CN1304510C - 各向异性导电粘合剂及使用该粘合剂的电路连接方法和结构 - Google Patents
各向异性导电粘合剂及使用该粘合剂的电路连接方法和结构 Download PDFInfo
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- CN1304510C CN1304510C CNB03825610XA CN03825610A CN1304510C CN 1304510 C CN1304510 C CN 1304510C CN B03825610X A CNB03825610X A CN B03825610XA CN 03825610 A CN03825610 A CN 03825610A CN 1304510 C CN1304510 C CN 1304510C
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
Abstract
Description
粘合强度(g/cm) | 连接阻抗(Ω) | 连接阻抗可靠性(Ω) | |
第一实施例 | 815 | 1.0 | 4.0 |
第二实施例 | 950 | 1.1 | 4.3 |
对比例1 | 812 | 24.0 | N/A |
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020079857 | 2002-12-13 | ||
KR1020020079857A KR20040052126A (ko) | 2002-12-13 | 2002-12-13 | 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로접속 구조체 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1714131A CN1714131A (zh) | 2005-12-28 |
CN1304510C true CN1304510C (zh) | 2007-03-14 |
Family
ID=36165425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB03825610XA Expired - Fee Related CN1304510C (zh) | 2002-12-13 | 2003-07-29 | 各向异性导电粘合剂及使用该粘合剂的电路连接方法和结构 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060054277A1 (zh) |
JP (1) | JP2006509884A (zh) |
KR (1) | KR20040052126A (zh) |
CN (1) | CN1304510C (zh) |
AU (1) | AU2003256092A1 (zh) |
TW (1) | TWI276674B (zh) |
WO (1) | WO2004055126A1 (zh) |
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- 2002-12-13 KR KR1020020079857A patent/KR20040052126A/ko not_active Application Discontinuation
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2003
- 2003-07-29 US US10/538,801 patent/US20060054277A1/en not_active Abandoned
- 2003-07-29 AU AU2003256092A patent/AU2003256092A1/en not_active Abandoned
- 2003-07-29 WO PCT/KR2003/001515 patent/WO2004055126A1/en active Application Filing
- 2003-07-29 CN CNB03825610XA patent/CN1304510C/zh not_active Expired - Fee Related
- 2003-07-29 JP JP2004560672A patent/JP2006509884A/ja active Pending
- 2003-08-15 TW TW092122454A patent/TWI276674B/zh not_active IP Right Cessation
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CN104349898A (zh) * | 2012-05-30 | 2015-02-11 | 埃克阿泰克有限责任公司 | 塑料组件及其制造、使用方法以及包含该塑料组件的制品 |
Also Published As
Publication number | Publication date |
---|---|
AU2003256092A1 (en) | 2004-07-09 |
US20060054277A1 (en) | 2006-03-16 |
TWI276674B (en) | 2007-03-21 |
TW200416268A (en) | 2004-09-01 |
CN1714131A (zh) | 2005-12-28 |
WO2004055126A1 (en) | 2004-07-01 |
JP2006509884A (ja) | 2006-03-23 |
KR20040052126A (ko) | 2004-06-19 |
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