CN1183656A - 具有球形接触面的高密度连接器 - Google Patents

具有球形接触面的高密度连接器 Download PDF

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CN1183656A
CN1183656A CN97122681A CN97122681A CN1183656A CN 1183656 A CN1183656 A CN 1183656A CN 97122681 A CN97122681 A CN 97122681A CN 97122681 A CN97122681 A CN 97122681A CN 1183656 A CN1183656 A CN 1183656A
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斯坦利·W·奥尔森
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Abstract

用于电路衬底上的具有隔件(10)和一批细长导线(8)的电连接器(1)。导线设于隔件(10)的通道(25)内。各导线的尾端终止于此隔件表面上的插孔(11)中,便于电连接器与衬底连接。隔件的通道保持导线尾端一致并在导线周围提供适应热膨胀与收缩效应的间隙。来自插孔(11)的有或没有预成型焊球(12)的焊锡膏凝结成至少是部分伸到插孔之外的球形体,用以在导线与电路衬底间进行连接。在导线(8)的端部上熔接一球形导体。

Description

具有球形接触面的高密度连接器
本申请是对先前提出的美国临时申请系列No.60/030799〔1996，11，14提出，题名为“球形栅极阵列高密度连接器(代理人审查No.EL-4474P)〕请求优先权。
本发明涉及电连接器，具体涉及到高密度I/O连接器，例如可利用焊球接触面连接于电路衬底上的这类连接器。
为减小电子设备的特别是个人便携式器件的尺寸，以及为给这类设备另增设功能的努力，正推动着所有的部件特别是电连接器的小型化。使电连接器小型化的努力包括缩短单排或双排线性连接中终端间的间距，以使装配于电路衬底上的指定用于置放连接器的紧凑区域内的连接器能够互联较多个数的I/O或其它线路。上述小型化的努力也使制造工艺测重于用来将部件安装到电路衬底上的表面安装技术(SMT)。增加使用SMT和要求线性连接器的细微间距两者相结合的结果，使得利用当前可以援引的安装设计来安装连接器的SMT已接近了高容量与低成本的极限。之所以到达了这种极限是由于进一步减小终端的间距大大增加了焊锡膏回流时相邻焊盘或终端间桥连的风险。为了满足已增加的I/O密度的需要，提出了阵列式电连接器。这类电连接器具有二维阵列的终端尾端并能提供改进了的密度。但是这类连接器在由SMT技术相对于电路衬底安装时带来了一定困难，这是因为这些终端中即使不是全部也是绝大多数的表面安装尾端必须连接于连接器体之下。结果由于在有故障时难以凭目力检查焊接头，就必须采用高度可靠的安装技术。
用于其它电子器件的安装技术已提出了在难以检验位置处要有可靠的焊接头。例如在把集成电路(IC)安装到塑料或陶瓷衬底上时，已越来越多地采用焊球和其它类似封装件来提供这种可靠的连接。在焊球技术中，连接到IC封装件上的焊球定位于通常用筛网或屏网涂布有焊锡膏层的电路衬底的电接触盘上。然后将此单元加热到这样一个温度，在此温度下，焊锡膏和至少一部分焊球会熔化而熔融到形成于电路衬底的底下导电盘上。这一加热过程通常称之为焊锡回流。由此将IC连接到衬底上而不需IC上的外引线。
虽然应用焊球与类似系统来将IC连接到衬底上具有许多优点，但近来则希望有相应的装置能将电连接器或类似部件安装到电路衬底之上。在安装电连接器中应用这种技术已落后于其在安装IC中的应用，这这是因为把焊球工艺用于将电连接器或类似部件安装到电路衬底上会带来IC安装置时未曾遇到过的问题。例如已采用了焊球的IC通常会提供平齐的连接面。相反，连接器通常则不提供平齐的连接面，而是出现一系列的通常称之为终端尾端的细长导线。将焊球连接到终端尾端梢部提供的小端面上与将其连接到平整表面上相比，会带来制造上的困难。
除了制造中的困难外，连接器由于它与电路衬底间的热膨胀系数(CTE)差的效应，通常易受焊接头应力的影响。这种易受影响的性质主要决定于连接器与IC间的尺寸与几何结构的差异。例如，IC安装面通常约为2.5cm的平方面。另一方面，连接器安装面一般具有窄的宽度(例如≤0.5cm)和较大的长度(例如≥5.0cm)。主要是由于连接器有较大的长度，它与电路衬底间的CTE差将比IC与电路衬底间的CTE差潜在有对焊接头大得多的影响。
经由焊球技术连到电路衬底上的连接点，与传统的SMT连接技术相比，也更易受接头应力的影响。例如，用传统的SMT将连接器终端尾端水平地连接到电路衬底上时能提供焊接头用的较大的连接面。传统SMT技术中焊接头的附加表面压较强，因而较能经受连接器、终端尾端与电路衬底间的CTE差。另一方面，焊球连接中是把连接器终端尾端垂直地连接到电路衬底上，以终端尾端与电路衬底直接匹配，而减少了连接表面积的大小。由于连接面较小的结果，CTE差就更可能使终端尾端将应力集中于电路衬底的接头上，导致失效或质量问题。
此外，在绝大多数的电路衬底的应用中，表面安装连接中的部件安装面必须满足严格的共面性要求。这样，应用焊球将连接器接附到电路衬底上时就需要这些焊球共面以保证一基本上平整的安装界面。于是，在最后的涂布中，焊球将回流并均匀地焊接到平面电路衬底上。在一定的安装连接下，焊料共面性有显著差别时，在连接头回流到印刷电路板上时，就会产生不良的焊接性能。因此，用户规定有很严的共面性要求例如约0.1～0.2mm的要求以实现高的焊接可靠性。通过提供采用焊球技术的连接，可以满足甚至有时超过共面性的要求。与常规的SMT不同，焊球可以通过加热变形来桥连终端尾端与电路衬底连接件间的间隙而吸收终端尾端长度的变化。
本发明认识到有需要改进电连接器设备以及伴随的电连接器构造技术，以克服现有电连接器的缺点。
为了满足上述要求，本发明提供了一种改进了的电连接器，用来在电部件的接触部与电路衬底的接触部之间形成电连，同时还提供了构造这种电连接器的方法。此电连接器包括：连接器体；一批电接点，设在此连接体上且布置成能与电部件的接触部分匹配；一批细长的电导线，或称之为终端尾端，设于连接体上并布置成与电路衬底形成电连。这些细长的导线与对应的电接点电连。衬底接点例如焊球则经对焊连接到各细长导线的端部，使得在细长导线与电路衬底的接触部之间能有选择地形成电连。
各细长导线设于一隔件通道中，此通道的横剖面直径稍大于细长导线的横剖面直径。结果在导线与通道侧壁之间形成有间隙。这种横剖面最好大致呈矩形。各通道终止于横过隔件平面中设置的插孔内。插孔具有矩形的顶部孔口，它沿隔件的长向上较长。此外，隔件与细长导线邻近的一部分涂有抗迁移溶液，例如疏油-疏水性的含氟化合物聚合物，以促进焊球的形成与连接过程。
制造上述连接器过程中所遇到的主要困难涉及到将衬底接触材料(例如焊球)熔接到细长导线尾端上的方法。本发明完成了这项困难的连接工作，它首先是在导线的平面内形成了上述的插孔。在此，上述平面是由能独立形成且连到连接体上的或是作为与此连接体成整体的部件形成的隔件提供。不论是哪种情形，细长导线的尾端都插入隔件中形成的通道内，使得尾端都终止于安装面的预定范围内并暴露于插孔中。然后以焊锡充填此插孔。最后，依据两种实施形式，将衬底接点熔接到细长导线的尾端上。
在第一实施形式中，将预制的衬底接点件例如焊球置于焊锡膏中。然后将细长导线的尾端、焊球(衬底接点件)与焊锡膏将热到焊锡膏熔点以上的预定温度，使得熔融焊锡凝聚于焊盘周围，使焊球熔接到细长导线端上。
依据第二实施形式，不采用预制的衬底接点件，而是将预定数量的焊锡膏涂布到插孔及其上方。然后将所述尾端与焊锡膏加热到焊锡膏熔点以上的预定温度。结果，焊锡膏凝结成连接细长导线端部的球体并避开了插孔。
如上所述的于细长导线上形成衬底接点的方法还可进一步改进，即用例如疏油性含氟聚合物的抗迁移溶液对上述插孔进行涂层。然后，在将焊锡膏加热后，焊锡膏便从插孔的已处理表面与分隔件上排斥出。结果使形成了较均匀的球。若使尾端的一部分纯化，致焊锡膏不接附到此钝化的部分上，则可以再次改进此衬底接点的连接方法。结果，焊料便只附着于细长导线的端稍处。通过使尾端钝化或涂以抗迁移溶液或兼用这两者，可在尾端限制焊料的流动。
下面参照附图进一步描述本发明的方法与连接器，附图中：
图1是代表本发明连接器一最佳实施形式的插件边缘连接器的顶视平面图；
图2是图1所示插件边缘连接器的前视图；
图3是图1所示插件边缘连接器的侧视图；
图4是通过图1中4-4线的横剖图；
图5是图4中衬底接触区的详图；
图6是已完成了将衬底接点连接到第一尾端上的实施形式的示意性横剖图；
图7是已完成了将衬底接点连接到第一尾端上的实施形式的示意性横剖图；
图8是衬底接点连接的底视平面图；
图9是依据第一种方法的衬底接点连接的示意性横剖图；
图10是依据第二种方法的衬底接点连接的示意性横剖图；而
图11是曲线图，比较了终端尾端高度与衬底接点高度的相对关系。
根据当前属最佳的实施形式，下面参看附图来描述具有焊球型电接点面的线性连接器以及用来将焊球连接到此连接器上的方法。内行的人当知这其相对于附图给出的说明只用于举例目的而无意以任何方式来限制本发明。例如在所描述的具有大致呈矩形安装面的电连接器中，此安装面的长度显著大于其宽度，但相对于此连接器所述的具体尺寸则仅仅用于说明目的而无限定意义。这里所公开的概念性原则能广泛地用于连接器安装面的几何结构有甚广变化的情形。例如，参看此种连接器所公开的设想可以用于连接安装面更为方形或辐射形几何结构的连接器。
参看图1～3，它们分别示明了本发明的电连接器1的顶视、前视与侧视图。如图所示，连接器1包括连接器件5、一批细长导线8、界面或隔件10、电气元件接点9、以及带有上延臂15与连接器插锁24的压紧件13。从图2中可以清楚看到，连接器1的前部包括一批设在两个孔口中的电接点9，它们经设计成用来有选择地与电气元件的相应电接点例如子插件上存在的电接点连接与配合。如后面将更详细说明的，每个电接点9与一对应的细长导线8电连而在其间形成电流通路。细长的导线8用来永久性连接到电路衬底(未示明)的电接点上。然后在插入到电连接器1中的电气元件与其所连接的电路衬底间作有选择的电连。这样，电连接器1例如可以连接到计算机母板所用那种插件边缘连接件之类的电路衬底上。然后用户便可通过所接附的电连接器1有选择地给计算机母板增设一或多个小插件(例如存储模件)。
连接器1的电接点9包括叠层成两平行行36A与36B的线性阵列，每行接收一个单一的小插件。用户将电气元件沿横向插入连接器1中。当各个子插件插入后，与特定的行36A与36B对应的连接器闩锁24便与此电气元件结合而将其于连接器1上锁定就位。尽管相对于连接器1示明的是两个平行行，但这里所公开的设想同样适用于具有一行、三行、等等的连接器。连接器件5与连接器闩锁最好由模塑塑料制成以减轻重量。
连接器1结构的进一步细节可参看图4。图4是沿图1中4-4线截取的连接器1的横剖图。如图所示，连接器1还包括叠置的模制的插入片件2，它们由销与插座装置4锁定在一起，经这样锁定后，片件2由一列配合于柱形孔7中的凹坑6保持于连接器件即机壳5中。一批细长的导线8插入各薄片2中。每个细长导线在此与一相应的电接点9电连。各线长导线8还从片件2中伸出而进入隔件10中。弯曲部29(在此公开的实施形式中最好约弯曲90°)与细长导线8的长度一起于两个不同的平面上提供了界面。例如，这一弯曲部使连接器1在垂向上与插件邻接，同时与相对于插件取水平位置的电气元件邻接。这样，电气元件便于水平方向上突出到电路衬底表面之上，保持着电路衬底的高度。可以根据需要采用其它度数的弯曲部29，来调节作不同应力的几何结构而不背离本发明的创新精神。例如，细长的导线也可以无弯曲部，这时的电气元件将相对于电路衬底垂直地突出。各细长导线8的尾端穿过隔件10的对应通道25并终止于衬底接点12例如焊球处。各细长导线8最好具有大致呈矩形例如方形的横剖面，但其它的横剖面形式例如圆形也完全相同的有效。
图5相对于隔件10更详示了细长导线8。隔件10可以是接附于连接器体5上的独立部件或可以与其形成整体。如图所示，隔件10有一批通道25，每个通道5可用来导引和支承位于通道25内的各细长导线的尾端。重要的是，通道25的直径稍大于细长导线8的直径。因此，细长导线8的尾端设在通道25内时使得导线8的侧面与通道25的壁部之间形成有间隙18。例如，细长导线8的宽度约0.305mm，通道25的宽度约0.38mm。间隙18的重要意义在于能经受形成隔件10的材料与形成在其上安装连接器的电路衬底材料间的CTE差。这就是说，通道25的尺寸确定为能在衬底接点12连接到以及在连接器1连接到电路衬底上时，给细长导线8提供导引装置。但是，由于细长导线8相对于隔件10边通道设有间隙而不与隔件10有实质性的接触，允许隔件10膨胀与收缩而不使通道25的侧壁与导线碰触。此间隙的大小与上述CTE的差有关。结果就减小了热膨胀与收缩循环时细长导线8与电路衬底间焊接头感生的应力。通道25的横剖面最好与细长导线8的横剖面相似。例如，当导线8的横剖面大致为矩形时，则通道25也如此。各通道25终止于插孔11的底部，且包括一便于将导线8引入隔件10中的宽的入口腔27。导线8的各端终止于插孔11之内，并于其中熔接到也是部分地设于插孔11中的衬底接点12之上。由于种种原因，包括导线8弯曲等原因，导线8在插孔11中的终端高度将因导线8的不同而不同。这种高度的变化通常用共面性表征。
下面参看图8，其中相对于插孔示明了衬底接点12的底视平面图。如图所示，插孔11的横剖面大致呈矩形，长度l略大于宽度W。例如，宽度W最好取0.5mm，而长度1最好为0.55mm。此外，根据第一实施形式，衬底接点12的高度约0.3～0.5mm。这样，在衬底接点12与插孔11两侧间的间隙约0.05mm。对通道25来说，插孔11的矩形剖面也有适应热膨胀和收缩的效果。插孔11与衬底接点12间的间隙保证了插孔11在膨胀与收缩中不会碰触焊接头。
插孔11的长度与隔件10的长度一致，能适应热循环并可使导线密度最大。由于隔件10的长度大于宽度，胀缩效应在隔件10的长度上也就大于宽度上的。因此，插孔11的顶部孔口具有的尺寸能适应长向的热膨胀与收缩。沿隔件10的宽度，由于相对于长度的尺寸较小，这种胀缩效应也小。因此，插孔11的宽度可小于其长度。总的结果是，使插孔11的尺寸选定成能沿连接器1的长度适应胀缩，同时允许插孔11与导线8沿接件1的宽度具有高的密度。此外，由于插孔11的顶部孔口具有依上述方式选定的尺寸，就能在隔件10的宽度上使组件导线有较高的密度，同时能允许插孔11各衬底接点连接过程中保持所需体积的焊锡膏。
下面参看图6～9说明将衬底接点12连接到细长导线8上的细节。图6示明将衬底基底12连接到导线8端部上的实施形式。通过对焊将衬底接点12熔接于导线8的端部上。为了确保衬底接点12与细长导线8间对焊的质量，使各导线8的尾端具有钝化的表面17。钝化的表面17保证了在连接过程所用的熔融焊锡，在衬底接点回流时不会沿导线8的侧面流动和有可能进入间隙18。如上所述，间隙18能适应CTE差。因此，要是焊锡进入间隙18，随着隔件10的胀缩，对应的焊接头便会受到损害。于是将一种括焊剂流散或是不为焊剂濡湿的材料涂布于表面17上。用于这种目的的一种最佳材料是镍镀层。虽然并无意受任何具体理论的限制，但相信这种镍镀层区的抗焊剂特性可以通过使镍镀层氧化，例如由激光氧化、与蒸汽或与环境空气接触氧化而改进。其它的抗焊锡流散材料例如含氧的抗焊锡涂层据信也可用于上述目的。此外，可以将镍与氟结合使用。
可以有其它的实施形式来防止焊锡流散。例如图7示明了衬底接点与细长导线8连接的第二种实施形式。在此实施形式中，细长导线8的端部修成锥面。由于这种锥面形式，在衬底接点12与细长导线8相连时，在接点12与导线8的端部之间便形成了焊锡小面21。此第二实施形式由于将焊锡截获于锥面内同样减少了焊锡流散到间隙18内的可能性。
在上述两实施形式中，各细长导线8的尾端位于插孔11之中。各个插孔11的尺寸与形状基本一致，而赋予了本发明若干重要特征。参看图9，例如各个插孔11通过采用例如简单的沉积与挤塞作业之类的方法，确保了其中接收着大致一致数量的焊锡膏19。这样，能用来将各焊球(衬底接点12)固定到细长导线8一端上的焊锡量基本上是一致的。插孔11在衬底接点于Z方向中相对于隔件10底面连接之前，使各衬底接点于侧面的X-Y方向中定位，同时使各细长导线8的端部定位。在焊锡回流后，如图6清楚地表明的，插孔11中焊锡膏19所含的焊锡便使焊球(衬底接点12)的大小增加一个区域16。
区域16的大小受到插孔11内导线8梢端高度的影响。各插孔11所沉积的焊锡膏19的数量由于细长导线8高度的变化而改变。例如，在插孔11中较高的导线8的梢端将排移较多的焊锡膏；而在插孔11中较低的导线8的梢端将排移较少的焊锡膏19。要是插孔中能用到的焊锡膏较少，则在焊锡膏回流时只能有较少的焊锡膏凝集于衬底接点周围，形成稍微较小的衬底接点12。较小的衬底接点形成了较低的接点高度。另一方面，当插孔中可资利用的焊锡膏较多时，将会形成较大的衬底接点，相应地有较高的衬底接点高度。
上述过程说明了应用预成形的衬底接点12例如焊球来进行衬底接点连接。但是根据第二实施形式，可以不用预成形的衬底接点来形成衬底接点连接。参看图10，其中示明了只用焊锡膏的衬底接点12的连接方法。根据这一方法，将预定量的焊锡膏19A沉积于插孔11之中及其上。此预定量的焊锡膏可用市售的分配机，例如Camelot Systems公司出售的CAM/A LOT1818型机进行沉积。在焊锡膏沉积之后，将连接器加热到焊锡膏熔点之上。然后，此焊锡膏中的焊锡凝集到形成于细长导线8之上的衬底接点16A之内。正如上面参考预成形衬底接点技术所说明的，插孔11中变动的焊锡膏体积将影响最终衬底接点的大小与共面性。与预成形衬底接点法类似，为插孔11中导线8的高度所排移的焊锡膏同样会在这一方法中影响到最终的共面性。
如前所述，应用衬底接点安装的连接器的衬底安装面的光面性对任何SMT器件部是严格的。在连接器1中，有两个主要因素影响连接器与电路衬底的界面：(1)细长导线8的端面部梢部的共面性，(2)衬底接点12的共面性。导线8梢部的共面性受到种种因素例如导线8的长度、弯曲部分的一致性、保持导线一致平行的能力，等等的影响。结果，极难将导线梢端保持在电路衬底制造商最终共面性要求的范围内的同时又保持高的产率和低的成本。但如下面较全面地说明的，通过采用衬底接点连接再结合插孔11，就可以满足完善的连接器1对共面性的严格要求，而对导线8梢端的共面性要求则可不太严格。
参看图11，其中示明了在与衬底接点12连接之前的细长导线8梢端共面性的典型曲线(曲线32)，以及作为对比的连接了衬底接点12的导线8的共面性(曲线34)。横标上的单位表示用于共面性测量的不同试样。纵标上的单位表示单位试样高度，标以0、1、2，等等；但是这样标出的单仅仅用来说明梢端位置与对应衬底接点高度间的相对关系。实际的单位与值将随位插孔尺寸与衬底接点大小之类因素而变化。
曲线32表示在插孔11底部之上测量的细长导线梢端的高度(同时参看图6)。这样，例如在试样0，测量得的梢端高度是0单位。在试样1，梢端高度是0.75，等等。在试样5，梢端高度则约为4单位。
曲线34表示在连接衬底接点12之后的同一梢端在插空11底部之上的高度(同时参看图6)。对于试样0，在连接衬底接点12之后的对应高度约为4.5单位。在试样1，对应的衬底接点高度约为5单位。最后，对于试样5，衬底接点高度此时约为6.5单位。
曲线32与34相比较的结果说明，将衬底接点12连接到导线梢端的方法吸收了导线8的梢端在共面性中的某些变化。例如在试样0处，梢端高度(连接前的曲线32)与衬底接点高度(连接后的曲线39)之间的差约为4.5单位。相反，在试样5处，梢端高度约4单位，而衬底接点高度约6.5单位，它们的差只是2.5单位。此外，在试样整个范围上的梢端高度的总体变化约为4单位，但是衬底接点高度在同一试样范围上的总的变化则只约2单位。
为了进一步说明由插空实行的共面性控制，考虑下面的例子。典型的连接器在衬底接点连接之前有许多具不同梢端高度的细长导线。例如，如果一装导线8具有的梢端高度为0(即此梢端与插孔底部恰好平齐，而另一连接器则具有4单位的梢端高度，这两个梢端间的共面性约为4单位。在某些情形下，4单位的共面性可能是不合格的。但在依据这里所述方法连接衬底接点12之后，对应的衬底接点高度将分别为4.5单位和6.5单位，而最终的共面性约2单位。重要的是，此最终共面性与4单位相比只是2单位。
总之，细长导线8梢端的共面性差在连接衬底接点12的过程中得以抵消。衬底接点的大小由于细长导线梢端高度变化的结果，因插孔11中焊锡膏体积的改变而改变。最后，在与导线8的梢端连接后，衬底接点的总体高度得到一定程度的均衡化。因此，与其它的方式相比，可将连接器1构造成对于细长导线的共面性允许具有较高的公差。
根据本发明的另一个方面，通过将一种抗迁移或抗流散的溶液涂布到插孔11之中或周围的区域上，可以提高衬底接点12的连接质量。在不加抗迁移溶液时，衬底接点有可能不均匀地形成，有时会流散到插孔的边缘处。涂布了抗迁移溶液后，焊锡就会从插空的边缘排斥开，而在细长导线的端部上形成较均匀的衬底接点。最佳的抗迁移溶液是疏油-疏水性的含氟聚合物。这种溶液可由3M公司于Fluorad商标名下购到。
在本发明的方法中，衬底接点最好是焊球。但内行的人可知，能以熔点低于连接器体5和导线8的熔点其它易熔材料来代替焊球。这种易熔材料件也可有异于球形的其它形状。如前所述，细长导线8的端部伸入插孔11内的量要足以提供适当的表面积供衬底接点2熔接，通常相对于插孔深度最好要插入其25～75％，而尤为最好的是要插入其50％。此插孔的横剖面通常为圆形、方形或任何其它正多边形。当导电元件是焊料时，它最好是组成范围为约10％的Sn和90％的Pb至约90％的Sn和约10％的Pb的合金。这种合金最好是低共熔点混合物，含63％的Sn与37％的Pb，具有183℃的熔点。通常用具有较高铅含量的“硬”焊料合金来与陶瓷一类材料匹配。“硬”衬底接点将呈“蘑菇形”或当它在典型的SMT条件下软化时略有变形，但它不会熔化。“软”的低共熔点混合物球被用来连接刷电路板，且通常将回流并在典型的SMT条件下重新整形。适用于电子工业用途的其它已知的焊料据信也可用于这种方法中。这类焊料包括但不限于电子工业中认可的锡-锑、锡-银与铅银合金以及铟。在衬底接点或其它导电元件位于插孔中时，此插孔通常要用焊锡膏充填。
或者，取代前述的衬底接点，可将一种在SMT温度下不熔融的材料体借助插孔中焊锡膏的回流而连接到接点上。此连接器安装界面将包括一批成紧致平面阵列的难熔的球体。这种连接点将通过通常的SMT技术固定到衬底上。
虽然包括任何常数的有机或无机的焊料助熔剂在内的焊锡膏据信能适用于本方法，但最好采用一种非清洗式(no clean)的焊锡膏。这种焊锡膏包括以细粉末形式悬浮于适当助熔材料中的焊料合金。上述粉末通常是一种合金而不是一些组分的混合物。焊料对助熔剂的比例通常很高，按焊料重要为80～90％，或按体积约为50％。当焊料悬浮于松香助熔剂中便形成了焊锡膏。这种松香助溶剂最好是由松香的或低活性的松香助熔剂，当然，激活的或超激活松香也是可有种种用途的，当细粉末形式的焊料合金悬浮于有机酸助熔剂或无机酸助熔剂中时，就可形成焊锡膏。这类有机酸可以选自乳酸、油酸、硬脂酸、酞酸、柠檬酸或其它类似的酸。这类无机酸则可选自盐酸、氢氟酸与正磷酸。可将焊锡膏刷涂、筛涂或挤涂到最好经过逐渐预热来保证有良好濡湿性的表面上。
加热最好是用板式红外焊料回流传送炉进行。后将连接器加热到焊锡膏中焊料熔点以上的温度。
上面已结合对照附图的各最佳实施形式描述了本发明，但应知在不背离发明精神的前提下是可以采用其它的实施形式或对所述实施形式作出修正或增述来取得相同功效的。因此，本发明不应限于任何单独的实施形式，而应按照后附权利要求书的内容理解其广度与管辖范围。

Claims (29)

1.用于在电子部件接触部与电路衬底接触部之间形成电连的电连接器，此电连接器包括：
连接器体；
设在连接器体之上并布置成能与电子部件接触部作电气匹配的一批电接点；
形成用来将连接器安装到电路衬底上的安装界面的隔件，隔件中有一批通道；
设在连接器体上且布置成能与电路衬底形成电连的一批细长导线，每根导线与所述这批电接点中对应的一个电连，每根导线都有一尾端自由地设于隔件的一个相应通道中；以及
一批衬底接点件，每个都有一弧形的衬底接触面连接到相应的一个细长导线的尾端上，使得这些细长导线和电路衬底的接点部之间能有选择地适应于电连。
2.如权利要求1所述电连接器，特征在于，所述衬底接点件是焊球，而所述通道的横剖面积大于所述细长导线的横剖面积。
3.如权利要求1所述电连接器，特征在于，它还包括一批设于所述隔件安装界面上的插孔，而每个插孔与所述这批通道中之一通连。
4.如权利要求3所述电连接器，特征在于，所述插孔的侧边尺寸大于所述衬底接点件横剖面的相应尺寸，而使衬底接点件能与插孔的侧边分开一定间隙。
5.如权利要求4所述电连接器，特征在于，各衬底接点件熔接到细长导线的一个尾端之上，形成一个部分地伸至插孔之外的球体。
6.如权利要求1所述电连接器，特征在于，所述插孔有一长向，此长向的长度与所述隔件的长度基本一致。
7.如权利要求1所述电连接器，特征在于，所述衬底接点件的光面性在0.1～0.2mm的范围。
8.如权利要求1所述电连接器，特征在于，一个衬底接点件熔接到细长导线的基本上呈球形的一个尾端之上。
9.如权利要求1所述电连接器，特征在于，所述细长导线经钝化处理，使得所述衬底接点件能在它的单个表面上作连接。
10用来与电路衬底形成电连的电连接器，此电连接器包括：
隔件，它具有与电路衬底形成界面的平表面并有一批设在所述界面上的插孔，每个插孔有一个从插孔底部通过所述隔件的对应通道，所述插孔具有形成一孔口的侧边；
一批各具有尾端的细长导线，其中的每根细长导线设在所选定的一个通道中之中，使得尾端在相应插孔中终止于上述平表面一预定范围内；以及
熔接于细长导线相应尾端上的导电材料，此导电材料具有部分伸到插孔孔口外的球形体。
11.如权利要求10所述电连接器，特征在于，所述导体材料的熔点低于所述细长导线的熔点，以便用来使所述细长导线与电路衬底熔接。
12.如权利要求1所述电连接点，特征在于，所述导电材料是焊料。
13.用来在具有电接点部的第一电气元件和具有电接点部的第二电器元件间形成电连的电连接器，此电连接器包括：
连接器体；
设在连接器体上的第一电接点，后者包括一用来与第一电气元件的电接点部匹配的导电表面，使得能在此第一电接点与第一电气元件间有选择地形成电连；
隔件，包括一平表面和设在此平表面内的插孔以及一使此插孔与隔件一第二表面相连的通道，
第二电接点，包括导电材料的异形体，后者具有使电连接器与第二电气元件电接点部相连接的外表面；
具有尾端的细长导线，它在第一与第二电接点间形成电连，所述连接器体与隔件沿细长导线的长度相分开，细长导线的尾端设在所述隔件的通道内并在插孔中终止于所述平表面的预定范围内，其中所述尾端与导电材料熔接。
14.如权利要求13所述电连接器，特征在于，所述导体材料的异形体部分地伸到插孔之外。
15.如权利要求13所述电连接器，特征在于，所述细长导线包括一约96°的弯曲部，使得第一电接点相对于第二电接点倾斜地设置。
16.如权利要求13所述电连接器，特征在于，所述通道的横剖面大致呈矩形。
17.如权利要求13所述电连接器，特征在于，所述通道的横剖面面积大于细长导线的横剖面面积，使得在此导线的侧面与通道侧壁间形成有间隙。
18.如权利要求13所述电连接器，特征在于，所述导线尾端的邻近部分经钝化处理用以防止焊料流散。
19.用于电路衬底上来实现预定电气功能的电气元件，此电气元件包括：
隔件，它具有用来安装到电路衬底上的平表面以及一插孔，此插孔有设在此平表面内的底部以及一通过隔件与插孔底部邻接设置的通道；
细长导线，用来在此电气元件与电路衬底间提供电流流动，此导线具有在通道内能作横向移动的尾部而此尾部的一端则在此插孔内终止于所述底部上方和所述隔件平表面一预定范围内；以及
导电材料，它熔接于上述尾部的端部，用以有选择地熔接于电路衬底之上面在细长导线和电路衬底之间形成电流通道。
20.如权利要求19所述电气元件，特征在于，所述细长导线包括一批形成线性序列的导体。
21.如权利要地注19所述电气元件，特征在于，所述元件包括插件边缘连接器。
22.电气部件，它包括
绝缘体；
安装于绝缘体上并从其上延伸出的细长导电件，此导电件有侧面和横切此侧面的端面；
导熔接件，它通过在此易熔接件与所述端面间对焊而只固定于端面之上。
23.如权利要求22所述电气部件，特征在于，所述易熔件是焊球，它的横剖面积大于上述端面的横剖面积。
24.如权利要求22所述电气部件，特征在于，所述电气部件包括电连接器。
25.用于将衬底接点形成于电气元件上的方法，其中的电气元件包括一安装面和一细长导线，此导线在上述电气元件与一电路衬底之间形成电流通道，所述方法包括下述步骤：
(a)在此电气元件的安装面上形成插孔；
(b)将细长导线的尾端插入此电气元件的一部分之中，使得此细长导线的尾端占据此插孔的一部分并终止于此安装面一预定范围内；
(c)用一定数量的焊锡膏填充此插孔；
(d)在此焊锡膏内放置导体；
(e)熔融此焊锡膏，使得此导体熔接到细长导线的尾端上，并使此导体与熔融焊锡膏凝聚成为至少是部分地伸到插孔之外的球体。
26.如权利要求25所述的用来将导体形成到电气元件上的方法，特征在于，此方法还包括处理一部分所述尾端，使熔融的焊锡膏不附着到此已处理部分上的步骤。
27.将易熔材料形成到用于电子器件和衬底电路的电连接器中细长导线尾端上的方法，其中的电连接器包括一衬底安装面，而所述细长导线则在电子器件与电路衬底间提供了电流通道，此方法包括下述步骤：
(a)在上述安装面内形成插孔；
(b)将所述导线尾端插入电连接器的安装面一预定范围内，使尾端的一部分暴露于插孔内；
(c)将膏状形式的预定量的易熔材料充填到插孔内及其上面；
(d)加热上述膏状物到至少是第一熔点，使其凝集成球体，而此球体则熔接到所述导线的尾端上。
28.如权利要求27所述的将易熔材料体形成于电连接器中的方法，特征在于，此方法还包括有这样的步骤：处理一部分尾端，使上述膏状物形成的熔接材料将不附着于已处理的部分上，致所述球体至少是部分地处于该插孔之外。
29.如权利要求28所述的将易熔材料形成于电连接器中的方法，特征在于，上述处理步骤至少包括钝化所述尾端部、以疏油-疏水含氟聚合物涂层此尾端部、以及以抗迁移溶液涂层所述插孔这些步骤中之一。
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KR100517098B1 (ko) 2005-10-19
US6454157B2 (en) 2002-09-24
DE69733243D1 (de) 2005-06-16
TW374959B (en) 1999-11-21
EP0843383A2 (en) 1998-05-20
DE69738037D1 (de) 2007-09-27
DE69738037T2 (de) 2008-04-30
JP4018213B2 (ja) 2007-12-05
EP0843383A3 (en) 1998-12-23
DE69738847D1 (de) 2008-08-28
DE69737982D1 (de) 2007-09-13
DE69737982T2 (de) 2008-05-08
EP0843383B1 (en) 2005-05-11
US6139336A (en) 2000-10-31
US6247635B1 (en) 2001-06-19
US20010015373A1 (en) 2001-08-23
CN1160833C (zh) 2004-08-04
SG67440A1 (en) 1999-09-21
DE69733243T2 (de) 2006-01-19
JPH10284192A (ja) 1998-10-23

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