CN1155080C - 球网格阵列组装件的多串衬底及其组装件的安装方法 - Google Patents

球网格阵列组装件的多串衬底及其组装件的安装方法 Download PDF

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CN1155080C
CN1155080C CNB951202707A CN95120270A CN1155080C CN 1155080 C CN1155080 C CN 1155080C CN B951202707 A CNB951202707 A CN B951202707A CN 95120270 A CN95120270 A CN 95120270A CN 1155080 C CN1155080 C CN 1155080C
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bga
pcb
substrate
circuit board
printed circuit
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CN1132462A (zh
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诺尔曼・L・欧文斯
诺尔曼·L·欧文斯
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NXP USA Inc
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Abstract

一种用于球网格阵列(BGA)组装件的多串印刷电路板衬底包括一个带有多个排列成N行(14)和M列(16)形成N×M阵列的BGA衬底(12)的印刷电路板(11)。N和M都大于或等于2，且N×M阵列的大小选定为多个BGA衬底(12)中的每一个保持平整度起伏小于约0.15mm(约6密尔)。印刷电路板(11)的厚度(26)足以减小平整度变化并使厂家能够使用自动组装设备而无需采用支持托盘。

Description

球网格阵列组装件的多串 衬底及其组装件的安装方法
技术领域
本发明涉及半导体封装，具体涉及球网格阵列半导体封装。
背景技术
球网格阵列(BGA)半导体封装已为电子工业界所公知。与四边形平面封装(QFP)相比，BGA封装具有更密集的表面安装互连。工业界普遍认为对于输入/输出(I/O)要求大于250来说，BGA封装比QFP封装的“成本和效果”更合算。但强烈要求使成本实惠的BGA解决方案降到100I/O。
在BGA封装的组装过程中，厚度为0.35mm数量级的有机树脂印刷电路板衬底被置于金属托盘即支持装置上。在大部分组装步骤中，金属托盘为印刷电路板提供支持。印刷电路板包含一个单一的BGA衬底或一排或一串的多个BGA衬底。可获得的最大的单串印刷电路板是具有最大总长度约为20mm的1×6印刷电路板。然后将带有多个连接焊盘的半导体管心连接到位于BGA衬底顶侧的管心焊盘上，再将引线连接到焊盘和BGA衬底顶侧上的焊接部位。接着用有机材料包封半导体管心和引线。包封之后，在提高的温度下固化包封材料。再用回流焊工艺使导电焊球连接到位于BGA衬底下侧的接触焊盘并通过导电的迹线(trace)电连接到焊接部位。然后对各BGA封装进行划线。当采用单串多个BGA封装时，使用冲压之类的分割工艺将多个BGA封装分割成单个单元。
上述组装工艺有一些缺点。因上述工艺在大部分组装步骤过程中需要用金属托盘来支持薄的BGA衬底，故此工艺无助于大规模自动化组装。结果，为了组装BGA封装，生产厂家就必须购买额外的设备，这需要设备投资和额外的厂房。而且，又因只采用单个衬底或单串几个衬底，厂家也难以高效率地大批量生产BGA封装。此外，为了在多个工艺步骤中装卸金属托盘即支持装置，需要大量的劳动投入。这对制造周期和质量都有不良影响。再则，托盘与自动化设备一起使用时要求精确的公差而使托盘很昂贵，为了支持生产线的运行，还要求厂家有大量的库存。
组装之后，工业标准要求在横穿衬底的三个点上测量时，每个BGA衬底须保持小于约0.15mm(约6密尔)的平整度起伏。换言之，各BGA衬底不过分弯曲即成为非平整状。由于这一严格的标准和对弯曲的关切，印刷电路板供应商和BGA半导体厂家对于突破现有的1×6单串印刷电路板不感兴趣。
随着对BGA封装迅速增长的要求，显然对有助于大规模自动化组装的、支持现有自动化组装设备的并在组装工序中不弯曲的、且成本和效果合算的印刷电路板有所需求。
发明内容
本发明提供一种用于球网格阵列组装件的多串衬底，其特征在于：一个印刷电路板，具有一个外缘，一个厚度以及安排成N×M阵列的多个BGA衬底，其中N和M大于或等于2，并且其中选择N×M阵列的尺寸以及厚度，使得多个BGA衬底中的每个在组装后在多个BGA衬底中的每个上维持小于大约0.15mm的平整度变化；与多个BGA衬底中的每个相连的半导体管芯；包封每个半导体管芯的覆盖铸模封装件；以及与多个BGA衬底中的每个相连的多个导电焊球。
本发明提供一种用于球网格阵列组装件的衬底，其特征在于：一个印刷线路板，具有两个相对的边、两个相对的端，和多个BGA衬底，所述多个BGA衬底被安排成N×M模式，其中N和M是对应于分别位于印刷线路板内的BGA衬底的行数和列数的整数，其中N和M大于或等于2，并且其中选择N和M，使得多个BGA衬底中的每个在组装时不会弯曲到大于约0.15mm的不平整状况，并且其中印刷线路板的具有的厚度足以支持自动化的组装并使多个BGA衬底中的每个的弯曲最小；与多个BGA衬底中的每个相连的半导体管芯；包封每个半导体管芯的覆盖铸模封装件；以及与多个BGA衬底中的每个相连的多个导电焊球。
本发明还提供一种组装球网格阵列封装件的方法，其特征在于包括以下步骤：提供在具有厚度的印刷电路板中排列成N×M阵列的多个BGA衬底，其中N和M≥2，并且其中N×M阵列的大小以及厚度使得多个BGA衬底中的每一个在组装之后保持平整度变化小于约0.15mm，多个BGA衬底中的每一个都在一侧带有多个焊接部位而在相对侧带有多个接触焊盘；将半导体管芯连接到多个BGA衬底的每一个，此半导体管芯有多个焊接焊盘；用包封剂包封半导体管芯；固化包封剂；将导电焊球连接到多个接触焊盘的每一个；以及将N×M阵列分割成分立的BGA封装件。
附图说明
图1示出了用于根据本发明的BGA组装件的印刷电路板衬底
实施例的俯视图；
图2示出了根据图1的BGA组装件的放大的剖面侧视图。
具体实施方式
参照图1和2可更好地了解本发明。图1示出了多串衬底的印刷电路板(PCB)11的俯视图。PCB 11通常包含一个诸如BT(bis-malein ide-triaz in)树脂、FR-4板之类的有机环氧玻璃树脂基材料。PCB 11包括排列成N行14和M列16组成一个N×M阵列的BGA衬底即图形化封装。每个BGA衬底12包括一个管心安装或连接焊盘13，焊盘13通常含铜或镀金的铜。管心安装焊盘13是一个实心金属化区或一个形似十字、联结插座或其它特定几何形状的图形化金属化区。为避免图中过分拥挤，未示出导线(导线示于图2中)。PCB 11用公知的印刷电路板制造技术来制作。
为了支持有效的大规模自动化组装，N和M最好至少大于或等于2。根据BGA衬底12的最终尺寸，N和M选择成全部组装步骤完成之后，每个BGA衬底12的平整度起伏在各BGA衬底12上都小于0.15mm左右。换言之，在组装过程中，每个BGA衬底12的弯曲不超过约0.15mm。而且，PCB 11的厚度26(示于图2)足以将弯曲减为最小。如下所述，厚度26最好为至少0.5mm数量级。根据标准的工业实践，在一个给定元件中的弯曲是借助于测定支座平面(由三个距离BGA衬底最远的导电焊球形成(见图2)和距离衬底最近的导电焊球之间的最大差值来确定的。弯曲测量在PCB11被分成单个BGA单元之后进行。
PCB 11最好还包括多个位于PCB 11上不同位置处的应力释放槽19。槽19最好伸过PCB 11。槽19的尺寸全部相同或彼此不同。槽19使各BGA衬底12的弯曲进一步减小。PCB 11最好还包括沿PCB 11一边或二个边的对准孔21。对准孔21从PCB 11的上表面延伸到下表面。根据管心安装和引线设备的要求来安置对准孔以支持自动化组装。此外，PCB 11最好包括PCB 11周边附近的孔22和沿PCB 11一个边的孔23。孔22提供了自动定向特点，以使制作人不致于将PCB 11反插入组装设备。孔23提供了定向特点，以使制作人可将PCB 11遥控置入夹具中。
在27mm×27mm BGA器件的最佳实施例中，N＝2，M＝6，而PCB 11的长度17大约为187mm，宽度18大约为63mm。上述指标对23mm×23mm以及25mm×25mm的BGA器件也是最佳的。在9mm×9mm BGA器件的最佳实施例中，N＝4，M＝12，而长度17约为200mm，宽度18约为63mm。在10.4mm×10.4mmBGA器件的最佳实施例中，N＝4，M＝12，而长度17约为212mm，宽度18约为63mm。在15mm×15mm BGA器件的最佳实施例中，N＝3，M＝9，而长度17约为187mm，宽度18约为63mm。在14mm×22mm BGA器件的最佳实施例中，N＝2，M＝9，而长度17约为187mm，宽度18约为63mm。对14mm×22mm的BGA器件，也可选N＝3，M＝6，而长度17和宽度18同上。在35mm×35mm BGA器件的最佳实施例中，N＝1，M＝4，而长度17约为187mm，宽度18约为63mm。上述尺寸有利于利用标准自动组装设备的要求。这使厂家可利用现有的工具和设备。上述尺寸可方便地修正以满足不同类型自动组装设备的要求。
图2示出了组装之后但在分割成为单个封装件之前的BGA结构物、组件或封装件22的放大的剖面图。BGA结构物22包含一个在PCB 11之中的BGA衬底12。带有BGA结构物12的PCB 11的厚度26最好使PCB 11能够承受连珠式(magazine-to-maga-zine)自动组装工序而不采用金属支持托盘。现今可获得的单个BGA的衬底PCB和单串BGA衬底的PCB的厚度约为0.35mm，若不采用托盘或载体，这一厚度对可靠的自动组装来说是太薄了。厚度26也被选定来使各BGA衬底12的平整度起伏减为最小。厚度26最好大于约0.5mm。厚度26最好在-0.5mm到0.8mm的范围内。
BGA结构物22还包括一个安装在各BGA衬底12上表面上管心安装焊盘13上的半导体管心24。半导体管心24有多个焊接焊盘28。各BGA衬底12都有一个导电连接结构，它包含焊接部位31、上导线32、通孔33、下导线36和接触焊盘38。导电焊球41连接于接触焊盘38。导线43将连接焊盘28电连接到焊接部位31。或者，在倒装片实施例中，半导体管心24用焊接焊盘28直接连接到焊盘28下面的连接部位，省去了导线43和管心连接焊盘13。包封层即包封剂46将半导体管心24和引线43覆盖以保护有源电路元件免遭物理损伤或腐蚀。
以下描述使带有BGA衬底12的PCB 11组成BGA结构物22的典型BGA组装工艺。首先提供带有所需的N×M图形的PCB11。将PCB 11装在ESEC 2006之类的自动管心连接机上。这种管心连接机是一种厂家用来将半导体管心连接到诸如塑料双列直插式(PDIP)、小外线集成电路(SOIC)和QFP封装件之类的其它类型半导体封装件的工业标准机器。管心连接机自动地将一个半导体管心24连接到PCB 11上的一个管心连接焊盘13。最好用管心连接环氧树脂来将半导体管心24连接到管心连接焊盘13。
管心连接之后，用自动清洗系统来清洗PCB 11。接着，将PCB 11置于自动引线机上，将引线43连接到焊接焊盘22和焊接部位31。在常规BGA工艺中，引线是用半自动操作来安装的相似的引线机来完成的。
接着，用包装剂46覆盖半导体管心24和引线43。包封剂46包含一种有机材料，用覆盖铸模(overmold)工艺或球状工艺包敷。可以采用自动模具来进行覆盖铸模工艺。当采用覆盖铸模工艺时，包封剂46最好含有一种有机成模化合物。当采用球状工艺时，包封剂46最好含有一种脱水环氧有机化合物。选为包封剂46的材料的热膨胀系数(TCE)最好接近PCB 11材料和半导体管心的TCE(差别在百万分之几以内)。这进一步有助于在剩下的安装工序中减小BGA衬底12的弯曲。
接着，最好用带式炉、垂直炉或批量处理炉来固化包封剂46，使用的温度随用作包封剂46的材料类型而不同。在固化工序中，最好用退火箱或其它某种保护方法来保护接触焊盘38免遭外来物质的沾污。
在包封之后，用室温连接工艺将导电焊球41连接到接触焊盘38。接着用自动回流焊工艺来回流导电焊球41。自动回流设备为带式炉。回流之后，用自动清洗设备再次清洗PCB11，用含水的或萜烯溶剂来清除导电焊球安装工序引起的各种腐蚀性残渣。然后在自动划片机(如自动激光划片机)上对各BGA结构22进行划片。也可任选地在包封之后立即划片。最后将各BGA衬底12分成分立封装件。采用冲压工艺来分割封装件。也可采用常规切割折断分割工艺。
至此，显然已提供了一种多串PCB，它包含一个用来制造BGA型半导体封装件的BGA衬底的N×M阵列。N、M及PCB的厚度的选定原则是要能提高制造效率。制造效率的提高从一个多串PCB制造更多的BGA封装件的能力以及采用标准自动组装设备的能力。制造效率提高的同时，还要使BGA衬底的平整度起伏小于约0.15mm。由于根据本发明的多串PGB可使用标准的自动组装设备，BGA厂家就可使用相同类型的设备来制造不同类型的封装件，从而降低了基建投资和所需的厂房面积。由于降低了处置要求，从而也减小了劳力成本并提高了质量。

Claims (10)

1.一种用于球网格阵列(BGA)组装件的多串衬底，其特征在于：
一个印刷电路板(11)，具有一个外缘，一个厚度(26)以及安排成N×M阵列的多个BGA衬底(12)，其中N和M大于或等于2，并且其中选择N×M阵列的尺寸以及厚度(26)，使得多个BGA衬底(12)中的每个在组装后在多个BGA衬底中的每个上维持小于大约0.15mm的平整度变化；
与多个BGA衬底中的每个相连的半导体管芯；
包封每个半导体管芯的覆盖铸模封装件；以及
与多个BGA衬底中的每个相连的多个导电焊球。
2.权利要求1的多串衬底，其特征在于，印刷电路板(11)还包括印刷电路板(11)中不同位置处的多个槽(19)，用以进一步减小平整度变化。
3.权利要求1的多串衬底，其特征在于，印刷电路板(11)包含一种有机树脂。
4.权利要求1的多串衬底，其特征在于，厚度(26)大于约0.5mm。
5.一种用于球网格阵列(BGA)组装件的衬底，其特征在于：
一个印刷线路板(11)，具有两个相对的边、两个相对的端，和多个BGA衬底(12)，所述多个BGA衬底(12)被安排成N×M模式，其中N和M是对应于分别位于印刷线路板内的BGA衬底的行数和列数的整数，其中N和M大于或等于2，并且其中选择N和M，使得多个BGA衬底(12)中的每个在组装时不会弯曲到大于约0.15mm的不平整状况，并且其中印刷线路板的(11)具有的厚度(26)足以支持自动化的组装并使多个BGA衬底(12)中的每个的弯曲最小；
与多个BGA衬底中的每个相连的半导体管芯；
包封每个半导体管芯的覆盖铸模封装件；以及
与多个BGA衬底中的每个相连的多个导电焊球。
6.权利要求5的衬底，其特征在于，印刷电路板(11)沿二个相对的边的至少一个边有一个对准孔(21)。
7.一种组装球网格阵列(BGA)封装件的方法，其特征在于包括以下步骤：
提供在具有厚度(26)的印刷电路板(11)中排列成N×M阵列的多个BGA衬底(12)，其中N和M≥2，并且其中N×M阵列的大小以及厚度(26)使得多个BGA衬底(12)中的每一个在组装之后保持平整度变化小于约0.15mm，多个BGA衬底(12)中的每一个都在一侧带有多个焊接部位(31)而在相对侧带有多个接触焊盘(38)；
将半导体管芯(24)连接到多个BGA衬底(12)的每一个，此半导体管芯有多个焊接焊盘(28)；
用包封剂(46)包封半导体管芯(24)；
固化包封剂；
将导电焊球(41)连接到多个接触焊盘(31)的每一个；以及
将N×M阵列分割成分立的BGA封装件(22)。
8.权利要求7的方法，其特征在于，包封半导体管芯(24)的步骤包括采用TCE接近半导体管芯(18)和印刷电路板(11)的TCE的包封剂来包封。
9.权利要求7的方法，其特征在于，提供在印刷电路板(11)中排列成N×M阵列的多个BGA衬底(12)的步骤包括在其中不同位置处带有多个应力释放槽(19)的一个印刷电路板中提供多个BGA衬底(12)。
10.权利要求7的方法，其特征在于，提供多个在印刷电路板(11)中排列成N×M阵列的BGA衬底(12)的步骤包括在厚度(26)大于约0.5mm的印刷电路板(11)中提供多个BGA衬底(12)。
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US20040129452A1 (en) 2004-07-08
KR960026504A (ko) 1996-07-22
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US20070137889A1 (en) 2007-06-21
US20080289867A1 (en) 2008-11-27
MY119990A (en) 2005-08-30
TW280019B (zh) 1996-07-01
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