CN1118910A - 薄柔性包装中的射频电路和存储器 - Google Patents

薄柔性包装中的射频电路和存储器 Download PDF

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CN1118910A
CN1118910A CN95104779A CN95104779A CN1118910A CN 1118910 A CN1118910 A CN 1118910A CN 95104779 A CN95104779 A CN 95104779A CN 95104779 A CN95104779 A CN 95104779A CN 1118910 A CN1118910 A CN 1118910A
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circuit
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antenna
chip
sheet base
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保罗·A·莫斯科维茨
迈克尔·J·布雷迪
保罗·W·科茨
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International Business Machines Corp
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Abstract

本发明是一个新型薄柔性射频(RF)标签,它由一具有逻辑电路、存储器、射频电路的半导体电路与天线相连构成的,所有互连线都放在一个单一连线平面内而没有交叉。该包装中的元件(片基、天线和层压覆盖层)都是柔性的。包装中的元件都是薄的。该标签是薄而且柔性的,使它具有独特的应用范围,包括信用卡、护照、入场券、以及邮票的RFID标签。

Description

薄柔性包装中的射频电路和存储器
本发明是关于在一个薄柔性包装中的射频电路和存储器,更具体地说,本发明是关于用作射频标签(tag)的薄柔性射频电路。
射频识别(RFID)只是用于识别目标的许多识别技术之一。RFID系统的核心是载有信息的标签。标签响应从基地站收到的编码RF信号而起作用。通常,这标签将入射的RF载波反射回基地站。由于反射信号被标签根据它的编程信息协议进行了调制从而传送了信息。
该标签由具有RF电路的半导体芯片、逻辑电路及存储器组成。该标签还有一个天线、常常是若干分离元件(例如电容、二极管等)的集合、在有源标签中的电池、用于安装这些元件的片基、各部件之间的连接线、以及一个物理的包装装置。一种标签是无源标签,没有电池。它们从用于质问该标签的RF信号中汲取能量。通常RFID是把单个元件装在一个电路卡上制成的。其作法或者是用短导线联接或焊接线路板与电路元件:芯片、电容、二极管、天线。线路卡可以是由环氧玻璃纤维组合物或陶瓷制成。天线通常是焊在电路卡上的导线环或者由刻蚀或电镀在电路卡上。整个组合可以封装在一塑料盒中或铸在一个三维塑料包装中。
尽管RFID技术的应用还不象其他ID技术(例如条形码)那样普及,但RFID正在一些领域中向着一种普遍性技术发展,引人注目的是车辆的识别领域。
RFID的发展一直受到许多限制:标签的高费用、大多数标签的体积大、以及标签灵敏度和距离范围的问题等。一个典型的标签价格在5美元至10美元范围。
许多公司已集中于壁龛(niche)应用。一些先有技术用于识别铁路车厢。这些标签倾向于相当大的尺寸,在装入固体的非柔性盒子中的若干电路板上的分离元件构成。RF标签现在应用于自动征收通行费行业,例如通路和桥梁的收取通行费。RF标签正在被试验用作公共汽车的无接触交费卡。雇员识别胸卡和安全胸卡已生产出来。动物识别标签也已能在市场买到,这如同在生产过程中追踪部件的RFID系统。
有标准信用卡那样长度和宽度的标签已经存在。然而,这些卡通常厚度超过2.5mm,而且有一个非柔性盒。也有如信用卡尺寸长度和宽度的标签但带放置电路的突起,这些电路使这些突起太厚,没法放入卡片读出机。
尽管一些电子监视装置(EAS)(例如防盗装置)是薄的(0.3mm)但它们通常包含有限量(即只有1位)信息。某些这类装置能被关掉一次但不能被再启动。
图1A显示出一个射频标签先有技术结构105。标签105有一芯片110装在片基115上。芯片110有触点120由导线125连到片基115上的电路上。囊状材料130盖在芯片上用于环境保护。这个标签105的厚度由芯片部件的组合厚度决定。通常这些标签的片基的厚度至少为10mil(密耳二千分之一英寸),或0.25mm,芯片110及连线的高环(high loop)122的厚度在20至40mil或0.5至1mm范围,而囊状物130为大约10mil或0.25mm厚。结果,这种结构的标签厚度为从最小40mil到60mil,或1至1.5mm。这种结构对于许多潜在的标签应用而言是太厚了。
图1B显示出另一种先有技术结构150,图中示出芯片110有芯片触点120用导电胶粘剂160连到电路触点155。这种结构150的片基通常是制成FR4/印刷电路(厚度40至60mil或1至1.5mm)或者是柔性片基(10mil或0.25mm)。芯片110和胶粘剂给结构150的厚度增加了另外的20至40mil或0.5至1mm,而囊状物130再增加10至20mil或0.25至0.5厚度。所以这种结构的厚度在80至130mil或2至3.5mm范围内变化,它比图1A的结构更厚。
在这类技术中还知道有其他厚结构。这包括矩形平包装(QFP)和/或小轮廓包装(SOP)作为组成部件。用这些部件构成的结构至少1mm厚,通常是2至3mm厚。
先有技术的经验表明长期以来感到需要制造在柔性片基上的RFID标签。然而,薄柔性标签的目标是人们所希望的,但先有技术没能达到这一目标。一个先有技术参考披露的标签有1.5至2.0mm厚。这一标签厚度限制了这种标签的应用。例如,它大大超过了ISO标准信用卡的厚度(即0.76mm),所以不能用于要插入信用卡读出机的信用卡中。
先有技术没能生产出薄标签的原因是:没有注意使每个元件很薄;元件彼此叠放;天线和连接导体需要超过一个电导线平面,即使用了交叉来实现互连。由于元件的叠放和层数的增加,使包装厚并损失了柔性。
另一个先有技术参考披露的包装有总厚度0.8mm。这仍然大于ISO标准信用卡的厚度(0.76mm)。再有,尽管披露了薄元件,但没有注意整个使用柔性片基。元件装在一个硬电路卡上并包装在塑料中。(“硬”,的意思是不能用手容易地弄弯曲)。其结果是一个刚性包装。先有技术没有显示出以薄的柔性层压覆盖材料用于这种包装。结果是包装厚而且没有柔性。
本发明的一个目的是一种改进的薄的射频标签装置。
本发明的一个目的是具有一薄的柔性保护层的柔性射频标签装置。
本发明的另一个目的是这样的一种柔性射频标签装置,它可以适应于ISO标准信用卡、护照封皮、邮票、防盗设备、或入场券的厚度限制。
本发明是一种新型射频(RF)标签,它由一个具有逻辑电路、存储器和射频电路的半导体电路组成。该半导体装在一片基上,它能通过天线接收RF信号,该电线通过半导体上的连接线连接到半导体上。
本发明是一个新型射频标签设计结构,它薄而且是柔性的。该标签使天线和所有互连线都放在单一导线平面上而没有交叉重叠。包装中的元件彼此相邻放置,即它们不叠加。包装中的元件、片基、天线和叠层外罩都是柔性的。所有元件都是薄的,因而整个包装(包括外罩)的厚度不超过一个ISO标准信用卡厚度。最后形成的标签包装由薄的柔性元件按新的方式排列和连接而成,也是薄的和柔性的。因此,这使之能够有新的应用范围,包括:信用卡、护照、入场券、和邮票的RFID标签。
图1由图1A和图1B组成,显示出先有技术中两个典型实施例的截面图。
图2显示出本发明的RFID标签的一个最佳实施例的截面。
图3显示出在片基上带一孔的本发明的薄RFID标签的一个最佳实施例的截面。
图4是该薄标签顶视图,显示出一个双极天线。
图5是一个薄标签顶视图,显示出不只一个折叠式双极天线。
图6是一个在电路中包括一个电池的薄标签。
图7是由图7A—图7E组成,显示出先有技术中用不同方法将芯片连到片基上的截面图,其中有热压连接(图7A)、超声连接(图7B)、C4焊料连接(图7C)、导电胶粘剂连接(图7D)以及点焊(图7E)。
图8显示一薄标签用作邮票。
图9显示放在护照封面的薄标签,它使用了谐振环天线。
图10是用于入场券上的薄标签。
图11是用作防盗装置的薄标签。
图12是放在信用卡内部的薄标签。
图13是放在许可证内的薄标签。
图2显示出新型RFID标签200的侧视图。芯片210位于一个柔性片基220上。芯片210在其接点222上有突起225与片基220上包含的天线230相连。该组合由薄的柔性叠层270封装,该叠层由内侧的热熔胶粘剂250(例如EVA)和外侧的坚固聚合材料外罩260组成。
天线被制成为片基的组成部分。它由薄的通常25至35微米厚铜线组成,或者是刻蚀在铜/有机物叠层上或者镀在有机表面上。铜的薄度保持了片基的柔性。使用的典型材料是聚酯或聚酰亚胺作为有机物层以及电镀或轧制的环形铜。铜可以镀上金或锌以利于连接。芯片用芯片上的突起与天线线相连,这些突起最好或者是镀金突起用于热压连接,或者是C4焊料突起用于焊接连接。于是突起225成为连接线。因为它们只有25微米左右厚度量级,所以他们不会由于向电路中引入不希望的电感而降低电性能。新的设计有一个单一金属层,在柔性连续薄层中没有通路(vias)。由于只使用一级金属产生天线和互连线,使整个包装保持薄型。本发明的其他新颖之处包括把元件(芯片、天线、以及可能有电池)安排成彼此相邻。这意味着这些元件是彼此隔离(即不是重叠)的。在一个更佳实施例中因为芯片210直接连到天线230上而不在电路中使用交叉线从而保证了这种隔离。这一点的实现是利用了或者双极或者折叠双极的谐振天线,而不是需要交叉连接的多环天线。这样所有的连线都放在了一个平面内。使天线邻近芯片,避免交叉和重叠,这些也对保持薄包装作出了贡献。
为保持包装是薄的,通过做薄使芯片成为22.5至37.5微米厚。通常,半导体是在厚达1mm的晶片上制成的。在制成之后对晶片抛光或背磨可以使其做薄。所有的元件和连线都很薄。元件最好是:芯片(以及电池,如果使用的话)为10至12mil(250至300微米)厚或更薄些;连接结构是2mil(50μm(微米))或更薄;层压材料每面2至4mil(50至125μm);最好生成总厚度约20mil(500μm)左右,但不能超过30mil(750μm)。连线机制不会象导线连接技术那样增大标签的厚度。
尽管在一个最佳实施例中不要求,但可以在包装的一侧或两侧叠压独特的柔性覆盖材料270。在另一个最佳实施例中,该材料由二层组成(250、260)。一个软的共聚物(如乙基—乙烯基—醋酸盐)处于盖层的内表面250。坚固的聚酯层位于外表面260。这种组合提供了环境保护而又保持了包装的柔性。覆盖层的典型厚度是50至125微米。另一种情况是也可以使用单层叠层,如聚乙烯作为覆盖层。
图3独特的RFID标签300的侧视图。芯片310带有接点322和突起325,通过片基320中的窗口315与天线330相连。在一个更佳实施例中,使用了囊状物340保护芯片310和触点322上与片基320之间窗口中的天线330相连的连接点325免于暴露在环境中。在又一个实施例中,该包装由薄的柔性叠层370密封,该叠层370由内侧的热熔胶粘剂350(如EVA)和外侧的坚固聚酯材料外罩360构成。在另一个最佳实施例中,层370由单一有机材料层构成。
为进一步减少包装的厚度,片基制成带有一个窗口,允许芯片插入这一窗口。这样,片基的厚度不增加到芯片厚度上。用刻蚀或冲压方法在有机材料(聚酰亚胺或聚酯)上产生窗口。此外,可以使用窗口以便让芯片用薄层囊状材料覆盖。Hysol环氧4510是这种材料之一。囊状物没有显著增加总包装厚度,或许增加50微米,但的确为芯片提供了附加的环境保护。在囊状物中的不透明材料保护了芯片上的光敏电路。在这个实施例中,天线和芯片中心可以共平面。
图4显示出薄RFID标签400的顶视图。芯片410位于柔性片基420中窗口450内部。芯片410连到柔性片基420上的触点425,而触点425与片基上包含的双极天线430相连。
图5显示出薄RFID标签500的顶视图。放在窗口550内的芯片510连到柔性片基520上的触点525,这些触点连到片基上包含的不只一个折叠双极天线530和531。
图6是薄标签600的顶视图。半导体芯片610由触点625连到折叠双极天线630上。如上所述那样该天线包含在片基620中。一个薄电池660由连在触点625的引脚661和662连到芯片610。
电池有短连接线661和662提供电池和芯片之间的电连接。电池是放在芯片的邻近处而不是叠在芯片之上。电池厚度约0.25mm使电池具有柔性。天线的设计也使天线邻近电池。那里没有重叠。导线保持在一个平面内而且所有元件(芯片、电池、天线)是共平面的;没有存在重叠。结果,整个包装是薄的和柔性的。
将电池接到先有技术射频标签上的连接方法包括下面描述的一些技术,即焊接、导电胶粘剂;以及导线连接。此外,也可以使用点焊。在点焊中,如图7E所示,将电池连接片压紧在片基触点上,同时以低电压大电流脉中将两种金属连在一起。
在一个最佳实施例中,对电池、芯片和片基的冶金术方面是使电池连接机制与芯片连接方法和机制相一致。例如,片基上使用锌片能使芯片连接但可能排除了使用导电胶粘剂连接电池,但可能允许使用金片使这两种连接都能用。
一种用于制作薄柔性粗糙包装的更佳实施例使用牢固的芯片连接技术,例如在TAB技术中使用的热压连接。对芯片使用TC连接而对电池使用点焊是连接技术的一种新组合,它使电池能连接到柔性片基620。在一个最佳实施例中,片基是TAB聚酰亚胺或聚酯。
图7显示了在生产RF标签时先有技术中采用的将芯片接到片基上电路的不同类型连接技术。这些包括热压连接、超声单点连接,焊接,以及导电胶粘剂。
图7A中使用热压连接,由加热器720加以压力750和热量740使适当的金属表面接触在一起,形成金属—金属连接760,通常是芯片710上的金突起730和处在下加热器780上的片基705上的镀金引脚706连接起来。许多引脚一次连接(批量连接)。这在卷—卷TAB(带自动连接)中广泛应用。
图7B显示了超声单点连接,这是TAB所用热压连接的一个变种,这里用一些超声能量代替一些压力。一次做一个连接。这种连接也需要金—金连接。连接头751施加压力731和超声能741使引出脚721压在处于下支撑705上的芯片711上的突起725上。
图7C显示了焊接或C4焊接,这里小的铅/锌焊料突起746用作芯片716和片基736上引出脚726之间的连接介质。当把片基拿到加热炉786中的平台756上时进行回流。这通常需要应用焊料助熔剂在提高了的温度下的焊料回流。
图7D显示的是导电胶粘剂连接,这里使用填充金属的胶粘剂744形成芯片714上的芯片接线片740和片基734上的片基接线片724之间的连接介质。利用加热器764和754之间的压力来加热774和加压784。
图7E显示的是点焊,这里由隙缝775分开的两个焊头755和765压向导体745,导体745保持与放在绝缘片基725上的导体735接触。电流785加热焊头755和765实现连接。
图8显示一个RF邮票800,它含有薄RF标签810,标签810由天线815、电池820、和芯片830固定在信封或包裹840上。这个标签810可以是上面描述的任何一个实施例。在这一应用中,该标签的覆盖层(通常是图2中的270和图3中的370)是邮票纸。胶粘剂(例如丙烯酸类)用于把标签夹在薄纸之间。这些胶粘剂对应于图2中的层250和图3中的层350。邮票的上表面(270和230的一侧)可以印上适当的图案,而下表面有压敏胶粘剂(在标签叠压在两面上的情况下是270和370的另一个侧面),也是丙烯酸类,用于把邮票粘到包裹或信封上。RF标签将含有关于邮寄的信息用于追踪邮票所在信件或包裹。另一种方式是RF标签850可以封装在包裹羊皮纸中或信封840的信封纸中。在另一个实施例中RF标签将放在包裹或信封内。
图9显示的薄RF标签920实现在护照930的封面910,形成一个RF护照900。这里的标签是夹在护照的纸皮中。标签可有一个环境叠层(270,370),这可见前述内容,或者可把护照封面用作标签叠层(270,370)。标签中在其存储器内包含关于护照持有者的标识码、签证、入境日期、限制、或任何其他需要的信息。信息可以是密码形式以增加其安全性。
密“钥”将是一个软件代码,它只由发放护照机关保持和使用。解密钥可以是公共的,从而(具有公共解密钥)的任何人能读出标签内存储器中的信息,但只有持密钥的机关才能向标签中写入信息。
图10显示的是含有RF标签1020的入场券1010。标签仍然是封在纸皮或其他叠层中间。这种票证可以是一个简单的入场券或者是一种权利,如飞机票或餐券。然而,带标签票证也可以用作追踪装置。
图11显示一个装在盒子1120中的CD1140带有附在盒子1120上的RFID防盗标签。这种标签即可作为条形码的替代物、存货目录装置、销售点装置,也可作为防盗装置。关于产品种类、价格、生产日期和销售日期可以由标签携带。在电路存储器中的附加信息位可以在销售时修改以指示该物品可以从仓库中拿出。
图12显示的是含有RF标签1220的ISO标准信用卡1210。信用卡可以用作ATM卡,常飞的飞行员卡、图书馆卡、电话卡、雇员标识(ID)卡、医疗标识(ID)卡、汽油信用卡或任何信用卡或借方卡。标签封面(叠层270,370)可以是信用卡的封面,最好是PVC叠层。信用卡的核心为0.5mm厚,在制作时在其中放了一个窗口。这个0.5mm厚的标签包装放在这个窗口中,然后加工成卡,最后造成的含有标签的信用卡将不仅有符合ISO标准的长度和宽度,也有符合ISO标准的厚度。
在图13所示本发明的另一个实施例中,RF标签1320按前述相同的方式放在车辆驾驶员许可证1310中。在RF标签中的允许信息包括个人识别标志、驾驶记录、器官捐赠者信息、限制、识别证明以及年龄等。这些信息可以加密以保证其安全性。

Claims (29)

1.一种薄的柔性电子射频标签电路,包括是:
a.一个绝缘的柔性片基;
b.一个天线作为片基的组成部分并具有端子;
c.一个电路芯片,具有调制器电路、逻辑电路、存储器电路、和芯片接头,放在片基上与天线邻近的地方;
d.在天线端子和芯片接头之间的一个或多个连接线,这些连接线与天线和天线端子共平面。(“共平面”的含义是没有经由、穿过等的单个连线平面。“相邻”的含义是没有元件重叠。)
2.如权利要求1的电路,其特征在于片基是有机材料。
3.如权利要求2的电路,其特征在于片基是聚酰亚胺。
4.如权利要求2的电路,其特征在于片基是聚酯材料的。
5.如权利要求1的电路,其特征在于其连接线是任何连接类型的,包括热压、单点连接、C4连接和导电胶粘剂。
6.如权利要求1的电路,其特征在于有一个孔用以放置芯片。
7.如权利要求1的电路,其特征在于芯片由囊状物覆盖。
8.如权利要求7的电路,其特征在于该囊装状是不透明的。
9.如权利要求7的电路,其特征在于一个有机外罩围绕芯片、囊状物、片基和天线周围。
10.如权利要求1的电路,其特征在于它是一层或几层的叠层。
11.如权利要求10的电路,其特征在于它是两层叠积在一起的,其两层叠层由硬的外层和粘的内层组成。
12.如权利要求10的电路,其特征在于该电路层压到一侧。
13.如权利要求10的电路,其特征在于该电路层压在两侧上。
14.如权利要求9的电路,其特征在于其外层是聚酯、聚酯薄膜、聚酰亚胺、及聚乙烯等材料之一。
15.如权利要求11的电路,其特征在于胶粘剂是乙基—乙烯基—醋酸盐(EVA)、酚醛丁缩醛、硅胶等。
16.如权利要求1的电路,其特征在于天线是一个谐振天线,而且是下述结构之一,包括折叠双极、半波双极、以及环形。
17.如权利要求1的电路,一个电池也固定在片基上天线和芯片附近,并由一个或多个电池连接线连到一个或多个芯片电池接点上,这里的电池连接线和电池触点与天线和连接线共平面。
18.如权利要求17的电路,其特征在于电池触点按下述任何一种方式连接到电池连接线上,包括最焊、焊接、热压连接、及导电胶粘剂。
19.如权利要求17的电路,电池触点的连接用点焊,而芯片触点的天线的连接使用热压连接。
20.如权利要求1的电路,其特征在于该芯片至少有一维小于300微米(12mil),天线有至少一维小于35微米(1.4mil),片基至少有一维小于125微米(5mil),因而该电路至少有一维小于508微米(20mil)。
21.如权利要求21的电路,其特征在于芯片存储器中含有关于邮寄的信息,该电路用于邮寄的信件或包裹。
22.如权利要求21的电路,其特征在于该RF电路封在邮票内。
23.如权利要求21的电路,其特征在于该RF标签封在包裹或信封羊皮纸内。
24.如权利要求20的电路,其特征在于该标签封在护照中。
25.如权利要求20的电路,其特征在于该标签封于入场券中。
26.如权利要求20的电路,其特征在于该标签封于一个物品中而且标签中含有防盗信息。
27.如权利要求10的电路,其特征在于该电路至少有标签的一维小于760微米(30mil)。
28.如权利要求27的电路,其特征在于它被包装成ISO标准信用卡尺寸。
29.如权利要求20的电路,其特征在于该标签封于驾驶员许可证中。
CN95104779A 1994-09-09 1995-04-25 薄柔性包装中的射频电路和存储器 Pending CN1118910A (zh)

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CN101036171B (zh) * 2004-10-04 2010-06-16 艾默生及卡明微波产品公司 改进的rfid标签
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CN101467165B (zh) * 2006-04-28 2015-02-25 Ask股份有限公司 射频识别装置载体及其制造方法
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CN101430772B (zh) * 2007-11-06 2011-06-29 台湾积层工业股份有限公司 设有射频识别卷标的包装材料及其制作方法
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CN112232471A (zh) * 2020-10-22 2021-01-15 浙江清华柔性电子技术研究院 柔性防盗标签及控制方法

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CA2153441A1 (en) 1996-03-10
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TW326960U (en) 1998-02-11
DE69509242D1 (de) 1999-05-27
DE69509242T2 (de) 1999-11-04
EP0855675A3 (en) 2000-11-15
SG46938A1 (en) 1998-03-20
ZA957078B (en) 1996-03-11
US5528222A (en) 1996-06-18
JPH0888586A (ja) 1996-04-02
HUT76996A (hu) 1998-01-28
WO1996007985A1 (en) 1996-03-14
ATE179270T1 (de) 1999-05-15
EP0855675A2 (en) 1998-07-29
KR960012743A (ko) 1996-04-20
EP0780007B1 (en) 1999-04-21

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