CN1244183C - 将焊料提供给接插件的焊料保持架 - Google Patents
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Abstract
提供了一种用于形成焊料保持架(17)阵列的阵列及方法,适用于通过自动步进冲压技术加工,并成套应用于电子装置的尾插头(33)的阵列,用于将插头直接地焊接到导体垫(41)或衬板的内部电镀孔(35),或提供如插头(33)与衬板的导线连接。
Description
本申请是1998年5月4日提交的发明名称为“将焊料提供给接插件的焊料保持架”的发明专利申请No.96198096.6的分案申请。
本申请享有申请系列号为60/006,205申请的优先权,申请日为1995年11月3日,申请人为Joseph Cachina,Jack Seidler和JamesR.Zanolli,名称为“将焊料提供给接插件或类似物的焊料保持架”。
技术领域
本发明涉及一种用于连接具有无焊料插头式或其它接头的接插件或其它电子元件与衬板如印刷电路板或其它电子元件的装置和方法。
背景技术
当通过焊接连接多接头元件时,如接插件与衬板,特别是具有内部电镀孔的衬板,尤其特别需要如专利号4,597,625;4,802,862;4,883,435;5,139,448和5,334,059等美国专利所披露的装置。元件具有不带焊料的接头,由于它们所在的位置常常需要特定的方法把焊料提供给接头与衬板上的接触垫、和/或衬板上的电镀孔的衬套。一种把焊料提供给元件接头和接触垫的方法是在特定的焊接区域内和周围使用焊药,如在孔的周围。然而,这种方法通常不能提供足够容量的连接元件接头和接触垫的焊料。
这样的接插件常常具有镀金的插头,交界面必须是金对金,须在衬板上镀金。因此,接插件不能波动焊接,并且通常是手工焊接或者在每一个尾插头上具有环形焊料和回流的热空气。对于具有大量接头的接插件,这种装配方法价格昂贵。
发明内容
本发明提供了一种简单廉价的适用于这种条件下提供焊料的方法,并容易自动化,不需要单独的将焊剂提供给元件接头、电镀孔或衬板接触垫。
按照本发明所提供的焊料保持架阵列,可以容易地手工或自动应用于接插件或其它元件接头阵列,很容易地连接接头与接触垫和衬板或类似装置的电镀内孔。
具体地说,根据本发明提供了一种用于连接一个第一电子装置的尾插头与一个第二电子装置的焊料保持架,所述焊料保持架包括:一个主体,所述主体具有一个在其中形成的开口,所述开口用于接收所述尾插头,并且将尺寸设计为与所述第二电子装置的一个开口对齐,以允许所述尾插头通过,所述主体具有一个邻近所述开口的焊料保持结构,其中所述主体具有一个U形结构,所述U形结构具有一对侧部和一个连接所述侧部的背部,每个所述侧部具有一对间隔的接头片;和一块位于每对侧部的所述成对接头片之间的焊料块。
本发明的最后一个方面涉及一种用于连接一个第一电子装置的尾插头的阵列与一个第二电子装置的焊料保持架阵列,所述焊料保持架的阵列包括:一个细长的材料带,所述带的一个纵向延伸的部分形成一个承载带,所述许多保持架与所述承载带形成一体并且从所述承载带横向延伸,所述保持架对应于所述尾插头的阵列间隔开,每个所述保持架具有一个主体,所述主体包括一个开口,所述开口用于接收所述尾插头,并且将尺寸设计为与所述第二电子装置的一个开口对齐,以允许所述尾插头通过,所述主体具有一个邻近所述开口的焊料保持结构,其中所述主体具有一个U形结构,所述U形结构具有一对侧部和一个连接所述侧部的背部,每个所述侧部具有一对间隔的接头片;和一块位于每对侧部的所述成对接头片之间的焊料块,用于在每个所述尾插头上摩擦地接合和保持每个所述保持架。
附图说明
下面通过对附图和最佳实施例的说明,本发明将更加清楚。
图1是用于加工本发明的一个实施例的毛坯在其长度方向上的局部平面图;
图2是根据本发明并使用图1毛坯的最终产品在其长度方向上的局部平面图;
图3是图2沿3-3线的剖视图;
图4是本发明的一个将带有插头的接插件与衬板连接的实施例在其长度方向上的局部平面图;
图5是图4的实施例沿5-5线的放大剖视图;
图6是在去除输送带板并且焊料回流后,与图5类似的本发明的一个实施例的剖视图;
图7是与图5类似具有处于不同位置的焊料保持架的本发明的另一个实施例的剖视图;
图8是用于加工本发明的改进形式的毛坯在其长度方向上的局部平面图;
图9是使用图8的毛坯的焊料保持架阵列在其长度方向上的局部平面图;
图10是图9沿10-10线的剖视图;
图11是图9的连接接插件与衬板的保持架在其长度方向上的局部平面图;
图12是图11沿12-12线的放大剖视图;
图13是图12的改进以适应与第二衬板连接的装置在其长度方向上的局部平面图;
图14是图13装置的侧视图;
图15是本发明的另一个实施例的平面图;
图16是图15的实施例沿16-16线的剖视图;
图17是图16沿17-17线的俯视图;
图18是图15的装置装配在一对接插件上的示意图;
图19是用于在衬板表面装配一个接插件的另一个实施例的示意图;
图20是本发明另一个实施例的平面图;
图21是图20的装置的部分透视图;
图22是图20的位于接插件和电路板之间的装置在焊料回流前的示意图;
图23是在焊料回流后,图22的装置的示意图;
图24是本发明另一个实施例的前视图。
具体实施方式
图1至图6表示本发明的一个实施例。如图1所示,一个导体材料的如铜或铜铍合金的长平带板11,冲压成图示形状的半成品毛坯。最好是步进冲压(progressive stamping)加工出大量轧制的支架毛坯17阵列,用于按照本发明的一种形式的保持架。另外,由于焊料部分与支架的连接提供了必要的导电系数,使接头与衬板或其它元件电连接,带板11不需导体材料制成。带板11制有纵向延伸的输送带板15,输送带板15沿其长度方向隔开的常用的分度或定位孔13,通过步进冲压机带动带板以连续步进的方式移动。输送带板15与各支架17是一体,相互独立的支架17从输送带板15横向按规则间距伸出,并相应于电子接插件上的接头或插头的间距彼此隔开,支架17的使用方式在下面说明。支架17可以是0.05或0.100英寸间距的间隔。
在每个支架上的一对彼此隔开的夹指19与输送带板15制成一体,通过连接段21与输送带板15相连,连接段21上制有凹槽23,以允许输送带板15容易折断或从支架17的序列分离开。当使用支架17时,夹指19的间隔距离为d,以配合电路元件31(如图4至6所示)的插头或接头的宽度。
如图2和3所示,一个焊料块25,最好以分段焊丝的形式横跨一对夹指19,夹指19然后部分地围绕焊料块25,充分地保持焊料在该位置上。这在步进冲压过程中很容易加工,如图2和3所示,通过敷设焊丝25(最好包含焊料)横跨一些支架17,绕焊丝25卷曲夹指19,剪断在支架17之间的焊料,留下由一对夹指19保持的焊料块25,使其适于焊接所需的体积。
在使用中,如图4和5所示,接插件或其它电路元件31具有多个对准的接头或插头33,通过相应的衬板37上的彼此隔开的内部电镀孔35。如图5的衬板37在垂直方向,很清楚也可以是在水平或其它合适的方向。一组支架17的带板部分如图2所示,相应于一些与衬板37焊接的元件接头,具有一些支架,置于接插件接头33的阵列上,如图4所示。例如,如果元件31具有21个对准的接头,图4的支架阵列的断面上具有21个支架用于夹在元件接头33上,如图所示,并从剩余的支架分离。所选择的每个分离支架的夹指19的间隙,便于在随后的运转期间,在每个支架17和与之相应的接插件接头33之间摩擦接合,使支架的带板保持在图4和图5所示的位置上。很清楚,尽管图4和5所示的仅仅是一行,元件31具有两行或多行接头,可以提供具有图4的支架带板的元件31的每行接头。
然后,向焊料供应热量,如通过热空气或其它惯用的方法,引起焊料回流并通过毛细管作用流至接头33和电镀衬板孔35侧面之间间隙。孔35具有金属表面,如通过在其内部电镀,如39所表示的。电镀层可以环形延伸至衬板37的表面形成接触垫,如41所表示的。正常地,小间隙43留在接头33和衬板孔35的电镀层39之间,融化的焊料被吸入其中。在正常操作中,可以不考虑所形成的间隙,由于正常轻度的元件接头或孔35内的电镀层39的形式上的不规则将允许融化的焊料流入其间,以使接头33与电镀层39结合,如图6所示。在焊接完成以后,输送带板15从各自的支架17在切断凹槽23处折断,留下支架17在其位置上,但是焊接在元件接头与孔的电镀层和接触垫片41上。如果需要,输送带板可在焊接完成之前折断,尽管这不是最好的方法。
图7示出了另外一种使用图2和图3的支架的方法。在这个例子中,接插件或其它元件31a如图示具有两行尾插头33取代了图5所示的一行尾插头。在这个例子中,支架17在元件插头33插入衬板37前,位于元件插头33上,并位于元件31a和衬板37之间。如图5和图6所示的情况,通过焊接连接插头33与衬板的电镀层39时,需要提供热量。
图8至图12示出了本发明的改进形式。如图8所示,毛坯具有与图1类似的带分度孔113的输送带板115。从输送带板115横向伸出的是独立的焊接保持架117。如图8所示,每个支架毛坯117与输送带板115通过一个具有折断凹槽123的连接段121连接。独立的支架毛坯117包括具有狭长切口149的主体部分147,狭长切口149延伸至主体部分147的边缘,其一端与主体部分制成一体形成夹指119。如图9所示,在支架阵列沿步进冲压装置移动时,焊丝151(最好包括焊药)铺设在部分支架117阵列的连续的主体部分147上。如图9至图11所示,夹指119绕焊丝151弯曲并使焊丝151保持在主体部分147上。在使用并通过夹指119保持住焊丝151后,孔145制成如图9所示,打穿支架主体147。同时,焊丝151被分成两部分,跨越每一个孔145,在相邻支架主体147之间的焊丝151上存在间隙153,如图9和图11所示。以此方式,每一个主体部分147带有两个焊料块125,跨越孔145。孔145具有与元件接头133摩擦接合的尺寸,使焊料块定位于相应的元件接头133的侧面,这样支架主体阵列被保持在了元件接头133上,如图11所示。焊料块125的保留由每个支架主体147保持住,其尺寸作成能提供用于连接每个支架117与相应的元件接头133的足够的焊料。
如图11和图12所示,这种焊料保持架可以以图6或图7或图12所示的形式使用。
进一步,支架117可以用于连接元件31或元件131与任一所希望的衬板或其它元件,无论衬板137是否被使用。如图13和图14所示,支架117可以具有可以用作其它装置的接头或导线的延伸段161。例如,每一延伸段161的一端可以制成用于图13和图14所示的衬板的边缘支架形状163,以允许与元件131平行或对齐的改进衬板(未示出)与元件131插头的连接。通过使延伸段161弯曲90°,改进衬板可以与衬板137垂直。代替边缘支架163,每个延伸段161的一端可以制成用于表面安装在衬板接触垫上或具有其它所希望的形状。
图15和图18示出了本发明的进一步改进。在该例子中,每一个焊料保持架219制有通过背面203连接的一对侧臂201。每一侧臂201具有一对夹指或接头片205部分围绕焊料块225延伸,在焊料块225和背面203之间的间隙207,用于接收接插件211的尾插头209。另外,最好臂201之间的间隙具有与插头209摩擦接合的尺寸。如图18所示,插头209穿过具有内部电镀孔和/或导体垫的衬板213,插头209将被焊接在内部电镀孔和/或导体垫上。
本发明的这种形式也适用于多级步进冲压。在加工中,一个细长的导体材料带板被冲压如图15所示,成为具有一系列横向伸出的支架219的输送带板215。支架主体弯成如图17所示的U形,形成每个支架侧臂201,每个支架侧臂201具有一对夹指或接头片205。焊丝225的直径与一对夹指205之间的间距一致并敷设在一对夹指205之间,夹指围绕焊225部分弯曲并使焊225定位。而后,切断支架219之间的焊丝225,保留适当数量的用于支架特定用途的焊料。连接部分221用于支架219与输送带板215的连接,并具有偏离的弯曲,如图17和图18所示,以便于当装配一行接头209时,避免尾插头209a、209b和输送带板215之间的干涉。
支架209之间的间隙与接插件211的插头209a和209b之间的间隙有关,以便于在使用中,图15所示的部分带板所具有支架219的数量等于一行接插件211的插头209的数量,并插在插头209上,如图15虚线所示和图18所示。图18示出双行类型的接插件211,具有尾插头209a和209b等间隔位于与页面垂直的方向上。很清楚,本发明可以用于尾插头从一行增加至多行。通过图示说明,接插件211可以是J1或J2类型,并且衬板213可以是PC104板。接头209可以是0.100英寸间距的彼此间隔,并且插头可以是0.480英寸长度为0.025英寸的长方形断面。
在回流时,焊料将围绕插头209流动并通过毛细管作用进入衬板213的内部电镀孔。在焊接完成后,支架通过其上的凹槽223使其连接段脱离或切断。
本发明的焊接保持架不仅仅用于将接插件或其它具有非焊接支承接头的元件焊接到衬板的电镀通孔上,也可以用于把一些具有所需接头形状的导线焊接在插头或其它电子元件的接头上。图19所示的带有导线221的导线支架219相对尾插头209向外弯曲90°,并且在焊料保持装置250内中断以允许安装在衬板(未示出)上的接插件221表面上。焊料保持装置可以具有多种相适应的结构,如美国专利NO4,679,889所示。
现在参照图20,其中示出了本发明的与图1至6所示相似的另一个实施例。然而,如图20所示,所提供的支架317带有两对夹指319,一对夹指位于与输送带板15相邻的支架317一侧,另一对夹指位于支架317的相对侧,支架317具有常见的双I字形,可通过步进冲压操作制成。两个焊料部分321横跨一对夹指319上。两个焊料部分321可按与焊丝25大致相同的形式制成(图2)。
每对夹指319围绕相应的焊料部分321弯曲,牢固保持住焊料部分321(图21)。如图20所示,焊料部分321部分伸进支架317的中间孔。现在参照图22,其中接插件或其它电路元件31具有多个插头33,每个插头33穿过相应的支架317的中间孔。由于焊料部分321部分伸进中间孔,与插入的插头33摩擦接合。在支架317定位于接插件31后,插头33接着插入衬板37的相应的孔35。这时供应热量,引起焊料部分321回流并被吸入接头33和孔35的侧面之间的间隙(图23)。尽管图20至图23所示的支架317定位于接插件31和衬板37之间,支架317也可以在衬板37与支架317连接后定位,与图5相似。
现在参照图24,其中示出了用于焊接接插件31上的一对插头33与位于衬板37相对两侧的一对接触垫350的一对支架219。事实上,该对支架219提供一个在接插件插头33和衬板37之间的“跨式安装”。如图24所示,支架219的焊料部分225彼此面对。接插件插头33插入相对的支架219,衬板位于支架219之间,以便于通过相对的焊料部分225摩擦接合。这时供应热量,如上所述,会引起焊料回流。支架219以一对阵列的形式焊接边缘接插件与两行接触垫,其中每行定位于衬板37上的相对两侧。
很清楚,焊接元件25、125、151和321可以装有常用的焊药,使正常的焊接操作更容易。
在使用接插件接头,详细说明本发明的焊接保持架时,很清楚,这些支架可以用于集成电路芯片的连接,芯片保持架,电阻,电容和其它非焊接支撑电子元件与印刷电路板或其它衬板的接触垫或电镀孔的连接。
上面的实施例仅仅作为例子说明,本发明通过下面的权利要求限定。
Claims (4)
1.一种用于连接一个第一电子装置的尾插头与一个第二电子装置的焊料保持架,所述焊料保持架包括:
一个主体,所述主体具有一个在其中形成的开口,所述开口用于接收所述尾插头,并且将尺寸设计为与所述第二电子装置的一个开口对齐,以允许所述尾插头通过,所述主体具有一个邻近所述开口的焊料保持结构,其中所述主体具有一个U形结构,所述U形结构具有一对侧部和一个连接所述侧部的背部,每个所述侧部具有一对间隔的接头片;和
一块位于每对侧部的所述成对接头片之间的焊料块。
2.按照权利要求1所述的焊料保持架,其特征在于,所述焊料与所述保持架背部间隔开,以与所述保持架侧部一起在两者之间形成所述接收尾插头的开口。
3.按照权利要求1所述的焊料保持架,其特征在于,一个侧部平行于另一个侧部。
4.一种用于连接一个第一电子装置的尾插头的阵列与一个第二电子装置的焊料保持架阵列,所述焊料保持架的阵列包括:
一个细长的材料带,所述带的一个纵向延伸的部分形成一个承载带,
所述许多保持架与所述承载带形成一体并且从所述承载带横向延伸,
所述保持架对应于所述尾插头的阵列间隔开,
每个所述保持架具有一个主体,所述主体包括一个开口,所述开口用于接收所述尾插头,并且将尺寸设计为与所述第二电子装置的一个开口对齐,以允许所述尾插头通过,所述主体具有一个邻近所述开口的焊料保持结构,其中所述主体具有一个U形结构,所述U形结构具有一对侧部和一个连接所述侧部的背部,每个所述侧部具有一对间隔的接头片;和
一块位于每对侧部的所述成对接头片之间的焊料块,用于在每个所述尾插头上摩擦地接合和保持每个所述保持架。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US620595P | 1995-11-03 | 1995-11-03 | |
US60/006,205 | 1995-11-03 | ||
US08/726,960 US5875546A (en) | 1995-11-03 | 1996-10-07 | Method of forming solder-holding clips for applying solder to connectors |
US726,960 | 1996-10-07 |
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CN96198096A Division CN1096123C (zh) | 1995-11-03 | 1996-11-01 | 将焊料提供给接插件的焊料保持架 |
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CN1438734A CN1438734A (zh) | 2003-08-27 |
CN1244183C true CN1244183C (zh) | 2006-03-01 |
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CNB021045755A Expired - Fee Related CN1244183C (zh) | 1995-11-03 | 1996-11-01 | 将焊料提供给接插件的焊料保持架 |
CN96198096A Expired - Fee Related CN1096123C (zh) | 1995-11-03 | 1996-11-01 | 将焊料提供给接插件的焊料保持架 |
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Application Number | Title | Priority Date | Filing Date |
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CN96198096A Expired - Fee Related CN1096123C (zh) | 1995-11-03 | 1996-11-01 | 将焊料提供给接插件的焊料保持架 |
Country Status (6)
Country | Link |
---|---|
US (4) | US5875546A (zh) |
EP (1) | EP0860033B1 (zh) |
CN (2) | CN1244183C (zh) |
AU (1) | AU7553696A (zh) |
DE (1) | DE69626536T2 (zh) |
WO (1) | WO1997016870A1 (zh) |
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- 1996-11-01 WO PCT/US1996/017704 patent/WO1997016870A1/en active IP Right Grant
- 1996-11-01 EP EP96937899A patent/EP0860033B1/en not_active Expired - Lifetime
- 1996-11-01 AU AU75536/96A patent/AU7553696A/en not_active Abandoned
- 1996-11-01 DE DE69626536T patent/DE69626536T2/de not_active Expired - Lifetime
- 1996-11-01 CN CN96198096A patent/CN1096123C/zh not_active Expired - Fee Related
-
1997
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-
2002
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Also Published As
Publication number | Publication date |
---|---|
CN1438734A (zh) | 2003-08-27 |
US6402574B2 (en) | 2002-06-11 |
CN1096123C (zh) | 2002-12-11 |
EP0860033A4 (en) | 2000-01-26 |
AU7553696A (en) | 1997-05-22 |
US6494754B2 (en) | 2002-12-17 |
US6099365A (en) | 2000-08-08 |
WO1997016870A1 (en) | 1997-05-09 |
EP0860033B1 (en) | 2003-03-05 |
US20020058446A1 (en) | 2002-05-16 |
US5875546A (en) | 1999-03-02 |
CN1201556A (zh) | 1998-12-09 |
DE69626536T2 (de) | 2003-11-06 |
US20010041481A1 (en) | 2001-11-15 |
DE69626536D1 (de) | 2003-04-10 |
EP0860033A1 (en) | 1998-08-26 |
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