CN1297266A - 具有应力释放的电连接器 - Google Patents

具有应力释放的电连接器 Download PDF

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CN1297266A
CN1297266A CN00134880A CN00134880A CN1297266A CN 1297266 A CN1297266 A CN 1297266A CN 00134880 A CN00134880 A CN 00134880A CN 00134880 A CN00134880 A CN 00134880A CN 1297266 A CN1297266 A CN 1297266A
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connector
substrate
electric connector
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玛林·E·哈恩
约瑟夫·B·叔艾
斯坦利·A·克利恩
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Connector Systems Technology NV
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Abstract

一种可固定到基板的电连接器。该电连接器包括壳,以及两者都固定到壳的表面固定触点和夹具。夹具可以是表面固定夹具。球格阵列连接器包括壳,多个固定到壳的触点,多个固定到触点用于将连接器固定到触点的可熔元件,以及固定到壳的夹具。夹具可以是表面固定夹具。一种将电连接器固定到基板的方法。该方法包括提供基板和具有触点和夹具的电连接器,并将触点和夹具固定到基板。触点可被固定到基板表面。

Description

具有应力释放的电连接器
本发明涉及电连接器。特别地，本发明涉及具有应力释放特征的电连接器。
各种类型的电连接器依赖表面固定技术(SMT)将连接器触点固定到基层基板。SMT连接器比早期的连接器具有更多优点，如简化制造和降低成本。
虽然提供了这些优点，但使用SMT也会引起其它问题。例如，一个担忧涉及触点与基层基板之间的焊接点吸收例如由装运、操作、装配以及热循环引起的力的能力。这些环节中的任何一个损坏将使焊接点变得不稳定，对整个连接器产生不利影响。
球格阵列(BGA)技术是SMT的一种。概括地说，利用BGA的电连接器有一个带触点的壳。可熔元件，典型的是焊接球，固定到每个触点。焊接球作为触点与基板表面之间的基本连接。逆流过程将焊接球熔化到基板。在逆流过程期间，发生BGA技术有益的“自对中”特征。特别地，作为焊接逆流，焊接表面张力有助于将连接器适当地与基层基板上的导电垫对齐。
对于SMT连接器，BGA连接器中的焊接点上力也提出了一个担忧。由于BGA连接器的自对中能力，但是，许多使用在STM连接器的解决方案不能用于BGA连接器。因此，需要开发为BGA连接器提供应力释放的技术。
本发明的目的是提供具有应力释放特征的电连接器。
本发明的另一目的是提供具有应力释放特征的表面固定电连接器。
本发明的另一目的是提供具有应力释放特征球格阵列电连接器。
本发明的另一目的是向与连接器自对中能力兼容的球格阵列电连接器提供应力释放特征。
本发明的另一目的是提供以简化步骤制造的电连接器。
本发明的这些和其它目的通过可固定到基板的电连接器在本发明的一个方面中实现。电连接器包括一个壳，以及两者都固定到罩的表面固定触点和夹具。夹具可以是表面固定夹具。连接器还包括通常包围壳的罩，其中夹具是罩的一部分。表面固定触点可包括焊接球形式的可熔元件。表面固定触点可形成矩阵阵列。同样，电连接器可以如此构造，使它固定到基板时保持基本平行。电连接器可包括固定到基板的支座，其中采用支座使壳与基板表面保持一定距离。支座可以是罩的一部分。
本发明的这些和其它目的通过球格阵列连接器在本发明的一个方面中实现，球格阵列连接器包括一个壳，壳中的多个触点，多个固定到触点用于将连接器固定到基板的可熔元件，以及固定到壳的夹具。夹具可以是表面固定夹具。球格阵列连接器还可包括通常包围壳的罩，其中夹具是罩的一部分。同样，球格阵列连接器可包括从壳伸展的支座，并适于使壳与触点表面保持一定距离。支座可以是罩的一部分。球格阵列连接器可以如此构造，使它固定到基板时保持基本平行。
本发明的这些和其它目的通过将电连接器固定到触点的方法在本发明中的一个方面中实现。本方法包括提供基板和具有触点和夹具的电连接器，并将触点和夹具固定到基板。触点可固定到基板表面。触点可在夹具固定之前固定，例如利用焊接技术允许连接器在基板上自对中。电连接器可包括固定到基板的罩。本方法还可包括构造电连接器，使当它固定到基板时保持基本平行。同样，本方法包括在基板上平衡电连接器，这样电连接器在它们被连接期间保持与基板基本平行。电连接器可以是球格阵列连接器。
本发明的这些和其它目的通过将电连接器固定到基板的方法在本发明的一个方面中实现。本方法包括提供基板和具有触点和夹具的电连接器，并将触点固定到基板。本方法还包括在基板上平衡电连接器，使电连接器在形成第一和第二焊接点时保持与基板基本平行。这种平衡可以从电连接器移去和/或增加材料来实现。或者，这种平衡可以在形成第一和第二焊接点期间在电连接器和/或基板上施加外力来实现。
本发明的这些和其它目的通过改进的具有多个能够支撑标定质量而没有不希望的可熔元件扁度的可熔元件的阵列连接器。标定质量小于连接器质量。这种改进包括连接器上的一个特征，防止不希望的可熔元件的扁度。该部件可包括支座。或者，该特征可包括从连接器壳移去的材料区域。
本发明的这些和其它目的通过改进的电连接器在本发明的一个方面中实现，改进的电连接器可固定到基板，具有可熔元件阵列，并显示相对于可熔元件不平衡。这种改进包括在连接器上的一个特征，防止这种不平衡在将连接器固定到基板时造成连接器不希望的斜度。该特征可以是支座。或者，该特征可包括从连接器壳移去的材料区域。
对于本领域的技术人员，参考说明书和附图，可使本发明的其它用途和优点变得更清楚，其中，
图1是本发明的第一替换实施例的顶部透视图；
图2A是图1中电连接器的底部透视图；
图2B是图1中电连接器侧视图；
图3是本发明第二替换实施例的顶部透视图；
图4A是图3中电连接器的底部透视图；
图4B是图3中具有替换壳实施例的电连接器的底部透视图；
图5是图3修正的电连接器透视图，以保证根据本发明在逆流过程期间连接器保持与基板基本平行。
这里描述的每一个替换实施例涉及到具有应力释放特征的表面固定电连接器。优选地，如焊接球的可熔元件利用球格阵列(BGA)技术将触点固定到基板上的导电元件。由于逆流期间，BGA连接器可以精确地相对于基板上的导体垫保持平行(称为“自对中”)这里讨论的应力释放特征最好不干扰这个需要的特性。下面详细说明每个替换实施例。
图1,2A和2B显示了电连接器100。插座底板连接器100使用美国专利号6,116,926中的许多特征，并在这里结合参考。由于详细讨论连接器100内部特征对于理解本发明是不需要的，下面仅简述内部特征。
连接器100是模块化的，由一系列子组件101形成。后绝缘壳103和前绝缘壳105组合在一起并包围子组件101形成连接器100。前壳105包括从匹配连接器(如图3,4A和4B所示)接受导电销的引入开口107。开口107形成差动对布置，两行接受信号销开口107s被一行接受对地销的开口107g侧翼包围。
外部罩109至少可包围后壳103。罩109最好由适当的可焊接材料制成，如铜合金。罩109最好至少沿连接器100的三个侧面伸展，后壁和两个侧壁。为保持在连接器100上，罩109也可包括弯曲接头110，该接头沿连接器100底臂部分伸展(即，面向基板S的壁)。
子组件101包含连接器100的对地触点113和信号触点115。对地触点和信号触点113,115与匹配连接器对应的对地销和信号销匹配。不同于美国专利号6,116,926所示的，连接器100的信号触点和对地触点表面固定到基板S，典型的是多层电路板(MLB)。
表面固定连接器100的选优方法利用BGA技术。在这里结合参考的国际专利公开号WO98/15991(国际专利申请号PCT/US97/18354)描述了各种连接器和利用BGA技术制造连接器的方法。
可熔元件117固定到触点113,115的末端区。最好，可熔元件是在逆流期间熔合到触点113,115的焊接球。触点113,115可在焊接球117熔合的末端区有接头。但是，可以使用任何将可熔元件117固定到触点113,115的其它方法，如将触点113,115末端置于连接器壳的凹槽(图4B中)中。
如图1所示，基板S有一个连接到适当轨迹(未示出)的导电垫阵列，例如为传输信号或为接地之用。垫C对应固定到连接器100上的触点113,115的可熔元件117阵列。
逆流过程，通常紧随将焊接球117熔合到触点113,115的逆流过程，将焊接球117熔合到垫C。通常，垫C在其上有黏胶(未示出)，以接受并将焊接球117临时固定到基板S。通常延伸在置于基板S上的模板(未示出)两端的隔离胶在需要的位置上提供适当量的焊接黏胶。逆流过程将焊接球117熔合到基板S上的垫C，由此在触点113,115和基板S之间产生电路。
由于机械加载需要和这些类型连接器的耐久性，如直角连接器100的底板连接器可以要求应力释放特征以保护由焊接球117形成的焊接点。因此，基板S在适当的位置包括另外的导电垫H，如在导电垫C周围。导电垫H最好与外部罩109的接头111匹配。这样，接头111作为夹具将罩109固定到基板S表面。
用于将焊接球117固定到基板S的逆流过程最好也将导电罩109固定到基板S。由于有导电垫C，导电垫H在隔离胶作用期间接受焊接黏胶。逆流过程将罩109熔合到基板S。
将导电罩109固定到基板S作为对连接器100的应力释放。因为罩109表面固定到基板S，连接器100的应力释放特征在逆流期间不干扰可熔元件117的自对中特性。
本发明可保护焊接球因为连接器的重量在逆流期间被扁平。这种扁平可能造成在邻近焊接球之间不需要的桥路。这可以通过许多技术来实现。例如，连接器可包括一个支座。支座限制了当焊接球熔化时连接器接近基板的能力。换句话说，支座防止了由于连接器重量扁平焊接球以及与邻近焊接球可能的桥路。支座可由任何适当的材料制成。另外，如图2B所示，罩109作为支座。罩109仅允许焊接球117的一部分延伸超过罩109的距离d。作为例子，支座可允许至40％，最好是30％的焊接球的扁度。选择距离d以限制在逆流过程中邻近焊接球的桥路。这样，罩109作用如一支座，防止连接器100在逆流期间在PCB上倾斜。
图3,4A和4B显示了电连接器200。底板插头连接器200最好与底板插座连接器100匹配。很清楚，连接器100,200被用在底板系统，如，连接子卡与母卡。
连接器200使用了美国专利申请系列号09/302,027中描述的许多特征，在这里结合参考。由于详细讨论连接器200内部特征对于理解本发明是不需要的，下面仅简述内部特征。
连接器200包括带开口的绝缘壳201，通过开口接受信号销103，对地销205和对地罩207信号和对地销203,205从壳201延伸，并对应连接器100中引入开口107的布置，用于匹配信号和对地触点113,115(如图1,2A和2B中所示)。对地罩207。保留在壳201中，啮合对地销205并用于包围信号销203。
外部罩209可包围壳201。罩209最好由适当的可焊接材料制成，如铜合金。如图3,4A和4B所示，罩209可以沿连接器200的侧壁延伸。为将罩209保持在连接器200上，罩209也可包括沿部分连接器200底壁(即，面向基板S的壁)延伸的弯曲接头211。
如连接器100(如图1,2A和2B所示)，连接器200表面固定至基板S，最好使用在国际专利公开号WO98/15991中讨论的BGA技术。可熔元件213固定至触点203,205的末端。最好，可熔元件213是在逆流过程中熔合到触点203,205的焊接球。触点203,205可在焊接球213熔合的末端区有接头。但是，可以使用任何将可熔元件213固定到触点203,205的其它方法，如在连接器壳201(如图4B所示)底表面中的凹槽215。
如图3所示，基板S有一个连接到适当轨迹(未示出)的导电垫C的阵列，例如用于传输信号或接地之用。垫C对应固定在连接器200上的触点203,205的可熔元件213的阵列。
逆流过程，通常紧随将焊接球213熔合到触点203,205的逆流过程，将焊接球213熔合到垫C。通常，垫C在其上有黏胶(未示出)，以接受并将焊接球213临时固定到基板S。通常延伸在置于基板S上的模板(未示出)两端的隔离胶在需要的位置上提供适当量的焊接黏胶。逆流过程将焊接球213熔合到基板S上的垫C，由此在触点203,205和基板S之间产生电路。
如连接器100(如图1,2A和2B所示)，连接器200可要求应力释放特征来保护由焊接球213形成的焊接点。因此，基板S在适当的位置包括另外的导电垫H，如在导电垫C周围。导电垫H最好与外部罩209的接头211的位置匹配。这样，接头111作为夹具将壳109固定到基板S的表面。
用于将焊接球213固定到基板S的逆流过程最好也将导电罩209固定到基板S。由于有导电垫C，导电垫H在隔离胶作用期间接收焊接黏胶。逆流过程将罩209熔合到基板S。
将导电罩209固定到基板S作为对连接器200的应力释放。因为罩209表面固定到基板S，连接器200的应力释放特征在逆流期间不干扰可熔元件213的自对中特性。
图4B显示了具有替换壳实施例的连接器200。特别地，图4B显示了带有一件连续壳结构216的连接器200。另外，壳216包括球凹槽215，用于接收焊接黏胶和焊接球213。凹槽也接收触点203,205的固定部分。
如参考连接器100的前面所述(如图1,2A和2B所述)，本发明可防止在逆流期间由于连接器重量焊接球被扁平。这种扁平可能造成在邻近焊接球之间不需要的桥路。这可以通过许多技术来实现。例如，连接器可包括一个支座。支座限制了当焊接球熔化时连接器接近基板的能力。换句话说，支座防止了由于连接器重量扁平焊接球以及与邻近焊接球可能的桥路。支座可由任何其它适当的材料制成。如图2B所示，罩209仅允许焊接球213的一部分延伸超过罩209的一个距离。距离也可被选择以限制在逆流过程中邻近焊接球的桥路。这样，罩209作用如一支座，防止连接器200在逆流期间在PCB上倾斜。
图5是本发明如何保证BGA连接器在逆流期间保持与基板基本平行的另一个实施例。如参考连接器100和200所讨论的，BGA连接器通过将焊接球加热直到焊料熔化并熔合到基板上的导电垫而连接至基板。焊接的表面张力对中基板轨迹上的连接器。但是，在连接器必须以不平衡状态制造的应用中(即，连接器在焊接的一侧比另一侧有更大的重量)，在逆流期间连接器相对于基板倾斜。结果，某些焊接点在小于标定机械力下可能失败。同样，倾斜可能造成邻近焊接球的不需要的桥路。本发明保证在逆流期间使连接器保持与基板基本平行。
如图5所述，连接器200上壳201的部分(为清晰起见，以虚线显示)可移去和/或增加使连接器200的质量在球格阵列上保持均匀平衡。特别地，部分502和505可从壳201的较重部分移去。部分503和504可加到壳201的较轻部分。虽然图5显示了在一定位置的部分502-505，但应该理解，部分502-505的位置以及大小和重量随连接器200的物理特性而变化。
虽然图5显示了通过修正连接器的物理特性保持连接器200在基板上平衡，但应该理解，本发明并不限于此。本发明可利用许多技术实现这种平衡。例如，在逆流期间，在连接器200的某一区域施加外力。确定这种力的大小以便克服由球格阵列上壳的不平衡造成的连接器200和基板的倾斜关系。在另一个实施例中，相似的力可加到基板S，以及连接器或非连接器上。因此，本发明包括克服在球格阵列上连接器固有不平衡的任何技术，并允许在逆流后使连接器保持与连接的基板基本平行。虽然本发明的平衡方面是参考连接器200讨论的，但是应该理解，这种平衡可应用于任何连接器，例如包括插座连接器100(如图1,2A和2B所述)。
虽然是结合各种特征的优选实施例来说明本发明，但是应该理解，也可应用其它类似的实施例或通过对描述的实施例修正和变形完成本发明相同的功能而不偏离。因此，本发明不限于任何单个实施例，而根据所附权利要求书更广泛地给予解释。

Claims (31)

1、一种电连接器，可固定到基板，包括：
壳；
固定到所述壳的表面固定触点；以及
固定到所述壳的夹具。
2、根据权利要求1所述的电连接器，其中所述夹具是表面固定夹具。
3、根据权利要求1所述的电连接器，还包括通常包围所述壳的罩，其中所述夹具是罩的一部分。
4、根据权利要求1所述的电连接器，其中表面固定触点包括可熔元件。
5、根据权利要求4所述的电连接器，其中所述可熔元件是焊接球。
6、根据权利要求1所述的电连接器，其中所述电连接器这样构造，使它在固定到所述基板时保持基本平行。
7、根据权利要求1所述的电连接器，其中多个所述表面固定触点形成一个矩阵阵列。
8、根据权利要求1所述的电连接器，还包括固定到所述壳的支座，其中所述支座适于使所述壳与所述基板表面保留一距离。
9、根据权利要求8所述的电连接器，其中所述支座是所述罩的一部分。
10、一种球格阵列连接器，包括：
壳；
固定到所述壳的多个触点；
固定到所述触点用于将所述连接器固定到基板的多个可熔元件；以及
固定到所述壳的夹具。
11、根据权利要求10所述的电连接器，其中所述夹具是表面固定夹具。
12、根据权利要求10所述的电连接器，还包括通常包围所述壳的罩，其中所述夹具是所述罩的一部分。
13、根据权利要求12所述的电连接器，其中所述支座是所述罩的一部分。
14、根据权利要求10所述的电连接器，还包括从所述壳延伸的支座并适于在所述壳与所述基板之间保留一距离。
15、根据权利要求10所述的电连接器，其中所述可熔元件是焊接球。
16、根据权利要求10所述的电连接器，其中所述球格阵列连接器这样构造，使它在固定到所述基板时保持基本平行。
17、将电连接器固定到基板的一种方法，包括：
提供具有触点和夹具的电连接器；
提供基板；
将所述触点固定到所述基板；以及
将所述夹具固定到所述基板。
18、根据权利要求17所述的方法，其中所述固定所述夹具包括：
向所述连接器提供罩；
将所述罩固定到所述基板。
19、根据权利要求17所述的方法，还包括这样构造所述电连接器，使它在固定到所述基板时保持基本平行。
20、根据权利要求17所述的方法，还包括在所述基板上平衡所述电连接器，使所述电连接器在所述固定期间保持与所述基板基本平行。
21、根据权利要求17所述的方法，其中所述电连接器是球格阵列连接器。
22、根据权利要求17所述的方法，其中所述固定包括将所述夹具焊接到所述基板。
23、将电连接器固定到基板的一种方法，包括：
提供具有触点和夹具的电连接器；
提供基板；
将所述触点固定到所述基板；以及
在所述基板上平衡所述电连接器，使所述电连接器在所述形成所述第一和第二焊接点期间保持与所述基板基本平行。
24、根据权利要求23的方法，其中所述平衡包括从所述电连接器移去材料。
25、根据权利要求23的方法，其中所述平衡包括向所述电连接器增加材料。
26、在具有多个能够支撑标定质量而没有所述可熔元件不希望的扁度的可熔元件的阵列连接器中，所述标定质量小于所述连接器质量，其中改进包括所述连接器上的特征，使它防止所述可熔元件的所述不希望的扁度。
27、根据权利要求26所述的阵列连接器，其中所述特征包括一个支座。
28、根据权利要求26所述的阵列连接器，其中所述特征包括从所述连接器壳移去的材料的区域。
29、在可固定到基板的电连接器中，所述连接器具有可熔元件阵列并显示相对于所述可熔元件的不平衡，其中改进包括在所述连接器上的一个特征，防止所述不平衡在将所述连接器固定到基板时造成所述连接器不希望的斜度。
30、根据权利要求29所述的连接器，其中所述特征包括一个支座。
31、根据权利要求29所述的连接器，其中所述特征包括从所述连接器壳移去材料的一个区域。
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CN1178337C (zh) 2004-12-01
DE60019527D1 (de) 2005-05-25
JP2001160436A (ja) 2001-06-12
EP1146596A3 (en) 2003-01-15
EP1094547A3 (en) 2001-10-04
DE60025159T2 (de) 2006-08-17
DE60025159D1 (de) 2006-02-02
CN100470958C (zh) 2009-03-18
EP1146596A2 (en) 2001-10-17
DE60025654D1 (de) 2006-04-06
ATE314744T1 (de) 2006-01-15
EP1146596B1 (en) 2005-12-28
EP1094547A2 (en) 2001-04-25
US6544046B1 (en) 2003-04-08
TW484251B (en) 2002-04-21
EP1094547B1 (en) 2005-04-20
JP2001160435A (ja) 2001-06-12
CN1211895C (zh) 2005-07-20
DE60025654T2 (de) 2006-11-23
CN1297265A (zh) 2001-05-30
TW531948B (en) 2003-05-11
DE60019527T2 (de) 2006-04-27
CN1529387A (zh) 2004-09-15

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