CN1313956A - 光电子学的金属基本组成部件 - Google Patents

光电子学的金属基本组成部件 Download PDF

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CN1313956A
CN1313956A CN99809814A CN99809814A CN1313956A CN 1313956 A CN1313956 A CN 1313956A CN 99809814 A CN99809814 A CN 99809814A CN 99809814 A CN99809814 A CN 99809814A CN 1313956 A CN1313956 A CN 1313956A
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C·布洛姆
C·维德尔
O·拉松
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Telefonaktiebolaget LM Ericsson AB
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/24—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a grooved structure, e.g. V-grooved, crescent active layer in groove, VSIS laser
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

Abstract

本发明涉及一种制作金属基本组成部件图案的方法和一种金属基本组成部件,所实现的测量精度在亚微米范围内。从硅母体开始,对所述硅母体以亚微米精度蚀刻并且然后在硅表面上电镀例如镍之类的金属,由此能形成精度和表面光洁度仍然在亚微米范围的镍薄垫片。在除去硅母体之后,可使用液体形式或薄膜形式的感光材料(5)形成向下到达镍薄垫片的模腔。然后金属电镀这些腔以形成高精度的三维基本组成部件(8)。

Description

光电子学的金属基本组成部件
本发明涉及一种制作金属基本组成部件图案的方法和一种制有图案的金属基本组成部件，根据制作金属基本组成部件图案的方法制造所述基本组成部件，其中所获得的测量精度在亚微米范围内。按此方法所形成的基本组成部件可用作光电和电子元件的载体、光纤和波导。金属基本组成部件也可用作微型结构的标准部件或用于注模或压模的模腔的部件。
目前最常见的在低耗应用中用于固定光电激光芯片的技术包括将芯片焊接到陶瓷或硅载体上。通过能高精度地蚀刻硅和由在焊料熔化中出现的表面张力来牢固地焊接激光器并对准的技术可实现激光器的光驱动部分和光纤芯之间的对准。例如，通常使用某些胶合技术将PIN二极管固定到载体上。通过用硅蚀刻并金属化表面而形成的光学镜子常常用于将来自纤维的光反射到PIN二极管。
当光电激光器芯片要固定在陶瓷载体或硅载体上时，通常会出现使芯片中产生热量散失的问题。在使用中，改变芯片温度能影响传输的波长。非常高的操作温度还会使芯片的有效寿命缩短。此外，由于包含相当复杂的制作工艺，陶瓷载体和硅载体通常成本很高。
根据本发明的技术能实现基本组成部件的有成本效益的生产，可单独地或作为注模或压模的模腔中产生图案的部件来使用基本组成部件。可使用此技术产生具有低热阻和良好导电性的金属载体，以防止因高温或改变温度损坏电和光电芯片，例如，激光器。
从硅母体上开始，所述硅基材或母体被以亚微米精度蚀刻并且然后在硅表面上电镀例如镍之类的金属，由此能形成精度和表面光洁度仍然在亚微米范围的镍薄垫片。如果需要的话，在将硅与镍分开之前使薄垫片的后侧面变成平面。在除去硅母体之后，可使用液体形式或薄膜形式的光敏材料形成向下到达镍薄垫片的腔。然后金属化这些腔以形成高精度的三维基本组成部件。
然后使用这些金属精密部件来例如有效地散去来自激光器或其它产生热的芯片的热量。由该方法实现的精度、表面光洁度和测量精度还能使光电元件(例如，具有单模光纤和极致光学镜面的激光器)对准。该方法还提供能传导电流的基本部件，使三维电导体或电极制造成特定的厚度。在电镀循环中还能重复使用根据上述方法形成的模板或外形，从而能实现电镀组成部件的低成本生产。
下面将参照优选实施例和附图详细描述本发明。
附图简介
图1a是微细加工硅板的横截面图。
图1b是覆盖有薄金属膜的制成图案的硅板的横截面图。
图1c是涂有另一金属层的有涂层硅板的横截面图。
图1d是图1c中金属层涂层已经变平或平滑的有涂层硅板的横截面图。
图1e是在除去硅板之后剩下的金属化层的横截面图。
图1f是涂有隔离层的剩下金属层的横截面图。
图1g是具有由感光材料层压而成的隔离层的金属化层的横截面图。
图1h是图1g的金属化层用掩膜曝光的横截面图。
图1i是图1h的金属化层具有溶解部分的横截面图。
图1j是图1i的金属化层具有电镀金属腔的横截面图。
图1k是图1j的金属化层具有蚀刻后剩余感光材料的横截面图。
图1l是各种分开的、释放的和随之形成的基本组成部件的横截面图。
图1m是可以再作为图1g的模型或模板使用的剩余金属化层的横截面图。
图1a描述了一种微细加工的硅板1。用一种或多种下列的方法能获得所得图案：干蚀刻，湿蚀刻，激光加工或火花加工。
图1b示出了如何在制有图案的硅板1上溅射或蒸发称为起始层的薄金属层2，使后面能起动电镀加工。
图1c示出如何在硅板1上的薄金属层2上电镀金属3以在起始层上提供所谓镍薄垫片，金属3优选镍。
图1d示出了如何用例如精研磨或抛光之类的某些机械加工方法已经使牢固地密封在硅板1上的镍薄垫片3变平或光滑。
图1e示出了如何在硅板1与镍薄垫片3颠倒之后使硅板1与镍薄垫片3相互隔开。
图1f示出了如何用在现有的起始层2上的隔离层4覆盖镍薄垫片3，所述隔离层在后面的步骤中能实现隔离，如下面参考图1l所示，但是不防碍电镀，参见图1j。
图1g示出了如何用感光材料5层压具有层2和层3的镍薄垫片。
图1h示出了如何通过所谓光掩膜6使光敏材料5的选择部分曝光。
图1i示出了感光材料如何显影，已经曝光的那些部分溶解在显影剂中以形成腔9，留下没有曝光的感光材料7。如果使用负感光材料，未曝光的部分将溶解在显影剂中。
图1j示出了用选择的金属来电镀模腔以形成组成部件8。
图1k示出了如何用适合于此目的化学制品溶解剩余未曝光的感光材料，使基本组成部件保留在镍薄垫片的隔离层上。
图1l示出了如何利用较早提供的隔离层使各个电镀基本组成部件分离。
图1m示出了如何利用隔离层4使各个电镀基本组成部件8与镍薄垫3分离。镍薄垫片可以再使用并涂上感光材料，如所标箭头指示的图1m至图1g所示。
在某些应用中，可以取消如参照图1k所述的蚀刻感光材料7以释放形成的基本组成部件的步骤，按照从图1m的状态至图1i的状态所标记的箭头方向运行生产循环，重新开始电镀。通过使用与上述操作具有相同基本内容但操作顺序略微不同的操作，能依据电镀的基本结构形成称为电极的电镀电气部件。
应该懂得，本发明不局限于其上面所述和所示的实施例，在下列权利要求的范围内可进行修改。

Claims (4)

1．一种给提供具有图案的基本组成部件的方法，所述基本组成部件如具有例如光纤专用槽之类的图案的载体，其特征在于金属电镀制有图案的硅板；蚀刻硅板；给形成的金属图案涂上感光材料；用光掩膜和光能确定金属图案的界限，从而形成腔；金属电镀形成的腔，以形成包括例如槽之类的图案的金属基本组成部件；其中为了专用作光纤载体或微型结构基本组成部件，所述基本组成部件可与金属分开，可再产生和再使用所述腔以形成新的基本组成部件。
2．一种制有图案的基本组成部件，例如具有如光纤专用槽之类的图案的载体，其特征在于，由金属电镀的制有图案的硅板，通过蚀刻用光掩膜(6)和想要的能量已经限定界限的金属图案(3)，提供为了金属电镀而形成专用金属基本组成部件的腔(9)，所述专用金属基本组成部件呈现与硅板相同的图案，其中可再产生和再使用所述腔以形成新的基本组成部件。
3．如权利要求2所述的基本组成部件，其特征在于所述硅板的制有图案的平面具有能使电镀加工开始的薄金属层(2)。
4．如权利要求3所述的基本组成部件，其特征在于金属层(2)涂有隔离层(4)。
CN99809814A 1998-08-18 1999-08-18 光电子学的金属基本组成部件 Pending CN1313956A (zh)

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SE9802751A SE522114C2 (sv) 1998-08-18 1998-08-18 Metalliska byggelement för optoelektronik
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EP (1) EP1110188A1 (zh)
JP (1) JP2002523805A (zh)
KR (1) KR100575498B1 (zh)
CN (1) CN1313956A (zh)
AU (1) AU5665599A (zh)
CA (1) CA2340987A1 (zh)
HK (1) HK1040548A1 (zh)
SE (1) SE522114C2 (zh)
TW (1) TW396369B (zh)
WO (1) WO2000011628A1 (zh)

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CN102787333A (zh) * 2012-08-22 2012-11-21 江苏大学 光纤激光与电化学复合纳秒脉冲沉积的制造方法和装置
CN102787333B (zh) * 2012-08-22 2015-02-04 江苏大学 光纤激光与电化学复合纳秒脉冲沉积的制造方法和装置

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US7163639B2 (en) 2007-01-16
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HK1040548A1 (zh) 2002-06-14
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