CN105506631A - PCB surface tin stripping solution - Google Patents
PCB surface tin stripping solution Download PDFInfo
- Publication number
- CN105506631A CN105506631A CN201610064408.4A CN201610064408A CN105506631A CN 105506631 A CN105506631 A CN 105506631A CN 201610064408 A CN201610064408 A CN 201610064408A CN 105506631 A CN105506631 A CN 105506631A
- Authority
- CN
- China
- Prior art keywords
- tin stripping
- pcb surface
- potassium permanganate
- stripping liquid
- tin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
Abstract
The invention discloses a PCB surface tin stripping solution which comprises the following components in parts by weight: 28%-30% of nitric acid, 10%-15% of ferric nitrate, 2%-5% of potassium permanganate, 1%-3% of a surfactant and 50%-58% of water. Potassium permanganate acidized by sulphuric acid is adopted as an additive, so that NO2 gas in the tin stripping process can be reduced, the tin stripping process is stable and controllable, and the tin stripping quality and efficiency can be improved.
Description
Technical field
The present invention relates to PCB and etch field, particularly relate to a kind of PCB surface tin stripping liquid, belong to chemical waste liquid process field.
Background technology
Spent solder stripper, mainly from printed-wiring board (PWB) (PCB) industry, reaches saturated generation by the tin stripping liquid molten tin amount of moving back in printed-wiring board (PWB) (PCB) in tin operation.In internal layer circuit plate, because traditional zinc-plated splicer's skill environmental pollution is serious, replaced by tin plating technique gradually.The effect of etching agent is the tin that optionally dissolves on copper electroplating layer and avoids copper stratum basale by eating away as far as possible.Tin stripping liquid mainly comprises two large types: fluorine-containing etching agent, nitric acid type etching agent.Fluorine-containing type etching agent, owing to producing obnoxious flavour, is eliminated gradually, and to compare fluorine-containing type etching agent little due to environmental pollution for nitric acid type etching agent, operate relatively simple, the advantages such as cost is lower, instead of fluorine-containing type etching agent very soon, are extensively accepted use by PCB producer.But in reality, because nitric acid type etching agent is moving back in tin process, including very complicated chemical reaction process, wherein can produce NO
2gas, NO
2gas and water reaction generate HNO
2and HNO
3, HNO
2and HNO
3reaction can discharge NO again
2gas, NO
2gas can produce rapidly in outburst mode and assemble, and after the tin layers of the complete covering of local location fast-etching, can erode to copper baseline road further, produces defect, and tin stripping liquid needs not stop to stir and could limit NO
2gathering.Inhibiter can be added to make HNO in actual production
2be oxidized to HNO more
3, and above-mentioned sluggish is occurred, but because limited efficiency, the defect generation that etching solution etches into copper base still can not be stopped.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of PCB surface tin stripping liquid component formula, Absorbable rod moves back in tin process a large amount of NO produced
2gas, and can by HNO
2be oxidized to HNO
3, make to move back tin process steadily controlled, improve and move back tin quality and efficiency.
For achieving the above object, technical scheme of the present invention is as follows: a kind of PCB surface tin stripping liquid, and each component weight percent content is as follows:
All the other are water, and wherein, described concentration of nitric acid is 78%, and described iron nitrate is nine water ferric crystals, and described potassium permanganate is the potassium permanganate of sulfuric acid acidation, and described tensio-active agent is 90% alcohol.
Further, described nitric acid mass percent is 28%-30%.
Further, described iron nitrate mass percent is 10%-15%%.
Further, described potassium permanganate is that dilute sulphuric acid compares mixed solution with potassium permanganate according to 1:1 quality.
Further, described potassium permanganate solution mass percent is 2%-5%.
Further, described alcohol quality per-cent is 1%-3%%.
Further, all the other are water.
Further, the preparation method of a kind of PCB surface tin stripping liquid, comprises the following steps:
(1) water and ferric crystals are added in agitated pool stir, treat that iron nitrate dissolves completely;
(2) in above-mentioned solution, add nitric acid, then stir, make uniform liquid;
(3) in above-mentioned solution, add potassium permanganate solution, then stir, make uniform liquid, be cooled to less than 40 degree;
(4) finally add alcohol to stir.
The invention has the beneficial effects as follows: the present invention adopts the potassium permanganate of sulfuric acid acidation as additive, can reduce the NO moving back and produce in tin process
2, make to move back tin process steadily controlled, improve and move back tin quality and efficiency.
Embodiment
Be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
The nitric acid 30% of concentration 78% technical grade, iron nitrate is nine water iron nitrates 13% of the purity 99% of technical grade, and potassium permanganate is sulfuric acid and the potassium permanganate mixed solution of massfraction 1:1, ratio 4%, and tensio-active agent is 90% alcohol 0.8%, water 51%.Preparation method: water and ferric crystals are added in agitated pool and stirs, treat that iron nitrate dissolves completely; In above-mentioned solution, add nitric acid, then stir, make uniform liquid; In above-mentioned solution, add potassium permanganate solution, then stir, make uniform liquid, be cooled to less than 40 degree; Finally add alcohol to stir.The principal feature of the present embodiment is that to move back tin capacity large, and it is high and stable to move back tin speed.Move back in tin process and have following reaction:
H
2O+NO
2＝HNO
3+HNO
2①
2NO+O
2＝2NO
2②
2HNO
2＝H
2O+NO↑+NO
2↑③
10NO
2+2KMnO
4+3H
2SO
4+2H
2O＝2MnSO
4+K
2SO
4+10HNO
3④
2MnO
4 -+5NO
2 -+6H
+＝2Mn
2++5NO
3 -+3H
2O⑤
Wherein, 1., 2., 3. reaction forms circulating reaction, can produce a large amount of NO in the short period of time
2if etching process stirs not in time, is easy at NO
2aggregate site has etched the laggard step etching of tin to copper base, produces bad.Owing to adding potassium permanganate as inhibiter, reaction 4., 5. can be participated in, not only can absorb the NO of generation on the one hand in a large number
2, make reaction process evenly controlled, also can be oxidized HNO on the other hand
2for HNO
3, slow down the speed of above-mentioned reaction further, and reaction product HNO
3for etching solution component, a large amount of NO
3 -ion exists, and can improve the service efficiency of tin stripping liquid, and then overall raising etching efficiency.
Embodiment 2
The nitric acid 28% of concentration 78% technical grade, iron nitrate is nine water iron nitrates 15% of the purity 99% of technical grade, and potassium permanganate is sulfuric acid and the potassium permanganate mixed solution of massfraction 1:1, ratio 5%, and tensio-active agent is 90% alcohol 1%, water 53%.Preparation method is with embodiment 1, and the main feature of the present embodiment is high for moving back tin efficiency, and moves back tin rate stabilization, produces gas few.
Embodiment 3
The nitric acid 30% of concentration 78% technical grade, iron nitrate is nine water iron nitrates 10% of the purity 99% of technical grade, and potassium permanganate is sulfuric acid and the potassium permanganate mixed solution of massfraction 1:1, ratio 2%, and tensio-active agent is 90% alcohol 3%, water 55%.Preparation method is with embodiment 1, and the main feature of the present embodiment, for moving back tin rate stabilization, produces gas few, and after moving back tin, copper-based surfaces light is clean, good appearance.
Embodiment 4
The nitric acid 30% of concentration 78% technical grade, iron nitrate is nine water iron nitrates 15% of the purity 99% of technical grade, and potassium permanganate is sulfuric acid and the potassium permanganate mixed solution of massfraction 1:1, ratio 5%, and tensio-active agent is 90% alcohol 3%, water 47%.Preparation method is with embodiment 1, and the main feature of the present embodiment is high for moving back tin efficiency, rate stabilization, produces gas few, and after moving back tin, copper-based surfaces light is clean, good appearance.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest former with disclosed herein and that features of novelty is consistent scope.
Claims (7)
1. a PCB surface tin stripping liquid, is characterized in that: each component weight percent content is as follows:
All the other are water
Wherein, described concentration of nitric acid is 78%, and described iron nitrate is nine water ferric crystals, and described potassium permanganate is the potassium permanganate of sulfuric acid acidation, and described tensio-active agent is 90% alcohol or ethylene glycol.
2. a kind of PCB surface according to claim 1 tin stripping liquid, is characterized in that: described nitric acid mass percent is 28%-30%.
3. a kind of PCB surface according to claim 1 tin stripping liquid, is characterized in that: described iron nitrate mass percent is 10%-15%.
4. a kind of PCB surface according to claim 1 tin stripping liquid, is characterized in that: described potassium permanganate is that dilute sulphuric acid compares mixed solution with potassium permanganate according to 1:1 quality.
5. a kind of PCB surface according to claim 1 tin stripping liquid, is characterized in that: described potassium permanganate solution mass percent is 2%-5%.
6. a kind of PCB surface according to claim 1 tin stripping liquid, is characterized in that: described alcohol quality per-cent is 1%-3%.
7. a preparation method for PCB surface tin stripping liquid, the method, based on the PCB surface tin stripping liquid described in claim 1-6 any one, is characterized in that, comprises the following steps:
(1) water and ferric crystals are added in agitated pool stir, treat that iron nitrate dissolves completely;
(2) in the solution in (1), add nitric acid, then stir, make uniform liquid;
(3) in solution in (2), add potassium permanganate solution, then stir, make uniform liquid, be cooled to less than 40 degree;
(4) finally add alcohol to stir.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610064408.4A CN105506631A (en) | 2016-01-29 | 2016-01-29 | PCB surface tin stripping solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610064408.4A CN105506631A (en) | 2016-01-29 | 2016-01-29 | PCB surface tin stripping solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105506631A true CN105506631A (en) | 2016-04-20 |
Family
ID=55714919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610064408.4A Pending CN105506631A (en) | 2016-01-29 | 2016-01-29 | PCB surface tin stripping solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105506631A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108975661A (en) * | 2018-08-31 | 2018-12-11 | 山东孟友玻璃科技有限公司 | Tin method is moved back on a kind of float glass tin stripping liquid and surface |
Citations (6)
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|---|---|---|---|---|
| US4374744A (en) * | 1981-04-06 | 1983-02-22 | Mec Co., Ltd. | Stripping solution for tin or tin alloys |
| CN101760743A (en) * | 2009-11-09 | 2010-06-30 | 广东奥美特集团有限公司 | Tin stripping liquid |
| CN101962776A (en) * | 2010-09-01 | 2011-02-02 | 济南德锡科技有限公司 | Solder stripping agent and preparation method thereof |
| CN102061477A (en) * | 2010-12-31 | 2011-05-18 | 深圳市格林美高新技术股份有限公司 | Solder removing liquid, preparation method and application thereof |
| CN104060269A (en) * | 2014-05-29 | 2014-09-24 | 深圳振华富电子有限公司 | Tin-stripping agent, preparation method of tin-stripping agent and tin-stripping method |
| CN105220156A (en) * | 2015-10-12 | 2016-01-06 | 中山市鸿博化工助剂有限公司 | A kind of etching agent for printed circuit board (PCB) and preparation method thereof |
-
2016
- 2016-01-29 CN CN201610064408.4A patent/CN105506631A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4374744A (en) * | 1981-04-06 | 1983-02-22 | Mec Co., Ltd. | Stripping solution for tin or tin alloys |
| CN101760743A (en) * | 2009-11-09 | 2010-06-30 | 广东奥美特集团有限公司 | Tin stripping liquid |
| CN101962776A (en) * | 2010-09-01 | 2011-02-02 | 济南德锡科技有限公司 | Solder stripping agent and preparation method thereof |
| CN102061477A (en) * | 2010-12-31 | 2011-05-18 | 深圳市格林美高新技术股份有限公司 | Solder removing liquid, preparation method and application thereof |
| CN104060269A (en) * | 2014-05-29 | 2014-09-24 | 深圳振华富电子有限公司 | Tin-stripping agent, preparation method of tin-stripping agent and tin-stripping method |
| CN105220156A (en) * | 2015-10-12 | 2016-01-06 | 中山市鸿博化工助剂有限公司 | A kind of etching agent for printed circuit board (PCB) and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 张玲等: "印刷电路硝酸型锡铅退除液的研制", 《电镀与涂饰》 * |
| 朱裕贞等: "《现代基础化学》", 30 June 2010 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108975661A (en) * | 2018-08-31 | 2018-12-11 | 山东孟友玻璃科技有限公司 | Tin method is moved back on a kind of float glass tin stripping liquid and surface |
| CN108975661B (en) * | 2018-08-31 | 2021-04-13 | 山东孟友玻璃科技有限公司 | Tin stripping liquid for float glass and surface tin stripping method |
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Application publication date: 20160420 |