CN1168126C - 电子部件及其制造方法 - Google Patents
电子部件及其制造方法 Download PDFInfo
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- CN1168126C CN1168126C CNB008020698A CN00802069A CN1168126C CN 1168126 C CN1168126 C CN 1168126C CN B008020698 A CNB008020698 A CN B008020698A CN 00802069 A CN00802069 A CN 00802069A CN 1168126 C CN1168126 C CN 1168126C
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Abstract
本发明的目的在于,提供能够在内壁具有梯级的组件的规定位置上高精度安装元件的电子部件。因此,在组件13的内壁具有梯级26,梯级26的上端面上形成内壁连接电极14。又,在组件13的底面形成密封电极15,在密封电极15上通过连接层16固定元件17。元件17与内壁连接电极14用导线19进行电气连接。在将元件17和导线19中的至少一个固定于规定的位置时对位置利用设置于组件13底面的未形成电极部18a、18b进行。
Description
技术领域
本发明涉及在例如SAW(表面弹性波)器件等组件中藏有电子元件的电子部件及其制造方法。
背景技术
图5是已有的SAW器件的顶视图,图6是其剖面图。如这些图所示,已有的SAW器件首先在陶瓷基板100的一个表面上层积第1陶瓷框体101、再在第1陶瓷框体101上层积第2陶瓷框体102然后进行烧结,使其一体化,得到组件103。接着在组件103的规定的地方形成内部连接电极104及密封电极105,同时将密封环110钎焊于组件的上端面。接着,在内部连接电极104、密封电极105、密封环110的表面上镀金。
表面弹性波元件107是在未图示出的压电基板上形成输入输出用的梳形电极,在该梳形电极的两侧形成反射器电极,以及在梳形电极上形成电气连接的连接电极得到的,表面弹性波元件107通过连接层106在组件103的内部底面,亦即在陶瓷基板100的一个表面上的密封电极105上安装。接着,从组件103的上表面侧、亦即密封圈110一侧向表面弹性波元件107一侧进行图像识别,检测组件103的第2陶瓷框体102与第1陶瓷框体101的边界、内部连接电极104和未形成内部连接电极部件108a、108b的边界,根据这两个边界和组件103的尺寸决定在内部连接电极104与导线109连接的位置。
接着,根据该定位用导线109连接表面弹性波元件107与内部连接电极104,在组件103的密封环110上焊接盖111。
在上述已有技术中,一旦钎焊了密封环110,由于形成位置有移动,进行高精度定位是极其困难的。
一旦可能可靠地进行这样的定位,就会发生例如把导线109连接于例如密封电极105上这样的错误定位,或者发生导线109与内部连接电极104不能够正常连接的情况。
因此,本发明的目的在于,提供能够将电子元件的配置精确定位,又能够把内部连接电极与导线的连接位置精确定位的电子部件及其制造方法。
发明内容
为了实现上述目的,本发明的电子部件的要点是,设置适于将安装于电子部件上的例如SAW元件等电子元件和连接于电子元件的导线等定位于组件的规定位置上的定位模式。
又,本发明的电子部件的制造方法的要点是,在组件的内壁具有梯级,对其梯级与所述组件内部底面的边界进行高精度检测,对所述元件及导线两者中的至少一个进行定位。
具体地说,本发明的电子部件是具备在其内壁具有梯级的组件、设置于所述内壁的梯级上端面上的多个内部连接电极、设置于所述组件内部底面的密封电极、配置于该密封电极上的元件、以及连接该元件与所述内部连接电极的导线;设置在将所述元件及所述导线两者至少其一的位置定位于所述内部底面的一部分时使用的未形成电极部的电子部件。所述未形成电极部可以采用作为使元件及导线两者至少其一与组件的规定位置一致时的定位模式。所述未形成电极部与形成于组件内部底面的密封电极容易识别,因此如果采用该未形成电极部,则元件的安装位置及内部连接电极与导线的连接位置能够高精度决定。
又,本发明的另一电子部件是具备:陶瓷基板、在所述陶瓷基板的一个面上形成的第1陶瓷框体、形成于所述第1陶瓷框体上的第2陶瓷框体、形成于所述陶瓷基板与所述第1陶瓷框体及所述第1陶瓷框体与所述第2陶瓷框体之间的梯级部、以及位于所述第1陶瓷框体与所述第2陶瓷框体的接合面,形成于所述第1陶瓷框体一个面上的内部连接电极,并且并且所述内部连接电极也通过所述第1陶瓷框体及所述陶瓷基板的侧面形成于所述陶瓷基板的另一面,而且在所述陶瓷基板的一个面上形成用于配置所述元件的密封电极,在所述密封电极上固定元件,还具备连接所述元件与所述内部连接电极的导线,设置在将所述元件及所述导线两者至少其一的位置定位于所述组件内部底面的一部分时使用的未形成电极部的电子部件。未形成电极部如上所述可以看作决定元件及导线两者至少其一的位置时的定位模式。借助于此,可以高精度决定元件的安装位置及内部连接电极与导线的连接位置。
又,本发明的另一特征是,所述未形成电极部至少设置2个,在连结上述两个未形成电极部的所述密封电极上配置所述元件。又,本发明是从组件上方观察时所述未形成电极部的一边与所述内部连接电极的一边处于同一线上的电子部件。还有,本发明是所述内部连接电极的一边或其延长线与所述未形成电极部的一边或其延长线大致相互垂直的电子部件。又,本发明是组件内壁的相对的梯级下部之间的宽度比梯级上部之间的宽度大的电子部件。本发明的电子部件借助于这些特征,可以以更高的精度决定元件的安装位置以及内部连结电极与导线的连结位置。又,本发明的电子部件是使元件的上表面与内部连接电极存在于大致相同的平面上的电子部件。借助于此,可以在内部连结电极和元件上对焦,因此能够以更高的精度决定内部连结电极与导线的连接位置。
又,本发明的电子部件是使内部连接电极与元件之间的方向上的未形成密封电极部的长度比对所述内部连接电极与未形成密封电极部的边界进行图像识别的透镜的焦点偏差的幅度大的电子部件。借助于此,可以高精度地对内部连接电极与未形成密封电极部之间的边界进行图像识别。又,本发明是使未形成密封电极部的靠近内部连接电极一方的长度比所述内部连接电极之间的长度大的电子部件。借助于此,即使是在未形成密封电极部发生位置偏离,也能够可靠地识别内部连接电极与密封电极之间的边界。
还有,本发明的电子部件的制造方法具备下述步骤,即在相对的内壁上具有梯级,在所述梯级的上端面具有多个内部连接电极的组件内安装元件的第1工序、在从所述组件上方观察时,对所述梯级与所述组件的内部底面之间的边界至少检查两处,根据该检查结果决定对所述内部连接电极与所述元件进行导线连接的位置的第2工序、用所述导线将所述元件与所述内部连接电极电气连接的第3工序、以及用盖密封所述组件的开口部的第4工序。借助于此,可以用导线可靠地连接内部连接电极与元件。
还有,本发明的电子部件的制造方法是组件的内部底面具有密封电极,同时具有在从上方观察组件时,靠近所述梯级的组件内部底面上具有未形成密封电极部,在第1工序,所述未形成密封电极部与所述梯级的边界至少检测出两处,以此决定导线的连接位置的电子部件的制造方法。借助于此,可以更加正确地决定内部连接电极与元件的引线的连接位置。
又,本发明的电子部件的制造方法具备下述步骤,即在相对的内壁具有梯级,在该梯级的上端面具有多个内部连接电极的组件中,从上方观察时,对所述梯级与内部底面的边界至少检测出两处,根据该检测结果决定元件的安装位置的第1工序、在所述组件内部的底面安装所述元件的第2工序、用导线将所述元件与所述内部连接电极电气连接的第3工序、以及用盖密封所述组件的开口部的第4工序。借助于此,可以将元件可靠地安装在组件上。
又,本发明的电子部件的制造方法是组件的内部底面具有密封电极,同时所述内部底面的靠近所述内部连接电极一方的端部具有未形成电极部,在第1工序,在从上方观察所述组件时,所述未形成密封电极部的一边或其延长线与所述内部连接电极的一个边或其延长线的交点至少检测出两个,以此决定元件的安装位置。借助于此,可以将元件更加可靠地安装于组件上。
又,本发明的电子部件的制造方法具备下述步骤,即在相对的内壁具有梯级,在该梯级的上端面具有内部连接电极的组件中,从上方观察该组件时,对所述梯级与内部底面的边界至少检测两处,根据该检测结果决定元件的安装位置的第1工序、在所述组件内部安装所述元件的第2工序、从上方观察所述组件时,对所述梯级与内部底面的边界至少检测两处,根据该检测结果决定设置连接所述内部连接电极与所述元件的导线的位置的第3工序、用导线电气连接所述元件和所述内部连接电极的第4工序、以及用盖密封所述组件的开口部的第5工序。借助于此,可以更加正确地将元件安装在组件上,用导线连接元件和内部连接电极。
本发明的电子部件的制造方法是在组件的内部底面形成密封电极,同时内部连接电极一边的端部作为未形成密封电极部,在第1工序中,至少检测两个所述未形成密封电极部的一边或其延长线与所述内部连接电极的一边或其延长线的交点,以此决定元件的安装位置。在第3工序中,至少检测出两个所述未形成密封电极部的一边或其延长线与所述内部连接电极的一边或其延长线的交点,以此决定导线的连接位置的电子部件的制造方法。借助于此,可以更加正确地将元件安装在组件上,用导线连接元件和内部连接电极。
附图概述
图1是用盖密封之前的本发明实施形态1~3的SAW器件的顶视图。
图2是本发明实施形态1~3的SAW器件的剖面图。
图3是本发明其他实施形态的SAW元件的顶视图。
图4是本发明其他实施形态的剖面图。
图5是用盖密封之前的已有的SAW器件的顶视图。
图6是已有的SAW器件的剖面图。
本发明的最佳实施方式
实施形态1
图1是本发明实施形态1的表面弹性波器件加盖前从盖的位置看表面弹性波元件的顶视图。图2是图1所示的表面弹性波器件的A-B剖面图。
下面参照这些附图对本发明实施形态1加以说明。陶瓷基板10的一个表面、即安装表面弹性元件17的表面依序形成其大小不同的第1陶瓷框体11及第2陶瓷框体12,再形成具有阶梯26的组件13。
又,在第1陶瓷框体11的一个面(表面)、与陶瓷基板10及第1陶瓷框体11的外侧面、以及陶瓷基板10的另一个面(背面)的一部分上,形成内部连接电极14。
密封电极15形成于安装表面弹性波元件17的陶瓷基板10表面,表面弹性波元件17通过连接层16固定于密封电极15上。未形成密封电极的部分18a及18b在设置于组件13的内部的底面的阶梯26的侧端部,将未形成密封电极的部分18a及18b加以连接的密封电极15上的规定位置上配置表面弹性波元件17。
又,在制造本发明的电子部件时,首先在形成密封电极15及内部连接电极14的地方的陶瓷基板10的表面、背面及外侧面形成电镀的基底层。接着,在该陶瓷基板10的上表面形成第1陶瓷框体11。在该第1陶瓷框体11的上表面及外侧面上也形成与想要形成的内部连接电极14相同形状的电镀基底层。
接着,在第1陶瓷框体11的上面形成外围形状与该第1框体11相同,其宽度比第1陶瓷框体11小的第2陶瓷框体12,在组件13的内侧构成梯级26后烧结,使陶瓷基板10与第1及第2陶瓷框体11、12形成一体,制成组件13。在该第2陶瓷框体12的上表面上形成电镀基底层。
在这里,陶瓷基板10、第1陶瓷框体11及第2陶瓷框体12以氧化铝为主要成份,基底层以钨为主要成份。
其后,在组件13的电镀基底层上镀镍,在组件13的第2陶瓷框体12的上端面部份使用银钎料设置与组件13相同或具有相等的热膨胀系数的密封环20。
接着在再次进行镀镍之后镀金,形成内部连接电极14及密封电极15。
从图1可知,多个内部连接电极14分别形成于组件内部的阶梯26的上端面(第1陶瓷框体11的上端面),直至第1陶瓷框体11的内环端部,其各边平行于组件13的各边(第1陶瓷框体11的各边)。亦即内部连接电极14为近似于长方形或正方形。
又,组件13的内部底面的未形成密封电极部分18a、18b的各边与组件13的各边平行设置,并达到第1陶瓷框体11的内环下端部。亦即未形成密封电极部分18a、18b也是近似长方形或正方形,内部连接电极14与未形成成密封电极部分18a、18b以大致正交的方式构成。
而且,在表面弹性波元件17的两侧形成两个未形成密封电极部分18a、18b,使得从其上表面一方、亦即参考图2从密封环20一方向着表面弹性波元件17的方向看组件13时内部连接电极14与未形成密封电极部分18a、18b相互靠近。
另一方面,在压电基板上形成多个在输入输出用的梳形电极22、在该梳形电极22的两侧的反射器电极23及与梳形电极22电气连接的连接电极24,得到表面弹长波元件17。
接着,通过连接层16把表面弹性波元件17固定于组件13的密封电极15上。这时,内部连接电极14与表面弹性波元件17的连接电极24在大致相同的高度上构成。而且在从组件13的上表面上方观察时,内部连接电极14与表面弹性波元件17的连接电极24之间存在着未形成密封电极部分18a、18b。
接着,从上方对组件13进行图像识别,在相对的各阶梯26检测未形成密封电极部18a、18b与内部连接电极14的边界点,求出连接这两个点的直线的中点,以该中点为基准,根据组件13的各种尺寸决定内部连接电极14与导线19的连接位置。又,对设置于SAW元件17表面的梳形电极22、连接电极24等的电极图形进行识别,又决定内部连接电极24与导线19的连接位置。其后,将导线19的一端连接于内部连接电极14,另一端连接于SAW元件17的连接电极24。接着,将盖21焊接于设置在组件13的上端面上的密封环20上,以此将SAW元件17密封在组件13内。
实施形态2
实施形态2涉及决定SAW元件的安装位置的步骤,下面参照图2进行说明。首先,形成具有与实施形态1一样的内部连接电极14及密封电极15的组件13和SAW元件17。接着通过连接层16将SAW元件17安装于组件13的密封电极15上。接着从其上方对组件13进行图形识别,检测未形成密封电极部18a、18b与内部连接电极14的交点,以连接这两个点的直线的中点为基准,根据组件13的各种尺寸决定SAW元件的安装位置。
换句话说,也就是至少设置两个未形成电极部18a、18b,在连接这两处直线上配置SAW元件17。
然后通过连接层16在组件13的密封电极15上安装SAW元件17。
接着,在用导线19连接SAW元件17的连接电极24与内部连接电极14之后,将盖21焊接于组件13的上端面上设置的密封环20上,将SAW元件17密封在组件13内。
实施形态3
实施形态3涉及决定内部连接电极14与导线19的连接部的步骤。下面参照图3进行说明。与图1标以相同的编号的部分具有相同的功能。下面只对与实施形态1不同之处进行说明。在实施形态1,从其上方观察组件13时,未形成密封电极部18a、18b与内部连接电极14靠近,而在本实施形态中,未形成电极部18a、18b与内部连接电极14形成一定距离。
因此,在从组件13上方对其进行识别时,检测未形成密封电极部18a、18b的靠近梯级26的一个边的延长线与内部连接电极14的靠近组件13的内部底面的一边的延长线的交点,以连接这两个点的直线的中点为基准,根据组件13的各种尺寸决定内部连接电极14与导线19的连接部。
其后,将导线19的一端电气连接于内部连接电极14,另一端电气连接于SAW元件17的连接电极24上。
接着将盖21焊接于组件13的上端面上设置的密封环20上,将SAW元件17密封在组件13内。
下面对本实施形态的特征进行叙述。
(1)在本实施形态中,为了决定SAW元件17的安装位置或导线19与内部连接电极14的连接部,采用从组件13的上方进行图形识别,对组件13的内部底面与内部连接电极14的边界点进行识别的方法,其理由如下。
首先,为了减小识别误差,最好是识别点之间的距离尽可能长。因此虽然从组件13的上方观察时只要识别密封环20与第1陶瓷框体的11的边界点即可,但是由于密封环20以银钎焊25固定于第2陶瓷框体12的上端面上,其位置发生移动。但是第1陶瓷框体11由于是冲裁形成的,其形状的偏差比密封环20的位置偏差小。
又,不仅在使用密封环20对盖进行焊接的情况下,而且在用钎焊进行密封的情况下也有必要在第2陶瓷框体12的上端面形成镀层,由于比第1陶瓷框体11形状精度差,在这种情况下最好是使用第1陶瓷框体11与组件13的内部底面的边界进行定位。
(2)内部连接电极14和密封电极15使用相同的镀金方法形成,因此在从组件13的上方进行图形识别时难于对两者加以区别。因此可以利用将未形成密封电极部18a、18b靠近内部连接电极14设置,借助于此,可以利用其与内部连接电极14的色彩不同产生的反差更正确地进行定位。
还有,未形成密封电极部18a、18b也可以形成得如在如图1所示,从上方对组件13进行观察时,未形成密封电极部18a、18b与内部连接电极14的角部靠近。
实施形态4
实施形态4与实施形态3一样参照图3进行说明。与图1标以相同的编号的部分如在实施形态1、2所述,故省略其说明。
下面只对与实施形态1、2不同之处进行说明。在实施形态1、2,从上方观察组件13时,和实施形态3一样,不使未形成密封电极部18a、18b与内部连接电极14靠近。但是,未形成电极部18a、18b的一边与内部连接电极14的一边存在于梯级26与内部底面的边界线上。
因此,从组件13上方对其进行图像识别,在组件13的相对的各阶梯26检测未形成密封电极部18a、18b的一个边的延长线与内部连接电极14的另一边的延长线的正交点,以连接这两个点的直线的中点为基准,根据组件13的各种尺寸决定SAW元件17的安装位置。
实施形态5
实施形态5在第1陶瓷框体11的形状上具有特征。下面参照图4对实施形态5进行说明。标以与图1相同的符号的地方其说明与实施形态1相同,因此省略其详细说明。
下面只对与实施形态1不同之处加以说明。在实施形态1中,第1陶瓷框体11的内周侧面与上端面构成的角是直角,而在本实施形态5,第1陶瓷框体11的内周侧面与上端面构成的角是锐角。因此,相对的梯级26之间的宽度为下部比上部宽。
第1陶瓷框体11是将陶瓷片冲裁成所希望的形状形成的。这样可以把第1陶瓷框体11的内周侧面加工成所希望的形状、例如锥状。一旦将第1陶瓷框体11的内周侧面与上端面构成的角选择为锐角,从上方对组件13进行图像识别时,可以精确地检测未形成密封电极部18a、18b的一边或其延长线与内部连接电极14的一边或其延长线的正交点。
这一件事情对于实施形态2~实施形态4的SAW元件17可以说也是相同的。
在这里,将以上所述的实施形态1~5的特征加以整理如下。
(1)在实施形态1、3,从上方观察组件13时,可以识别未形成密封电极部18a、18b的一边或其延长线与内部连接电极14的一边或其延长线的正交点,用导线19将SAW元件17的连接电极24与内部连接电极14可靠地加以连接。
又,在实施形态2、4,在将SAW元件17安装于组件13内之前,从上方观察组件13,可以识别未形成密封电极部18a、18b的一边或其延长线与内部连接电极14的一边或其延长线的正交点,决定SAW元件17的安装位置。
这样形成,使未形成密封电极部18a、18b的一边或其延长线与内部连接电极14的一边或其延长线在从上方观察组件13时大致为正交,以此可以规定SAW元件17的安装位置和导线19的连接位置。当然,在制造一个SAW器件时,为了规定SAW元件17的安装位置和内部连接电极14与导线19的连接位置,也可以进行二次图像识别。
(2)像实施形态1、3那样,在为规定内部连接电极14与导线19的连接位置而进行图像识别时,使未形成密封电极部18a、18b的宽度比进行图像识别的透镜的焦点的偏差幅度还大,以此可以防止出现识别上的错误。
(3)又,使SAW元件17的上表面与内部连接电极14存在于大致相同的一个面上,这样就可以在进行图像识别时聚焦于SAW元件17的内部连接电极14两者上,能够同时识别未形成密封电极部18a、18b的一边或其延长线与内部连接电极14的一边或其延长线的正交点以及SAW元件17的连接电极24或梳形电极等的电极图形。
(4)还有,在实施形态1、2,由于对未形成密封电极部18a、18b的一边与内部连接电极14的一边的正交点进行检测,能够可靠地识别组件13与内部底面的边界。另一方面,在实施形态3、4,由于对未形成密封电极部18a、18b的一边的延长线与内部连接电极14的一边的延长线的正交点进行检测,一旦例如组件13的形状有变化,其位置识别精度与实施形态1、2相比也就稍微低一些。
因此,最好是像实施形态1、2那样形成未形成密封电极部18a、18b,使得在从上方观察组件13时未形成密封电极部18a、18b与内部连接电极14相邻接。又在形成未形成密封电极部18a、18b时,最好是将未形成密封电极部18a、18b靠内部连接电极14的一方的边的长度做得比同一梯级26的内部连接电极14之间的距离大,使得不管产生多少位置偏差也没有影响。
(5)在实施形态5,使第1陶瓷框体11的形状具有特征。也就是说,使第1陶瓷框体11的内周侧面与上端面构成的角为锐角。以此可以使相对的梯级26之间的距离为下部比上部大的结构。因此,在从上方对组件13进行图像识别时,可以精确地检测未形成密封电极部18a、18b的一边或其延长线与内部连接电极14的一边或其延长线的正交点。这样的陶瓷框体11的结构可以适用于全部实施形态1~4。
(6)又,在上述各实施形态中,将未形成密封电极部18a、18b分别靠近相对的梯级26设置。设置两个未形成密封电极部18a、18b使其只与一个梯级26邻接,可以识别未形成密封电极部18a、18b的一边或其延长线与内部连接电极14的一边或其延长线的正交点,进行定位。为了进行更高精度的识别,最好是将未形成密封电极部18a、18b形成于组件13的底部的SAW元件17的两侧。
(7)本发明在从组件13上方对其进行观察时能够对梯级26与底面的边界进行高精度的识别,决定SAW元件17的安装位置,因此可以把组件13的内部的大小限制于安装需要的最低限度的大小。因此能够使SAW器件小型化。
还有,在本发明中,密封电极15做得尽可能大则其密封效果也大。又,未形成密封电极部18a、18b也可以形成3个以上,但是形成两个对于决定SAW元件17的安装位置是足够的。又,在本发明的实施形态中,以SAW器件为例进行了说明,但是对于在组件的上端面与底面设置电极,在内部安装元件的电子部件也能够得到相同的效果。
工业应用性
如上所述,采用本发明可以提供能够高精度设定内部连接电极与导线的连接位置的电子部件及其制造方法。
Claims (15)
1.一种电子部件,其特征在于,具备
在其内壁具有梯级的组件、设置于所述内壁的梯级上端面上的多个内部连接电极、设置于夹在所述内壁之间的所述组件内部底面的密封电极、配置于该密封电极上的元件、以及连接该元件与所述内部连接电极的导线,
设置在将所述元件定位于所述内部底面时和将所述导线定位于所述内部接线电极时两种情况中的至少一种定位时使用的未形成电极部。
2.一种电子部件,其特征在于,具备
陶瓷基板、在所述陶瓷基板的一个面上形成的第1陶瓷框体、形成于所述第1陶瓷框体上的第2陶瓷框体、形成于所述陶瓷基板与所述第1陶瓷框体及所述第1陶瓷框体与所述第2陶瓷框体之间的梯级部、以及位于所述第1陶瓷框体与所述第2陶瓷框体的接合面,形成于所述第1陶瓷框体上表面的内部连接电极,
并且所述内部连接电极也通过所述第1陶瓷框体及所述陶瓷基板的外侧面形成于所述陶瓷基板的另一面,而且在所述陶瓷基板的一个面上形成用于配置元件的密封电极,在所述密封电极上安装元件,还具备连接所述元件与所述内部连接电极的导线,设置在将所述元件定位于所述陶瓷基板时和将所述导线定位于所述内部接线电极时两种情况中的至少一种定位时使用的未形成电极部。
3.根据权利要求1或2所述的电子部件,其特征在于,至少设置2个所述未形成电极部,在连接所述至少2个未形成电极部的所述密封电极上配置所述元件。
4.根据权利要求1或2所述的电子部件,其特征在于,所述未形成电极部的一边与所述内部连接电极的一边存在于同一线上。
5.根据权利要求1或2所述的电子部件,其特征在于,从上方观察时所述内部连接电极的一边与所述未形成电极部的一边垂直。
6.根据权利要求1或2所述的电子部件,其特征在于,组件内壁的梯级之间下方的宽度比下方大。
7.根据权利要求1或2所述的电子部件,其特征在于,使元件的上表面与内部连接电极存在于相同的平面上。
8.根据权利要求1或2所述的电子部件,其特征在于,使内部连接电极与元件之间的方向上的未形成密封电极部长度比对所述内部连接电极与未形成密封电极部的边界进行图像识别的透镜的焦点偏差的幅度大。
9.根据权利要求1或2所述的电子部件,其特征在于,使未形成密封电极部的内部连接电极一方的长度比内部连接电极之间的长度大。
10.一种电子部件的制造方法,其特征在于,具备下述步骤,即
在其内壁具有梯级,在所述梯级的上端面具有多个内部连接电极的组件内安装元件的第1工序、对所述梯级与所述组件的内部底面之间的边界至少检查两处,根据该检查结果决定对所述内部连接电极与所述元件进行导线连接的位置的第2工序、用所述导线将所述元件与所述内部连接电极电气连接的第3工序、以及用盖密封所述组件的开口部的第4工序。
11.根据权利要求10所述的电子部件的制造方法,其特征在于,组件的内部底面具有密封电极,同时具有在从上方观察所述组件时,其一边或其延长线与所述内部连接电极的一个边或其延长线垂直的未形成密封电极部,在第1工序,至少检测出两个所述未形成密封电极部的一边或其延长线与所述内部连接电极的一边或其延长线的交点,以此决定导线的连接位置。
12.一种电子部件的制造方法,其特征在于,具备下述步骤,即
在其内壁具有梯级,在该梯级的上端面具有多个内部连接电极的组件中,从上方观察该组件,对所述梯级与内部底面的边界至少检测出两处,根据该检测结果决定元件的安装位置的第1工序、在所述组件内部的底面安装所述元件的第2工序、用导线将所述元件与所述内部连接电极电气连接的第3工序、以及用盖密封所述组件的开口部的第4工序。
13.根据权利要求12所述的电子部件的制造方法,其特征在于,组件的内部底面具有密封电极,同时具有在从上方观察所述组件时,其一边或其延长线与所述内部连接电极的一个边或其延长线垂直的未形成密封电极部,在第1工序,至少检测出两个所述未形成密封电极部的一边或其延长线与所述内部连接电极的一边或其延长线的交点,以此决定元件的安装位置。
14.一种电子部件的制造方法,其特征在于,具备下述步骤,即
在其内壁具有梯级,在该梯级的上端面具有内部连接电极的组件中,从上方观察该组件,对所述梯级与内部底面的边界至少检测两处,根据该检测结果决定元件的安装位置的第1工序、在所述组件内部安装所述元件的第2工序、从上方观察所述组件,对所述梯级与内部底面的边界至少检测两处,根据该检测结果决定设置连接所述内部连接电极与所述元件的导线的位置的第3工序、用导线连接所述元件和所述内部连接电极的第4工序、以及用盖密封所述组件的开口部的第5工序。
15.根据权利要求14所述的电子部件的制造方法,其特征在于,在组件的内部底面形成密封电极,同时具有在从上方观察所述组件时,其一边或其延长线与内部连接电极的一个边或其延长线垂直的未形成密封电极部,在第1工序,至少检测两个所述未形成密封电极部的一边或其延长线与所述内部连接电极的一边或其延长线的交点,以此决定元件的安装位置。在第3工序中,至少检测出两个所述未形成密封电极部的一边或其延长线与所述内部连接电极的一边或其延长线的交点,以此决定导线的连接位置。
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CN100392835C (zh) | 2008-06-04 |
CN1591808A (zh) | 2005-03-09 |
US20050036278A1 (en) | 2005-02-17 |
US7345362B2 (en) | 2008-03-18 |
KR20010080607A (ko) | 2001-08-22 |
EP1143504A4 (en) | 2005-10-12 |
WO2001024252A1 (en) | 2001-04-05 |
EP1143504A1 (en) | 2001-10-10 |
CN1322375A (zh) | 2001-11-14 |
KR100397003B1 (ko) | 2003-09-02 |
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