CN1149669C - 将热油脂涂覆于集成电路的方法 - Google Patents

将热油脂涂覆于集成电路的方法 Download PDF

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CN1149669C
CN1149669C CNB971974098A CN97197409A CN1149669C CN 1149669 C CN1149669 C CN 1149669C CN B971974098 A CNB971974098 A CN B971974098A CN 97197409 A CN97197409 A CN 97197409A CN 1149669 C CN1149669 C CN 1149669C
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integrated circuit
cover plate
substrate
seal
packaging part
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CN1228872A (zh
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F�����ƶ�
F·科尔曼
���ڶ���
M·布劳内尔
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Intel Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

一种集成电路封装件(10)，包括一安装在衬底(14)上的集成电路(12)。集成电路(12)由连接于衬底(14)的盖板(16)封闭。盖板(16)与集成电路隔开一个小空隙(26)。盖板(16)具有一对孔口(36)，使得热油脂(38)得以注入集成电路(12)与盖板(16)之间的空隙(26)中。封装件(10)具有在盖板(16)和衬底(14)之间围绕集成电路(12)的密封件(30)。密封件(30)将热油脂(38)控制并限制在紧邻于集成电路(12)的区域(32)处。

Description

将热油脂涂覆于集成电路的方法
技术领域
本发明涉及一种集成电路封装件，还涉及将热油脂涂覆于集成电路的方法。
背景技术
集成电路通常被容纳在一个安装于一印刷电路板上的封装件内。集成电路通常产生必须从封装件中除去的热量。一些封装件具有一些热条或散热片以便将热量从集成电路上排除。散热片连接于集成电路以便在模子和封装件的周围空间之间形成直接的导热通路。由于制造公差，在集成电路和散热片之间可能存在气隙或气穴。空气是不良热导体。因此一般在集成电路的顶部涂覆一层热油脂，以便在电路和散热片之间提供比较低的热阻。
为了减小封装件的热阻，需要对热油脂的涂覆进行控制。过多的热油脂将会过度地增加封装件的热阻以及集成电路的接合温度。不足量的热油脂可能会留下气隙和气穴，这也会增加封装件的热阻。因此，需要提供一种具有可控制的热油脂层的集成电路封装件。
发明内容
本发明是一种集成电路封装件。该封装件包括一个安装在一衬底上的集成电路。集成电路由一个连接于衬底的盖板封闭。盖板与集成电路隔开小的空隙。盖板具有一对孔，使得热油脂能注入集成电路和盖板之间的该空隙中。封装件的密封件在盖板和衬底之间环绕着集成电路。该密封件将热油脂控制并限制在紧邻于集成电路的区域。
附图说明
本领域的技术人员在阅读了下面的详细描述和附图之后将会更加理解本发明的目的和优点，其中：
图1是本发明集成电路封装件的剖面图；
图2是类似于图1的剖面图，其示出注入封装件中的热油脂。
具体实施方式
参照具体由标号示出的附图，图1示出本发明的集成电路封装件10。封装件10中装有一集成电路12。集成电路12可以是微处理器。尽管示出且描述了一集成电路，但可以理解，封装件可容纳任何电气装置。
集成电路12安装在衬底14上。衬底14可以是具有表面垫、内部线路和通路(未示出)的印刷电路板，它们将集成电路12连接于一外部印刷电路板。集成电路12可具有焊料头(未示出)，其在通常称作“C4”或“倒装片法”封装的过程中将电路12连接于衬底14。
集成电路12由连接于衬底14的盖板16所封闭。盖板16可通过多个螺栓18连接于衬底14。螺栓18穿过板16的间隙孔20并由螺母22紧固。盖板16通常由例如铜等导热金属材料制成以便将由集成电路12产生的热量传递至封装件10的周围空间。因此，盖板16的作用是封装件10的保护盖和散热片。
盖板16具有一个平板表面24，该平板表面24与集成电路12的顶表面之间距离一个空隙26。盖板16还包括邻近于该平板表面24的一环形凹槽28。封装件10具有位于环形凹槽28中的密封件30。密封件30封闭了集成电路12并且限定了邻近于电路12的一个热区域32。在优选实施方案中，密封件30是一个通过盖板16使之变形的O形圈。盖板16还具有一入口孔34和一出口孔36。
如图2所示，热油脂38被注入封装件10的空间区域32中。热油脂38被泵压入区域32，直到油脂38充满了位于盖板16和集成电路12之间的空隙26。出口孔36使得热区域32中的空气流出了封装件，从而在集成电路12和盖板16的界面中不再形成气穴。密封件30控制热油脂38的流动，从而油脂38完全充满了盖板16和集成电路12之间的空隙26。
因此，本发明提供一种用以控制集成电路12与散热片16之间的热油脂层厚度的装置。尽管示出且描述了一个封装件，但衬底和盖板可以作为一种工具将热油脂层均匀涂覆在一集成电路上，该集成电路接着被组装到另一封装件内。例如，在涂覆了热油脂之后，盖板16可以拆下并且可以移走油脂所覆盖的集成电路12，以便组装到一个例如在本领域已知的陶瓷或塑料模制的封装件中。尽管描述了热油脂，但可以理解，油脂可以是导热的环氧树脂或者是可以注入封装件10之热区域32内的另一种导热材料。
尽管已描述且在附图中已示出几个示例性的实施例，可以理解，这些实施例仅是示例性的而不是对本发明的限制，并且本发明不限于图示和描述的特定结构和装置，因为对于本领域的技术人员而言可以进行各种其他变化。

Claims (2)

1.一种将热油脂涂覆于集成电路的方法，包括以下步骤：
a)将集成电路放置在衬底上；
b)将密封件围绕所述集成电路设置在所述衬底上；
c)用盖板封闭所述集成电路，使得所述集成电路、所述盖板、与所述密封件限定一个热腔；以及
d)通过所述盖板的一个入口孔将热油脂注入所述热腔内，使得所述热油脂与所述集成电路、所述盖板和所述密封件接触；
e)将所述盖板固定在所述衬底上。
2.权利要求1的方法，其特征在于，所述密封件通过所述盖板而发生变形。
CNB971974098A 1996-06-24 1997-05-27 将热油脂涂覆于集成电路的方法 Expired - Fee Related CN1149669C (zh)

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US67179496A 1996-06-24 1996-06-24
US08/671,794 1996-06-24

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US (1) US6016006A (zh)
JP (1) JP3949724B2 (zh)
KR (1) KR100310585B1 (zh)
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AU (1) AU3145997A (zh)
MY (1) MY123799A (zh)
WO (1) WO1997050124A1 (zh)

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CN1228872A (zh) 1999-09-15
AU3145997A (en) 1998-01-14
US6016006A (en) 2000-01-18
JP3949724B2 (ja) 2007-07-25
KR100310585B1 (ko) 2001-11-17
WO1997050124A1 (en) 1997-12-31
KR20000022209A (ko) 2000-04-25
JP2000513148A (ja) 2000-10-03
MY123799A (en) 2006-06-30

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