CN1292635A - 布线电路衬底及其制造方法 - Google Patents
布线电路衬底及其制造方法 Download PDFInfo
- Publication number
- CN1292635A CN1292635A CN001296817A CN00129681A CN1292635A CN 1292635 A CN1292635 A CN 1292635A CN 001296817 A CN001296817 A CN 001296817A CN 00129681 A CN00129681 A CN 00129681A CN 1292635 A CN1292635 A CN 1292635A
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- protuberance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L21/4857—Multilayer substrates
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H05K3/3457—Solder materials or compositions; Methods of application thereof
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
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- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
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- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49137—Different components
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- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Geometry (AREA)
- Metallurgy (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (116)
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP289277/99 | 1999-10-12 | ||
JP28927799A JP2001111189A (ja) | 1999-10-12 | 1999-10-12 | 配線回路基板とその製造方法 |
JP289277/1999 | 1999-10-12 | ||
JP374462/1999 | 1999-12-28 | ||
JP374462/99 | 1999-12-28 | ||
JP37446299A JP3981227B2 (ja) | 1999-12-28 | 1999-12-28 | 多層配線基板とその製造方法 |
JP142658/2000 | 2000-05-16 | ||
JP142658/00 | 2000-05-16 | ||
JP2000142658A JP2001326459A (ja) | 2000-05-16 | 2000-05-16 | 配線回路基板とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1292635A true CN1292635A (zh) | 2001-04-25 |
CN100377625C CN100377625C (zh) | 2008-03-26 |
Family
ID=27337500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001296817A Expired - Fee Related CN100377625C (zh) | 1999-10-12 | 2000-10-12 | 布线电路衬底及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (6) | US6528874B1 (zh) |
EP (4) | EP2278865B1 (zh) |
KR (1) | KR100495957B1 (zh) |
CN (1) | CN100377625C (zh) |
TW (1) | TW512467B (zh) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1312966C (zh) * | 2003-02-06 | 2007-04-25 | Lg电子株式会社 | 用于互连多层印刷电路板的方法 |
US7315083B2 (en) | 2004-05-31 | 2008-01-01 | Sanyo Electric Co., Ltd. | Circuit device and manufacturing method thereof |
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TW512467B (en) * | 1999-10-12 | 2002-12-01 | North Kk | Wiring circuit substrate and manufacturing method therefor |
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- 2000-10-11 EP EP10011152.5A patent/EP2278865B1/en not_active Expired - Lifetime
- 2000-10-11 EP EP00121369A patent/EP1093329A3/en not_active Withdrawn
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US10396114B2 (en) | 2013-03-14 | 2019-08-27 | Invensas Corporation | Method of fabricating low CTE interposer without TSV structure |
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US9646917B2 (en) | 2014-05-29 | 2017-05-09 | Invensas Corporation | Low CTE component with wire bond interconnects |
US10032647B2 (en) | 2014-05-29 | 2018-07-24 | Invensas Corporation | Low CTE component with wire bond interconnects |
US10475726B2 (en) | 2014-05-29 | 2019-11-12 | Invensas Corporation | Low CTE component with wire bond interconnects |
CN106373920A (zh) * | 2015-07-24 | 2017-02-01 | 台湾积体电路制造股份有限公司 | 形成导电特征的方法 |
US10181447B2 (en) | 2017-04-21 | 2019-01-15 | Invensas Corporation | 3D-interconnect |
US11031362B2 (en) | 2017-04-21 | 2021-06-08 | Invensas Corporation | 3D-interconnect |
US11929337B2 (en) | 2017-04-21 | 2024-03-12 | Invensas Llc | 3D-interconnect |
CN110891366A (zh) * | 2018-09-10 | 2020-03-17 | 奥特斯奥地利科技与系统技术有限公司 | 具有感光性介电层和结构化导电层的部件承载件 |
CN110891366B (zh) * | 2018-09-10 | 2023-02-17 | 奥特斯奥地利科技与系统技术有限公司 | 具有感光性介电层和结构化导电层的部件承载件 |
Also Published As
Publication number | Publication date |
---|---|
US20030143833A1 (en) | 2003-07-31 |
US20070209199A1 (en) | 2007-09-13 |
KR100495957B1 (ko) | 2005-06-17 |
US7721422B2 (en) | 2010-05-25 |
EP2278865A1 (en) | 2011-01-26 |
EP2278865B1 (en) | 2016-05-11 |
US7096578B2 (en) | 2006-08-29 |
EP1093329A3 (en) | 2006-01-18 |
US20060258139A1 (en) | 2006-11-16 |
EP2288244B1 (en) | 2013-06-26 |
US7546681B2 (en) | 2009-06-16 |
US20030151067A1 (en) | 2003-08-14 |
EP2288244A1 (en) | 2011-02-23 |
US20040197962A1 (en) | 2004-10-07 |
US6528874B1 (en) | 2003-03-04 |
CN100377625C (zh) | 2008-03-26 |
US6646337B2 (en) | 2003-11-11 |
EP1093329A2 (en) | 2001-04-18 |
EP2306797B1 (en) | 2017-04-05 |
EP2306797A1 (en) | 2011-04-06 |
US6828221B2 (en) | 2004-12-07 |
KR20010050954A (ko) | 2001-06-25 |
TW512467B (en) | 2002-12-01 |
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