CN1226756A - 有凹进的焊球脚的电连接器 - Google Patents
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- 238000009434 installation Methods 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000013011 mating Effects 0.000 abstract 2
- 238000003466 welding Methods 0.000 description 5
- 230000003321 amplification Effects 0.000 description 4
- 210000003141 lower extremity Anatomy 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
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- 238000007634 remodeling Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Abstract
一种电连接器包括一个有一个配接表面(12)和在该配接表面(12)中的一个凹部(32)的介电壳体(10)。壳体(20)带有一个电接触件(20),它有一个设在凹部(32)内的安装表面(54)。把凹部的壁(33,34,35和36)构形成紧密地包围着装接到该安装表面(54)上的焊球(60)的至少一部分。凹部(32)使于把焊球(60)安装到窄的边缘被模压的接触件的被剪切的边缘上,并减小接触件的整个高度。
Description
本发明涉及有接触件的电连接器,该接触件带有焊球脚,它在该接触件与配接部件之间提供了电连接。
美国专利申请序列号08/949010与本申请有相同的受让人,该申请公开了一种有带焊球前端的接触件的电连接器,这些接触件被设置在一个球格栅阵列接口中,用来与电路板上的导电垫连接。每个接触件由薄片材料模压成形,并有由该薄片材料的主表面形成的一个下表面。每个接触件的下表面在壳体的底部暴露出来,并把焊球装到每个接触件的平的下表面上。形成高度非常低的接触件比如小于0.125英寸的接触件,并把一个焊球以精确的位置装接在每个接触件的平的下表面上,这是困难的制造工序。需要解决的一个问题是如何简化制造有带焊球前端的低型线接触件的电连接器。
这个问题的解决是通过按照本发明的一种电连接器。该连接器包括一个有一个配接表面和在该配接表面中有一个凹部的介电壳体。壳体带有一个电接触件,它有一个设在凹部内的安装表面。把凹部的壁构形成紧密地包围着装接到该安装表面上的焊球的至少一部分。
按照一个方面,接触件由有相对的主表面的薄片材料模压而成,并且,沿着接触件的一个边缘形成安装表面,该边缘在相对的主表面之间穿过薄片材料的厚度伸展。
按照另一方面,安装表面的形状为中凹的弧形。
按照又一方面,接触件包括一个有一个凹进的边缘的基座部分,该凹进的边缘位于壳体中,在配接表面下面,沿着该凹进的边缘形成安装表面,并且,基座部分有一个升高部分,它由凹进的边缘朝向配接表面伸展,从而提供了一个焊料的阻挡。
现在将以示例的方式参考着附图描述本发明,在附图中:
图1为一个代表性的壳体和一个用于按照本发明的电连接器中的接触件,以及容纳于连接器中的一个配接插头的分解等角透视图;
图2为该连接器和配接插头的不同方向的分解等角透视图;
图3为穿过该连接器的放大的剖面图,示出了安装在壳体中的接触件;
图4为壳体的配接表面的放大的局部等角透视图;
图5为配接表面的放大的局部平面视图,示出了安装在壳体内的接触件;以及
图6为穿过连接器的放大的剖面图,示出了装接在该接触件上的一个焊球。
在图1和2中示出了用于按照本发明的电连接器的代表性的介电壳体10和导电接触件20。虽然将关于代表性的壳体10和一个接触件20讨论本发明,但是,应该理解到,通常将在一个连接器壳体中实施本发明,该壳体带有按规则阵列布置的多个接触件。
壳体10有配接表面12、接触件接纳狭缝14和插头接纳腔室16;配接表面适宜面对一块电路板(未画出);接触件接纳狭缝通过配接表面通入壳体;而插头接纳腔室16穿过壳体的相对的表面开通,以便允许一个电子元件的导端18比如一个插头格栅阵列电子插件的一个插头插入该连接器。壳体10也有一个凹部32,它包围着配接表面12上的一部分狭缝14。凹部32与狭缝相交,并比狭缝宽。在下面将更详细地讨论该凹部。
接触件20包括一个导电体,该导电体比如靠把薄片材料剪切或平面模压成所要求的接触件形状制造而成,由薄片材料制作出此导电体。该接触件20有相对的侧表面22、24,它们与薄片材料的相对的主表面对应,并且,该接触件有周边边缘26,此边缘限定接触件的边界,并与穿过薄片材料的厚度相对应。该接触件的宽度等于薄片材料的厚度,而接触件的宽度只稍微比狭缝14在壳体中的宽度小一点。
也参见图3,接触件20有一个基座部42,把它的尺寸做成由于该基座部的波浪形的边缘44与狭缝的端壁相接合而被压配合到狭缝14中。一个接触件臂46由该基座部42伸展出,该接触件臂有一个弹性的端部48,它伸展到腔室16中,用来与被容纳在其中的导端18相接合。
当把该接触件装入壳体中时,接触件的基座部42的下边缘50基本上与壳体的配接表面12共平面。基座部42也有一个凹进的边缘52,它处在壳体中离开配接表面12有一定深度。凹进边缘52的一部分处在凹部32中。此部分提供了一个安装表面54,该安装表面适宜于把一个焊球装接在其上,从而为接触件20提供一个焊球脚。如图所示,安装表面54的形状最好为一个中凹的弧形,其用作焊球的一个凹窝。由于安装表面54以一定深度在凹部32中凹进,焊球部分地在壳体中凹进,从而降低了连接器的整个高度。
如在图4和5中所详细地示出的那样,四个侧壁33、34、35、36和一个底壁38围成凹部32,这些壁一起形成了一个梯形的形状。三个侧壁33,34,35是倾斜的,使得当它们由壳体的配接表面12向底壁38伸展时收缩。侧壁36垂直于配接表面12。底壁38离开配接表面有一个深度,并把此深度选择成至少与安装表面54离开配接表面的深度那样大。这样,安装表面在凹部32中总是暴露的,使得可以把焊球安装到该安装表面上。
把侧壁33,34,35,36构形成当把焊球施加到安装表面54上时引导、对准和控制焊球的位置。当焊球被装在定位表面上时,侧壁紧密地包围着焊球的一部分。在装接焊球之前,安装表面上涂有焊药。在安装前侧壁用来支承焊球,并确保在焊接软熔过程中焊球在相对较窄的安装表面上正确地定位。
图6示出了壳体中的凹部的壁如何支承一个焊球60和使它如何稳定在安装表面54上。可以把凹部的壁的形状如所要求的那样做成控制焊球的位置并控制其软熔特点。
接触件20有许多特点,这可以减小在焊料软熔过程中的焊接灯芯效应。进一步参考图6,接触件的基座部42在凹进的边缘52的一端有一个凹坑56,而一个升高部分58把该凹坑连接到下边缘50上。凹坑56和升高部分58提供了一个焊料阻挡,此阻挡用来控制和限制焊料的迁移。另外,把接触件臂46连接到基座部42的一端上,并且由一个通道43将该接触件与基座部42的其余部分分开。此通道阻止了焊料对于接触件臂46有灯芯效应,也增加了接触件臂的有效长度,从而提高了它的弹性。还有,当把接触件20装到一个携带窄条上时,其上通常涂有锡-铅材料,就在即将把接触件插进壳体之前,沿着下边缘50由该携带窄条上剪切下接触件。下边缘50保持为未被涂布的表面,与被涂布的表面相比,此部分表面不易发生焊料的灯芯效应。
本发明提供了一种使连接到电连接器的一个接触件上的焊球的位置稳定,并对其位置进行控制的装置。本发明使得把焊球设置在相对较窄的边缘模压的接触件的被剪切的边缘上变得较容易。由于焊球的一部分凹进连接器中,本发明提供了较低形状的连接器。
已经描述了本发明,对于那些对本技术熟悉的技术人员来说,多种改型现在将变得明显起来。尽管企图使本发明包括上述的优选实施例以及相当大范围内的等价物,但是,为了确定本发明提出排它的权利要求的范围,应该参考所附的权利要求书而不是上面的对示例的讨论。
Claims (8)
1.一种电连接器,它包括一带有一个配接表面的介电壳体,介电壳体携带着一个电接触件,该电接触件有一个安装表面,其中,安装表面可以装接上一个焊球,该电连接器的特征在于:
安装表面设在安装表面中的一个凹部中,把凹部的壁构形成紧密地包围着焊球的至少一部分。
2.按照权利要求1所述的电连接器,其中,接触件由有相对的主表面的薄片材料模压而成,并且,其特征在于,沿着接触件的一个边缘形成该安装表面,该边缘在相对的主表面之间穿过薄片材料的厚度伸展。
3.按照权利要求2所述的电连接器,其特征在于,安装表面的形状为中凹的弧形。
4.按照权利要求2所述的电连接器,其特征在于,接触件包括一个有一个凹进的边缘的基座部分,该凹进的边缘位于壳体中,在配接表面下面,沿着该凹进的边缘形成安装表面,并且,基座部分有一个升高部分,它由凹进的边缘朝向配接表面伸展,从而提供了一个焊料的阻挡。
5.一种电连接器,它包括一有一个配接表面的介电壳体,介电壳体携带着一个电接触件,该电接触件有一个安装表面,其中,安装表面可以装上一个焊球,该电连接器的特征在于:
介电壳体有穿过配接表面开设的一个狭缝,并在壳体中有一个凹部,该凹部在配接表面上穿过狭缝的一部分伸展;
把电接触件安装在该狭缝中,使得安装表面设在凹部中,并把焊球在凹部中装接到安装表面上,并使焊球由凹部伸出,越过配接表面。
6.按照权利要求5所述的电连接器,其中,接触件由有相对的主表面的薄片材料模压而成,并且,其特征在于,沿着接触件的一个边缘形成安装表面,该边缘在相对的主表面之间穿过薄片材料的厚度伸展。
7.按照权利要求6所述的电连接器,其特征在于,安装表面的形状为中凹的弧形。
8.按照权利要求6所述的电连接器,其特征在于,接触件包括一个有一个凹进的边缘的基座部分,该凹进的边缘位于狭缝中,在配接表面下面,沿着该凹进的边缘形成安装表面,并且,基座部分有一个升高部分,它由凹进的边缘朝向配接表面伸展,从而提供了一个焊料的阻挡。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/024,048 US6116921A (en) | 1998-02-16 | 1998-02-16 | Electrical connector having recessed solderball foot |
US09/024,048 | 1998-02-16 | ||
US09/024048 | 1998-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1226756A true CN1226756A (zh) | 1999-08-25 |
CN1205702C CN1205702C (zh) | 2005-06-08 |
Family
ID=21818601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99102366.8A Expired - Fee Related CN1205702C (zh) | 1998-02-16 | 1999-02-23 | 有凹进的焊球脚的电连接器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6116921A (zh) |
CN (1) | CN1205702C (zh) |
FR (1) | FR2775133B1 (zh) |
GB (1) | GB2334387B (zh) |
TW (1) | TW430204U (zh) |
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TW406454B (en) * | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
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US6371784B1 (en) * | 1999-12-02 | 2002-04-16 | The Whitaker Corporation | Zero insertion force contact for use with a pin grid array |
JP3605564B2 (ja) * | 2000-12-28 | 2004-12-22 | 日本圧着端子製造株式会社 | 接続用端子及びこの端子の回路基板への取付け方法 |
US7115986B2 (en) * | 2001-05-02 | 2006-10-03 | Micron Technology, Inc. | Flexible ball grid array chip scale packages |
SG122743A1 (en) * | 2001-08-21 | 2006-06-29 | Micron Technology Inc | Microelectronic devices and methods of manufacture |
US6488513B1 (en) | 2001-12-13 | 2002-12-03 | Intercon Systems, Inc. | Interposer assembly for soldered electrical connections |
SG104293A1 (en) | 2002-01-09 | 2004-06-21 | Micron Technology Inc | Elimination of rdl using tape base flip chip on flex for die stacking |
SG115459A1 (en) * | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Flip chip packaging using recessed interposer terminals |
SG115456A1 (en) | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Semiconductor die packages with recessed interconnecting structures and methods for assembling the same |
SG121707A1 (en) | 2002-03-04 | 2006-05-26 | Micron Technology Inc | Method and apparatus for flip-chip packaging providing testing capability |
US6975035B2 (en) | 2002-03-04 | 2005-12-13 | Micron Technology, Inc. | Method and apparatus for dielectric filling of flip chip on interposer assembly |
SG115455A1 (en) | 2002-03-04 | 2005-10-28 | Micron Technology Inc | Methods for assembly and packaging of flip chip configured dice with interposer |
SG111935A1 (en) | 2002-03-04 | 2005-06-29 | Micron Technology Inc | Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods |
US20040018773A1 (en) * | 2002-07-29 | 2004-01-29 | Fci Americas Technology, Inc. | Printed circuit board assembly having a BGA connection |
US20040036170A1 (en) | 2002-08-20 | 2004-02-26 | Lee Teck Kheng | Double bumping of flexible substrate for first and second level interconnects |
US6780028B1 (en) * | 2002-12-06 | 2004-08-24 | Autosplice Systems Inc. | Solder reserve transfer device and process |
US7479020B2 (en) * | 2004-11-22 | 2009-01-20 | Visteon Global Technologies, Inc. | Electronic control module having an internal electric ground |
US9142932B2 (en) * | 2010-04-20 | 2015-09-22 | Hon Hai Precision Industry Co., Ltd. | Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder joint |
FR3021814B1 (fr) * | 2014-08-08 | 2018-06-15 | Commissariat Energie Atomique | Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie |
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US4605278A (en) * | 1985-05-24 | 1986-08-12 | North American Specialties Corporation | Solder-bearing leads |
US4767344A (en) * | 1986-08-22 | 1988-08-30 | Burndy Corporation | Solder mounting of electrical contacts |
US5030144A (en) * | 1990-04-13 | 1991-07-09 | North American Specialties Corporation | Solder-bearing lead |
US5199884A (en) * | 1991-12-02 | 1993-04-06 | Amp Incorporated | Blind mating miniature connector |
US5442852A (en) * | 1993-10-26 | 1995-08-22 | Pacific Microelectronics Corporation | Method of fabricating solder ball array |
JP3399959B2 (ja) * | 1993-11-15 | 2003-04-28 | バーグ・テクノロジー・インコーポレーテッド | 高密度電子装置用はんだ付け可能なコネクタ |
US5593322A (en) * | 1995-01-17 | 1997-01-14 | Dell Usa, L.P. | Leadless high density connector |
KR0157284B1 (ko) * | 1995-05-31 | 1999-02-18 | 김광호 | 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지 |
TW267265B (en) * | 1995-06-12 | 1996-01-01 | Connector Systems Tech Nv | Low cross talk and impedance controlled electrical connector |
US5823801A (en) * | 1996-08-05 | 1998-10-20 | The Whitaker Corporation | Electrical connector having thin contacts with surface mount edges |
TW406454B (en) * | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
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1998
- 1998-02-16 US US09/024,048 patent/US6116921A/en not_active Expired - Fee Related
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1999
- 1999-02-01 TW TW088201588U patent/TW430204U/zh not_active IP Right Cessation
- 1999-02-11 GB GB9903118A patent/GB2334387B/en not_active Expired - Fee Related
- 1999-02-15 FR FR9901786A patent/FR2775133B1/fr not_active Expired - Fee Related
- 1999-02-23 CN CN99102366.8A patent/CN1205702C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6116921A (en) | 2000-09-12 |
GB2334387A (en) | 1999-08-18 |
GB9903118D0 (en) | 1999-04-07 |
CN1205702C (zh) | 2005-06-08 |
TW430204U (en) | 2001-04-11 |
FR2775133A1 (fr) | 1999-08-20 |
GB2334387B (en) | 2002-03-20 |
FR2775133B1 (fr) | 2001-06-22 |
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