CN105774132A - Thermally-conductive and electrically-conductive foam adhesive tape - Google Patents
Thermally-conductive and electrically-conductive foam adhesive tape Download PDFInfo
- Publication number
- CN105774132A CN105774132A CN201610245197.4A CN201610245197A CN105774132A CN 105774132 A CN105774132 A CN 105774132A CN 201610245197 A CN201610245197 A CN 201610245197A CN 105774132 A CN105774132 A CN 105774132A
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- heat
- ink
- conductivity conducting
- foam
- conductive
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
Abstract
The invention discloses thermally-conductive and electrically-conductive foam adhesive tape mainly applied to heat conduction buffer and electrostatic protection of electronic components. The thermally-conductive and electrically-conductive foam adhesive tape comprises a metal foil base material. A first thermally-conductive and electrically-conductive adhesive layer and a second thermally-conductive and electrically-conductive adhesive layer are arranged on the upper surface and the lower surface of the metal foil base material, a layer of foam is pasted on the surface of the first thermally-conductive and electrically-conductive adhesive layer in a covering mode, a layer of release film is pasted on the surface of the second thermally-conductive and electrically-conductive adhesive layer in a covering mode, first ink suction holes are formed in the foam, a layer of thermally-conductive and electrically-conductive ink is attached to the surface of the foam, and the thermally-conductive and electrically-conductive ink seeps into the first ink suction holes and makes contact with the first thermally-conductive and electrically-conductive adhesive layer. The thermally-conductive and electrically-conductive foam adhesive tape is simple in production process and can be freely cut according to actual needs.
Description
Technical field
The present invention relates to a kind of heat-conductivity conducting foam tape, be mainly used in electronic unit heat-conducting buffer and electrostatic protection.
Background technology
In electronic product, such as TV, LCD display, LCD TV, mobile phone, notebook, MP3, communication cabinet and Medical Instruments etc., it is generally required to patch last layer conducting foam on some electronic units therein, thus playing the effect of conduction, antistatic and buffering antidetonation, this kind of conducting foam needs have good flexibility, relatively low impedance and good heat conductivility.nullTraditional conducting foam adhesive tape is whole coated with conductive heat-conducting layer (such as by the mode of Vacuum Deposition in the coat of metal or graphite linings such as foam surface plated with nickel) on the surface of foam，Chinese patent 201520681192.7 discloses a kind of conducting foam，This conducting foam adopts the structure of the one layer of electrically conductive graphite layer of Surface coating at foam body，Although it can play conduction、The effect of antistatic and buffering antidetonation，But production technology relative complex，What is more important，Adhesive tape is accomplished by determining its concrete width before manufacture，Adhesive tape finished product cannot be cut as required again，Concrete reason is in that: first，This adhesive tape finished product is directly in foam Surface coating graphite linings，Owing to foam has high-compressibility，When cutting, foam significantly compresses the situation easily occurring that graphite linings be full of cracks is even peeled off，Secondly，Cut even if smoothly completing，Its conduction of adhesive tape after cutting and heat conduction effect are also greatly reduced and even lose (if this adhesive tape is cut into two parts by width，The adhesive tape obtained after then cutting carries out conducting electricity and heat conduction only with unilateral graphite linings，Conduction and heat conduction effect of adhesive tape are greatly reduced，If this adhesive tape is cut into three parts by width，Then the adhesive tape of mid portion is owing to being spaced one layer of heat insulation foam between its upper strata graphite linings and lower floor's graphite linings，Therefore the adhesive tape of this mid portion will not possess conduction and heat conduction effect).
Summary of the invention
The technical problem to be solved in the present invention is: provide a kind of production technology simple, it is possible to arbitrarily to carry out the heat-conductivity conducting foam tape cut according to actual needs.
In order to solve above-mentioned technical problem, the present invention adopts the following technical scheme that a kind of heat-conductivity conducting foam tape, including metallic foil substrates, described metallic foil substrates upper, lower surface is respectively equipped with the first heat-conductivity conducting glue-line and the second heat-conductivity conducting glue-line, described first heat-conductivity conducting film surface pastes one layer of foam, described second heat-conductivity conducting film surface pastes one layer of mould release membrance, described foam offers the first ink-sucking hole, one layer of heat-conductivity conducting ink of described foam surface attachment, described heat-conductivity conducting ink penetrates in the first ink-sucking hole and contacts with the first heat-conductivity conducting glue-line.
Further, described first heat-conductivity conducting glue-line offering the second ink-sucking hole communicated with the first ink-sucking hole, described heat-conductivity conducting ink penetrates in the second ink-sucking hole and contacts with metallic foil substrates.
Further, described metallic foil substrates offering the 3rd ink-sucking hole communicated with the second ink-sucking hole, described heat-conductivity conducting ink penetrates in the 3rd ink-sucking hole and contacts with the second heat-conductivity conducting glue-line.
Wherein, described first ink-sucking hole, the second ink-sucking hole and the 3rd ink-sucking hole process by die punching/high-voltage electric shock perforate is disposable.
Wherein, described heat-conductivity conducting ink silk screen printing/coat foam surface, described foam is formed to 0.1-0.3mm in the solid after heat compression set type of heat-conductivity conducting ink by the polyethylene/polyurethane/tripolycyanamide foam of 0.5mm.
Preferably, described first heat-conductivity conducting glue-line and the second heat-conductivity conducting glue-line are made up of the acrylate pressure sensitive adhesive being added with heat-conductivity conducting powder.
Preferably, described heat-conductivity conducting powder includes nickel, gold, powdered graphite.
Wherein, described metallic foil substrates is Copper Foil or aluminium foil.
Wherein, the temperature of described thermocompression forming is more than 120 degrees Celsius.
What the present invention obtained has the beneficial effects that: heat-conductivity conducting foam tape collection heat conduction provided by the invention, the functions such as conduction and bumper and absorbing shock are in one, in the present invention, heat-conductivity conducting ink can make it be attached to foam surface by the mode of silk-screen/coating, the first ink-sucking hole is offered owing to foam surface is intensive, and heat-conductivity conducting ink penetrates in the first ink-sucking hole and contacts with the first heat-conductivity conducting glue-line, therefore adhesive tape finished product can carry out cutting of any specification as required, it is absent from because cutting the situation causing that adhesive tape conduction and heat conduction effect are greatly reduced or lose, simultaneously, owing to the present invention adding metallic foil substrates, while ensureing that adhesive tape is easier to cut, improve its heat conduction and electric conductivity.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of embodiments of the invention；
Fig. 2 is the structural representation of metallic foil substrates in embodiment illustrated in fig. 1；
Fig. 3 is the structural representation of the first heat-conductivity conducting glue-line in embodiment illustrated in fig. 1；
Fig. 4 is the structural representation of foam in embodiment illustrated in fig. 1；
Accompanying drawing is labeled as:
1 metallic foil substrates 2 first heat-conductivity conducting glue-line
3 first heat-conductivity conducting glue-line 4 foam 5 mould release membrances
6 heat-conductivity conducting ink 1a the 3rd ink-sucking hole 2a the second ink-sucking holes
4a the first ink-sucking hole.
Detailed description of the invention
For the ease of the understanding of those skilled in the art, below in conjunction with embodiment, the present invention is further illustrated with accompanying drawing, and the content that embodiment is mentioned not is limitation of the invention.
It is emphasized that, in describing the invention, term " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or hint indication device or element must have specific orientation, with specific azimuth configuration and operation, be therefore not considered as limiting the invention.
Additionally, term " first ", " second " are only for descriptive purposes, and it is not intended that indicate or imply relative importance or the implicit quantity indicating indicated technical characteristic.In describing the invention, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
As Figure 1-4, a kind of heat-conductivity conducting foam tape, including metallic foil substrates 1, the upper and lower surface of metallic foil substrates 1 is respectively equipped with the first heat-conductivity conducting glue-line 2 and the second heat-conductivity conducting glue-line 3, first heat-conductivity conducting glue-line 2 surface pastes one layer of foam 4, second heat-conductivity conducting glue-line 3 surface pastes one layer of mould release membrance 5, foam 4 offers the first ink-sucking hole 4a, one layer of heat-conductivity conducting ink 6 of foam surface attachment, heat-conductivity conducting ink 6 penetrates in the first ink-sucking hole 4a and contacts with the first heat-conductivity conducting glue-line 2.
nullThe heat-conductivity conducting foam tape collection heat conduction that above-described embodiment provides、The functions such as conduction and bumper and absorbing shock are in one，In the above-described embodiments，Heat-conductivity conducting ink 6 can pass through the mode of silk-screen/coating and (it will be appreciated by those skilled in the art that，Above-mentioned heat-conductivity conducting ink 6 can also pass through other mode of printings except adopting silk-screen/coating and be attached to foam 4 surface by it) make it be attached to foam 4 surface，The first ink-sucking hole 4a is offered owing to foam 4 surface is intensive，And heat-conductivity conducting ink 6 penetrates in the first ink-sucking hole 4a and contacts with the first heat-conductivity conducting glue-line 2，Therefore the adhesive tape finished product finally given can carry out any specification as required and (it should be noted that，Cutting described in the present invention refers to the width to adhesive tape and carries out cutting of all size) cut，It is absent from because cutting the situation causing that adhesive tape conduction and heat conduction effect are greatly reduced or lose，Simultaneously，Metallic foil substrates 1 is added due in the heat-conductivity conducting foam tape that above-described embodiment provides，While being added in of metallic foil substrates 1 ensures that adhesive tape is easier to cut，Also improve its heat conduction and electric conductivity.
In the above-described embodiments, further, it is also possible on the first heat-conductivity conducting glue-line 2, offer the second ink-sucking hole 2a communicated with the first ink-sucking hole 4a, heat-conductivity conducting ink 6 penetrates in the second ink-sucking hole 2a simultaneously and contacts with metallic foil substrates 1.Said structure so that the heat-conductivity conducting ink 6 on foam 4 surface is tightr with the connection of other ingredients of adhesive tape, can be not easily stripped when cutting, come off, and the heat-conductivity conducting performance that adhesive tape simultaneously can also be allowed overall is more excellent.
Additionally, in the above-described embodiments, it is also possible to offering on metallic foil substrates 1 and the second ink-sucking hole 2a the 3rd ink-sucking hole 1a communicated, heat-conductivity conducting ink 6 penetrates in the 3rd ink-sucking hole 1a and contacts with the second heat-conductivity conducting glue-line 3.The starting point offering the 3rd ink-sucking hole 1a is similar with the second ink-sucking hole 2a, does not repeat them here.
Wherein, the first ink-sucking hole 4a in above-described embodiment, the second ink-sucking hole 2a and the three ink-sucking hole 1a process by die punching/high-voltage electric shock perforate is disposable.Such as, first metallic foil substrates the 1, first heat-conductivity conducting glue-line 2 and foam 4 are compound to together, then pass through the above-mentioned first ink-sucking hole 4a of the disposable processing of mode, second ink-sucking hole 2a and the three ink-sucking hole 1a of mold cavity or high-voltage electric shock perforate, adopt above-mentioned processing mode to obtain the first ink-sucking hole 4a, the second ink-sucking hole 2a and the 3rd ink-sucking hole 1a concentricity is high, it is more conducive to heat-conductivity conducting ink 6 penetrate into, above-mentioned processing mode technique is simple, easy to operate simultaneously, and processing cost is relatively low.
As preferred scheme, heat-conductivity conducting ink 6 silk-screen/coat foam 4 surface, foam 4 is formed to 0.1-0.3mm at the solid rear thermocompression forming of heat-conductivity conducting ink 6 by the polyethylene/polyurethane/tripolycyanamide foam of 0.5mm.Foam 4 is carried out thermocompression forming after heat-conductivity conducting ink 6 is solid again and can improve the heat-conductivity conducting ink 6 compactedness in the first ink-sucking hole 4a, the second ink-sucking hole 2a and the three ink-sucking hole 1a, thus ensureing that adhesive tape has the heat-conductivity conducting performance being provided simultaneously with excellence of comfort cushioning damping performance.
Wherein, first heat-conductivity conducting glue-line 2 and the second heat-conductivity conducting glue-line 3 are made up of the acrylate pressure sensitive adhesive being added with heat-conductivity conducting powder, above-mentioned heat-conductivity conducting powder preferably includes nickel, gold, powdered graphite, metallic foil substrates 1 is preferably Copper Foil or aluminium foil, finally, the above-mentioned temperature to foam 4 thermocompression forming is preferably more than 120 degrees Celsius.To the temperature of foam 4 thermocompression forming more than 120 degrees Celsius primarily for following 2 considerations: one, adopt the high temperature of more than 120 degrees Celsius can shorten the time of thermocompression forming；Two, under the hot conditions of 120 degrees Celsius, the mobility of heat-conductivity conducting ink 6 can strengthen (although ink has cured at normal temperatures, but it starts softening under the high temperature conditions, mobility increases), it is more beneficial for improving the heat-conductivity conducting ink 6 compactedness in the first ink-sucking hole 4a, the second ink-sucking hole 2a and the three ink-sucking hole 1a.It should be noted that, in the present invention, the addition of metallic foil substrates 1 effectively ensure that the thermocompression forming effect of foam 4, if end liner made by metal-foil-free base material 1, thickness after the longer shaping time of needs and sizing also can be become to be difficult to control to by the thermocompression forming operation of foam 4, and the fraction defective of final products will rise.
Above-described embodiment is the present invention preferably implementation, and in addition, the present invention can also realize by alternate manner, and under the premise conceived without departing from the technical program, any apparent replacement is all within protection scope of the present invention.
In order to allow those of ordinary skill in the art understand the present invention improvements relative to prior art more easily, some accompanying drawings of the present invention and description are simplified, and for the sake of clarity, present specification is omitted some other elements, and those of ordinary skill in the art it is to be appreciated that these elliptical elements also may make up present disclosure.
Claims (9)
1. a heat-conductivity conducting foam tape, including metallic foil substrates (1), described metallic foil substrates (1) upper, lower surface is respectively equipped with the first heat-conductivity conducting glue-line (2) and the second heat-conductivity conducting glue-line (3), described first heat-conductivity conducting glue-line (2) surface pastes one layer of foam (4), described second heat-conductivity conducting glue-line (3) surface pastes one layer of mould release membrance (5), described foam (4) offers the first ink-sucking hole (4a), one layer of heat-conductivity conducting ink (6) of described foam surface attachment, described heat-conductivity conducting ink (6) is penetrated in the first ink-sucking hole (4a) and contacts with the first heat-conductivity conducting glue-line (2).
2. heat-conductivity conducting foam tape according to claim 1, it is characterized in that: offer the second ink-sucking hole (2a) communicated with the first ink-sucking hole (4a) on described first heat-conductivity conducting glue-line (2), described heat-conductivity conducting ink (6) is penetrated in the second ink-sucking hole (2a) and contacts with metallic foil substrates (1).
3. heat-conductivity conducting foam tape according to claim 2, it is characterized in that: offer the 3rd ink-sucking hole (1a) communicated with the second ink-sucking hole (2a) on described metallic foil substrates (1), described heat-conductivity conducting ink (6) is penetrated in the 3rd ink-sucking hole (1a) and contacts with the second heat-conductivity conducting glue-line (3).
4. heat-conductivity conducting foam tape according to claim 3, it is characterised in that: described first ink-sucking hole (4a), the second ink-sucking hole (2a) and the 3rd ink-sucking hole (1a) process by die punching/high-voltage electric shock perforate is disposable.
5. the heat-conductivity conducting foam tape according to any one in claim 1-4, it is characterized in that: described heat-conductivity conducting ink (6) silk-screen/coat foam (4) surface, described foam (4) is formed to 0.1-0.3mm at the solid rear thermocompression forming of heat-conductivity conducting ink (6) by the polyethylene/polyurethane/tripolycyanamide foam of 0.5mm.
6. heat-conductivity conducting foam tape according to claim 5, it is characterised in that: described first heat-conductivity conducting glue-line (2) and the second heat-conductivity conducting glue-line (3) are made up of the acrylate pressure sensitive adhesive being added with heat-conductivity conducting powder.
7. heat-conductivity conducting foam tape according to claim 6, it is characterised in that: described heat-conductivity conducting powder includes nickel, gold, powdered graphite.
8. heat-conductivity conducting foam tape according to claim 6, it is characterised in that: described metallic foil substrates (1) is Copper Foil or aluminium foil.
9. heat-conductivity conducting foam tape according to claim 5, it is characterised in that: the temperature of described thermocompression forming is more than 120 degrees Celsius.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610245197.4A CN105774132B (en) | 2016-04-20 | 2016-04-20 | A kind of thermal conductivity foam tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610245197.4A CN105774132B (en) | 2016-04-20 | 2016-04-20 | A kind of thermal conductivity foam tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105774132A true CN105774132A (en) | 2016-07-20 |
| CN105774132B CN105774132B (en) | 2017-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610245197.4A Active CN105774132B (en) | 2016-04-20 | 2016-04-20 | A kind of thermal conductivity foam tape |
Country Status (1)
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| CN (1) | CN105774132B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106273790A (en) * | 2016-08-12 | 2017-01-04 | 斯迪克新型材料（江苏）有限公司 | A kind of Copper Foil conduction, heat conduction, antidetonation, the preparation method of shielding tape |
| CN107033802A (en) * | 2017-05-12 | 2017-08-11 | 东华大学 | A kind of polyimides elastic heat conducting adhesive tape easily torn off |
| CN108471702A (en) * | 2018-05-15 | 2018-08-31 | 苏州盛达胶粘制品有限公司 | A kind of thermal conductivity foam tape and preparation method thereof |
| CN108546524A (en) * | 2018-07-26 | 2018-09-18 | 东莞捷邦实业有限公司 | The anti-tampering copper foil foam component of electronic circuit board static conductive |
| CN108650872A (en) * | 2018-05-15 | 2018-10-12 | 苏州盛达胶粘制品有限公司 | A kind of conductive and heat-conductive foam tape and preparation method thereof |
| CN109273145A (en) * | 2018-11-06 | 2019-01-25 | 深圳市美信电子有限公司 | A kind of cladded type conducting foam and preparation method thereof |
| CN109353083A (en) * | 2018-11-22 | 2019-02-19 | 深圳市宏能胶粘制品有限公司 | A kind of compound foam tape of novel heat-conducting conduction shading |
| CN110023079A (en) * | 2017-01-31 | 2019-07-16 | 松下知识产权经营株式会社 | Graphite composite film and its manufacturing method |
| CN112194993A (en) * | 2020-10-16 | 2021-01-08 | 苏州盛达飞智能科技股份有限公司 | Conductive foam adhesive tape with good thermal conductivity |
| CN112210309A (en) * | 2020-10-12 | 2021-01-12 | 苏州盛达飞智能科技股份有限公司 | Method for manufacturing electric-conduction heat-conduction foam adhesive tape |
| CN112226173A (en) * | 2020-10-16 | 2021-01-15 | 苏州盛达飞智能科技股份有限公司 | Conductive foam double-sided tape |
| CN114379100A (en) * | 2021-12-20 | 2022-04-22 | 隆扬电子(昆山)股份有限公司 | Integrated forming process for aluminum foil local back foam |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106273790A (en) * | 2016-08-12 | 2017-01-04 | 斯迪克新型材料（江苏）有限公司 | A kind of Copper Foil conduction, heat conduction, antidetonation, the preparation method of shielding tape |
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| CN108471702B (en) * | 2018-05-15 | 2021-01-01 | 苏州盛达飞智能科技股份有限公司 | Heat-conducting and electric-conducting foam adhesive tape and manufacturing method thereof |
| CN108546524A (en) * | 2018-07-26 | 2018-09-18 | 东莞捷邦实业有限公司 | The anti-tampering copper foil foam component of electronic circuit board static conductive |
| CN109273145B (en) * | 2018-11-06 | 2023-09-22 | 美信新材料股份有限公司 | Coated conductive foam and preparation method thereof |
| CN109273145A (en) * | 2018-11-06 | 2019-01-25 | 深圳市美信电子有限公司 | A kind of cladded type conducting foam and preparation method thereof |
| CN109353083A (en) * | 2018-11-22 | 2019-02-19 | 深圳市宏能胶粘制品有限公司 | A kind of compound foam tape of novel heat-conducting conduction shading |
| CN112210309A (en) * | 2020-10-12 | 2021-01-12 | 苏州盛达飞智能科技股份有限公司 | Method for manufacturing electric-conduction heat-conduction foam adhesive tape |
| CN112226173A (en) * | 2020-10-16 | 2021-01-15 | 苏州盛达飞智能科技股份有限公司 | Conductive foam double-sided tape |
| CN112194993A (en) * | 2020-10-16 | 2021-01-08 | 苏州盛达飞智能科技股份有限公司 | Conductive foam adhesive tape with good thermal conductivity |
| CN114379100A (en) * | 2021-12-20 | 2022-04-22 | 隆扬电子(昆山)股份有限公司 | Integrated forming process for aluminum foil local back foam |
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| CN105774132B (en) | 2017-07-25 |
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