CN1296794C - 包含具有电压衰减补偿的电压调节器的功率传递系统 - Google Patents

包含具有电压衰减补偿的电压调节器的功率传递系统 Download PDF

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CN1296794C
CN1296794C CNB038038129A CN03803812A CN1296794C CN 1296794 C CN1296794 C CN 1296794C CN B038038129 A CNB038038129 A CN B038038129A CN 03803812 A CN03803812 A CN 03803812A CN 1296794 C CN1296794 C CN 1296794C
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socket
voltage
power
cpu
decoupling capacitor
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CN1633635A (zh
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L·黄
P·库马
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Intel Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262Arrangements for regulating voltages or for using plural voltages
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10325Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10704Pin grid array [PGA]

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dc-Dc Converters (AREA)
  • Continuous-Control Power Sources That Use Transistors (AREA)
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Abstract

一种电源功率传递器件统包括与电子元件相耦联且向电子元件传递电源功率的插座。电压控制传感器与插座相耦联,以检测在插座上的输出电压并提供负反馈控制。插座和相关主板的包括在负反馈控制中,并且可以帮助补偿输出电压的电压衰减。

Description

包含具有电压衰减补偿的电压调节器的功率传递系统
技术领域
本发明涉及一种具有电压衰减补偿的电压调节器。
背景技术
在主板上的电压调节器可以向中央处理单元(CPU)提供电源功率。为了驱动当今强大的CPU,就需要更多的功率和电流。然而,随着传递给CPU的功率增加,静态和瞬时电压衰减就成为越来越严重的问题。电压衰减是指电压响应CPU负载的下降。瞬时电压衰减可以在向CPU提供电源功率或者在变化负载时以电压起始下降方式发生的。静态电压衰减表示随时间时恒定的电压衰减。
发明内容
本发明提供一种装置,该装置包括:具有阻抗的插座,该插座与电子元件相耦联,并将电源功率传递至电子元件;电压控制传感器,与插座相耦联,以检测在插座上的输出电压并且提供负反馈控制,从而将插座的阻抗包括在负反馈控制中。
本发明还提供一种电源功率传递器件,该器件包括:接受CPU的插座;以及,电压调节器,通过所述插座向所述CPU提供可调节的电压,所述电压调节器包括:电压控制传感器,与所述插座相耦联,以检测在所述插座上的输出电压并且提供负反馈控制;以及,第一去耦电容器,耦联在所述插座和所述CPU之间的结点上。
本发明又提供一种调节电源功率的方法,所述方法包括:通过插座向电子元件传递电源功率;检测在所述插座上的输出电压;以及,根据所检测到的电压和所述插座的阻抗来提供负反馈控制。
附图说明
图1显示了根据本发明一个实施例的一种功率传递系统。
图2显示了根据本发明一个实施例的一种功率传递系统的方框图。
图3是一模拟的电压性能图形。
图4是一使用不同的去耦电容器的模拟电压性能图形。
具体实施方式
图1显示了由电压调节器12向CPU 14提供电源功率的功率传递系统10。CPU14可由电路片(die)16和封装18组成。CPU 14是通过插针19(interposer)锚接在主板22上的插座20上。从插座20延伸的引脚24与主板22相连,以进行电气连接。电压调节器12的元件,例如,场效应晶体管,控制器,和诸如滤波电容器和电感器之类的无源元件,可以分布在主板22和插座20上。
图2显示了电压调节器12的各种元件是如何相连接的。CPU 14与插座20相耦联。负反馈控制环路26与插座20的一端相耦联,以检测在插座和CPU 14接口上的电压调节器12的输出电压。控制环路26的另一端耦联着电源功率开关28,该开关可以包括金属氧化物场效应晶体管(MOSFET)。可以在负反馈控制下通过开关28的接通和断开来调节输出电压。Z1和Z2包括电感器和去耦电容器,以提供一种适用于电压调节器12的直流/直流变换器的低通滤波器。在图1中,所显示的去耦电容器Z2安装在插针19上,但它也可以设置在封装18上。
功率传递系统10有助于在CPU 14需要功率时可以减小静态和瞬时电压衰减。通过负电压反馈环路26检测在插座20和CPU 14接口上的电压调节器12的输出电压,系统10能够补偿插座引脚24的阻抗,该阻抗会加剧电压衰减。也就是说,插座20的引脚24的阻抗包括在采用适当调节诸如Z1和/或Z2的功率传递系统10的设计中。
图3示出电压衰减的例子,它说明补偿插座引脚24阻抗的功率传递系统10的电压性能模拟(模拟A)和没有补偿插座引脚24阻抗的常规功率传递系统的电压性能模拟的图形(模拟B)的图形。对于两个模拟来说,电压调节器的开关频率设置为1MHz,电流设置为50安培等级,以及在所使用的插针19上的去耦电容器Z2的数值为24×100微法(μF)。
正如图3所示,模拟A显示了瞬时电压衰减在78μs附近为大约46mV。相反,常规系统的模拟B显示了瞬时电压衰减在78μs附近为大约100mV。于是,系统10能够在CPU 14需要功率的任何场合下明显地减小电压的衰减。
图4显示了采用设置为900μF数值的去耦电容器Z2的功率传递系统的电压性能模拟图形(模拟C)和采用设置为2400μF数值的相对应去耦电容器的常规功率传递系统的电压性能模拟图形(模拟D)。常规系统中相对应的去耦电容器设置在主板上,而不能设置在插座20或封装18上。在两项模拟中,CPU负载保持相同。图形表示采用较小去耦电容器的系统10仍旧存在着比常规系统更小的电压衰减问题。使用较小去耦电容器的一个优点是系统10的成本是可控制的,因为在功率传递系统中所使用的多层陶瓷电容器(MLCC)的成本价格会随着电容数值的增加而增加。
也有可能把去耦电容器设置在插座20或者在封装18上,因为随着电源功率技术趋向于更高电压调节器的开关频率,所需的去耦电容数值会明显地减小,例如,在25KHz为5000μF,而在3MHz则减小为800μF。更低电容数值的去耦电容器可以更容易和廉价地设置在CPU附近。此外,所设置的去耦电容器越接近于CPU就使得互连的电感越小,因此,电压衰减也就越小。
系统10可以减轻电压衰减问题,而没有根本改变在CPU 14和主板22之间的接口。通过合并插座阻抗作为电压调节器输出滤波器的一部分以及检测在CPU 14和插座20接口上的电压调节器输出电压12,可以克服电压衰减的问题。这一技术还可以通过连接器延伸至任何功率传递器件,以改善其性能。
其它实施方法都在本权利要求的范围内。

Claims (17)

1.一种装置包括:
具有阻抗的插座,该插座与电子元件相耦联,并将电源功率传递至电子元件;
电压控制传感器,与插座相耦联,以检测在插座上的输出电压并且提供负反馈控制,从而将插座的阻抗包括在负反馈控制中。
2.根据权利要求1所述装置,其特征在于,还包括一个去耦电容器,它的一端耦联在所述插座和所述电子元件之间的结点上。
3.根据权利要求2所述装置,其特征在于,所述去耦电容器包括设置在插座上的电容器。
4.根据权利要求1所述装置,其特征在于,所述插座包括引脚,并且所述电压控制传感器与所述插座的一个和多个引脚相耦联。
5.根据权利要求1所述装置,其特征在于,所述插座与CPU相耦联,以向所述CPU传递电源功率。
6.根据权利要求1所述装置,其特征在于,所述插座是CPU插座。
7.根据权利要求1所述装置,其特征在于,还包括主板,在所述主板上设置所述插座和所述电压控制传感器。
8.根据权利要求1所述装置,其特征在于,还包括开关,在远离所述插座一端与所述电压控制传感器相耦联,并通过另一个去耦电容器与所述插座相耦联。
9.一种电源功率传递器件,其特征在于,包括:
接受CPU的插座;以及,
电压调节器,通过所述插座向所述CPU提供可调节的电压,所述电压调节器包括:
电压控制传感器,与所述插座相耦联,以检测在所述插座上的输出电压并且提供负反馈控制;以及,
第一去耦电容器,耦联在所述插座和所述CPU之间的结点上。
10.根据权利要求9所述电源功率传递器件,其特征在于,所述第一去耦电容器包括设置在所述插座上的电容器。
11.根据权利要求9所述电源功率传递器件,其特征在于,所述插座包括引脚,并且所述电压控制传感器与所述插座的一个和多个引脚相耦联。
12.根据权利要求9所述电源功率传递器件,其特征在于,还包括主板,在所述主板上设置所述插座和所述电压控制传感器。
13.根据权利要求9所述电源功率传递器件,其特征在于,所述电压调节器包括开关,该开关在远离所述插座一端与所述电压控制传感器相耦联,以及通过第二去耦电容器与所述插座相耦联。
14.根据权利要求13所述电源功率传递器件,其特征在于,所述第一去耦电容器,所述第二去耦电容器和所述插座的引脚形成了低通滤波器。
15.一种调节电源功率的方法,其特征在于,所述方法包括:
通过插座向电子元件传递电源功率;
检测在所述插座上的输出电压;以及,
根据所检测到的电压和所述插座的阻抗来提供负反馈控制。
16.根据权利要求15所述方法,其特征在于,还包括:
提供耦联在所述插座和所述电子元件之间的结点上的电容器,以调节所述插座的阻抗。
17.根据权利要求15所述方法,其特征在于,还包括:
接通和断开电压,以把电压调节作为通过所述插座输出到所述电子元件的电源功率的输出。
CNB038038129A 2002-01-08 2003-01-07 包含具有电压衰减补偿的电压调节器的功率传递系统 Expired - Fee Related CN1296794C (zh)

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US10/042,773 US6611435B2 (en) 2002-01-08 2002-01-08 voltage regulator with voltage droop compensation

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US6611435B2 (en) 2003-08-26
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AU2003205067A1 (en) 2003-07-24
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