CN1306574C - Manufacturing process of conducting hole - Google Patents
Manufacturing process of conducting hole Download PDFInfo
- Publication number
- CN1306574C CN1306574C CNB2004100282926A CN200410028292A CN1306574C CN 1306574 C CN1306574 C CN 1306574C CN B2004100282926 A CNB2004100282926 A CN B2004100282926A CN 200410028292 A CN200410028292 A CN 200410028292A CN 1306574 C CN1306574 C CN 1306574C
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- conductive
- perforation
- manufacture craft
- layer
- photoresist
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- Expired - Lifetime
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 56
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 17
- 238000000059 patterning Methods 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 7
- 238000005234 chemical deposition Methods 0.000 claims description 4
- 238000000608 laser ablation Methods 0.000 claims description 4
- 238000005289 physical deposition Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 7
- 238000001259 photo etching Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 2
- 241000482268 Zea mays subsp. mays Species 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The present invention relates to a manufacturing process for conducting through holes, which comprises the following steps: firstly, forming at least one perforative hole on a baseplate, and a first and a second surfaces of the baseplate is connected through the perforative hole; then forming a photoresist layer on the inner wall of the perforative hole of the baseplate, and on the first and the second surfaces; then forming a plurality of conduits on the photoresist layer, each conduit extends from the first surface to the second surface through the inner wall of the perforative hole, and the conduit respectively exposes part of the inner wall of the perforative hole, part of the first surface and part of the second surface; finally, filling a first conducting material in each conduit to respectively form a conducting wire, and removing the photoresist layer. The manufacturing process for conducting through holes can provides multiple signal connection paths.
Description
Technical field
The present invention relates to a kind of conductive through hole manufacture craft, particularly relate to a kind of conductive through hole manufacture craft of several signal connection paths in same perforation of making.
Background technology
Because the progress and the demand of electronics technology, various electronic correlation products develop towards the direction of miniaturization and multifunction invariably, and drive related semiconductor manufacture craft technology strides forward towards higher positive degree.Chip volume after the encapsulation is littler, complexity is higher in order to make, such as upside-down mounting (Flip Chip, FC) encapsulation, ball grid array (Ball Grid Array, BGA) encapsulation and chip size packages (Chip ScalePackage, CSP) etc. encapsulation technology more widely industrial circle utilize.In addition, circuit board (PCB) aspect, in order to improve line density, also used the circuit board that Layer increasing method (Build-Up) for example or laminated method formation such as (Lamination) have multilayer line, and above-mentioned flip-chip packaged and BGA encapsulate employed base plate for packaging also in this range of application.Yet, no matter be base plate for packaging or multilayer circuit board, all have a plurality of conductive through holes that run through multilager base plate, connecting different patterned line layer, with as the signal access path between the different circuits.
Please in regular turn with reference to Figure 1A～Fig. 1 D, it illustrates the cutaway view of existing a kind of conductive through hole manufacture craft respectively.
At first, shown in Figure 1A, provide a substrate 100, its upper and lower surface has a Copper Foil 102 respectively, and for example in the mode of laser drill (Laser Drilling) or machine drilling (Mechanical Drilling), forms a perforation 104 on substrate 100.Then, shown in Figure 1B, substrate 100 is carried out comprehensive copper facing step, form a copper metal layer 110 with surface and perforation 104 inwalls at Copper Foil 102 respectively.At last, shown in Fig. 1 C, carry out consent (Plugging) step, it is in the mode of printing (Printing), consent is inserted in the perforation 104 with printing ink 106, and finish the conductive through hole manufacture craft, wherein the main purpose of consent is to prevent that aqueous vapor from entering in the perforation 104, thereby causes popcorn effect (Popcorn Effect).
After finishing above-mentioned conductive through hole manufacture craft, just can carry out the step of patterning (Patterning) to copper metal layer 110, it utilizes photoetching method earlier, actions such as process photoresist coating and exposure, development, limit the shape of photoresist, photoresist with patterning is a photomask again, and the upper and lower surface at substrate 100 forms patterned line layer 110a, 110b respectively by etch copper metal level 110, and obtains the individual layer wiring board 150 that illustrated as Fig. 1 D.In Fig. 1 D, be positioned at the patterned line layer 110a and the 110b of substrate 100 upper and lower surfaces, can pass through conductive layer 110c mutual conduction respectively, and when being applied to multilayer circuit board, different patterned line layer more than two more can interconnect by conductive through hole, to reach the purpose that signal transmits.It should be noted that, because but conductive through hole needs the wiring space of the substrate surface of sacrificial section when forming, to form perforation and bumping pad (Land Area), and also there is the restriction on its minimum dimension in the aperture of conductive through hole, so the important key that is configured to improve the circuit integrated level of conductive through hole.
Because each above-mentioned conductive through hole only can provide single signal access path, in order to increase the usability of conductive through hole, existing proposition can provide the conductivity through-hole structure of multiple signal access path.Please refer to Fig. 2, it illustrates the processing schematic diagram of existing another kind of conductive through hole.After the existing conductive layer 210 on forming conductive through hole 220 inwalls, by laser 250 on conductive layer 210, ablate (ablation) go out a plurality of grooves 230, conductive layer 210 being divided into a plurality of independently time conductive layer 210a, and each time conductive layer 210a can provide different signal access paths respectively.
Yet, separate fully in order to ensure adjacent inferior conductive layer 210a, the above-mentioned mode of utilizing laser cutting copper metal layer 210 damages the part substrate 200 to copper metal layer 210 peripheries unavoidablely, and glass (glass fiber) layer (not illustrating) and the copper metal layer 210 that are covered on the substrate 200 all are difficult for being removed by laser, so need to use long process time and bigger laser energy, thereby cause the increase of production cost.In addition, more because the machined surface of laser 250 is comparatively narrow and small, therefore also comparatively narrow by laser 250 formed grooves 230, and when carrying out the consent step, to make printing ink 206 can't insert fully in the groove 230 and form emptying aperture (void), and then influence the electrical property (electrical performance) and the reliability (reliability) of overall wire line structure.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of conductive through hole manufacture craft,, and provide several signal connection paths in order to many separate conductors of formation within single perforation.
Based on above-mentioned purpose, the present invention proposes a kind of conductive through hole manufacture craft, and it can make a plurality of leads in a perforation.This conductive through hole manufacture craft at first provides a substrate, and it for example has a first surface and a corresponding second surface.Then, on substrate, form perforation, and this perforation connects first surface and second surface.Then, on substrate, form a photoresist layer, and this photoresist layer covers inwall, first surface and the second surface of perforation.Afterwards, form a plurality of conduits on the photoresist layer, wherein each conduit is respectively from the inwall of first surface via perforation, and extends to second surface, and this each conduit exposes inwall, part first surface and the part second surface of part perforation respectively.Then, in each conduit, insert a conductive material, forming a plurality of leads, and these leads respectively from first surface via the perforation inwall, and extend to second surface.At last, remove the photoresist layer, and with a plurality of wire producings in same perforation.
In addition, the present invention also proposes another kind of conductive through hole manufacture craft, and it can make a plurality of leads in a perforation.This conductive through hole manufacture craft at first provides a substrate, and it for example has a first surface and a corresponding second surface, and forms perforation on substrate, and this perforation connects first surface and second surface.Then, on substrate, form a conductive layer, and conductive layer is inwall, first surface and the second surface that covers perforation.Then, form a plurality of strip photoresists on conductive layer, wherein each strip photoresist is respectively from the inwall of first surface via perforation, and extends to second surface.Afterwards, remove strip photoresist institute exposed portions conductive layer, forming a plurality of leads respectively, and these leads are respectively from the inwall of first surface via perforation, and extend to second surface.At last, remove the strip photoresist, and with a plurality of wire producings in same perforation.
Based on above-mentioned, conductive through hole manufacture craft of the present invention can be carried out photoetching making technology earlier and be formed the patterning photoresist layer with a plurality of grooves being pre-formed on the substrate of perforation, again for example to electroplate or the mode of deposition forms many leads in groove.In addition, conductive through hole manufacture craft of the present invention also can be earlier plates a metal level being formed with comprehensively on the substrate of perforation, and the photoresist by patterning carries out etching as photomask to metal level again, to form many leads.Therefore, the photoresist pattern of conductive through hole manufacture craft of the present invention after by photoetching cooperates modes such as plating, deposition or etching, and forms multiplex conductor in same perforation.
Description of drawings
Figure 1A～Fig. 1 D illustrates the cutaway view into existing a kind of conductive through hole manufacture craft respectively;
Fig. 2 is the processing schematic diagram of existing another kind of conductive through hole;
Fig. 3 A～Fig. 3 F is the partial perspective cutaway view of first kind of conductive through hole manufacture craft of preferred embodiment of the present invention;
Fig. 4 A～Fig. 4 G is the partial perspective cutaway view of second kind of conductive through hole manufacture craft of preferred embodiment of the present invention.
Embodiment
Please refer to Fig. 3 A～Fig. 3 F, it illustrates the partial perspective cutaway view of first kind of conductive through hole manufacture craft of preferred embodiment of the present invention in regular turn.
At first, as shown in Figure 3A, one substrate 302 is provided, it for example has a first surface 302a and a corresponding second surface 302b, and shown in Fig. 3 B, on substrate 302, form consistent at least hole 304, and perforation 304 connection first surface 302a and second surface 302b, the method that wherein forms perforation 304 for example comprises processing modes such as laser drill or machine drilling.
Then, shown in Fig. 3 C, on substrate 302, form a photoresist layer 310 comprehensively, and photoresist layer 310 covers inwall, first surface 302a and the second surface 302b of perforation 304, wherein photoresist layer 310 is high-aspect-ratio (high aspect ratio) photoresist, and can spin coating (spin coating) liquid photoresist (liquid PR) or make electricity consumption photoresist modes such as (Electro-Deposited PR) to be covered in above-mentioned surface.Then, shown in Fig. 3 D, photoresist layer 310 is exposed and step such as development, on photoresist layer 310, to form a plurality of conduits 312, wherein each conduit 312 is from the inwall of first surface 302a via perforation 304, and extend to second surface 302b, and each conduit 312 exposes the inwall of the perforation 304 of part, the first surface 302a of part and the second surface 302b of part.What deserves to be mentioned is that except that above-mentioned exposure, developing, first kind of conductive through hole manufacture craft of the present invention also can form above-mentioned conduit 312 by for example laser ablation alternate manners such as (laser ablation).
Afterwards, shown in Fig. 3 E, by for example modes such as plating or deposition, in each conduit 312, insert a conductive material (for example can be copper), to form many leads 320 independent of each other, wherein each bar lead 320 is from the inwall of first surface 302a via perforation 304, and extends to second surface 302b.At last, shown in Fig. 3 F, remove photoresist layer 310, and finish conductive through hole 300 of the present invention.
First kind of conductive through hole manufacture craft of the present invention is to utilize the mode of photoetching earlier, have one and to form patterning photoresist layer on the substrate of perforation with a plurality of grooves, and the same perforation of the extensible process of these grooves, by for example mode such as plating or physical deposition, chemical deposition electric conducting material is filled within these grooves again, in these grooves of photoresist layer, to form a lead respectively.It should be noted that, multiplex conductor is formed in the same perforation in the mode of electroplating if select, conductive through hole manufacture craft then of the present invention also is included in and forms before the patterning photoresist layer, promptly electroplate first surface and the second surface that inculating crystal layer is formed on perforation inwall and substrate with one in advance, in order to the carrying out of follow-up plating action.In addition, after the step that removes the photoresist layer, also need remove the part that exposes of electroplating inculating crystal layer.
In addition, after finishing each above-mentioned step, conductive through hole manufacture craft of the present invention also can be inserted an insulating material (as consent with insulating material such as printing ink) in perforation, enter in the perforation to prevent extraneous aqueous vapor, and can avoid difference but bridge joint mutually between the adjacent wires.It should be noted that, because the spacing of the lead that the present invention is produced can be bigger, the integrality of the therefore situation that can avoid existing insulating material can't fill up the groove 230 (as shown in Figure 2) between the two adjacent leads, and then increase perforation itself and the reliability of overall wire line structure.
Please refer to Fig. 4 A～Fig. 4 G, it illustrates the partial perspective cutaway view of second kind of conductive through hole manufacture craft of preferred embodiment of the present invention in regular turn.
At first, shown in Fig. 4 A and Fig. 4 B, provide a substrate 402, and on substrate 402, form consistent at least hole 404, and perforation 404 connects the first surface 402a and the second surface 402b of substrate 402 by for example mode such as laser drill or machine drilling.
Then, shown in Fig. 4 C, for example in modes such as plating, physical deposition or chemical depositions, a conductive layer 420 is formed at inwall, first surface 402a and the second surface 402b of the perforation 404 of substrate 402 comprehensively, wherein before forming conductive layer 420 with plating mode, can form one on above-mentioned surface in advance and electroplate inculating crystal layer (not illustrating), then form the remainder of conductive layer 420 again in the mode of electroplating.
Afterwards, shown in Fig. 4 D, Fig. 4 E, on conductive layer 420, form a photoresist layer 410 comprehensively, and by for example expose, mode such as development comes patterning photoresist layer 410, so that a plurality of strip photoresists 412 are formed on the conductive layer 420, wherein each strip photoresist 412 is from the inwall of first surface 402a via perforation 404, and extends to second surface 402b.
Then, shown in Fig. 4 F, be photomask with these strip photoresists 412, come etching conductive layer 420, to remove 412 exposed portions conductive layers 420 of these strip photoresists (shown in Fig. 4 C).In addition, if form conductive layer 420, then after removing conductive layer 420, also need remove the part that exposes of electroplating inculating crystal layer (not illustrating) with plating mode.So just can form many separate leads 422, wherein each lead 422 is from the inwall of first surface 402a via same perforation 404, and extends to second surface 402b.At last, shown in Fig. 4 G, remove the strip photoresist 412 on the lead 422, and form conductive through hole 400 of the present invention.
Second kind of conductive through hole manufacture craft of the present invention is earlier to plate conductive layer on the substrate of perforation being formed with comprehensively, produces multiplex conductor simultaneously by step such as photoetching and etching in single perforation again.In addition, can after finishing each above-mentioned step, for example in perforation, insert insulating material equally in the mode of printing.
In sum, conductive through hole manufacture craft of the present invention for example can use the high-aspect-ratio photoresist as photomask, and collocation addition process (additive process) (for example electroplating or deposition) or subtractive process (subtractive process) (for example etching), in the single perforation of substrate, to form multiplex conductor.Therefore, the present invention has following advantage at least:
(1) because the present invention adopts photoetching making technology, thus can in same perforation, produce multiplex conductor simultaneously, thereby have higher production efficiency.
(2) because the present invention utilizes photoetching making technology, thus can in same perforation, produce the multiplex conductor of less live width or big line-spacing, thereby help to improve the coiling density of substrate.
(3) the produced multiplex conductor its spacing of the present invention can be bigger, thereby help the filling of insulating material in the making plug holes, so that preferable electrical property and reliability to be provided.
(4) the present invention can keep the integrality of itself shape of the perforation that passes through multiplex conductor of substrate, and does not need to remove local steps such as substrate, fiberglass layer and copper metal layer as existing, thereby can obtain preferable manufacture craft qualification rate and reliability.
(5) the produced conductive through hole of the present invention can provide a plurality of signal paths simultaneously in single perforation, so can reduce the wiring space of the shared line carrier plate of conductive through hole effectively, thereby help to shorten the coiling distance of circuit, and can reduce the voltage plane of sacrificing or the area of ground plane because of the configuration conductive through hole.
(6) multiplex conductor of the produced same conductive through hole of the present invention can offer the close signal of electrical distribution (electrical attribute) and uses, for example be equipped on the interior paired differential lines (Differential Pair) of line carrier plate etc., obtain preferable control with electrical property (electrical performance) for the chip packing-body of using this circuit base plate.
(7) multiplex conductor of the produced same conductive through hole of the present invention can provide the function of guardwire (guard wire); can form for example guardwire such as earth connection or power line in the both sides of the signal conductor of same conductive through hole, to keep preferable electrical property.
Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limiting the present invention, anyly is familiar with this operator, without departing from the spirit and scope of the present invention; can do some change and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined.
Claims (13)
1. a conductive through hole manufacture craft can be made a plurality of leads in a perforation, and this conductive through hole manufacture craft comprises:
One substrate is provided, and wherein this substrate has a first surface and a corresponding second surface;
On this substrate, form this perforation, and this perforation connects this first surface and this second surface;
On this substrate, form a photoresist layer, and this photoresist layer covers inwall, this first surface and this second surface of this perforation;
On this photoresist layer, form a plurality of conduits, wherein each conduit is from the inwall of this first surface via this perforation, and extend to this second surface, and this each conduit exposes inwall, this first surface of part and this second surface of part of this perforation of part respectively;
Insert a conductive material in these conduits, forming each lead, and this each lead is respectively from the inwall of this first surface via this perforation, and extends to this second surface; And
Remove this photoresist layer.
2. conductive through hole manufacture craft as claimed in claim 1, wherein after forming this perforation, and before forming this photoresist layer, the inwall that also is included in this perforation forms one and electroplates inculating crystal layer, this first surface and this second surface, to electroplate inculating crystal layer by this, insert this conductive material by the mode of electroplating, and after removing this photoresist layer, remove the part that exposes of this plating inculating crystal layer.
3. conductive through hole manufacture craft as claimed in claim 1, the method for wherein inserting this conductive material comprise physical deposition and chemical deposition one of them.
4. conductive through hole manufacture craft as claimed in claim 1, the method that wherein forms each conduit comprises exposure, develops.
5. conductive through hole manufacture craft as claimed in claim 1, the method that wherein forms each conduit comprises laser ablation.
6. conductive through hole manufacture craft as claimed in claim 1 wherein after removing this photoresist layer, also is included in and inserts an insulating material in this perforation.
7. a conductive through hole manufacture craft can be made a plurality of leads in a perforation, and this conductive through hole manufacture craft comprises:
One substrate is provided, and wherein this substrate has a first surface and a corresponding second surface;
On this substrate, form this perforation, and this perforation connects this first surface and this second surface;
On this substrate, form a conductive layer, and this conductive layer covers inwall, this first surface and this second surface of this perforation;
Form a plurality of strip photoresists on this conductive layer, wherein each strip photoresist is from the inwall of this first surface via this perforation, and extends to this second surface;
Remove this each strip photoresist institute this conductive layer of exposed portions, forming each lead, and this each lead is respectively from the inwall of this first surface via this perforation, and extends to this second surface; And
Remove this each strip photoresist.
8. conductive through hole manufacture craft as claimed in claim 7, wherein after forming this perforation, and before forming this conductive layer, the inwall, this first surface and this second surface that also are included in this perforation form one and electroplate inculating crystal layer, and by this plating inculating crystal layer, form this conductive layer in the mode of electroplating, when removing this conductive layer of part, also remove the part that exposes of this plating inculating crystal layer of part simultaneously afterwards.
9. conductive through hole manufacture craft as claimed in claim 7, the method that wherein forms this conductive layer comprise physical deposition and chemical deposition one of them.
10. conductive through hole manufacture craft as claimed in claim 7, the step that wherein forms each strip photoresist comprises:
On this conductive layer, form a photoresist layer; And
This photoresist layer of patterning is to form this each strip photoresist.
11. conductive through hole manufacture craft as claimed in claim 10, wherein the method for this photoresist layer of patterning comprises exposure, develops.
12. conductive through hole manufacture craft as claimed in claim 10, wherein the method for this photoresist layer of patterning comprises laser ablation.
13. conductive through hole manufacture craft as claimed in claim 7 wherein after removing each strip photoresist, also is included in and inserts an insulating material in this perforation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100282926A CN1306574C (en) | 2004-03-09 | 2004-03-09 | Manufacturing process of conducting hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100282926A CN1306574C (en) | 2004-03-09 | 2004-03-09 | Manufacturing process of conducting hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1560912A CN1560912A (en) | 2005-01-05 |
| CN1306574C true CN1306574C (en) | 2007-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2004100282926A Expired - Lifetime CN1306574C (en) | 2004-03-09 | 2004-03-09 | Manufacturing process of conducting hole |
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| CN (1) | CN1306574C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109757037A (en) * | 2017-11-07 | 2019-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | High density circuit board and preparation method thereof |
| CN110958788A (en) * | 2018-09-27 | 2020-04-03 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN111010799A (en) * | 2018-10-08 | 2020-04-14 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and manufacturing method thereof |
| CN113133192A (en) * | 2019-12-31 | 2021-07-16 | 华为技术有限公司 | Multilayer circuit board, electronic device, and multilayer circuit board processing method |
| TWI744896B (en) * | 2020-05-12 | 2021-11-01 | 台灣愛司帝科技股份有限公司 | Conductive glass substrate, manufacturing system thereof and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200904B1 (en) * | 1999-06-01 | 2001-03-13 | United Microelectronics Corp. | Method of forming a contact hole of a DRAM |
| JP2002185104A (en) * | 2000-12-15 | 2002-06-28 | Hitachi Chem Co Ltd | Method of manufacturing wiring board |
| US6458514B1 (en) * | 2000-03-27 | 2002-10-01 | Chong-Ren Maa | Process for forming through holes in substrate of printed circuit board |
-
2004
- 2004-03-09 CN CNB2004100282926A patent/CN1306574C/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6200904B1 (en) * | 1999-06-01 | 2001-03-13 | United Microelectronics Corp. | Method of forming a contact hole of a DRAM |
| US6458514B1 (en) * | 2000-03-27 | 2002-10-01 | Chong-Ren Maa | Process for forming through holes in substrate of printed circuit board |
| JP2002185104A (en) * | 2000-12-15 | 2002-06-28 | Hitachi Chem Co Ltd | Method of manufacturing wiring board |
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| CN1560912A (en) | 2005-01-05 |
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