The example of the semiconductor of such doping comprises silicon doped with one or more following item and germanium: chlorine, fluorine, nitrogen, oxygen, barium and caesium.

In various embodiments, depend on the selection of concrete environment, application and gas, except above listed material except those is used to dissociate surface 140.

Composite surface 120 contributes to monomer compound and gets back to dimer, and thus, the material and the monomer that are selected for composite surface interact in the mode being conducive to compound, such as, by affecting the distribution of the electric charge of monomer.In certain embodiments, composite surface 120 slightly in conjunction with monomer, such as, passes through weak HyB, HaB or VdWB.Therefore, the interaction between gaseous monomer and composite surface 120 does not have ascendancy relative to the formation of bonding between monomer, thus creates dimer.Similar with dissociate surface 140, in idealized system, the monomer inciding 100% on composite surface 120 combines to produce dimer, and it leaves the region close to checking near surface subsequently.But the system of use usually has the compound being less than 100% and goes adsorption rate (incident monomer compound occurs and the dimer produced leaves the percentage in the region near close to composite surface 120).In one embodiment, compound goes adsorption rate between 0.01% and 90%.In another embodiment, compound goes adsorption rate between 0.1% and 90%.In another embodiment, compound goes adsorption rate between 0.1% and 50%.In a further embodiment, compound goes adsorption rate between 0.1% and 10%.In other embodiments, other compound goes adsorption rate to occur, and depends on the concrete gas of use and material and ETD operating temperature and pressure.

The usual classification representing the material of these characteristics includes, but is not limited to: nonpolar, organically surface, the hydrocarbon of such as HMW, organosilan, chlorine polymer and unfunctionalized polymer.Those skilled in the art will recognize that, in various applications, based on above understanding, embodiment can adopt following as composite surface 120: polyethylene, polypropylene, paraffin, natural rubber, or polyethers.

In addition, many fluoropolymers present for the proper characteristics as composite surface 120, comprise the homopolymers and copolymer that make from following item: ethene, propylene, PVF, vinylidene fluoride, tetrafluoroethene, hexafluoropropene, perfluoropropyl vinyl ether, perfluoromethylvinyl base, and CTFE.What those skilled in the art will recognize that is, in various applications, based on above understanding, embodiment can adopt following as composite surface 120: polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene (PTFE), perfluoroalkoxy, polyethylene chlorotrifluoroethylene, fluorubber, PFPE, or perfluorinated sulfonic acid.And then Graphene and its allotrope (such as, graphite, CNT) also represent these characteristics and can be used to composite surface 120, and use together in conjunction with suitable gas.

The another kind of material being used as composite surface 120 of vdWB, HaB or HyB is used to be the semiconductor adulterated in certain embodiments.By utilizing negative electrical charge or positive charge kind doped semiconductor, be created with the interactional position of mode and monomer of encouraging compound.The example of the semiconductor of such doping comprises silicon doped with one or more following item and germanium: chlorine, fluorine, nitrogen, oxygen, barium and caesium.

In various embodiments, depend on the selection of concrete environment, application and gas, except above listed material except those is used to composite surface 120.

In one embodiment, the separation between surface 120 and 140 is less than for gas phase dissociation-recombination reaction collision or the mean free path (or its grade) of reflection.Such as, for the air pressure of about 0.01 to 10 air, the separation of the correspondence in about 10-0.01 micrometer range can be used in.In other embodiments, be low to moderate 0.001 and the air pressure of height to 40 air is used, correspond to the separation in about 100 to 0.0025 micrometer ranges.

In addition, surface 120 and 140 there is high thermal conductivity and be physically thin (such as, 1 to 10nm) so that supplemental heat transmission turnover ETD unit 100.In certain embodiments, surface 120 and 140 has high surface area (such as, coarse or dendritic) to maximize the chemical reaction of every cellar area, and be optically thin (such as, being less than infrared wavelength) fit over the radiation delivery of the inside of ETD unit 100 to make the optical signature of heat transfer surface 110 prop up.

The expectation that multiple separator 160 maintains between active surface 120 and 140 is separated.The materials and structures of separator 160 is selected as keeping low as much as possible via the amount of the heat trnasfer across cavity 130 of separator.In embodiment in fig. ib, this is done by using separator 160, and this separator 160 is the thin posts with fillet tip, thus the area contacted with heat transfer surface 110 is minimized.In other embodiments, difform separator 160 is used, such as spherical particle.Although separator 160 is against heat transfer surface 110 in an illustrated embodiment, separator abutment surface 120 and 140 and/or be embedded into surface 120 and 140 (such as in figure 3 shown in) in other embodiments.

Separator 160 is mechanically enough strong and be properly spaced out and be in the value close to expecting with the separation maintained between surface 120 and 140 when ETD unit 100 is applied in stress.Distance piece 160 also has and returns to the heat on comparatively warm surface 140 thermal conductivity led from compared with cold surface 120 for minimizing.In addition, distance piece 160 has low-E (such as, similar minute surface) so that do not absorb internal radiation.

In one exemplary embodiment, the gas in cavity 130 is acetic acid, and dissociate surface 140 is polymethyl methacrylates, and composite combined surface 120 is polyethylene.In a further exemplary embodiment, gas is formamide, and dissociate surface 140 is haloflexes of part surface, and composite surface 120 is polypropylene.In still further illustrative embodiments, gas is ammonia, and dissociate surface 140 is aluminium oxide ceramics, and composite surface 120 is polystyrene.In yet another exemplary embodiment, gas is formic acid, and dissociate surface 140 is polymethyl methacrylates, and composite surface 120 is polyethylene.

Determine the combination of gas-surface

Fig. 4 illustrates according to the combination for test material and gas of an embodiment to determine the device 400 of the applicability that they use in ETD unit.Device 400 is included in the black matrix cylinder 420 of vacuum tank 410 inside.In one embodiment, the main body of vacuum tank 410 has the diameter of about 30 centimetres (cm) and the stainless steel cylinder of the about length of 40cm, and black matrix cylinder 420 be by tungsten or rhenium paper tinsel (having the thickness of about 26 microns) builds, the cylinder of the diameter with about 0.64cm and the about length of 10cm.Vacuum tank is diffused pump to about 10 ^-6the reference pressure of holder.The inside 524 (such as, the part of middle 2.5cm) of black matrix cylinder 420 is closed by a pair aluminum pan.

In the embodiment illustrated in figure 4, cylindrical electrode 442 (such as, tantalum electrode) is attached to the interior surface of every one end of black matrix cylinder 420.Electrode 442 is attached to variable power supply 440 via a pair electric wire 445.By using variable power supply 440 to apply electric current to black matrix cylinder 420, black matrix cylinder and its content can by Ohmic heatings.The change power that thus equalization temperature (without any surface catalysis effect) of black matrix cylinder 420 and its content can be supplied by variable power supply 440 and being controlled.Be designed at device 400 in other embodiment being used to find room temperature surface catalysis to combine, some or all in variable power supply 440, electric wire 445 and electrode 442 are omitted.In another embodiment, the mechanism for cooling black matrix cylinder 420 is provided to the low-temperature surface catalysis characteristics of enable test material.

Be fed by the hole in aluminum pan 422 within a pair thermocouple 430 is positioned in black matrix cylinder 420, the core of each thermocouple 430 is positioned within inner 425.It is the material of the candidate tended to the half-reaction of specific gas dissociation that first thermocouple 430A is coated with, and the second thermocouple 430B to be coated be the material of the candidate tended to same gas compound half-reaction (relative to the first material).Each thermocouple is connected to corresponding thermocouple needle 450 via electric wire 435.Thus, the thermocouple needle 450A being connected to the first thermocouple monitors the temperature of the first thermocouple, and the second thermocouple needle 450B monitors the temperature of the second thermocouple.Such as, thermocouple needle 450 may be by per second once monitor and record thermocouple temperature data logger on pair of channels.

Within black matrix cavity 420, thermocouple 430 stands four heat trnasfer channels: 1) along the heat trnasfer of electric wire 435,2) thermal convection current of gas black body radiation, 3) by existing in cavity, and 4) gaseous dissociation/recombination reaction (that is, surface catalysis effect).Thus, in order to determine that whether the temperature difference that senses between thermocouple is caused by (at least partly by) surface catalysis, system should for any by other three channels cause poor and tested.

Fig. 5 illustrates the illustrative methods 500 being combined in the applicability used in ETD unit according to the determination specific gas-surface of an embodiment.In the following paragraphs, method 500 is described from the aspect using the device 400 shown in Fig. 4 to perform the method.But, different testing arrangements can be used in other embodiments.In various embodiments, some in the step of method 500 are with different order and/or perform concurrently.Some embodiments of method 500 comprise additional and/or different step.

510, within this is placed on black matrix cylinder 420 to thermocouple 430.Be described above with reference to Fig. 4, the first thermocouple 430A is coated with the first candidate material and the second thermocouple 430B is coated with the second candidate material.

520, vacuum tank 410 is evacuated (such as to 10 ^-6the pressure of holder) and this is monitored until reach balance to the temperature of thermocouple 430.Such as, temperature can be monitored, until all do not observe in a setting-up time section (such as a minute) change being greater than threshold value (such as 0.1%).If material-gas combination is used for tested at the target operating temperature not being room temperature, power is provided to variable power supply 440 so that this system of Ohmic heating.Because thermocouple 430 is positioned in the black matrix cavity of vacuum, any change in temperature must be due to the heat trnasfer along electric wire 435 or due to black body radiation, or due to both.Theoretical and experiment determines between this is to thermocouple 430, do not have the temperature difference to be observed under these conditions.

530, surface catalysis inert gas (mean target temperature everywhere in balance time without undergoing the dissociation of significant quantity and the gas of recombination reaction) be imported in vacuum tank 410.Inert gas preferably has with the gas of candidate surface catalytic gas similar characteristic to be tested so that minimize the possibility that non-surface catalysis effect is the reason of any temperature difference sensed.Such as, if tested candidate surface catalytic gas is hydrogen, so helium can be used in this stage of method 500.Suppose that inert gas is deposited at candidate material and do not represent surface catalysis characteristic in case, compare any change in the temperature of the thermocouple 430 be sensed with step 520 and the thermal convection current being inert gas (and other search gas any) owing to existing in black matrix cylinder 420 is caused.Theoretical and experiment determines between this is to thermocouple 430, do not have the temperature difference to be observed under these conditions.

540, the inert gas in vacuum tank 410 replace by candidate surface catalytic gas.If candidate surface catalytic gas preferably relative to the second thermocouple 430B closer to (or vice versa) dissociation near the first thermocouple 430A, will steady state temperature difference be caused, as previously mentioned.Thus, the temperature difference will be observed between the thermocouple 430 that there is not (in step 520 and 530) before.Theory and experiment this characteristic verified.Such as, when tungsten and rhenium thermocouple 430 in high temperature and low pressure (such as, 1900 Kelvins (K) temperature and 1 holder pressure place) be exposed to hydrogen time, tungsten thermocouple 430A is sighted and naturally heats relative to rhenium thermocouple 430B, and the temperature difference observed is thermodynamic stable.

550, the feasibility using candidate surface catalytic gas and candidate material to construct ETD unit is determined based on the temperature observed.In step 540 but in step 520 and 530, do not show that any combination of the large temperature difference can be used to the effective ETD unit of component.Usually, the combination with the large temperature difference will have the more efficient ETD unit of more high power density within other constraint causing applying at the special properties by material.Such as, if candidate material has tensile strength low especially, this can limit the size of ETD unit and possible geometry.As another example, if specific combination requires that the temperature being heated to rising is with operation, this is by reducing the net efficiency of ETD unit, because power must be consumed heating system.Consequently, represent and can cause more efficient or overall ETD unit easily compared with the combination of Low Temperature Difference.

Using method 500, for surface catalysis characteristic, material and combination of gases can easily be tested.In certain embodiments, given gas can be utilized to be tested within black matrix cylinder 420 by comprising additional thermocouple 430 more than two candidate materials simultaneously.Additionally, by comprising the one or more thermocouples 430 scribbling such inert material, candidate material can compare with the material that to be known as relative to given gas be surface catalysis inertia similarly.

Fig. 6 illustrates the alternative of the applicability of the given combination for determining the gas, dissociate surface material and the composite surface material that use in ETD unit 100 according to an embodiment.In various embodiments, some in the step of method 600 are with different order and/or perform concurrently.Some embodiments of method 600 comprise additional and/or different step.

610, Candidate gaseous stream is directed on the first candidate material.In one embodiment, this is done in supervacuum chamber, and wherein the pure samples of the first candidate material stands Candidate gaseous stream, and this stream comprises dimer and the monomeric substance of Candidate gaseous.As used in this article, pure samples is cleaned as far as possible.In other embodiments, impure sample is used.

Airflow strikes, on the sample of the first candidate material, absorbs on sample, with sample chemical ground and/or physically react, and leaves (go absorption).620, the monomer/dimer ratio of the flux adsorbed that goes leaving the first candidate material is measured to.In one embodiment, go the flux of absorption analyzed by mass spectrograph.In other embodiments, being applicable to quantitative judge goes other diagnostic tool of the material adsorbed also to be used.

630, Candidate gaseous stream is knocked on the second candidate material.In one embodiment, this is done in supervacuum chamber, and wherein the pure samples of the second candidate material stands Candidate gaseous stream, and this stream comprises dimer and the monomeric substance of Candidate gaseous.In other embodiments, impure sample is used.

Airflow strikes, on the sample of the second candidate material, absorbs on sample, with sample chemical ground and/or physically react, and leaves (go absorption).640, the monomer/dimer ratio of the flux adsorbed that goes leaving the second candidate material is measured to.In one embodiment, go the flux of absorption analyzed by mass spectrograph.In other embodiments, being applicable to quantitative judge goes other diagnostic tool of the material adsorbed also to be used.

650, the monomer measured/dimer ratio is compared to determine whether the particular combination of gas and material is applicable to use in the structure of ETD unit 100.Show that the flux adsorbed that goes exceeding the monomer component of gas-liquid equilibrium value creates good dissociate surface 140 for specific gas.On the contrary, show that the flux adsorbed that goes being less than or equal to the monomer component of gas-liquid equilibrium value creates good composite surface 120 for specific gas.In various embodiments, if be greater than threshold quantity for the difference between the monomer component measured by each surface, specific gas and the right combination of candidate material are being considered to be applicable to use in the structure of ETD unit 100.Use threshold value based on the expectation between the surface for this embodiment minimum temperature difference and selected, the difference that wherein larger temperature difference requirement is larger, therefore larger threshold value.In the embodiment that some are such, upper threshold value to be also used to arrange in monomer component the upper limit of difference, so that filter out the enough large temperature difference of generation to cause the combination of the pyrolytic damage to ETD unit 100 and/or surrounding objects.

Above method 600 can be repeated to determine for gas and the right multiple combination of material can by those combinations (cast aside considering in such as structure and economic feasibility and so on) used in structure ETD unit 100.

Exemplary test data

The method 500 shown in Fig. 5 of use, the experiment using the device of Fig. 4 to implement determine that steady state temperature difference can be established between the effects on surface that there is superficial catalytic activation gas.The temperature place of hydrogen dimer H2 in the scope of 300K to 1950K tests the thermocouple scribbling tungsten (W) and rhenium (Re) simultaneously, and wherein air pressure is high to about 10 holders.For the temperature more than 1700K, the different steady state temperature difference developed between the thermocouple scribbling W and Re is that ETD effect provides evidence.The measured maximum steady state ETD temperature difference is 126K, and the pressure place of its mean temperature at 1950K and 1 holder is observed.

Based on energy scale parameter, can infer that steady state temperature difference can be established in room temperature and maintain.All standard chemicals reaction institute based on chemical equilibrium constant (Keq) depend on temperature and reaction Gibbs free energy (Keq=exp [-G/RT]), to its main contributions normally for react in conjunction with energy.Under these circumstances, the characteristic energy yardstick (φ) for chemical balance is provided, i.e. φ=Δ G/RT to the ratio of heat energy by bonding energy.Thus, more weak key needs quite low temperature to realize dissociation and the similar level going to adsorb.

The order of magnitude that hydrogen bond (about 0.5eV) is normally more weak than covalent bond (about 5eV), and the order of magnitude that Van der Waals key is normally more weak (about 0.05eV).Thus, because the covalent surface catalysis of H2 is in about 2000K place operational excellence, the dimeric surface catalysis dissociation of what it was followed is hydrogen bonding and Van der Waals bonding should occur in room temperature or lower than room temperature.Such as, because wherein 4.5eV be the ratio φ (4.5eV/2000K) at the dimeric suitable bond strength place of hydrogen with wherein 220K is roughly equal far below the ratio φ (0.5eV/220K) at room temperature place, what can infer is can be easy to show surface catalysis characteristic at room temperature place to depositing hydrogen bond dimer in case on suitable surface.

Can find in following delivering about the additional experiment of the steady state temperature difference between a pair surface catalysis surface and theoretical details, it is merged in herein with its entirety at this.

Sheehan, D.P., D.J.Mallin, J.T.Garamella and W.F.Sheehan, Experimentaltestofathermodynamicparadox, Found.Phys.44235 (2014).

Sheehan,D.P.,Nonequilibriumheterogeneouscatalysisinthelongmean-free-pathregime,Phys.Rev.E88032125(2013).

Sheehan, D.P., J.T.Garamella, D.J.Mallin and W.F.Sheehan, Steady-statenonequilibriumtemperaturegradientsinhydrogen gas-metalsystems; Challengingthesecondlawofthermodynamics, Phys.Scr.T151014030 (2012).

It should be noted that similar phenomenon also finds to be present in the plasma of certain type, it is called as surface ionization plasma.Such plasma can set up steady state pressure gradient under black matrix condition.As its name implies, the plasma of surface ionization is by being produced via the surface of strong gas-surface interactions ionized gas.The plasma of many surface ionizations presents strong nonlinearity feature, such as the speed of non-Maxwell's pencil ion, and it can cause steady state pressure and the temperature difference then.Thus, ETD unit can also be constructed, and wherein energy is ionizing surface and is being transmitted through cavity between more not active surface relative to plasma electric.

Can find in following delivering about the additional experiment of the steady state pressure difference in the plasma of surface ionization and theoretical details, it is merged in herein with its entirety at this.

Sheehan, D.P. and T.Seideman, Intrinsicallybiasedelectrocapacitivecatalysis; J.Chem.Physics122204713 (2005).

Sheehan, D.P. and J.D.Means, Minimumrequirementforsecondlawviolation:Aparadoxrevisite d; Phys.Plasmas52469 (1998).

Sheehan,D.P.,Anotherparadoxinvolvingthesecondlawofthermodynamics；Phys.Plasmas3104(1996).

Sheehan,D.P.,Aparadoxinvolvingthesecondlawofthermodynamics；Phys.Plasmas21893(1995).

Use the example system of multiple ETD unit

Fig. 2 is the equidistant diagram comprising the system configuration 200 of parallel multiple ETD unit 100 according to an embodiment.Only for illustrated object, Fig. 2 shows one section of the ETD plate that three ETD unit 100 are wide and two ETD unit 100 are dark.In practice, ETD plate will comprise more (such as, become hundred, thousands of or even millions of) ETD unit 100.When ETD unit 100 is located parallelly, the heat flux of cross-system 200 increases, but the temperature difference between the both sides of unit remains unchanged.This is similar to concurrently by cell layout in circuit, wherein electric current increase and voltage is constant.

In an illustrated embodiment, surface 120 and 140 and heat transfer surface 100 are expanded across multiple ETD unit 100.This is conducive to producing, because ETD plate can use method well known in the prior art to be built layer by layer.In addition, adjacent units shared separator 160 (thus, each separator is the logical gate of four ETD unit 100).As previously mentioned, with reference to Figure 1B, single cavity 130 is shared by the ETD unit 100 of all (or at least some) in plate.Heat transfer surface 110 uses gas-tight seal and is connected with end wall 280 in the edge of plate.Thus, the combination of heat transfer surface 110 and end wall 280 produces the container of sealing, and it prevents gas from leaving cavity 130.In one embodiment, valve (not shown) is set between cavity 130 and the outside of ETD equipment with the insertion of enable gas and/or replacement.

Separator 160 maintains the separation 230 of substantial constant between surface 120 and 140 throughout this plate.In various embodiments, depend on environment and embody rule, separate 230 and selected in the scope of about 0.01 micron to about 100 microns.In an illustrated embodiment, separator 160 is equally spaced a distance 260.The number reducing separator 160 increases the useable surface area on surface 120 and 140, separates the less regularity of 260 for cost with surface.Therefore, the demand of distance 260 based on embody rule and the rigidity of material for surface 120 and 140 and heat transfer surface 110 and select.In various embodiments, distance 260 is selected in the scope of about 0.1 micron to about 1000 microns.In other embodiments, distance 260 can configure (such as, hexagonal cells) and used by and/or non-rectilinear different from other direction in one direction.In another embodiment, particulate (such as, ball shaped nano pearl) is normally used as separator 160 and they are dispersed in cavity 130 at random or partly randomly.This has the advantage needing less precise hard_drawn tuhes during production process.

Fig. 3 represents according to the side view in series combining the system configuration 300 of the ETD unit 100 of three layers of an embodiment.Although every layer is illustrated as being single ETD unit 100, in practice, every layer can comprise many (such as, hundreds of, thousands of even millions of) the ETD unit be arranged in parallel, described by above reference Fig. 2.The selection showing three layers is in order to illustrated object purely.Principle described herein can be used to the layer of stacked any amount.Independently layer is in good thermo-contact with adjacent layer.When ETD unit 100 is by arranged in series, the temperature difference of unit increases, but the heat flux of cross-system 200 is constant.This is similar in series by cell layout in circuit, wherein voltage increase and electric current is constant.

In an illustrated embodiment, adjacent layer shares heat transfer surface 110, make the top heat transfer surface of one deck also be used as the end heat transfer surface of the layer on it, and vice versa.In an illustrated embodiment, bottom 301 has two surfaces 350 and 360 and comprises the cavity 355 of the first gas.Thus, bottom 301 causes the first temperature difference T1 across it.Material for surperficial 350 and 360 and the first gas are selected as the operation when inputting optimization system when heat transfer surface 110A is in the operating temperature of expectation.

Intermediate layer 302 also has two surfaces 330 and 340 and comprises the cavity 335 of the second gas.Thus, intermediate layer 302 causes the second temperature difference T2 across it.In one embodiment, the material for intermediate layer 302 is identical with those use in bottom 301 with gas.In other embodiments, be selected as the operation of the optimization system when the surperficial 110B of the first internal heat transfer is in the operating temperature of expectation based on the operating temperature of expectation of input heat transfer surface 110A and Δ T1 for the material on surface 330 and 340 and the second gas.

Top layer 303 also has two surfaces 310 and 320 and comprises the cavity 315 of the 3rd gas.Thus, top layer 303 causes the 3rd temperature difference T3 across it.In one embodiment, the material for top layer 303 is identical with those use in bottom 301 and/or intermediate layer 302 with gas.In other embodiments, be selected as the operation of the optimization system when the surperficial 110C of the second internal heat transfer is in the operating temperature of expectation based on the operating temperature of expectation of input heat transfer surface 110A and Δ T1 and Δ T2 for the material on surface 310 and 320 and the 3rd gas.

Therefore, the temperature difference T1+ Δ T2+ Δ T3 that system configuration 300 as a whole provides input heat transfer surface 110A and exports between heat transfer surface 110D, this can significantly be greater than by any one temperature difference obtained in layer 301-303.

Additional consideration

As used herein, term " comprises ", " comprising ", " having ", " having " or other variant any are intended to contain comprising of nonexcludability.Such as, comprise the process of a series of key element, method, article or device and be not necessarily only limitted to those key elements, but can comprise and clearly not list or intrinsic in other element of these processes, method, article or device.In addition, unless clearly there is contrary explanation, "or" refer to inclusive or, instead of exclusiveness or.Such as, condition A or B be satisfied with following in any one: A is true (or existence) and B is false (or not existing), A is false (or not existing) and B is true (or existence), and A and B is true (or existence).

In addition, the use of "a" or "an" is used to the element and the parts that describe embodiment described herein.This only conveniently and give of the present disclosurely to complete in general sense.This description should be understood to include one or at least one, and odd number also comprises plural number, unless clearly it refers to odd number.

When reading present disclosure, one of skill in the art will appreciate that the another alternative 26S Proteasome Structure and Function design for ETD, which creating steady state temperature difference.Thus, although specific embodiment and application have been illustrated and have described, but be to be understood that, described theme is not limited to precision architecture disclosed herein and parts, to those skilled in the art apparent various amendment, change and change can layout in method and apparatus disclosed herein, make in operation and details.

Claims

1. a surface catalysis thermal diode unit, comprising:

First surface, described first surface and the mutual chemical action of gas, make described gas sentence first rate dissociation close to described first surface; And

Second surface, described second surface and the mutual chemical action of described gas, make described gas sentence the second speed dissociation close to described second surface, described second speed is lower than described first rate;

Wherein said first surface and the definition of described second surface are configured to the cavity comprising described gas, and the difference between described first rate and described second speed causes across the steady state temperature difference of described cavity between described first surface and described second surface.

2. surface catalysis thermal diode unit according to claim 1, wherein said first surface is made up of at least one material being selected from group that the following forms: magnesium, aluminium, scandium, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, yttrium, zirconium, molybdenum, ruthenium, rhodium, palladium, silver, tin, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, hafnium, the silicon of doping, tantalum, tungsten, rhenium, osmium, iridium, platinum, gold, mercury, plumbous, aluminium oxide, magnesia, titanium dioxide, silica, nitrocellulose, aromatic polyamides, nylon, staple fibre, and polymethyl methacrylate.

3. surface catalysis thermal diode unit according to claim 1, wherein said second surface is made up of at least one material being selected from group that the following forms: polyethylene, polypropylene, paraffin, natural rubber, the silicon of doping, polyethers, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene (PTFE), perfluoroalkoxy, polyethylene chlorotrifluoroethylene, fluorubber, PFPE, and perfluorinated sulfonic acid, Graphene, graphite and CNT.

4. surface catalysis thermal diode unit according to claim 1, wherein said gas comprises at least one gas be selected from group that the following forms: formic acid, acetic acid, methyl alcohol, ethanol, formaldehyde, ammonia, dimethyl ketone, methylamine, dimethylamine, dimethyl ether, hydronium(ion) potassium oxide (water), acetamide, first sulphur, cyanogen, hydrogen cyanide, hydrogen fluoride, hydrogen sulfide, cyanogen methane, formamide, amino azomethine, hydrogen chloride, ethyl cyanide, nitrogen, carbon monoxide, carbon dioxide, sulfur dioxide, nitrogen oxide, single halomethane, methylene halide, haloform, tetrahalomethanes, halothane, hydrogen, helium, neon, argon, krypton, xenon, radon, methane, ethane, and propane.

5. surface catalysis thermal diode according to claim 1, wherein said first surface is arranged essentially parallel to described second surface.

6. surface catalysis thermal diode according to claim 5, comprise the multiple distance pieces between described first surface and described second surface further, described multiple distance piece is by the distance of the distance maintaining between described first surface and described second surface in substantial constant.

7. surface catalysis thermal diode according to claim 6, wherein said constant distance is in the scope of 0.01 to 100 micron.

8. surface catalysis thermal diode unit according to claim 1, comprise the first heat transfer surface further, described first heat transfer surface is connected with described first surface and substantially parallel on the opposite side of described first surface with described cavity, described first heat transfer surface be configured to from described surface catalysis thermal diode externally to described first surface heat conduction.

9. surface catalysis thermal diode unit according to claim 8, comprise the second heat transfer surface further, described second heat transfer surface is connected with described second surface and substantially parallel on the opposite side of described second surface with described cavity, and described second heat transfer surface to be configured to from described second surface heat conduction outside described surface catalysis thermal diode.

10. a surface catalysis thermal diode equipment, comprise the according to claim 5 multiple surface catalysis thermal diode unit be connected in parallel, the cavity of wherein said multiple surface catalysis thermal diode unit is interconnected, and adjacent surface catalysis thermal diode shares at least one distance piece.

11. 1 kinds of surface catalysis thermal diode equipment, comprise the according to claim 1 multiple surface catalysis thermal diode unit be connected in series, wherein adjacent surface catalysis thermal diode unit is separated by the heat transfer surface shared, and described shared heat transfer surface is configured to transferring heat between adjacent surface catalysis thermal diode.

12. surface catalysis thermal diode unit according to claim 1, wherein said gas on the first surface with described first rate dissociation and described gas on described second surface with described second speed dissociation.

13. surface catalysis thermal diodes according to claim 1, wherein said first surface and described second surface cleaned.

14. surface catalysis thermal diodes according to claim 1, comprise a certain amount of described gas be positioned within described cavity, under the amount of described gas is selected as the pressure that described gas is in 0.01 to 10 barometric pressure range further.

15. surface catalysis thermal diodes according to claim 14, wherein said gas is through purification.

16. 1 kinds for generation of and maintain the method for the temperature difference, comprising:

There is provided first surface, described first surface and the mutual chemical action of gas, make described gas sentence first rate dissociation close to described first surface;

Second surface is provided, described second surface and the mutual chemical action of described gas, make described gas sentence the second speed dissociation close to described second surface, described second speed is lower than described first rate, and described first surface and described second surface define cavity; And

A certain amount of described gas is provided in described cavity;

Difference between wherein said first rate and described second speed causes across the described temperature difference of described cavity between described first surface and described second surface.

17. methods according to claim 16, wherein said first surface is made up of at least one material being selected from group that the following forms: ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, scandium, cadmium, titanium, hafnium, the silicon of doping, vanadium, tantalum, chromium, tungsten, manganese, rhenium, iron, osmium, cobalt, iridium, nickel, copper, zinc, yttrium, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, aluminium oxide, magnesia, titanium dioxide, silica, nitrocellulose, aromatic polyamides, nylon, staple fibre, and polymethyl methacrylate.

18. method according to claim 16, wherein said second surface is made up of at least one material being selected from group that the following forms: polyethylene, polypropylene, paraffin, natural rubber, the silicon of doping, polyethers, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene (PTFE), perfluoroalkoxy, polyethylene chlorotrifluoroethylene, fluorubber, PFPE, and perfluorinated sulfonic acid, Graphene, graphite and CNT.

19. methods according to claim 16, wherein said gas comprises at least one gas be selected from group that the following forms: formic acid, acetic acid, methyl alcohol, ethanol, formaldehyde, ammonia, dimethyl ketone, methylamine, dimethylamine, dimethyl ether, hydronium(ion) potassium oxide (water), acetamide, first sulphur, cyanogen, hydrogen cyanide, hydrogen fluoride, hydrogen sulfide, cyanogen methane, formamide, amino azomethine, hydrogen chloride, ethyl cyanide, nitrogen, carbon monoxide, carbon dioxide, sulfur dioxide, nitrogen oxide, single halomethane, methylene halide, haloform, tetrahalomethanes, halothane, hydrogen, helium, neon, argon, krypton, xenon, radon, methane, ethane, and propane.

20. methods according to claim 16, wherein said first surface is arranged essentially parallel to described second surface.

21. methods according to claim 20, comprise further:

There is provided the multiple distance pieces between described first surface and described second surface, described multiple distance piece is by the distance of the distance maintaining between described first surface and described second surface in substantial constant.

22. methods according to claim 16, comprise further:

First heat transfer surface is provided, described first heat transfer surface is connected with described first surface and substantially parallel on the opposite side of described first surface with described cavity, described first heat transfer surface be configured to from described surface catalysis thermal diode externally to described first surface heat conduction.

23. methods according to claim 22, comprise further:

Second heat transfer surface is provided, described second heat transfer surface is connected with described second surface and substantially parallel on the opposite side of described second surface with described cavity, and described second heat transfer surface to be configured to from described second surface heat conduction outside described surface catalysis thermal diode.

24. methods according to claim 16, wherein said gas on the first surface with described first rate dissociation and described gas on described second surface with described second speed dissociation.

25. methods according to claim 16, are included in clean described first surface and described second surface before providing described gas further.

26. methods according to claim 16, the amount being wherein positioned at the described gas within described cavity causes the pressure of 0.01 to 10 atmospheric scope.

27. methods according to claim 16, are included in further before providing described gas and purify described gas.