CN1143381C - 用于制作芯片卡-模块的方法 - Google Patents
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Abstract
本发明涉及到一个芯片卡-模块(1),它包括了具有一个第一个接触平面(3)的一个载体(2)和一个半导体芯片(4)以及在半导体芯片和第一个接触平面之间的导电连接(5)。附加于第一个接触平面芯片卡-模块在载体(2)的另外一边有一个另外的连接平面(6),它同样与半导体芯片(4)是导电连接的。另外的连接平面(6)例如可以与一个集成在卡片体内的电感线圈相接触用于无接触的数据传输。此外本发明还涉及到一个无接触和有接触数据传输的组合卡,它包括了按照本发明的芯片卡-模块(1),以及芯片卡-模块和组合卡的制造方法。
Description
技术领域
本发明涉及到制造一个芯片卡-模块的方法,一个用这种方法制造的芯片卡-模块和一个包括这个芯片卡-模块的组合-芯片卡。
背景技术
关于组合-芯片卡(或简称为组合卡)以下应被理解为一个芯片卡,在其上数据和信息不仅可以用传统的方法通过电接触获取而且也可以用电感的方法无接触地与一个卡片阅读机-/-打印机交换。
这样的组合卡例如可以用于小额交易所或带有记录的人员接近检查。
对于传统的,所谓的有接触的数据传输的芯片卡在一个它的表面上有接触面,它一般符合ISO-标准7810或7816,并且它们借助于电的提取接触被阅读。有接触的数据传输的接触面在以下的叙述中一般被称为第一个接触面或被简称为ISO-接触面。
对于用电感方法的数据传输在芯片卡上被集成一个天线。一般是将一个电线圈用从外边不能看到的方法被安放在芯片卡体上。例如适合的线圈具有一个公开的例如13.56MHz载波频率的工业带宽。
发明内容
本发明在下面用一个电线圈的例子被叙述,而不是被限制于一个天线的这种特殊结构。此外按照本发明的方法制造的芯片卡-(CC-)模块原则上也适用于一个芯片卡与其他被接触的元件的接触。
如果在一个芯片卡上将上述两种数据传输系统组合在一起,有必要,从导体芯片不仅建立与ISO-接触面而且还要建立与线圈的导电连接。
一般ISO-接触面的制造是这样完成的,首先制造一个芯片卡-模块,然后将其装入卡片载体的一个孔中(置入)。芯片卡-模块是由一个柔性的载体材料,例如一个玻璃纤维加强的环氧树脂薄膜,在其上的一边被安放了半导体芯片和在另一边为ISO-接触面。最后一般是由一个具有一个镍涂层和一个金涂层的一个表面精化的铜涂层所组成。ISO-接触面和半导体芯片是通过在模块-载体薄膜上的孔与连接线导电连接的。
理论上可以考虑为,另外的与线圈电接触所需要的接线放在ISO-接触面上,这样ISO-接触面应扩大两个附加区。
然而一个这样的装置是有缺点的,在芯片卡的表面安放接线点因此可能会引起干扰因素和接近操作。由于触摸接触面和/或与金属物体的物理接触和因此而出现的短路可以引起例如固有频率的移位。其结果是运行干扰或完全的功能中断。为了避免电感被传送的信息的这样的干扰和操作,必须寻找到半导体芯片与线圈之间接触的另外的方法。
在DE-A-195 00 925中被叙述了不仅作为无接触而且作为有接触的数据传输用的一个芯片卡,在装入卡片体内的芯片-模块上有两个相互对面的连接平面用于有接触的数据传输以及用于一个天线的连接。
此外在DE-A-195 00 925叙述的方法中,一个这样的芯片-模块是如何被装入卡片体内的和必要的接触是如何进行的。
迄今所使用的制造芯片卡-模块的方法包含了很多方法步骤例如一个或多个接触平面(例如通过腐蚀)以及模块载体带(例如通过冲压或钻孔)的分别的构成并且因而是很费时间和很贵的。
因而本发明的任务是,创立一个CC-模块的一个制造方法,它允许将一个天线(电感线圈)或一个芯片卡的其他的被接触的组成部分用简单和廉价的方法连接,此时在按照这种方法制造的CC-模块上应尽可能地避免干扰或操作对连接的影响。此外按照本发明的方法应导致一个CC-卡,它应允许用传统的方法被置入于一个卡片体内。
此任务的解决是按照下述制造方法完成的。
制造一个芯片卡-模块的方法,包括一个载体,该载体具有一个第一个接触平面和一个半导体芯片以及在半导体芯片与第一个接触平面之间的导电连接,并且包括了在载体的第一个接触平面对面的一个另外的连接平面,它与半导体芯片是导电连接的,
其特征为,
与其顺序无关,包括下列步骤:
-将一个金属带沿纵向粘在一个模块载体带的一个第一个面上作为另外的连接平面,
-将金属带构造成另外的连接平面的单个的连接点,
-将一个金属薄膜粘在模块载体带的另一面并且构造成第一个接触平面,
-将模块载体带打上通孔构造成用于半导体芯片和/或用于导电的连接,
-将半导体芯片和触点与第一个接触平面和另外的连接平面装配在一起,
-用塑料将半导体芯片包围和
-将芯片卡-模块分成单个的,其中
-粘接对于另外的连接平面的金属带并且将其构造成单个的连接点,这是在粘接和构造成第一个接触面以前完成的,
-构成另外的连接平面是与构成模件载体带同时完成的。
此外本发明涉及一个组合卡,它包括了按照本发明的CC-模块,和按照本发明的制造方法。具有优越性的进一步的构成和结构是叙述在相关的实施例中。
按照这些本发明涉及到制造一个CC-模块的一个方法,CC-模块包括一个载体和安置在其上的一个第一个接触平面(ISO-接触面)和一个半导体芯片。CC-模块可以用传统的方法构成。例如在载体上可以涉及到一个塑料-薄膜,特别是一个玻璃纤维加强的环氧树脂薄膜,它有用于半导体芯片和用于连接导线的孔,用它半导体芯片被与第一个接触面连接在一起。ISO-接触面可以由一个铜层构成,它是用镍和金覆盖的。一般来说接触面符合ISO 7810或7816标准。
按照本发明方法制造的CC-模块有一个另外的连接面,它是被按置于第一个接触面对面的模块载体的一个面上。附加的连接平面一般和半导体芯片一样是位于载体的同一边。另外的连接平面最好是由金属构成的。为了给予它与第一个接触平面同样的连接能力,最好将它构造成与这个一样。例如它是由一个由镍和金涂层覆盖的铜层构成的。
另外的连接平面应构成为,建立必要数量的与电感线圈或与一个芯片卡的其他被接触的组成部分的连接点。
另外的连接平面的结构最好是用冲压或类似的。按照本发明的方法,它们是在模块载体上同时冲压出为了半导体芯片的孔,为了连接导线的通孔和在实际的情况下为了运输开口同时完成的。用这种方法另外的连接平面的制造就很容易了。
另外的连接平面或至少它的基础层在模块载体构成以前已经被安置在它的上面了。如果另外的连接平面是由一个层系列Cu-Ni-Au组成的,例如首先在模块载体的一边,最好是中间,被粘上一个铜带。然后通过冲压或类似的方法完成模块载体的构造。随后被电镀上镍-和金层。特别是最好电镀与位于模块载体另一面的ISO-接触面(第一个接触面)的电镀层同时进行。随后将半导体芯片用原本已知的方法固定在CC-模块上。然后与第一个连接平面(ISO-接触面)和与另外的连接平面的附加连接点的导电连接被用同样的方法制造,例如使用金的连接导线。
如果希望,可以安放一个围绕半导体芯片的支撑环以保护在CC-模块上的半导体芯片。这个支撑环最好同时被用作覆盖芯片的塑料物质的侧面的界限。最好支撑环是由一个弹性的材料,例如是由金属和特别是由铜构成的。为了避免支撑环与另外的连接平面中间的短路,有必要在两者之间被安放一个介质。例如介质可以是粘接剂,支撑环用它被固定在模块上。最好使用一种压力敏感的粘接剂。
按照本发明方法制造的CC-模块(有或无支撑环)可以用原本已知的方式使用传统的方法被置入芯片卡的卡片体内。例如在卡片体中,一般是一个塑料-薄膜,例如由聚碳酸脂铣出一个空穴,其形状和大小与置入的CC-模块相适应。一般来说CC-模块是使用一种热的-或熔融的粘接剂被粘在空穴内(所谓的热熔法)。
特别优越的是,如果天线(电感线圈),它应与CC-模块的附加的连接平面相连接时,它被集成在卡片体上或被安放在其上。如果电感线圈是一个铜导线的线圈时,它从外边是看不到的而是被置入卡片体的,在CC-模块被置入以前通过卡片体表面的铣削连接点被显露出来。特别好的是连接点的显露与对于CC-模块的空穴的铣削是同时完成的。
CC-模块的另外的连接平面与电感线圈连接之间的导电连接是或者通过软焊接或者借助于一种各向异性的导电的粘接剂制成的。
附图说明
本发明在下面在附图的基础上被进一步叙述。其中表示:
附图.1通过一个按照本发明方法制造的CC-模块的一个截面简图;
附图.2为承受按照本发明方法制造的CC-模块的一个卡片体的上视图的简图和
附图.3按照附图.2沿A-A直线通过卡片体的一个截面的简图。
具体实施方式
附图.1详细地表示了一个按照本发明方法制造的CC-模块1和一个模块体2的一个例子,它例如可以由一个塑料薄膜如玻璃纤维加强环氧树脂薄膜构成的。在载体2的下边是一个第一个接触平面3借助于一种粘接剂7粘上去的。第一个接触平面一般是由符合ISO-标准7810或7816的接触面组成的。接触面本身例如可以由一个镍和金层覆盖的铜膜构成的。
在第一个接触平面3对面的载体2的面上按照本发明是一个另外的连接平面6,它是由金属和特别是由一个用粘接剂7粘上的镍-和金涂层的铜薄膜构成的。另外的连接平面包括一个右边的和一个左边的连接点。
在载体2的一个孔内放有一个半导体芯片4,它与第一个接触平面3和与另外的连接平面6是导电连接的。在上述情况下只表示了与第一个接触平面3的连接5,它例如是用金的连接导线制造的并且通过在载体2上另外的通孔被引入的。没有被显示的半导体芯片与另外的连接平面6的连接(即右边的和左边的连接点)可以用与第一个接触平面3相同的方法达到,例如同样用连接导线。
为了保护半导体芯片4在另外的连接平面6上安放了一个支撑环8,它包围着半导体芯片。支撑环8最好是由一个弹性的材料和特别是由金属,例如由铜构成的。为了避免另外的连接平面6与支撑环8之间的短路,在另外的连接平面与支撑环之间放入一种介质9。最好支撑环是被粘上去的。此时粘接剂最好用作为介质。特别好的是使用一种压力敏感的粘接剂。
支撑环8也可以同时作为,例如硅漆或环氧树脂,塑料物质10的侧面界限,用它半导体芯片4被盖住。
CC-模块1是借助于按照本发明的方法制造的,它包括以下步骤:
-将一个金属带沿纵向粘在一个模块载体带的一个第一个面上作为另外的连接平面(6),
-将金属带构造成另外的连接平面(6)的单个的连接点,
-将一个金属薄膜粘在模块载体带的另一面并且构造成第一个接触平面(3),
-将模块载体带通过打上通孔构造成用于半导体芯片(4)和/或用于导电的连接(5),
-在现实情况下第一个接触平面(3)和/或另外的连接平面(6)的电镀的涂层,
-在现实情况下在另外的连接平面(6)上安放一个支撑环(8),
-将半导体芯片(4)和触点(5)与第一个接触平面(3)和另外的连接平面(6)装配在一起,
-用塑料将半导体芯片(4)包围和
-将芯片卡-模块(1)分成单个的。
上述步骤不必要所有的均按叙述的顺序进行。然而在本发明的方法中考虑了,对于另外的连接平面及将其构成为单个的连接点在第一个接触平面粘上和构成以前就完成并且另外的连接平面与模块载体带构成同时完成。
在这里首先将一个铜带,例如可以具有一个宽度为200μm至1mm,主要是在中间和沿长度方向上粘在模块载体带上。
“模块载体带”一词在这里是涉及用于一系列连续的模块单元的一个载体薄膜。这些主要是在中间安放的金属带上在制作好的模块上也主要是位于这个中间范围。然而这个定义也包括了较大宽度的载体薄膜,例如多行模块单元相互平行地位于其上。在一种这样的情况下每一个模块行被粘上一条金属带。
金属带放上以后这个带子可以在一个随后的步骤中被构造,这样就得到了单个的连接点。构造最好可以通过分割面的冲压金属带来完成。然而也可以使用所有一般的构造金属平面的方法,例如构造ISO-接触面的方法。特别是最好在构造模块载体2的同时构造完成。通过冲压对于半导体芯片4的孔,对于连接导线5与半导体芯片与第一个接触平面接触的通孔和对于运输开口的通孔在另外的连接平面上同时产生分割面并且因而产生绝缘的连接点。
第一个接触平面的安放是用原本熟悉的方法和在另外的连接平面粘上去以后,在一个Cu-Ni-Au金属层上即在铜层粘上去以后完成。
为了使第一个和第二个连接平面达到一个同样的连接能力,另外的连接平面也可以同样被表面精化,例如通过用镍和金的电镀层。最好电镀层是在构造以后完成并且特别是与第一个接触平面的电镀涂层同时进行。
随后为了保护半导体芯片还可以安放上一个支撑环8,最好是用一个压力敏感的粘接剂粘上。
用塑料10将半导体芯片4包围是用一般的方法。支撑环8此时可以用作塑料物质侧面的界限。
此外本发明涉及到一个组合卡用于无接触的和有接触的数据传输,它包括一个按照本发明方法制造的CC-模块1。
按照本发明方法制造的CC-模块的优点是,它不仅使用传统的方法步骤制造,而且还可以用一般的方法被置入卡片体内。
用已知的方法在卡片体上,一般是聚碳酸脂的一个塑料薄膜,制造一个空穴,其形状和大小于与被置入的CC-模块相适应。CC-模块可以用广泛使用的热熔-法被置入。为了制造CC-模块1另外的连接平面6的连接点和一个集成在卡片体内的天线,例如一个被放入钻孔的铜线圈,或一般来说是一种无接触数据传输的方法,之间的导电连接,是这样进行的,在接受CC-模块的空穴内,连接点应被显露出来。为了这个目的例如空穴可以有一个阶梯形的截面,如在附图2和3所表示的。
附图.2表示了具有一个空穴13的一个卡片体12,在其上天线11的两个连接点被显露出来。在附图.3上是一个沿附图.2上的直线A-A的一个截面图,在其中可以看到空穴13的阶梯形的轮廓。在置入时将CC-模块的第一个接触平面3放在上面,并且另外的连接平面6的连接点放在天线11的被铣露出来的天线11连接点上。
例如在这个区域内的导电连接是这样完成的,在连接点范围内被放入软焊或一种各向异性的导电的粘接剂。为了能在热熔-法中被使用,最好软焊具有一个软化点大约为110℃范围内。
按照本发明方法制造的CC-模块有附加于一个第一个连接平面(ISO-接触面)的一个另外的连接平面,它能确保抵抗来自外部的干扰和操作。CC-模块不仅可以用传统的方法步骤制造,而且也可以用快速方法被置入于一个卡片体内,因此用简单和廉价的方法制造芯片卡也是可能的。
Claims (10)
1.制造一个芯片卡-模块(1)的方法,该芯片卡-模块包括一个载体(2),该载体具有一个第一个接触平面(3)和一个半导体芯片(4)以及在半导体芯片与第一个接触平面之间的导电连接(5),并且包括了在载体(2)的第一个接触平面(3)对面的一个另外的连接平面(6),它与半导体芯片(4)是导电连接的,
其特征在于,包括下列步骤:
-将一个金属带沿纵向粘在一个模块载体带的一个第一个面上作为另外的连接平面(6),
-将金属带构造成另外的连接平面(6)的单个的连接点,
-将一个金属薄膜粘在模块载体带的另一面并且构造成第一个接触平面(3),
-将模块载体带打上通孔构造成用于容纳半导体芯片(4)和/或用于导电连接(5),
-将半导体芯片(4)和导电连接(5)与第一个接触平面(3)和另外的连接平面(6)装配在一起,
-用塑料将半导体芯片(4)包围和
-将芯片卡-模块(1)分成单个的,其中
-另外的连接平面(6)的金属带的粘接及将其构造成单个的连接点,这是在粘接和构造成第一个接触面(3)以前完成的,
-构成另外的连接平面(6)是与构成模件载体带同时完成的。
2.按照权利要求1的方法,
其特征为,
它至少包括以下步骤中的一个:
-在第一个接触平面(3)和/或另外的连接平面(6)上施加电镀层;
-在另外的连接平面(6)上安放一个支撑环(8)。
3.按照权利要求1或2的方法,
其特征为,另外的连接平面(6)由铜构成并且该铜具有一个镍的电镀层,随后具有一个金的电镀层。
4.按照权利要求1或2的方法,
其特征为,金属带被粘在模块载体带的一个第一面的中心。
5.按照权利要求2的方法,其特征在于,第一个接触平面(3)与另外的连接平面(6)的电镀层是共同完成的。
6.按照权利要求1或2的方法,
其特征为,
将一个支撑环(8)粘接在另外的连接平面(6)上。。
7.按照权利要求6的方法,
其特征为,
所述粘接采用一种压力敏感的粘接剂(9)。
8.按照权利要求1的方法,
其特征为,
另外的连接平面(6)在构成时形成两个用于连接一个天线(11)的连接点。
9.按照权利要求8的方法,
其特征为,
所述连接点连接用于电感数据传输的电感线圈。
10.按照权利要求1的方法,
其特征为,
第一个接触平面(3)是由ISO-接触面构成的。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19632813A DE19632813C2 (de) | 1996-08-14 | 1996-08-14 | Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte |
DE19632813.6 | 1996-08-14 |
Publications (2)
Publication Number | Publication Date |
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CN1233334A CN1233334A (zh) | 1999-10-27 |
CN1143381C true CN1143381C (zh) | 2004-03-24 |
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Country | Link |
---|---|
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KR (1) | KR100358578B1 (zh) |
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AT (1) | ATE209800T1 (zh) |
BR (1) | BR9711161A (zh) |
DE (2) | DE19632813C2 (zh) |
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IN (1) | IN191477B (zh) |
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Families Citing this family (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19640304C2 (de) | 1996-09-30 | 2000-10-12 | Siemens Ag | Chipmodul insbesondere zur Implantation in einen Chipkartenkörper |
FR2760113B1 (fr) * | 1997-02-24 | 1999-06-04 | Gemplus Card Int | Procede de fabrication de carte sans contact a antenne bobinee |
CN1110770C (zh) * | 1997-06-23 | 2003-06-04 | 罗姆股份有限公司 | 智能卡用模块、智能卡及智能卡用模块的制造方法 |
US6651891B1 (en) * | 1997-11-04 | 2003-11-25 | Elke Zakel | Method for producing contactless chip cards and corresponding contactless chip card |
US6826554B2 (en) * | 1998-06-29 | 2004-11-30 | Fujitsu Limited | System and method for adaptively configuring a shopping display in response to a recognized customer profile |
FR2788646B1 (fr) * | 1999-01-19 | 2007-02-09 | Bull Cp8 | Carte a puce munie d'une antenne en boucle, et micromodule associe |
US6412702B1 (en) * | 1999-01-25 | 2002-07-02 | Mitsumi Electric Co., Ltd. | Non-contact IC card having an antenna coil formed by a plating method |
US6578203B1 (en) * | 1999-03-08 | 2003-06-10 | Tazwell L. Anderson, Jr. | Audio/video signal distribution system for head mounted displays |
US20060174297A1 (en) * | 1999-05-28 | 2006-08-03 | Anderson Tazwell L Jr | Electronic handheld audio/video receiver and listening/viewing device |
US20020057364A1 (en) | 1999-05-28 | 2002-05-16 | Anderson Tazwell L. | Electronic handheld audio/video receiver and listening/viewing device |
US7210160B2 (en) | 1999-05-28 | 2007-04-24 | Immersion Entertainment, L.L.C. | Audio/video programming and charging system and method |
JP3461308B2 (ja) * | 1999-07-30 | 2003-10-27 | Necマイクロシステム株式会社 | データ処理装置、その動作制御方法 |
US7782363B2 (en) | 2000-06-27 | 2010-08-24 | Front Row Technologies, Llc | Providing multiple video perspectives of activities through a data network to a remote multimedia server for selective display by remote viewing audiences |
US7812856B2 (en) | 2000-10-26 | 2010-10-12 | Front Row Technologies, Llc | Providing multiple perspectives of a venue activity to electronic wireless hand held devices |
US20030112354A1 (en) * | 2001-12-13 | 2003-06-19 | Ortiz Luis M. | Wireless transmission of in-play camera views to hand held devices |
US7630721B2 (en) | 2000-06-27 | 2009-12-08 | Ortiz & Associates Consulting, Llc | Systems, methods and apparatuses for brokering data between wireless devices and data rendering devices |
US8583027B2 (en) | 2000-10-26 | 2013-11-12 | Front Row Technologies, Llc | Methods and systems for authorizing computing devices for receipt of venue-based data based on the location of a user |
US7796162B2 (en) * | 2000-10-26 | 2010-09-14 | Front Row Technologies, Llc | Providing multiple synchronized camera views for broadcast from a live venue activity to remote viewers |
US7149549B1 (en) * | 2000-10-26 | 2006-12-12 | Ortiz Luis M | Providing multiple perspectives for a venue activity through an electronic hand held device |
JP4873776B2 (ja) * | 2000-11-30 | 2012-02-08 | ソニー株式会社 | 非接触icカード |
DE10109993A1 (de) | 2001-03-01 | 2002-09-05 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Moduls |
US20030085288A1 (en) * | 2001-11-06 | 2003-05-08 | Luu Deniel V.H. | Contactless SIM card carrier with detachable antenna and carrier therefore |
US7344074B2 (en) * | 2002-04-08 | 2008-03-18 | Nokia Corporation | Mobile terminal featuring smart card interrupt |
DE10237084A1 (de) * | 2002-08-05 | 2004-02-19 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements |
WO2004034617A1 (en) | 2002-10-07 | 2004-04-22 | Immersion Entertainment, Llc | System and method for providing event spectators with audio/video signals pertaining to remote events |
US7593687B2 (en) | 2003-10-07 | 2009-09-22 | Immersion Entertainment, Llc | System and method for providing event spectators with audio/video signals pertaining to remote events |
KR100579019B1 (ko) * | 2003-11-10 | 2006-05-12 | (주)이.씨테크날리지 | 콤비카드 제조방법 |
EP2039460A3 (de) * | 2004-11-02 | 2014-07-02 | HID Global GmbH | Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit, herstellungsanlage, Verfahren zur Herstellung und eine Transpondereinheit |
KR100723493B1 (ko) * | 2005-07-18 | 2007-06-04 | 삼성전자주식회사 | 와이어 본딩 및 플립 칩 본딩이 가능한 스마트 카드 모듈기판 및 이를 포함하는 스마트 카드 모듈 |
US8286332B2 (en) * | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US7979975B2 (en) * | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
US7971339B2 (en) * | 2006-09-26 | 2011-07-05 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US8240022B2 (en) * | 2006-09-26 | 2012-08-14 | Feinics Amatech Teorowita | Methods of connecting an antenna to a transponder chip |
US7546671B2 (en) * | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
US8608080B2 (en) * | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
US8322624B2 (en) * | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
US7581308B2 (en) | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
ES2355682T3 (es) * | 2007-09-18 | 2011-03-30 | Hid Global Ireland Teoranta | Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato. |
CN101673789B (zh) * | 2008-09-12 | 2011-08-17 | 光海科技股份有限公司 | 发光二极管封装基板结构、制法及其封装结构 |
TWM362572U (en) * | 2009-04-13 | 2009-08-01 | Phytrex Technology Corp | Signal convertor |
US8474726B2 (en) | 2010-08-12 | 2013-07-02 | Feinics Amatech Teoranta | RFID antenna modules and increasing coupling |
US8366009B2 (en) | 2010-08-12 | 2013-02-05 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
CN102299142B (zh) * | 2010-06-23 | 2013-06-12 | 环旭电子股份有限公司 | 具有天线的封装结构及其制作方法 |
US9033250B2 (en) | 2010-08-12 | 2015-05-19 | Féinics Amatech Teoranta | Dual interface smart cards, and methods of manufacturing |
US9195932B2 (en) | 2010-08-12 | 2015-11-24 | Féinics Amatech Teoranta | Booster antenna configurations and methods |
US8870080B2 (en) | 2010-08-12 | 2014-10-28 | Féinics Amatech Teoranta | RFID antenna modules and methods |
US8789762B2 (en) | 2010-08-12 | 2014-07-29 | Feinics Amatech Teoranta | RFID antenna modules and methods of making |
US8991712B2 (en) | 2010-08-12 | 2015-03-31 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
US9112272B2 (en) | 2010-08-12 | 2015-08-18 | Feinics Amatech Teoranta | Antenna modules for dual interface smart cards, booster antenna configurations, and methods |
EP2447886A1 (fr) * | 2010-10-07 | 2012-05-02 | Gemalto SA | Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication |
BR112014005507A2 (pt) | 2011-09-11 | 2017-06-13 | Féinics Amatech Teoranta | módulos de antena rfid e métodos de fabricação |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
AU2013214133A1 (en) | 2012-02-05 | 2014-07-31 | Feinics Amatech Teoranta | RFID antenna modules and methods |
DE102012205768B4 (de) * | 2012-04-10 | 2019-02-21 | Smartrac Ip B.V. | Transponderlage und Verfahren zu deren Herstellung |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
DE102014107299B4 (de) | 2014-05-23 | 2019-03-28 | Infineon Technologies Ag | Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls |
US10817768B1 (en) | 2019-12-20 | 2020-10-27 | Capital One Services, Llc | Systems and methods for preventing chip fraud by inserts in chip pocket |
US10977539B1 (en) | 2019-12-20 | 2021-04-13 | Capital One Services, Llc | Systems and methods for use of capacitive member to prevent chip fraud |
US11049822B1 (en) | 2019-12-20 | 2021-06-29 | Capital One Services, Llc | Systems and methods for the use of fraud prevention fluid to prevent chip fraud |
US10888940B1 (en) | 2019-12-20 | 2021-01-12 | Capital One Services, Llc | Systems and methods for saw tooth milling to prevent chip fraud |
US10810475B1 (en) | 2019-12-20 | 2020-10-20 | Capital One Services, Llc | Systems and methods for overmolding a card to prevent chip fraud |
US11715103B2 (en) | 2020-08-12 | 2023-08-01 | Capital One Services, Llc | Systems and methods for chip-based identity verification and transaction authentication |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
DE3723547C2 (de) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
DE3924439A1 (de) * | 1989-07-24 | 1991-04-18 | Edgar Schneider | Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente |
JP2713529B2 (ja) * | 1992-08-21 | 1998-02-16 | 三菱電機株式会社 | 信号受信用コイルおよびこれを使用した非接触icカード |
US5585618A (en) * | 1993-03-18 | 1996-12-17 | Droz; Fran+525 Ois | Method of manufacture of a card comprising at least one electronic element and card obtained by such method |
JPH0737049A (ja) * | 1993-07-23 | 1995-02-07 | Toshiba Corp | 外部記憶装置 |
JPH07117385A (ja) * | 1993-09-01 | 1995-05-09 | Toshiba Corp | 薄型icカードおよび薄型icカードの製造方法 |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
DE4443980C2 (de) * | 1994-12-11 | 1997-07-17 | Angewandte Digital Elektronik | Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren |
DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
-
1996
- 1996-08-14 DE DE19632813A patent/DE19632813C2/de not_active Expired - Fee Related
-
1997
- 1997-08-04 IN IN1442CA1997 patent/IN191477B/en unknown
- 1997-08-12 BR BR9711161-9A patent/BR9711161A/pt not_active IP Right Cessation
- 1997-08-12 DE DE59705575T patent/DE59705575D1/de not_active Expired - Fee Related
- 1997-08-12 EP EP97942853A patent/EP0919041B1/de not_active Expired - Lifetime
- 1997-08-12 RU RU99105123/09A patent/RU2161331C2/ru not_active IP Right Cessation
- 1997-08-12 ES ES97942853T patent/ES2171274T3/es not_active Expired - Lifetime
- 1997-08-12 JP JP50940198A patent/JP3262804B2/ja not_active Expired - Fee Related
- 1997-08-12 WO PCT/EP1997/004378 patent/WO1998007115A1/de active IP Right Grant
- 1997-08-12 KR KR1019997001253A patent/KR100358578B1/ko not_active IP Right Cessation
- 1997-08-12 CN CNB971987653A patent/CN1143381C/zh not_active Expired - Fee Related
- 1997-08-12 AT AT97942853T patent/ATE209800T1/de not_active IP Right Cessation
- 1997-12-08 UA UA99020806A patent/UA52673C2/uk unknown
-
1999
- 1999-02-16 US US09/250,874 patent/US6095423A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE209800T1 (de) | 2001-12-15 |
EP0919041B1 (de) | 2001-11-28 |
WO1998007115A1 (de) | 1998-02-19 |
BR9711161A (pt) | 2000-01-11 |
KR20000029989A (ko) | 2000-05-25 |
JP2000501535A (ja) | 2000-02-08 |
DE19632813A1 (de) | 1998-02-19 |
CN1233334A (zh) | 1999-10-27 |
US6095423A (en) | 2000-08-01 |
JP3262804B2 (ja) | 2002-03-04 |
UA52673C2 (uk) | 2003-01-15 |
ES2171274T3 (es) | 2002-09-01 |
EP0919041A1 (de) | 1999-06-02 |
KR100358578B1 (ko) | 2002-10-25 |
RU2161331C2 (ru) | 2000-12-27 |
IN191477B (zh) | 2003-12-06 |
DE19632813C2 (de) | 2000-11-02 |
DE59705575D1 (de) | 2002-01-10 |
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