CN1140823A - 装有强迫气冷设备的机房的空调方法 - Google Patents
装有强迫气冷设备的机房的空调方法 Download PDFInfo
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Abstract
本发明涉及装有强迫气冷设备的机房的空调方法,从空调器的室内单元11中产生的冷空气被吹入到设备7之下的地板2下面的空气通路里。吹入到空气通路6的冷空气通过地板2的开口2B,被引入到设备7中。吹入到设备7中的冷空气释放到房间的自由空间1中。进一步,释放到房间自由空间里的空气流部分地再被引入到设备7中。
Description
本发明涉及一种空气调节方法,其中冷空气通过地板下的空气通路,吹到地板上的强迫气冷设备上。
在房间里安装计算机通讯设备时广泛使用双层地板。双层地板结构包含基地板和房间地板,其中房间地板位于基地板的上面,两层地板之间有预先确定好的距离,这样就可以在基地板和房间地板之间形成一个自由空间。由于计算机的电缆等安装在地板之间的特定自由空间里,因此房间的空间可以得到更充分的利用。
应该注意到在计算机或者其它设备的运行中,会产生很多热量,使得必须安装空调设备来冷却计算机或其它设备。例如,熟悉本领域的人都知道,空气调节器产生的冷空气通过双层地板之间的自由空间,吹到计算机等设备上。有时,设备本身已经被制作成能够接受冷空气,那么,这样的设备叫做强迫气冷设备。当空调器用于给机器房间里的所有强迫气冷设备制冷时,空调器的空气流量和驱动风扇产生所需冷气流量的电能将增加。因此,设备消耗和运行费用将增加。
同样还应该注意到,所产生的热量的数量由于设备的不同而不同,造成不同设备上所释放的空气流的温度不同。在一个房间里安装一组设备时,应该注意的是,房间的温度分布并不与所需要的温度分布相同,导致难以给房间维护一个舒适的环境。更具体地说,产热少的机器所释放的空气流的温度低。在这种情况下,外部的温度降低,使得房间里的人感到冷飕飕的。
本发明的一个目的是提供一种空气调节方法,在不间断地给房间中的设备进行制冷的前提下,降低设备的消耗和运行费用,并且通过压缩低温空气流来改进温度分布,创造出舒适的房间环境。
根据本发明,提供了一种空气调节的方法,包含以下步骤:
把空调器产生的冷空气吹到地板下面的空气通路中;
引导空气通路中所说的冷空气,使空气通过地板上的开口,吹到地板上面的设备中;
把吹入到所说的设备中的冷空气释放到房间的自由空间中;以及
把房间里的空气引入到设备中。
本发明的其它目的和优势将在下面的描述中进行说明。从这些说明或者从依据本发明的实践中,可以清楚地认识到本发明的优势。通过把本发明仪器化,并且结合后面的权利要求,对本发明的目标和优势还可以有进一步的认识。
后面所附的插图,构成了本发明的一部分。这些插图示出了本发明的优选实施例,以及前面的总体描述和下面将要给出的详细描述,用来解释本发明的原理。
图1原理性地示出了在本发明的第一个实施例的方法中,所用的空气调节器系统的结构;
图2示出了控制电路的方块图,这些控制电路应用在本发明的所有实施例的方法中;
图3示出了在本发明的各个实施例的方法中,如何控制空气体积的流程图;
图4原理性地示出了在本发明的第二个实施例的方法中,所用的空气调节器系统的结构;
图5原理性地示出了在本发明的第三个实施例的方法中,所用的空气调节器系统的结构;以及
图6原理性地示出了在本发明的第四个实施例的方法中,所用的空气调节器系统的结构;
图1示出了在本发明的第一个实施例的方法中,所用的空气调节器系统。如图1所示,房间内的空间1由房间地板2,侧壁3和天花板3所决定。房间地板2位于基地板5的上面,并且与它之间有预定的距离,二者形成双地板结构,其间有自由空间6(空气通路)。一组设备7安装在地板2之上。每个设备7都是所说的强迫气冷设备,在这些设备中,为了制冷,需要吸入冷空气。这些设备7的电缆安装在双层地板结构的自由空间6里。
在向地板2安装每个设备7时,一组支持部件8通过螺栓安装在地板2的预定位置上,它们是固定不动的。然后,设备7安装在支持部件8之上。同样也可以使用可移动的带轮子的支持部件8。
每个设备7都有一个机箱,其上有一个空气入口7A和一个空气出口7B,它们分别穿过设备机箱的底盘和顶板。风扇7F安排在机箱内空气出口7B的下面。风扇7F在设备7的运行过程中也一直运行,以便形成设备机箱内的空气通路,包括空气入口和空气出口。如图中所见到的那样,发热元件7H安排在机箱的空气通路上。
地板2上还安装了空调器所含的室内单元11。室内单元11有一个机箱,其上有一个空气入口11A和一个空气出口11B,它们分别穿过机箱的顶板和底盘。房内热交换器12和房内风扇13安排在机箱内的空气入口11A和空气出口11B之间。房内风扇允许房间空间1里的空气被吸入到机箱内,以流过房内热交换器12,通过空气出口11B排出到外面。
室外单元14安装在侧壁3的外面。室外单元14和室内单元11一起形成空气调节器。室外单元14有一个机箱,其上有一个空气入口14A和一个空气出口14B,二者形成在机箱壁上。房外热交换器15和房外风扇16安装在机箱内的空气入口14A和空气出口14B之间。进一步,压缩机17和扩张阀18安装在室外单元14的机箱上。
房外风扇16允许房外空气通过空气入口14A被吸入到机箱内,并且允许吸入的空气流过房外热交换器15,然后,通过空气出口14B流到机箱外面。
房外热交换器15的一端,经由管子连接到压缩机17的泄放口。同样,房内热交换器12的一端,经由扩张阀18连接到房外热交换器15的另一端。进一步,压缩机的吸入口经由管子连接到房内热交换器12的另一端。经由上述连接,完成空调器的制冷循环。
当压缩机17开始运行时,致冷剂从压缩机17中释放出来,在房外热交换器15,扩张阀18,房内热交换器12之间形成致冷循环,并且流回到压缩机17中。在致冷循环中,房外热交换器15做为凝结器,房内热交换器12做为蒸发器。
当房内风扇13开始工作时,房间空间1的空气通过空气入口11A,被吸入到室内单元11的机箱内。吸入机箱内的空气,由房内热交换器12冷却,然后,冷却了的空气通过空气出口11B排出到机箱外。
与空气出口11B对应的开口2A位于地板2上室内单元11的下面。类似地,开口2B位于地板2上每个设备7的下面。空气体积速率控制单元20安装在每个开口2B上,以控制流经开口2B的空气体积。
流过室内单元11的空气出口11B的冷空气通过地板2的开口2A,被吹入到双层地板结构的自由空间6之中,然后通过地板2的开口2B被吹入到支持部件8中。如图中所见的那样,支持部件8有一个机箱,其上有开口8A,开口8B和开口8C,分别安装在底盘,顶板和侧壁上。开口8A和8B与地板2的开口2B和设备7机箱内的空气入口7A相对应。
温度传感器31安排在双层地板结构的自由空间6(空气通路)中,位于开口2A的附近。流自室内单元11,流到自由空间6的冷空气的温度Ta由温度传感器31来检测。
类似地,温度传感器32安排在设备7的机箱里,位于空气入口7A的附近,以检测通过空气入口7A,流进设备7机箱里的空气温度Tb。进一步,温度传感器33安装在设备7的空气出口7B的附近。当然,温度传感器33用于检测流出空气出口7B的空气温度Tc。
图2是图1所示系统内的控制电路的方块图。从图中可以看出,连接到控制器40的是压缩机17的马达17M,房外风扇16的马达16M,房内风扇13的马达13M,每个空气体积控制单元20,温度传感器31,每个温度传感器32,每个温度传感器33,以及运算单元41。控制器40用作根据运算单元41的指示,控制马达17M,16M和13M的运行,以开始或者停止运行图1中的系统。控制器40同样还给体积控制单元20发送指示,以根据由温度传感器31,32和33检测到的温度,控制流入设备7的空气体积。
操作设备7时,安装在设备7机箱内的风扇7F也一直在运行。当运算单元41指示开始运行系统时,压缩机17和室外单元14的房外风扇16开始运行。同时,室内单元的房内风扇13也开始运行。
房间空间1的空气通过空气入口11A被吸入到室内单元11,并且在室内单元11中冷却。冷却了的空气作为冷空气,通过空气出口11B和与之对应的地板2的开口2B释放到双层地板结构的自由空间6中。流入到自由空间6的冷空气流过开口2B,支持部件8和空气入口7A,进入到设备7的机箱内,如图1所示,是设备7中风扇7F的运转结果。流入到设备7机箱内的冷空气吸收了发热元件7H的热量,然后,释放到房间空间1中。释放到房间空间1中的空气再次作为房内风扇11的运转结果,被吸入到室内单元11中,然后,冷却了的空气释放到双层地板结构的自由空间6(空气通路)中,如上面所述的那样。
应该注意到设备7的风扇7F的空气吹动体积大于设备7通过地板2和支持部件8吸入的空气体积。由于风扇7F的额外吹动体积,释放到房间空间1的空气部分地通过支持部件的开口8C,被吸入到设备7的机箱中。
如上面所描述的,从设备7释放到房间空间1的空气部分地通过开口8C,流进支持部件8中,然后,和流过开口2B,8A和8B的空气结合到一起,被引入到设备7的机箱中,冷却产热元件7H。应该注意到的是,产热元件7H由两股空气流来冷却,例如,流过地板2的开口2B的空气流和另一股流过开口8C的空气流。自然,流过开口8C的空气流的存在使得能够减少室内单元11的空气流量。换句话说,室内单元11的房内风扇13被减小了,使得设备费用降低。同样还可以压缩房内风扇13的能耗,降低运行费用。
同样还应该注意到的是,由于从设备7释放的空气部分地再循环进入设备7的机箱中,因此从不同设备7释放的空气流的温度都是一样的,使得房间空间1内的温度分布很均匀。
如果从设备7产生的热量比较小,则可能使低温空气流进入房间空间1。但是,实际上进入房间空间1的空气流在某种程度上由于释放进设备7机箱里的空气的部分再循环作用而变暖,使得不必担心进入房间空间的低温空气流。换距话说,本发明能够防止被冷却的外部空气引起房间里的人的冷的感觉。从而可以使房间空间1的环境维持在一个比较舒适的情况下。
如上面所指出的那样,从设备7释放的空气流的温度高于现有的系统。自然,吸入到室内单元11的温度同样也高于过去。使得室内单元11的房内热交换器12能够提高致冷剂与吸入到室内单元11的空气流的热交换效率。提高了的热交换效率能够节省运行房内热交换器12的能量,使得能耗和运行费用降低。
图3示出了在本发明中,如何控制空气流动速率的流程图。如流程图所示,流自室内单元11的冷空气的温度Ta由温度传感器31在步骤101检测。然后,引入到设备7的空气流的温度Tb由温度传感器32在步骤102检测。进一步,释放自设备7的空气流的温度Tc由温度传感器33在步骤103检测,然后在步骤104计算由温度传感器32检测到的温度Tb和由温度传感器33检测到的温度Tc之间的温度差ΔTbc。
最后,流过空气体积控制单元20的空气体积由步骤105根据由温度传感器31检测到的温度Ta,上面计算的温度差值ΔTbc,以及房间空间1的温度Ts来控制。在此步骤中,从设备7释放的空气流的温度,按照需要进行控制,使得能够基于事先设置在运算单元41中的设定值,在房间空间1内保持一个最优的温度分布。
图4示出了用在本发明的第二个实施例的方法中的空气调节器系统。图4的系统基本上与图1的系统相同,但是图1实施例中支持部件8顶板上的开口8B在图4中的实施例中没有,并且图4实施例中机箱的空气入口7A安装在侧壁上,而不象图1实施例那样安装在机箱的底盘上。
在图4实施例中,引入到双层地板结构自由空间的冷空气经过空气体积控制单元20,开口2B和8A,流入支持部件8。进一步,支持部件8里的冷空气经过开口8C流入到房间空间1,并且,然后被吸入到设备7机箱的空气入口7A中。引入到机箱中的冷空气吸收了安装在机箱上的产热元件7H的热量,并且,然后释放到房间空间1中。释放进入到房间空间1的空气流部分地加入到流经支持部件8的开口8C流入到设备7的空气入口的空气流中。在这种方式下,释放到房间空间1的空气流部分地再循环到设备7的机箱中,以产生如图1中系统那样的显著效率。
图5示出了用在本发明的第三个实施例的方法中的空气调节器系统。图5的系统基本上与图1的系统相同,但是支持部件8没有安装任何开口,并且图5实施例中设备7机箱的空气入口7A安装在侧壁上,与图4实施例相同,而不象图1实施例那样安装在设备7机箱的底盘上。进一步,地板2的开口2B在图1实施例中正好位于支持部件8的下面,而在图5实施例中,被移动到支持部件8的侧壁之外。当然,空气体积控制单元20也随开口2B一起移动了位置。
在图5实施例中,引入到双层地板结构自由空间的冷空气经过空气体积控制单元20和开口2B,流入房间空间1。进一步,房间空间1里的冷空气经过空气入口7A流入到设备7的机箱内。引入到机箱里的冷空气吸收了安装在机箱上的产热元件7H的热量,并且然后,释放到房间空间1中。释放进入到房间空间1的空气流部分地加入到流经开口2B流入到设备7的空气入口7A的空气流中。在这种方式下,释放到房间空间1的空气流部分地再循环到设备7的机箱中,以产生如图1中系统那样的显著效率。
图6示出了用在本发明的第四个实施例的方法中的空气调节器系统。图6的系统基本上与图1的系统相同,但是支持部件8没有象图1中实施例那样在底盘上安装开口8A,并且图1中地板2的开口2B正好位于支持部件8的下面,而在图6实施例中,开口2B被移动到支持部件8的侧壁之外。当然,空气体积控制单元20也随开口2B一起移动了位置。
图6实施例中,引入到双层地板结构自由空间的冷空气经过空气体积控制单元20和开口2B,流入房间空间1。进一步,房间空间1里的冷空气经过开口8C流入到支持部件8中,并且,然后经过开口8B和空气入口7A流入到设备7的机箱里。引入到机箱里的冷空气吸收了安装在机箱上的产热元件7H的热量,并且,然后释放到房间空间1中。释放进入到房间空间1的空气流部分地加入到流经开口2B流向支持部件8的开口8C的空气流中。进一步,合并起来的空气流流经开口8B和空气入口7A,流入到设备7的机箱中。在这种方式下,释放到房间空间1的空气流部分地再循环到设备7的机箱中,以产生如图1中系统那样的显著效率。
在上面所述的各种实施例中,支撑着设备7的支持部件8直接与地板2接触。但是,也可以取消支持部件8,使得设备7直接与地板2接触。
熟悉本领域的人可以认识到本发明的其它优势和修改。因此,本发明在广义上不限于上面所描述的细节以及给出的示范。在不脱离本发明的精神和范围的前提下,可以对本发明进行各种修改。因此本发明受下面的权利要求保护。
Claims (8)
1.一种空气调节方法,其特征为包含以下步骤:
把空调器11产生的冷空气吹入到地板2下面的空气通路6中;
通过地板2的开口2B,引导所说的空气通路6中的冷空气进入地板2上的设备7中;
把引入到所说的设备7中的冷空气释放到房间的自由空间1中;以及
把房间里的空气引入到设备7中。
2.如权利要求1中所说的方法,其特征在于,从所说的设备7中释放出来到房间的自由空间1的空气部分地再循环进入设备7中。
3.如权利要求1中所说的方法,其特征在于,所说的冷空气通过把所说的房间里的空气吸入到所说的空调器中来制备。
4.如权利要求1中所说的方法,其特征在于:
所说的设备7由直接与所说的地板2接触的支持部件8来支撑;
所说的空气通路中的冷空气通过所说的地板2和所说的支持部件8,被引入到所说的设备7中;以及
所说的房间中的空气通过支持部件8,被引入到设备7中。
5.如权利要求1中所说的方法,其特征在于:
所说的设备7由直接与所说的地板2接触的支持部件8来支撑;以及
所说的空气通路6中的冷空气通过所说的地板2和所说的支持部件8,被引入到所说的设备7中,并且引入到支持部件8中的冷空气被引入到房间的自由空间1中,然后和房间里的空气一起再次被引入到设备7中。
6.如权利要求1中所说的方法,其特征在于:
所说的设备7由直接与所说的地板2接触的支持部件8来支撑;以及
所说的空气通路6中的冷空气通过所说的地板2,被引入到房间的自由空间1中,并且引入到房间的自由空间1中的冷空气和房间里的空气一起再次被引入到设备7中。
7.如权利要求1中所说的方法,其特征在于:
所说的设备7由直接与所说的地板2接触的支持部件8来支撑;
所说的空气通路6中的冷空气被引入到房间的自由空间1中;以及
被引入到房间的自由空间中的冷空气和房间里的空气一起被引入到支持部件8中,然后引入到设备7中。
8.如权利要求1中所说的方法,其特征在于流经地板2的冷空气的体积受到控制,以控制从设备7中释放到房间的自由空间1里的空气温度。
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JP95108716 | 1995-05-02 | ||
JP07108716A JP3113793B2 (ja) | 1995-05-02 | 1995-05-02 | 空気調和方式 |
JP108716/95 | 1995-05-02 |
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EP (1) | EP0741269B1 (zh) |
JP (1) | JP3113793B2 (zh) |
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Also Published As
Publication number | Publication date |
---|---|
MY115015A (en) | 2003-03-31 |
EP0741269B1 (en) | 2001-11-21 |
DE69617089D1 (de) | 2002-01-03 |
CN1109854C (zh) | 2003-05-28 |
EP0741269A3 (en) | 1997-02-05 |
EP0741269A2 (en) | 1996-11-06 |
KR100194646B1 (ko) | 1999-06-15 |
DE69617089T2 (de) | 2002-04-18 |
US5718628A (en) | 1998-02-17 |
KR960041926A (ko) | 1996-12-19 |
JPH08303815A (ja) | 1996-11-22 |
JP3113793B2 (ja) | 2000-12-04 |
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