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Número de publicaciónCN1561656 A
Tipo de publicaciónSolicitud
Número de solicitudCN 99814109
Número de PCTPCT/US1999/028636
Fecha de publicación5 Ene 2005
Fecha de presentación3 Dic 1999
Fecha de prioridad4 Dic 1998
También publicado comoCN1294787C, DE69924152D1, DE69924152T2, EP1145612A2, EP1145612A3, EP1145612B1, WO2000035262A2, WO2000035262A3
Número de publicación99814109.7, CN 1561656 A, CN 1561656A, CN 99814109, CN-A-1561656, CN1561656 A, CN1561656A, CN99814109, CN99814109.7, PCT/1999/28636, PCT/US/1999/028636, PCT/US/1999/28636, PCT/US/99/028636, PCT/US/99/28636, PCT/US1999/028636, PCT/US1999/28636, PCT/US1999028636, PCT/US199928636, PCT/US99/028636, PCT/US99/28636, PCT/US99028636, PCT/US9928636
InventoresD·S·翁德日克, D·V·佩德森
Solicitante佛姆法克特股份有限公司
Exportar citaBiBTeX, EndNote, RefMan
Enlaces externos:  SIPO, Espacenet
Method for mounting an electronic component
CN 1561656 A
Resumen  traducido del chino
一种用于安装电子元件的方法。 A method for mounting electronic components. 在该方法的一个例子中,电子元件是靠着诸如承载体的框架之类的承载体的一部分放置的集成电路。 In one example of the method, the electronic component is an integrated circuit such as a carrier part against the carrier frame or the like disposed. 该电子元件具有安装在电子元件上的相应的第一电接触垫上的、多个细长的弹性电接触件。 The electronic component having a respective first electronic components mounted on the electrical contact pad, a plurality of elongate resilient electrical contacts. 将该电子元件固定在承载体上,将该承载体紧压在第一基板上,该第一基板具有位于该第一基板的一表面附近的多个第二电触头。 The electronic component is fixed to the carrier, the carrier is pressed against the first substrate, the first substrate having a first substrate surface located in the vicinity of the second plurality of electrical contacts. 在该方法的一典型例子中,电子元件是可在固定于承载体中的同时被测试的集成电路。 In a typical example of the method, the electronic component is an integrated circuit can be secured to the carrier body while being tested. 该集成电路已从含有多个集成电路的一晶片上分成单个化。 The integrated circuit comprising a plurality of integrated circuits from a wafer into individual oriented.
Reclamaciones(29)  traducido del chino
1.一种用于安装电子元件的方法,所述方法包括:将所述电子元件靠着承载体的框架放置,所述电子元件具有安装在所述电子元件上的相应的第一电接触垫上的多个细长的弹性电接触件,所述多个细长的弹性电接触件延伸超出所述承载体的一表面;将所述电子元件固定在所述承载体上;将所述承载体紧压在第一基板上,所述基板具有位于所述第一基板的一表面附近的多个第二电触头。 1. A method for mounting an electronic component, the method comprising: the electronic component is placed against the frame bearing body, said electronic component having a corresponding first electrical electronic component mounted on said contact pad a plurality of elongate resilient electrical contact member, said plurality of elongate elastic electric contact member extends beyond a surface of the carrier body; said electronic component is fixed on the carrier; the carrier pressed on the first substrate, said substrate having a surface close to said first plurality of second electrical contact substrate.
2.如权利要求1所述的方法,其特征在于,所述电子元件是集成电路(IC)。 2. The method according to claim 1, characterized in that said electronic component is an integrated circuit (IC).
3.如权利要求1或2所述的方法,其特征在于,所述方法还包括:在将所述电子元件靠着所述框架放置之前,先将所述多个细长的弹性电接触件安装在所述电子元件上。 Electronic component against said frame prior to placement of the first plurality of elongate resilient electrical contacts in the: 3. The method according to claim 1 or claim 2, wherein said method further comprises mounted on the electronic components.
4.如权利要求3所述的方法,其特征在于,还包括:在将所述多个细长的弹性电接触件安装在所述晶片上的电子元件之后,使包括所述电子元件的所述晶片分成单个化。 4. The method according to claim 3, characterized in that, further comprising: after the electrical contacts of the plurality of resilient elongate member mounted on said wafer electronic components, so that the electronic device comprises said wafer into individual oriented.
5.如权利要求4所述的方法,其特征在于,在将所述细长的弹性电接触件安装至所述电子元件之后,所述各细长的弹性电接触件至少在少量的处理步骤中是独立的。 5. The method according to claim 4, characterized in that, after the electrical contacts of the elongated elastic member is mounted to the electronic device, each of said elongate resilient electrical contact member at least in a small number of process steps It is independent.
6.如权利要求5所述的方法,其特征在于,所述固定包括将一顶部放置在所述承载体上。 6. The method according to claim 5, characterized in that said fixing comprises placing a top on said carrier.
7.如权利要求5所述的方法,其特征在于,当所述细长的弹性电接触件用于电连接时,所述框架的尺寸限定了对于所述各细长的弹性接触件的最大压缩限度。 7. The method according to claim 5, characterized in that, when said elongate resilient electrical contacts for electrical connection, the size of the frame for defining the respective elongated elastic contact piece Maximum Compression limits.
8.如权利要求7所述的方法,其特征在于,所述细长的弹性电接触件将所述第一电接触垫电连接至相应的所述第二电触头上。 8. The method according to claim 7, characterized in that said elongate resilient electrical contact member of said first electrical contact pads electrically connected to the respective said second electrical contact.
9.如权利要求7所述的方法,其特征在于,所述第一基板是用于测试所述电子元件的测试电路板。 9. The method according to claim 7, characterized in that said first substrate is a test of the electronic components for testing circuit boards.
10.如权利要求7所述的方法,其特征在于,所述第一基板是用于使用所述电子元件的最终包装。 10. The method according to claim 7, wherein the first substrate is used for the final packaging of electronic components.
11.如权利要求7所述的方法,其特征在于,所述电子元件是靠着所述框架放置的,而不具有用于所述电子元件的一分离的包装。 11. The method according to claim 7, characterized in that said electronic component is placed against said frame, rather than having a separate package for said electronic component.
12.如权利要求6所述的方法,其特征在于,所述顶部基本呈平面状。 12. The method according to claim 6, characterized in that said substantially planar top.
13.如权利要求6所述的方法,其特征在于,所述顶部包括自所述顶部的一表面突出的一个部分,所述部分被构成为紧压在所述电子元件的一表面上。 13. The method according to claim 6, characterized in that said one portion comprises a top surface projecting from said top, said portion being configured as a pressed on a surface of the electronic component.
14.如权利要求7所述的方法,其特征在于,所述细长的弹性电接触件在所述电子元件的测试中的压缩程度要小于测试后使用时的压缩程度。 14. The method according to claim 7, characterized in that said elongated elastic electric contact member in the degree of compression degree of the compression test of the electronic components is less than the test after use.
15.如权利要求7所述的方法,其特征在于,还包括:使所述承载体相对于所述第一基板自动对齐。 15. The method according to claim 7, characterized in that, further comprising: said carrier member is automatically aligned with respect to the first substrate.
16.如权利要求15所述的方法,其特征在于,所述承载体包括多个第一部分,并且所述第一基板包括多个第二部分,所述第二部分被构成为与所述多个第一部分唯一匹配,以使所述承载体相对于所述第一基板自动对齐。 16. The method according to claim 15, wherein said carrier comprises a plurality of first portions and said first substrate comprises a plurality of second portions, the second portion is configured with the multi- a first portion of a unique match, so that the carrier with respect to the automatic alignment of the first substrate.
17.如权利要求16所述的方法,其特征在于,所述多个第一部分自所述承载体的所述表面突出,所述表面面对所述第一基板,并且所述多个第二部分是位于所述第一基板上的接纳结构,所述接纳结构用于接纳所述第一部分。 The method of 16 wherein said second plurality claim 17., wherein said plurality of said first surface portion projecting from said carrier, said surface facing the first substrate, and structure of the receiving portion is located on the first substrate, said first receiving structure for receiving said portion.
18.如权利要求17所述的方法,其特征在于,所述多个第一部分自所述承载体的延伸长度要大于所述多个细长的弹性电接触件的延伸长度,籍此,所述多个第一部分将早于所述多个细长的弹性电接触件先触及平面,从而当所述承载体不紧压在所述第一基板上时,保护所述接触件。 18. The method according to claim 17, wherein said plurality of lengths extending from said first portion is greater than the carrier of the plurality of elongate elastic member extending the length of the electrical contacts, whereby, the a first portion of said plurality of first touches the plane prior to the plurality of elongated resilient electrical contact member, whereby when said carrier is not pressed against said first substrate, said contact member protection.
19.如权利要求5所述的方法,其特征在于,所述电子元件是通过下列方式固定在所述承载体上的:用连接在所述承载体上的保持件来固定所述电子元件的第一侧面;所述框架固定所述电子元件的第二侧面,所述第二侧面与所述第一侧面相对,所述多个细长的弹性电接触件安装在所述电子元件的所述第二侧面上。 19. The method according to claim 5, characterized in that said electronic component is secured in the following manner on the carrier: The carrier is connected to said retaining member fixed to said electronic device a first side surface; fixing the second side of the electronic component frame, said second side opposite the first side, the plurality of resilient electrical contacts mounted on said elongated member of said electronic components on the second side.
20.如权利要求19所述的方法,其特征在于,所述保持件机械毗邻所述电子元件的所述第一侧面的至少一部分,所述框架机械毗邻所述电子元件的所述第二侧面的至少一部分。 20. The method according to claim 19, characterized in that at least a portion of said holding member adjacent to said mechanical electronic components of the first side of the frame of the machine adjacent to the second side of the electronic component at least a portion.
21.如权利要求20所述的方法,其特征在于,所述保持件包括至少一个开口。 21. The method according to claim 20, characterized in that said holding member comprises at least one opening.
22.如权利要求21所述的方法,其特征在于,还包括:在将所述电子元件固定在所述承载体中之后,通过所述保持件中的所述至少一个开口在所述电子元件上制作标记。 22. The method according to claim 21, characterized in that, further comprising: the electronic component secured to the carrier body, after, the holding member by the at least one opening in said electronic component the production mark.
23.如权利要求22所述的方法,其特征在于,所述标记体现出涉及所述电子元件的测试结构的信息。 23. The method according to claim 22, characterized in that said marker reflecting the information related to the electronic components of the test structure.
24.如权利要求23所述的方法,其特征在于,所述测试包括所述电子元件的熔接测试。 24. The method according to claim 23, characterized in that said testing of said electronic device comprises a welding test.
25.如权利要求5所述的方法,其特征在于,还包括:将来自所述电子元件的热量传递至所述承载体上的热量传递媒体。 25. The method according to claim 5, characterized in that, further comprising: a heat transfer from the electronic component to the carrier body heat transfer media.
26.如权利要求20所述的方法,其特征在于,所述保持件包括用于传递来自所述电子元件的热量的开口。 26. The method according to claim 20, wherein said holding member comprises transferring heat from the opening of the electronic components.
27.如权利要求20所述的方法,其特征在于,所述保持件包括用于测量所述电子元件的温度的探头。 27. The method according to claim 20, wherein said holding member comprises for measuring the temperature of the electronic components of the probe.
28.如权利要求20所述的方法,其特征在于,所述承载体靠着所述第一基板安装,然后,将所述电子元件靠着所述框架放置,接着,将所述电子元件固定在所述承载体上。 28. The method according to claim 20, characterized in that said carrier member against said first mounting substrate, and then the electronic component is placed against said frame, and then, fixing the electronic component on the carrier.
29.如权利要求20所述的方法,其特征在于,将所述电子元件靠着所述框架放置,然后,将所述电子元件固定在所述承载体上,接着,将所述承载体紧压在所述第一基板上。 29. The method according to claim 20, wherein said electronic component is placed against said frame, and then the electronic component is fixed on the carrier, then the carrier immediately Pressure on the first substrate.
Descripción  traducido del chino
用于安装电子元件的方法 A method for mounting electronic components

发明背景发明的技术领域本发明总的涉及电子组件及其测试方法。 Technical Field of the Invention invention generally relates to electronic components and their test methods of the present invention. 更具体地,本发明涉及从最初的晶片至测试板、印刷电路板、以及/或最终的产品基板对芯片进行传送和处理的方法和装置。 More particularly, the present invention relates to a method and apparatus to test from the initial wafer boards, printed circuit boards, and / or final product on the substrate and the chip transfer process.

相关技术的描述许多年来芯片规模封装的主题一直是本行业中的热点研究问题。 Description of the related art for many years been the subject of chip scale package is the industry hot research question. 一个非常有前景的技术包括将一小型弹性体固定在适当的基板上,并使这些元件在运行的装置和其他电路之间形成接触。 A very promising technique involves a small resilient body is fixed on a suitable substrate, and these elements between the operating device and other circuitry to form a contact. 用来制造用于微电子的弹性互连体以及用来将弹性接触体直接构造在半导体装置上的方法是已知的。 Used to make the elastic interconnection used in microelectronics and used to construct the elastic contact member directly on a semiconductor device a method is known. 一特别有用的弹性互连体包括一自由竖立的弹性接触体,该弹性接触体在一端固定在一电子装置上,并具有远离该电子装置的一自由端,从而容易地接触第二电子装置。 A particularly useful elastomeric interconnection comprises a free standing resilient contact member, the elastic contact member is fixed at one end on an electronic device, and remote from the electronic device having a free end so as to easily contact the second electronic device. 例如,见第5,476,211号美国专利“Method for ManufacturingElectrical contacts,Using a Sacrificial Member”(“使用牺牲体来制造电接触体的方法”)。 For example, see U.S. Patent No. 5,476,211 "Method for ManufacturingElectrical contacts, Using a Sacrificial Member" ("sacrificial body to make electrical contact with the body of the method").

具有安装在其上的弹性接触体的半导体装置可视为弹性的半导体装置。 The semiconductor device having a resilient contact member mounted thereon a semiconductor device can be regarded as elastic. 弹性半导体装置能够以两种主要方式中的一种与一个互连基板相互连接。 Flexible semiconductor device capable of one of two main ways interconnected with an interconnect substrate. 可以永久地连接,例如通过将弹性接触体的自由端焊接在互连基板例如一印刷电路板的相应的接线端上。 It may be permanently connected to, for example, by welding the free end of the elastic contact member in the interconnection substrate such as a printed circuit board on the corresponding terminal. 另外,也可以简单地通过对着互连基板推压弹性半导体装置以在接线端和弹性接触体的接触部分之间形成压力连接,从而可调换地连接于接线端。 Alternatively, it can simply by pressing against the interconnection substrate, a semiconductor device with an elastic contact portion between the terminal and the elastic body is formed in contact pressure connection, which can be swapped connected to the terminal. 这样的可调换的压力连接可描述为弹性半导体装置的自我插接。 Such pressure connections can be swapped elasticity of the semiconductor device can be described as self-insertion. 制造带有弹性封装(MicroSpringTM接触体)的半导体的讨论可在1998年11月3日授权的第5,829,128号美国专利“Method of MountingResilient Contact Structures to Semiconductor Devices”(“将弹性接触结构安装在半导体装置上的方法”)中找到。 Discussion of fabricating a semiconductor package with an elastic (MicroSpringTM contact body) is available in 3 November 1998 authorizing the United States Patent No. 5,829,128 "Method of MountingResilient Contact Structures to Semiconductor Devices" ("The resilient contact structure is mounted on a semiconductor device method ") be found. 使用和测试带有MicroSpringTM接触体的半导体的讨论揭示在1998年11月4日递交的名为“Socket for Matingwith Electronic Component,Particularly Semiconductor Device withSpring Packaging,for Fixturing,Testing,Burning-in or Operating Sucha Component”(“与电子元件、特别是带有弹性封装的半导体装置相匹配、用于固定、测试、熔接(burning-in)或操作该元件的插座”)并转让给本发明的受让人的美国专利申请09/205,502中。 We discuss the use and testing of semiconductors with MicroSpringTM contact body revealed in November 4, 1998, filed named "Socket for Matingwith Electronic Component, Particularly Semiconductor Device withSpring Packaging, for Fixturing, Testing, Burning-in or Operating Sucha Component" ("electronic components, especially semiconductor device having an elastic encapsulated matches for fixing, testing, welding (burning-in) or operating outlet of the element") and assigned to the assignee of the present invention, U.S. Patent Application 09 / 205,502 in.

能够从与互连基板的压力连接状态移开弹性半导体装置在替换或升级弹性半导体装置的情况下非常有用,可简单地通过与弹性半导体装置形成可调换的连接获得一非常有用的目的。 Can be connected to the pressure from the state of removing resilient interconnection substrate of the semiconductor device is useful in the case of replacement or upgrade resilient semiconductor device can be formed simply by connecting the interchangeable elastic obtain a semiconductor device useful purpose. 这对于暂时或永久地安装到一系统的互连基板上以熔接弹性的半导体装置或者确定该弹性的半导体装置是否达到其规格也是有用的。 This temporarily or permanently installed on the system interconnection substrate with a fused elastic resilient semiconductor device or a semiconductor device that determines whether the specifications are also useful. 总的来说,这可通过与弹性接触体形成压力连接来完成。 In general, this can be in contact with the elastic member is formed by a pressure connection to complete. 这样的接触具有依靠接触力等可松开的限制。 Such contact with a contact force and other limitations rely releasable.

在一个典型的制造工艺中,晶片接受有限的测试以确定总体功能和晶片上的单个部分的失效。 In a typical manufacturing process, the wafer receiving limited testing to determine the failure of a single part of the overall function and the wafer. 而后该功能良好的半导体部分或芯片被封装用于进一步熔接和更为全面的测试。 Then the well-functioning of the semiconductor chip is packaged in part or used for further fusion and more comprehensive tests. 封装工艺既昂贵又费时。 Packaging process is both expensive and time consuming.

使用用于互连体的MicroSpring接触体提供了在位于晶片上时完全能够测试的芯片。 MicroSpring contact body to use for interconnection provided on the wafer when in fully able to test the chip. 测试晶片的一个较佳的方法是使它们单个化(singulate),而后移动它们通过正在封装的装置上进行的或多或少的典型测试流程。 A preferred method of test wafer is a single of them (singulate), then move them through typical testing procedures on the package means being more or less. 一个关键的区别是芯片一旦从晶片上单个化之后就被封装,但是目前的测试装备并不适于与此类装置一起使用。 A key difference is that after the chip from the wafer into individual pieces once it was packaged, but the current test equipment is not suitable for use with such devices.

为此,芯片级的部分或IC晶片一旦从最初的晶片上被切成小片之后就可放置到承载体中。 To this end, chip-level section or IC wafer once from the initial wafer is cut into small pieces can be placed into the carrier body. 而后承载体将芯片传送到测试板上以进行例如熔接测试。 And then transferred to the carrier chip test board for testing such as welding. 一旦承载体中的所有芯片通过检查,而后承载体可用来将芯片传送和安装到印刷电路板上或最终的产品基板上。 Once the body carries all the chips by checking, then the chip carrier can be used to transmit and mounted on the printed circuit board or substrate final product.

该承载体对于具有MicroSpring接触体或类似接触体的芯片特别有用。 The carrier is particularly useful for chips with MicroSpring contact body or similar contact body. 该承载体对于与具有合适连接机构的测试装置或最终产品形成接触的传统芯片也是有用的。 The carrier for the test device or the final product with a suitable attachment mechanism formed in contact with conventional chips are also useful. 具有MicroSpring接触体的测试装置或最终产品对于连接传统的芯片是特别有用的。 Test apparatus or final product having MicroSpring contact body for connecting conventional chips are particularly useful.

芯片级的承载体相对于现有技术提供了几个优点。 Chip carrier level relative to prior art provides several advantages. 第一,可以测试单个芯片,并且如果未通过测试可以将其替换。 First, you can test a single chip, and if you do not pass the test can be replaced. 第二,芯片级的承载体可以结合能够跟踪单个芯片的跟踪机构,在承载体上储存相关信息以进行监控和跟踪。 Second, the carrier can be combined with chip-level single chip capable of tracking mechanism to track, store related information on the carrier to be monitored and tracked. 第三,在传送、储藏和使用过程中,芯片级的承载体使得能够容易地处理许多芯片并保护诸芯片及它们的弹性接触体。 Third, in the transport, storage and use, supports chip-level enables easy handling many chip and protect such chips and their elastic contact body. 而且,承载体可以限制芯片上的弹性接触体在测试时的压缩量,该压缩量可以小于在随后的芯片的主要使用中所允许的压缩。 Moreover, the carrier body can limit the amount of compression on the resilient contact chip in the test, which may be less than the amount of compression is mainly used in the subsequent chip allowed in compression. 压缩的限制可通过确定弹性接触体在测试阶段所允许的最大压缩的设计来获得。 Compressed by determining the limit allowed by the elastic contact body in the testing phase of maximum compression is designed to obtain. 而后,对于实际的使用可采用不同的限制。 Then, for the actual use may be different restrictions. 该特征可以延长弹性体的“运行”寿命。 This feature can be extended "Run" life elastomer.

发明概述本发明总的涉及一种用于安装诸如集成电路之类的电子元件的方法。 Summary of the Invention The present invention generally relates to a method for mounting electronic components such as integrated circuits are. 在本发明方法的一个例子中,将电子元件靠着诸如框架之类的承载体放置。 In one example of the method of the invention, the electronic components such as the frame against the carrier and the like are placed. 该电子元件包括安装在电子元件上的相应的第一电接触垫上的、多个细长的弹性电接触件。 Corresponding first electrical mounting the electronic component on the electronic component comprises a contact pad, a plurality of elongate resilient electrical contacts. 这些细长的弹性电接触件延伸超出承载体的一表面。 The elongated elastic member extending beyond an electrical contact surface of the carrier. 将电子元件固定在承载体上,将该承载体紧压在第一基板上,该基板具有位于该第一基板的一表面附近的多个第二电触头。 The electronic component is fixed to the carrier, the carrier is pressed against the first substrate, the substrate having a surface located in the vicinity of the first substrate a plurality of second electrical contacts.

在本发明方法的一特殊的例子中,当这些细长的弹性电接触件用于电连接时,框架的尺寸限定了对于各细长的弹性接触件的最大压缩限度。 In one specific example of the method of the present invention, when the elongate resilient electrical contacts for electrical connection, the frame size is defined for each of the elongated elastic contact piece limits maximum compression.

附图简介通过参考附图以举例方式进一步描述本发明,在附图中:图1A是本发明的承载体组件的剖视图,该组件包括支承一芯片的一承载体以及将芯片固定在承载体中的一盖子。 BRIEF DESCRIPTION By way of example, with reference to the accompanying drawings further describe the present invention, in the drawings: Figure 1A is a cross-sectional view of the carrier assembly of the present invention, the assembly includes a carrier supporting a chip carrier and the chip is fixed in the body A lid.

图1B和1C示出本发明的一个较佳实施例。 1B and 1C of the present invention illustrating a preferred embodiment.

图1D示出本发明的另一较佳的实施例。 Figure 1D shows another preferred embodiment of the present invention example.

图1E示出含有九个承载体的JEDEC托架,并示出将要附加到该托架上的第十个托架。 Figure 1E shows a JEDEC tray containing nine bearing body and shows will be attached to the bracket of the tenth bracket.

图2A是本发明的承载体的一个实施例的俯视图。 2A is a plan view of the embodiment of the present invention carrier.

图2B是本发明的承载体的第二实施例的俯视图。 2B is a plan view of a second embodiment of the carrier of the present invention.

图3A是具有位于其内的诸孔的本发明的一盖子的一个实施例的俯视图。 3A is a top plan view of an embodiment of a lid having the holes located therein according to the present invention.

图3B是具有位于其内的诸孔的本发明的一盖子的第二实施例的俯视图。 3B is a lid having located therein the holes of the second embodiment of the present invention, a top view.

图4是是本发明的承载体组件的另一实施例的剖视图,该组件包括支承芯片的一承载体以及弹性锁定在所述承载体上并将所述芯片固定在所述承载体中的一盖子。 Figure 4 is a cross-sectional view of another bearing assembly embodiment of the present invention, the assembly includes a chip carrier support and a resilient locking member and said carrier on said chip carrier is fixed to the body of a cover.

图5是图1A所示安装在测试板上并使用支脚的本发明的该实施例的剖视图。 Figure 5 is shown in Fig. 1A is installed on the test board and use the foot of the present invention, a cross-sectional view of this embodiment.

图6A是安装在测试板上并使用薄垫片的本发明的另一实施例的剖视图。 6A is to install another test board and use shims of the present invention cross-sectional view of an embodiment.

图6B是安装在测试板上并使用薄垫片的本发明的另一实施例的剖视图。 6B is another test board installation and use shims cross-sectional view of the present invention embodiment.

图7是本发明的另一实施例的剖视图,其中承载体具有位于每个开口中的两凸缘,并且盖子具有向下延伸进入到开口中以将芯片固定在承载体中的一附加的部分。 7 is a sectional view of another embodiment of the present invention, wherein the carrier body having an opening located in each of the two flanges, and the lid having extending downwardly into the opening in the chip carrier is fixed to a portion of an additional .

图8是本发明的另一实施例的剖视图,其中承载体自身通过使用弹性锁、而不是盖子将芯片固定就位。 8 is a sectional view of another embodiment of the present invention, wherein the carrier itself by using an elastic lock lid instead of the chip in place.

图9A是示出通过降低横过板的后部的一个臂来将本发明的承载体组件夹在板上的一方法的剖视图。 9A is a sectional view through the lower rear portion of one arm across the board to the carrier assembly of the present invention is a method of sandwiching the board.

图9B是本发明的另一实施例的剖视图,其中通过弹簧加载的保持臂将承载体固定到负载板上。 9B is a cross-sectional view of another embodiment of the present invention, wherein a spring-loaded arm holding the load carrier fixed to the plate.

图9C是本发明的另一实施例的剖视图,其中通过弹簧加载的螺栓将承载体固定到负载板上。 9C is a cross-sectional view of another embodiment of the present invention, wherein a spring-loaded by a bolt fixing the carrier to the load plate.

图9D示出本发明的一个特别较佳的实施例。 9D shows the present invention are particularly preferred embodiments.

图10是示出将承载体组件安装到板上的另一方法的剖视图,其中承载体组件被首先安装到臂上,而后降低到板上的适当位置中。 FIG. 10 is a sectional view of the carrier plate assembly to another method, wherein the carrier assembly is mounted to the first arm, then lowered into place board.

图11是示出将图8所示的承载体组件安装到板上的一方法的剖视图。 FIG 11 is a cross-sectional view showing the carrier assembly shown in Figure 8 is mounted to a method of the board.

图12A是本发明的一承载体组件的剖视图,其中板上的定位孔具有倾斜的前边缘,以致承载体组件滑入到适当位置中并通过越过板上的相应接触垫的芯片的弹性接触体产生擦拭动作。 12A is a cross-sectional view of the carrier assembly of the present invention, wherein the positioning hole plate having a front edge slanted so that the resilient contact member carrier assembly slides into place and through the corresponding contact pads of the chips across the board produces wiping action.

图12B和12C示出包括弹性部分、相应的承载体、盖子和芯片的一测试板的侧视图和俯视图。 12B and FIG. 12C shows a resilient portion comprises a corresponding carrier, a cover and a chip test board side and plan view.

图13A是还包括位于承载体上的跟踪标签和位于芯片上的辨识标记的本发明的承载体的俯视图。 13A is further comprising a carrier tracking label on the body and located a plan view of identification marks on the chip carrier according to the present invention.

图13B是还包括位于承载体上的一跟踪标签和连接至电子存储装置的一连接部分的本发明的承载体的端视图。 13B is further comprising carrying a tracking tag on the body and is connected to the end view of the carrier of a connecting portion of the electronic storage device of the present invention.

图13C是示出用于多个承载体的一托架的立体图。 13C is a diagram showing a perspective view of a bracket for a plurality of carrier body.

图14是示出包含在制造、传送和最终的使用过程中跟踪承载体和/或单个芯片的步骤中的流程图。 14 is a diagram showing the steps included tracking carrier and / or a single chip in the manufacture, transfer and end-use of the process of the flowchart.

图15是示出包含在制作和利用本发明中的步骤的流程图。 15 is a flowchart illustrating the steps included in the production and use of the present invention.

发明的详述现描述通过测试和最终的应用来操纵集成电路(IC)芯片的一方法和装置。 Detailed Description of the invention will now be described by testing and final application to manipulate the integrated circuit (IC) chip, a method and apparatus. 揭示了用于跟踪该芯片的一方法和装置。 It discloses a method and apparatus for tracking the chip. 在以下的详尽描述中,列出了多个具体细节以更为完全地理解本发明。 In the following detailed description, numerous specific details are listed in a more complete understanding of the present invention. 但是,也可以在没有这些具体细节的情况下实施本发明,这对于本领域的技术人员而言是显而易见的。 However, the present invention can also be implemented without these specific details, which for the skilled person that is obvious. 在其它方面,众所周知的装置、方法、过程和单个元件没有详尽描述,只要不会不必要地使本发明的诸方面变得难以理解就行。 In other aspects, the well-known devices, methods, procedures, and no detailed description of the individual components, provided they do not unnecessarily aspects of the present invention will become difficult to understand on the line.

本发明提供了在从最初的晶片切割之后在测试过程中用来传送和跟踪集成电路芯片的承载体。 The present invention provides a wafer after the initial cut for transmitting and tracking integrated circuit chip carrier during the test. 本发明的承载体一般用来在测试中传送和支承芯片,并可被贴上标签以跟踪该承载体及其单个组成部分。 Carrier of the present invention is generally used to transport and support chips in the test can be labeled to track the carrier and its individual components. 本发明的承载体可用于具有焊接弹性、针孔弹性或压力弹性接触体的芯片。 Carrier of the present invention can be used with welding elastic, resilient or pinholes resilient contact pressure member chip. 一旦完成测试,该承载体可被传送和安装在印刷电路板上以形成最终的基板外壳。 Once testing is completed, the carrier may be transferred and mounted on a printed circuit board to form the final substrate housing.

该承载体可用于根本没有弹性体的芯片,以与包括用来与芯片建立电接触的适当接触机构的测试或最终应用产品相接合。 The carrier can be used no chip elastomer, and comprising means to establish electrical contact with the chip contacts the appropriate agency, or the final application of the test product engagement. 一个较佳的测试产品包括与本申请中详尽描述的位于硅片上的弹性体相类似的弹性的、自由竖立的接触体。 A preferred test products include a detailed description of the present application is located on a silicon elastomer similar flexible, free standing contact body. 一个较佳的最终应用产品包括相似的弹性体。 A preferred application of the final product include similar elastomers.

本发明的一总的实施例示出在图1A中。 A total of embodiments of the present invention is shown in Figure 1A. 该承载体或较低的组成部分10被用来在芯片12的传送、测试和/或最终的应用中承载芯片12。 Or the lower part of the composition of the carrier 10 is used in the chip 12 transport, testing, and / or final applications hosted chip 12. 承载体10一般是用有机材料例如聚合物制造并可使用注塑模制来形成的。 Carrier 10 is generally used organic materials such as polymer manufacture and use of injection molding to form. 在一个较佳的实施例中,将环氧玻璃层压材料切成一定的尺寸并加工成想要的形状。 In a preferred embodiment, the epoxy-glass laminate material is cut to size and processed into a desired shape. 通过开口14将芯片12放置到承载体10中,在此它停靠在形成开口14的基部的至少一部分的衬里的凸缘18上。 Placing the chip 12 through the opening 14 into the carrier 10, where it rests on at least a portion of the liner is formed an opening 14 of the base portion of the flange 18. 注意到开口14的壁较佳地是斜面以允许容易地将芯片12插入到开口14中。 Noting the opening wall 14 is preferably beveled to allow easy the chip 12 is inserted into the opening 14. 而且,注意在封装该芯片之前将该芯片放置到承载体中。 Also, note that in the place before encapsulating the chip in the chip to the carrier. 即,没有围绕和保护芯片的外壳。 That is, there is no housing around and protect the chip. 在承载体10中测试之后,该承载体可作为芯片12的最终外壳。 After 10 test carrier, the carrier can be used as a final shell chip 12.

芯片12的弹性部分16通过开口14向下延伸以在将来与测试板、印刷电路板或最终应用的基板外壳的接触垫形成电接触。 12 elastic portion 16 of the chip 14 extends downwardly through an opening in the future in order to contact with the test board, a printed circuit board or the final application of the substrate housing electrical contact pads. 弹性部分16延伸通过开口14并伸出凸缘18的下侧。 Resilient portion 16 extends through the opening 14 and the lower side of the flange 18 extends. 弹性部分或接触体16一般是细长的弹性的电接触体。 Or contact with the elastic part 16 is generally elongated electrical contacts flexible. 对此类弹性的电接触体的详尽讨论揭示在1999年2月2日授权给Eldridge等人并转让给本发明的受让人的第5,864,946号美国专利“制造接触末端结构的方法”中,该专利的内容通过引述结合在此。 A thorough discussion of such resilient electrical contacts revealed in February 2, 1999 authorized the US Patent "Method for manufacturing the contact tip structure," No. 5,864,946 Eldridge et al. And assigned to the assignee of the present invention, the Content patent is incorporated herein, by reference.

注意高度H=H1-H2给弹性部分16设置了最大的压缩界限。 Note that the height H = H1-H2 resilient portion 16 is set to maximum compression limit. H1是从承载体10的底部至盖子20底部的尺寸,盖子20的底部是当弹性部分被压缩时芯片的顶部的位置。 H1 from the carrier to the size of the bottom 10 of the bottom cover 20, bottom cover 20 is the position of the top of the chip when the elastic portion is compressed. H2是芯片的厚度。 H2 is the thickness of the chip. 需要考虑的另一因素是在特定的几何形状下,弹性部分将接触高出某些接触表面的接线端并处在开口14中。 Another factor to consider is that in the specific geometry of the flexible portion of the contact terminal up and impose some contact surfaces in the opening 14. 该情况下,在最大的压缩下确定最小的弹性部分长度时必须考虑接线端的厚度。 In this case, at maximum compression must be considered to determine the minimum thickness of the terminal portion of the length of the elastic.

换言之,被压缩的弹性部分不会超过高度H。 In other words, the compressed elastic portion does not exceed the height H. 总体上,有三个特别需要注意的弹性部分高度-1)新产品或静止高度(例如30密耳),2)用于测试的熔接高度(例如28密耳),3)运行高度(例如25密耳)。 Overall, there are three elastic part to note the height of -1), a new product or a stationary height (for example, 30 mils), and 2) to test the weld height (for example 28 mils), 3) operating altitude (such as 25 secret ear). 在测试过程中尽可能不压缩弹性部分以保持弹性部分的寿命,即,保持弹性以在后面的操作中呈现最佳的性能。 During the test as much as possible to maintain the life of the elastic portion compression elastic portion, that is, to maintain flexibility to present the best performance in subsequent operations. 换言之,对于最后的操作,增加弹性部分的压缩是合乎需要的以确保良好的电接触,在最后的操作之前最小的压缩是合乎需要的。 In other words, the last operation, increasing the compression of the resilient portion is desirable to ensure good electrical contact, prior to the final operation of the minimum compression is desirable.

图1B和1C示出图1A所示装置的分解的侧视图和俯视图。 1B and 1C illustrate a device exploded side view and a top view shown in Figure 1A. 这些视图示出2×4布置的芯片,以及带有相应开口的盖子20。 The view shows the 2 × 4 arrangement of chips, and a cover with corresponding openings 20. 图1D示出本发明的另一较佳的实施例。 Figure 1D shows another preferred embodiment of the present invention example. 该视图示出1×8布置的八个芯片、承载体10、盖子20和辐射体20A。 This view shows the arrangement of eight 1 × 8 chip carrier 10, the cover 20 and the radiator 20A. 在该分解的视图中,所示的固定销钉8的长度被放大以示出分解的视图。 In this exploded view, the length of the fixing pin 8 is shown in an enlarged exploded view to show. 实际上,固定销钉8的长度能够将盖子20对着承载体10牢固地夹持就位,并对着板30固定住承载体10。 In fact, the length of the fixing pin 8 can lid 20 against the carrier member 10 is firmly held in place and hold the plate 30 against the carrier 10.

图2A和2B示出承载体10的俯视图,示出了承载体10中的开口14的可能性布置的两个例子。 Figures 2A and 2B show a plan view of the carrier member 10, showing the possibility of two examples of carrier 10 in the opening 14 of the arrangement. 图2A是具有设置成两排各四个开口的八个开口的承载体10(对应于图1A所示承载体10的剖视图)的图示。 Figure 2A is a set (corresponding to a cross-sectional view shown in FIG. 1A body 10 carries) illustration carrier two rows of eight each opening four openings 10. 图2B是另一布置,其中八个开口14a在承载体10中(该俯视图不直接对应于图1A所示的剖视图)定位成单个直线排。 2B is another arrangement in which eight openings 14a in the carrier body 10 (the cross-sectional plan view does not directly correspond to the view shown in FIG. 1A) positioned in a single straight row. 注意尽管图2A和图2B所示的是具有设置成直线方式的八个开口14的承载体10,但这并不是本发明的要求。 Note that although Figures 2A and 2B is 10, but this is not a requirement of the present invention having eight openings arranged in a linear fashion the carrier 14. 相反,依据多个因素,设计选择承载体10中的开口14的实际数量、位置和方向。 On the contrary, according to a number of factors, design choices carrier body 10 the actual number, the position and orientation of the opening 14.

再次参见图1A,一个盖子20(或帽盖等等)连接在承载体10上。 Referring again to FIG. 1A, a cover 20 (or cap, etc.) connected to the carrier 10. 对于该承载体,可用有机材料使用注塑材料的方法形成盖子20。 For the carrier, the use of organic materials can be used in the method of forming a molding material 20 covers. 在一个较佳实施例中,该盖子是用环氧玻璃层压材料加工成的。 In a preferred embodiment, the cap is working with epoxy glass laminate into. 该盖子还可以包括一金属层以助于散热,并可以增加散热部分,例如安装在其上的翼片。 The lid may also include a metal layer to facilitate heat dissipation, and can increase the cooling portion, e.g., flap mounted thereon. 该盖子可被视为一个保持体。 The cover can be regarded as a holding body. 注意任何保持体例如弹性锁(snap lock)、滚珠轴承、保持器、单个杆等等都可用来附加到盖子上以将芯片固定在承载体中。 Note that any holding body such as an elastic lock (snap lock), ball bearings, cage, single lever, etc. can be used to attach the lid to the chip is fixed to the carrier body. 该保持体将通常被定位成当该芯片被放置在承载体中时机械地邻接芯片的后侧表面的一部分。 The holding body would normally be positioned such that when any part of the chip is placed in the rear side of the carrier surface mechanically adjacent chip.

盖子20起到两个基本作用。 Cover 20 serves two fundamental role. 首先,在传送过程中盖子20用来将芯片12固定在承载体10的开口14中。 First, the cover 20 during transmission chip 12 is fixed to the carrier 10 of the opening 14. 第二,当芯片12在测试或使用过程中承受加压时,盖子20提供顶靠芯片12的后侧的阻力。 Second, when the chip 12 to withstand pressure during testing or use, the cover 20 abuts the rear side of the chip 12 to provide the resistance. 该加压来自推压芯片12和下面的基板例如测试板(见图5)的弹性部分的力。 The pressing force of the elastic portion from the pressing chip 12 and the underlying substrate such as test board (see FIG. 5). 盖子20以几种机械连接方式中的任意一种连接在承载体10上。 Cover 20 in several mechanical connection to any kind of connection on the carrier 10. 图1A中所示的是按扣(snap)壳体22B和按扣头部22B。 Figure 1A shows the snap (snap) housing 22B and snaps head 22B. 按扣头部22A通过铆钉22固定在盖子20上。 Snaps the head 22A is fixed by a rivet 22 on the lid 20. 但是,也可以使用螺帽和螺栓或者一个夹子。 However, you can use a nut and bolt or a clip. 图5和6B包含使用将两个部分固定在一起的弹性锁的一变型的另一实施例的图示。 Figure 5 illustrates the use and 6B contains two parts together another elastic lock a variant of the embodiment. 连接承载体10和盖子20的方法并不重要,只是确保这是一个暂时连接,在本发明的大部分(并非全部)情况下是有用的。 The method of connecting carrier 10 and cover 20 is not important, just make sure this is a temporary connection, in most (not all) of the invention are useful. 暂时的连接允许在后面的时刻将盖子20取下来,例如在测试或使用之后取下芯片12时,或者允许取下和替换具体的芯片12时,或者允许替换盖子20自身时。 Temporary connections allow time later to take down the lid 20, for example, after removing 12 test or use the chip, or allow removal and replacement of specific chip 12, or when allowed to replace the cap 20 itself.

盖子20还可以包括暴露芯片12的后侧的一部分的开口24。 Cover 20 may also include openings exposing a portion of the rear side 12 of the chip 24. 在图1A中,示出了暴露芯片12的后侧的大部分并被定位成基本位于芯片12和承载体开口14的中心之上的单个开口24。 In Figure 1A, there is shown a rear side chip 12 is exposed and positioned substantially most of the chip carrier 12 and a single central opening 14 above the opening 24. 图3A提供了盖子20的俯视图,示出位于每个芯片12之上的诸矩形开口24。 Figure 3A provides a top view of the cap of FIG. 20, the chip 12 is shown located above each such rectangular openings 24. 注意,但是,开口24并不需要是矩形的或位于每个芯片之上的单个。 Note, however, the opening 24 need not be rectangular or located above each individual chip. 例如,图3B示出盖子20a的可行的另一实施例,其中在承载体10中的每个芯片12之上具有两个椭圆形的开口24a。 For example, FIG. 3B shows another possible embodiment of the cover 20a, wherein each chip 10 on the carrier body 12 has two oval openings 24a.

尽管盖子20不需要具有开口并可以是实心的片状材料,但诸开口给本发明的承载体提供了几个优点。 Although the lid 20 need not have an opening and can be solid sheet material, but all the openings to the carrier of the present invention provides several advantages. 首先,诸开口24允许控制温度的气体直接传送到芯片12的后侧。 First, such an opening 24 allows to control the temperature of the gas is directly transferred to the rear side of the chip 12. 在熔接测试中,控制温度的气体有助于保持恒定的所需温度。 In the welding tests, it helps to control the temperature of the gas required to maintain a constant temperature. 主要地,这允许改变芯片12的温度,因此可在不同的运行温度来评估性能。 Basically, this allows changing the temperature of the chip 12, it can be run in different temperatures to evaluate the performance. 需要时可将热气体直接传送在芯片12的后侧以用于测试的目的。 When necessary, the hot gas is transferred directly aimed at the rear side of chip 12 for testing. 第二,开口24允许在测试时给芯片进行其它的连接。 Second, the opening 24 allows the test to make other connections to the chip. 例如,一热电偶可用来监控每个芯片的温度,或者其它连接可用来在测试或运行时测量例如电阻。 For example, a thermocouple can be used to monitor the temperature of each chip, or other connection can be used to run the test or measurement such as resistance. 第三,开口24提供了接近每个芯片12的后侧的路径,从而可按照需要附加辨识标记ID(见图13)。 Third, the opening 24 is provided near the rear side of the path of each chip 12, thereby requiring additional identification tag according to ID (see FIG. 13). 例如,芯片12可被标上墨点以表示未通过测试。 For example, the chip 12 may be marked with dots to represent not pass the test. 一部分可被标上标记以示出测试的结果,例如直接标上速度等级。 Part can be marked to show the marked test results, such as the direct target speed rating. 可以施加产品的辨识信息例如生产商、批号等等。 Product identification information may be applied such as the manufacturer, batch number and so on. 此外,条形码或其它机器可读的编码可印刷在每个芯片的后部以能够跟踪每个芯片12,或者带有编码的的磁性条可放置在芯片上(见以下对跟踪更详尽的讨论)。 In addition, bar codes or other machine-readable code printed on the back of each chip in order to be able to track each chip 12, or with a magnetic strip encoded can be placed on a chip (see below for a more detailed discussion of tracking) .

现在请回到图1A上,用于将承载体10与盖子20相连接的按扣还用于提供支脚(stand off)26。 Now back to Figure 1A, for the carrier 10 is connected with the cover 20 snaps also be used to provide the legs (stand off) 26. 在一较佳例子中,该支脚26是将按扣22B固定到承载体10上的紧固件的一部分。 In a preferred example, the leg 26 will buckle 22B is fixed to the carrier on the part of the fastener 10. 该支脚可被设计成固定到壳体10之中、或者以其它方式固定到该壳体上。 The legs may be designed to be secured to the housing 10 into or otherwise secured to the housing.

支脚26自承载体10的基座向下延伸至弹性部分16的下方,并用于在输送、存放或搬运期间为弹性部分16提供保护。 Leg 26 from the base body 10 extends downwardly to the bottom of the elastic bearing portion 16, and for transporting, storing or during transport 16 provides protection for the resilient portion. 例如,倘若在测试之前将承载体10下放在一平面上,则支脚26可防止弹性部分16受压。 For example, if the carrier before testing 10 down on a flat surface, the leg 26 prevents the elastic part 16 compression. 请注意,倘若采用除图1A中所示的按扣与铆钉22之外的、用于将承载体10与盖子20相连接的方法,例如采用未延伸通过两个构件的总长的螺钉、或者采用弹性锁,则可在制造过程中将支脚增设到承载体上、或者将其制成为承载体的一部分。 Please note, if adopted outside except snaps and rivets 22, 10 and the cover 20 is connected to the method used for the carrier, for example, as shown in FIG. 1A using not extend through the entire length of the two members of the screws, or use Flexible lock in the manufacturing process can be added in the foot to the carrier body, or it made as part of the carrier body. 图4示出了这样一种制造好的支脚,当利用弹性锁将承载体与盖子相连接时,该制造好的支脚可为弹性部分提供保护。 Figure 4 shows a method of manufacturing such good feet, when the elastic lock body and the lid when the carrier is connected to the manufacture of good foot to provide protection for the elastic portion.

支脚还提供极为显著的第二功能,即有助于使承载体准确地定位在板上。 Feet also offers extremely significant second function, which helps to accurately position the carrier board. 在测试期间,将如图5所示的那样将承载体10安装在测试板30上。 During the test, as shown in Figure 5 shows the carrier 10 is mounted on the test board 30. 弹性部分16将被放置成与测试板30上的接触垫31相接触。 Flexible section 16 is placed in contact with the test pads 31 on the plate 30 in contact. 当将承载体10安装到板30上时,重要的是要确保各弹性部分16与板30上的接触垫31对齐并接触。 When the carrier 10 is mounted to the plate 30, it is important to ensure that the contact portion 16 and each of the elastic plate 30 and the contact pads 31 are aligned. 为此,测试板30上的定位孔32要与支脚26相配合。 To this end, the positioning hole 32 on the test board 30 to be fitted with the leg 26. 在这种方式中,当承载体10安装在板30上、且支脚26位于定位孔32中时,弹性部分16与板30的顶表面上的接触垫31相接触。 In this manner, when the contact 26 is located on the top surface of the positioning hole, the elastic portion 16 of the carrier plate 32 30 10 mounted on the plate 30 and the foot contact pad 31. 在图5所示实施例的情况中,测试板30可具有诸孔32,该孔要比系芯片的最终包装的一部分的最终基板上的孔来得浅。 In the case of the embodiment shown in Figure 5, the test board 30 may have the holes 32, the holes on the final portion of the substrate than the bore of the final chip packaging system is more shallow. 这样,弹性部分在测试中的压缩程度要小于最终使用时的压缩程度。 Thus, the elastic portion of the compression in the test is less than the degree of compression final use. 从图2A和2B中可以看到,在一较佳实施例中,以这种方式采用三组或更多的定位孔和相应的支脚,以便只一次就能准确对齐和装配。 As seen in Figure 2A and 2B, in a preferred embodiment, this method using three or more positioning holes and the corresponding leg, so that only one can accurately aligned and assembled. 要注意,虽然图2A和2B中仅仅示出了三个支脚26,但根据需要易于增设更多的支脚。 Note that, although FIGS. 2A and 2B show only three feet 26, but according to need easy-to-create more leg. 在图1B和1C所示的一特殊的较佳实施例中,两个偏置的定位孔即足以使管脚对齐。 A particular preferred embodiment shown in FIG. 1B and 1C, the positioning hole is enough to make two offset pin alignment. 将对齐管脚13固定到位于板30的一侧的垫板13上。 The alignment pin 13 is fixed to the plate 30 located on one side of the plate 13. 使承载体和盖子中的孔15与对齐管脚13对齐。 The bearing body and the holes in the lid 15 is aligned with the pin 13. 在适度偏置的情况下,操作人员易于准确地对齐承载体。 In the case of moderate bias, the operator is easy to accurately align the carrier. 虽然可将承载体插入在相对的对齐管脚上,但该承载体也可与定位装置(fixture)明显偏斜,从而易于准确对齐。 While the carrier may be inserted on the opposite alignment pins, but the carrier can also be significantly skew and positioning device (fixture), making it easy to accurately aligned.

图1E示出了一种标准的JEDEC托架,除其中一个槽敞露之外,在另九个槽中各设有一个承载体。 Figure 1E shows a standard JEDEC tray, in addition to one of the slots Chang Lu, on the other nine slots each provided with a carrier. 图中所示的承载体10正准备插入到托架中去。 Carrier shown in FIG. 10 is preparing to go into the bay.

虽然采用支脚是较佳的,但本发明并不仅限于使用支脚。 Although the use of the legs is preferred, but the present invention is not limited to the use of feet. 例如,如图6A和6B所示,还可采用薄垫片60,以便最大限度地防止弹性部分受压。 For example, as shown in FIG. 6A and 6B, shims 60 may be employed in order to maximize compression to prevent the elastic part. 此类薄垫片只能在测试期间使用,但不能在芯片的使用期间使用,以使弹性部分在测试中的压缩程度要小于使用时的压缩程度。 Such shims only during testing, but not during the use of the chip so that the elastic portion of the compression in the test is less than the degree of compression to use. 当采用薄垫片60来取代支脚时,需要另一种装置来协助承载体在安装到板上时的定位和对齐。 When replacing a shim 60 feet, they need another device to assist in carrier into place when the board and aligned. 例如,可采用诸如双射光束之类的标准对齐技术,以识别弹性部分和接线端的位置,并将它们精确对齐。 For example, a standard such as a two-shot alignment beam such techniques to identify the location of the elastic portion and the terminals, and their precise alignment.

图7中示出了本发明的第二实施例。 Figure 7 shows a second embodiment of the present invention. 在该第二实施例中,承载体70同时具有作开口76的衬里的第一凸缘72和第二凸缘74。 In this second embodiment, the carrier body 70 also has a first flange 76 for the opening 72 of the liner 74 and the second flange. 芯片12通过开口76放下,并由第一凸缘72支承。 Chip 12 through the opening 76 down, 72 is supported by the first flange. 盖子78具有向下装配到开口76中、且停靠在第二凸缘74上的延伸部分79。 Cover 78 has downward fitted into the opening 76, and the second flange 74 rests on the extension 79. 以这种方式,该延伸部分79用于将芯片12固定在承载体70中,并可克服对着芯片12的弹性触头所施加的压力。 In this manner, the extended portion 79 for the chip carrier 12 is fixed to the body 70, and against the pressure against the resilient contacts 12 of the chip applied. 然而,要注意的是,该实施例还可有其它的变化形式,可去除目前的第二凸缘,取而代之以使延伸部分79停靠在芯片12的背面上。 However, it should be noted that this embodiment may also have other variations, the second flange can be removed now replaced so that the extended portion 79 rests on the back of the chip 12. 在本发明的一种实施例中,可采用具有不同高度的诸延伸部分的不同的角部,以使弹性构件在测试中的压缩程度要小于使用时的压缩程度。 In one embodiment of the present invention may be used with different corners of the extension of the various different heights so that the elastic member in compression test should be less than the degree of compression in use.

图8中示出了本发明的第三实施例。 Figure 8 shows a third embodiment of the present invention. 图8示出了一种仅仅具有承载体而没有盖子的承载装置。 Figure 8 shows a carrier body having only the carrier means without the cover. 取而代之的是,该承载体80具有用于将芯片12固定在开口84之中的弹性锁82。 Instead, the carrier body 80 having the chip 12 is fixed to the opening 84 in the lock 82 being resilient. 该弹性锁采用一种连接在承载体上的保持件的形式。 The use of a form of the elastic lock holding member is connected to the carrier body. 当将芯片12下放到开口84中时,该弹性锁放宽,以允许芯片12通过。 When the chip 12 into the opening when under 84, the elastic lock relaxed to allow chip 12 pass. 一旦芯片12完全下放到开口84中,则弹性锁82就返回至其原有位置,并将芯片12锁定在位。 Once the device is placed in the opening 12 is completely under 84, the elastic lock 82 returns to its original position, and the chip 12 locked in place. 通过操纵设备可将弹性锁保持在“打开”位置上、以使芯片易于进入承载体,然后,移动到“闭合”位置、以便将芯片保持在位。 By manipulating the device will remain resilient locks in the "open" position to allow easy access to the chip carrier, and then moved to the "closed" position, in order to keep the chip in place. 本发明的该实施例可有利地去除若干零件和制造过程中的若干步骤。 The embodiments of the present invention may advantageously be removed several parts and several steps in the manufacturing process. 然而,由于芯片12的背侧未被完全支承,因而当受到压力时,硅芯片12会弯曲变形而损坏。 However, since the back side of chip 12 is not completely supported so that when subjected to pressure, the silicon chip 12 will be bent and deformed and damaged. 测试芯片、芯片的尺寸、弹力、材料的强度等的具体选择将影响到该设计对于某种应用的适用性。 The specific choice test chip, chip size, elasticity, strength of materials, etc. will affect the suitability of the design for certain applications.

一旦将各种不同的实施例设置在板上,必须将承载体组件(包括承载体、芯片和盖子)牢固地连接在板上。 Once the various embodiments provided in the plate carrier assembly must be (including carrier, chips and lid) securely connected to the board. 该连接可由若干种方式中的任何一种来实现。 The connection may be several ways to achieve any one. 在众多较佳实施例中,这种连接并不是永久的,这样该承载体组件就可被释放和拆除。 Among the preferred embodiment, this connection is not permanent, so that the carrier assembly can be released and removed. 要注意,在一个板上可以安装单个或多个承载体。 To note, the board can be installed in a single or multiple carrier.

图9A中示出了一种用于将承载体组件连接到板上的一较佳实施例-蛤壳设备(clamshell)。 Figure 9A shows a carrier assembly for connecting the board to a preferred embodiment - clamshell device (clamshell). 支承臂90位于该板的一侧边缘处。 The support arm 90 at one side edge of the plate. 铰接臂92自支承臂90延伸过承载体组件94的整个背侧。 Hinge arm 92 from the support arm 90 extends over the entire back side of the carrier assembly 94. 一旦将承载体组件设置在板30上,该铰接臂92就下降,以便其越过承载体组件94的整个背部平放。 Once the carrier assembly disposed on the plate 30, the hinge arm 92 is lowered, so that it crosses carrier assembly 94 of the entire back flat. 一旦铰接臂92下降,则它就与位于承载体组件94的相对侧上的第二支承臂93卡合到位,该第二支承臂96具有可牢固地保持铰接臂92的接纳弹性锁98。 Once the hinge arm 92 falls, it is the second support arm 93 card opposite side of the carrier assembly into place on the 94, the second support arm 96 having firmly held articulated arm 92 receiving the elastic lock 98. 铰接臂92相对于承载体组件94的尺寸以及铰接臂的数量主要取决于承载体组件94的尺寸。 Hinge arm 92 with respect to the size and number of the carrier assembly 94 of articulated arm carrier assembly 94 depends on the size. 举一个例子,一种铰接臂92可固定单个承载体组件94,而另一种铰接臂92则可固定几个承载体组件。 As an example, one kind of articulated arm 92 can be fixed to a single carrier assembly 94, while the other hinge arm 92 can be a fixed number of carrier components.

请参阅图9B,一铰接盖将芯片固定在一载板上的适当位置上。 Please refer to Figure 9B, a hinged lid chip is fixed in place on a carrier board. 壳体91包含有用于芯片12的开口,该壳体的结构与例如结合图7所详细描述的承载体的结构极其相似。 Housing 91 with an opening 12 for the chip, the structure and the structure of the housing 7 such as described in detail in connection with FIG carrier body very similar. 顶部92A可转动地铰接于壳体91。 Top 92A rotatably hinged to the housing 91. 当处于打开位置时,它易于插入芯片12。 When in the open position, it is easy to insert the chip 12. 当处于闭合位置时,它用于固定芯片12。 When in the closed position, which fixes the chip 12. 它可由锁闩93固定在闭合位置上。 It can be fixed to the latch 93 in the closed position. 例如可用螺钉将壳体91以永久性或半永久性的方式从板30的相对侧固定在该板上(未图示)。 E.g., by screws 91 to the housing permanent or semi-permanent manner from the opposite side of the plate 30 is fixed to the plate (not shown). 这尤其适用于在早期研究阶段中测试数量有限的芯片。 This applies particularly in the early stages of a limited number of test chips.

图9C示出了将承载体固定到板上的另一种方法。 9C shows another way the board is fixed to the carrier. 每一根支柱90B支承一个对着承载体枢转、以便将该承载体固定到板30上的臂92B。 Each pillar 90B supports a front carrier pivoted to the carrier arm is fixed to the plate 30 92B. 该臂92B处于扭转弹簧(未示出)的张力下,因而保持对承载体施加压力。 The arm 92B is in a torsion spring (not shown) of the tension, thus keeping exert pressure on the carrier. 该弹力足以将承载体保持在位,但可由将承载体设置在板上的操作人员所克服。 The spring force is sufficient to keep the carrier in place, but by the carrier body is arranged operator panel overcome.

如图10所示,可清楚地看到,无须将承载体组件104首先设置/安装在板30上。 Shown, it can be clearly seen in Figure 10, without the need to first set the carrier assembly 104 / mounted on the plate 30. 取而代之的是,在一种实施例中,可(籍由某些非永久性的机械装置)将承载体组件104本身安装在臂102上,然后下降,直到承载体组件104相对于板30处于准确的位置上为止,接着,该臂102由第二支承件106的弹性锁108卡合到位并固定。 Instead, in one embodiment, it can be (non-permanent membership by some mechanical device) will host the assembly 104 itself is mounted on the arm 102, and then decreases until the carrier assembly 104 relative to the plate 30 is accurate position till then, the arm 102 by a second support member 106 of the elastic latch 108 snaps into place and secured.

可连同图8中所示的上述第三实施例(即,一种利用弹性锁而非盖子来固定芯片的承载体)一起来采用上述设计的一种变化形式。 Available in conjunction with the third embodiment shown in FIG. 8 patients (ie, an elastic locking lid to secure the carrier instead of chips) together to a variation of the above design. 图11示出了一种具有装配到开口84中的延伸部分115的臂112。 Figure 11 shows a fitting into the opening 84 with the extended portion 115 of the arm 112. 当芯片处于压力之下时,这些延伸部分115提供所需的支承和抵抗力,它们可防止芯片因弯曲变形而受损。 When the chip is under pressure, the extension of the 115 needed to provide support and resistance, they prevent chip damage due to bending deformation. 在具备上述蛤壳设备的情况中,臂112下降,直到其由第二支承件116的弹性锁118卡合到位并固定为止。 In the case with the above-described clamshell device, the arm 112 is lowered until it into place by a second elastic support member 116 and the fixed latch 118 until the card.

可以包含在本发明各种实施例中的另一个特点是允许弹性触头具有当承载体组件安装在测试板上时、横扫整个着落(或接触)垫的擦拭动作。 May be included in various embodiments of the present invention, another characteristic example is to allow the resilient contacts with a carrier when the assembly is mounted on the test board, swept the landing (or exposure) wiping action pad. 当在两个电子元件之间进行任何连接时,它通常有利于使其中一个相对于另一个移动,以便这个电子元件与另一个电子元件滑动接触。 When any electronic components between the two connections, it is usually beneficial to make the move one relative to the other, so that the electronic components in sliding contact with the other electronic components. 这样往往能去除可能会给良好的电连接带来影响的残屑。 This can often be removed may give a good electrical connection impact of debris. 因此,允许在测试期间、用所焊接的弹性部分进行擦拭的能力是一个显著的优点。 Thus allowing During the test, the ability to wipe the elastic part of the welding is a significant advantage.

在测试期间,擦拭动作通常是因弹性部分的压力连接所固有的,但焊接连接的弹性部分并不是必要的。 During the test, the wiping action is usually due to the pressure inherent in the elastic portion of the connection, but the elastic portion of the solder connection is not necessary. 用于压力接触的弹性部分的较佳的弹性形状包括一种几何形状,以便直接朝向支承基板的弹性部分的压缩(倘若该基板处于XY平面,则该压缩沿Z轴)会使弹性部分的接触区域侧移,即具有一个XY分量。 The preferred shape of the contact elastic portion for elastically contacting pressure comprises a geometry, so that the elastic compression portion directed towards the support substrate (if the substrate is in the XY plane, the compressed along the Z-axis) makes elastic portion lateral regions, i.e., having an XY component. 这样就会引起横扫通常多少有些呈平面状的接线端面的擦拭动作。 This will cause the sweep was wiping action is usually somewhat flat connection end face. 用于焊接连接的弹性部分、或者针孔连接的弹性部分的较佳的形状可不具有大量或者任何压缩时的XY移动。 The preferred shape of the elastic portion for elastically connecting portions welded, pinholes or may not have a large number of connections or any of the XY moving compression.

图12A示出了一种实现擦拭动作的方法。 12A shows a method for realizing the wiping action. 在该实施例中,板120上的定位孔122可略有所变化,以便它们具有倾斜的前端边缘124。 In this embodiment, the positioning holes 122 on the plate 120 which may be a slight change, so that they have an inclined front end edge 124. 当承载体组件置于定位孔122的前端边缘124的上方、且下放到适当位置时,支脚128在到达定位孔124中的一固定静止位置之前,先沿着该倾斜的前端边缘124下滑。 When the carrier assembly to the front edge of the positioning hole 122 of the top 124, and the lower into place, 128 feet before reaching the positioning hole 124 in a fixed stationary position, the first decline along the front edge of the inclined 124. 承载体组件126的该滑动会使接触用的弹性部分触及板120上的接触垫而横扫擦拭该接触垫。 The slide carrier assembly 126 will make contacts with the elastic portion 120 touches the contact plate on the mat and sweep clean the contact pad. 该擦拭动作能在接触用的弹性部分与接触垫之间建立更佳的最终电接触。 The wiping action can establish a better electrical contact between the end-portion of the contact with the elastic contact pads.

另一种实施例(未图示)具有大致位于供承载体相对于板移动之用的板的平面内的一种图案的不同定位孔。 Another embodiment (not shown) having a pattern with respect to the plane of the plate with the moving plate inside the positioning hole located substantially for different carrier. 当承载体开始与板接触时,该承载体在该定位孔中移动,从而进行擦拭动作。 When the carrier came into contact with the plate, the carrier moving in the positioning hole, thereby wiping action. 当通过一处理器来定位该承载体时,可直接对作为装载过程的一部分的侧向运动编程。 When a processor by locating the carrier directly to the lateral movement of the programming as part of the loading process.

到目前为止,讨论已集中在用于芯片的承载体上,其中该芯片包含有弹性部分。 So far, the discussion has focused on a carrier for the chip, wherein the chip comprises resilient portions. 然而,相同的原理也同样适用于其中的测试板或最终的包装设备包含有弹性件的设备和方法。 However, the same principle also applies to one of the test board or final packaging equipment includes a device and method for the elastic member. 请参阅图12B和12C,并将它们与图1B和1C作比较,载板30A可制备有弹性件。 See Figure 12B and 12C, and Fig. 1B and 1C are compared, the carrier plate 30A can be prepared resilient member. 题为“用于电子元件的插座和连接电子元件的方法”的美国专利5,772,451号中详细描述了一种用于将弹性件安装在此类板上的较佳的方法。 Entitled "Method for electronic components and socket connection of electronic components," described in detail in U.S. Patent No. preferred method for mounting the elastic member in such plate No. 5,772,451. 该专利揭示了将弹性触头固定到一适当的基片上。 This patent discloses an elastic contact is fixed to a suitable substrate. 该基片可包含有诸如焊珠之类的、与弹性件相对的触头,并接着软熔(reflow),以便连接到诸如印刷电路板之类的基板上的接线端上。 The substrate may contain beads or the like, such as a relative's contact with the elastic member, and then reflow (reflow), in order to be connected to the terminal on a printed circuit board or the like, such as a substrate. 采用本文中的此类元件,基片125可制备有弹性件127,并被设置成与图示的半导体芯片上的接线端相接触。 Using herein such elements, the substrate 125 may be prepared elastic member 127, and is disposed in contact with the end of the wiring on the semiconductor chip illustrated. 一种实施例是将焊珠123设置在与弹性件127相对的基片125的侧面上。 An embodiment of the bead 123 is provided on the side surface of the elastic member 127 relative to the substrate 125. 这些焊珠可例如通过软熔固定在板的接线端上。 These beads can, for example melt plate secured to the terminal by soft. 这些弹性件可开始与芯片相接触,以供芯片测试或其它操作之用。 These elastic members may begin contact with the chip for chip testing or other operations it. 当需要时,可将基片125从板上拆除,以达到更换、修缮或其它目的。 When desired, the substrate 125 from the plate removed to achieve the replacement, repair or other purposes. 可增加支脚26的高度,以便在测试期间设定准确的弹性张力。 To increase the height of 26 feet, so that during the test to set the exact elastic tension. 相应地,倘若在成品中采用一类似的承载体,则可提供如图12B所示的弹性连接,其中适当的支脚用于适当的连接。 Accordingly, if in the finished product using a similar carrier, it may be provided as shown in FIG. 12B resilient connection, wherein appropriate for appropriate connection legs.

可将芯片放置在承载体中,并如在这揭示内容中所述的那样进行管理。 The chip can be placed in the carrier body, and as disclosed in this managed content as described. 这样,即使不具有弹性部分的传统的芯片也能以与上述用于带有弹性部分的芯片的极为相同的方式来操纵、测试和使用。 Thus, the conventional chip without having resilient portions can also very same manner as described above for the elastic portion of the chip having to manipulate, test and use.

通过使用跟踪装置可进一步改进本发明。 By using the tracking device of the present invention may be further improved. 例如,如图13A所示,在承载体130中可增设一跟踪机构。 For example, as shown in Figure 13A, the carrier 130 can be added a tracking mechanism. 任意地,可将标识符ID施加到位于承载体130之中的芯片12的背侧上。 Optionally, the identifier ID may be applied to the carrier 130 is located among the chip backside 12. 跟踪承载体、以及获知支承于其中的芯片在任何给定时间上的所发生的情况的能力提供了优于现有技术的若干优点。 Carrier tracking, and the ability to learn is supported in the case where the chips that occur at any given time provides several advantages over the prior art. 通过在承载体上设置跟踪标记、并记录涉及增设到承载体上以及/或者卸离承载体的各芯片在任何给定时间上的信息,用户可对芯片上的信息进行存取,该信息包括它所来自的具体晶片、以及甚至包括特定制造商的晶片的特定制造批量(lot)。 By setting the track marks on the carrier and recorded on a carrier involves the addition and / or discharged from each chip carrier of information at any given time, users can access information on the chip, including the information Specifically it from the wafer, and even specific manufacturer specific wafer fabrication batch (lot). 虽然跟踪能力存在于晶片级别上,但目前尚未能获得存在于芯片级别上的此类跟踪能力。 While tracking capability exists on the wafer level, but has yet to get on the chip-level presence of such tracking capability. 然而,通过在本发明的承载体上设置跟踪标记,可保持芯片级别上的信息。 However, by setting a track mark on the carrier of the present invention can keep the information on the chip level.

如图13B所示,可将跟踪标记有利地设置在承载体的侧面上,这样即便盖子在位也能看到该跟踪标记。 13B, the trace flag may advantageously be provided on the side of the carrier, so that even if the cap in place could see the track marks. 另外,例如另一种方法,承载体可装配有诸如EEPROM(电可擦可编程序只读存储器)之类的可编程装置。 In addition, for example, another method, the carrier body may be fitted with means such as a programmable EEPROM (electrically erasable programmable read only memory) and the like. 图13B中示出了与一EEPROM之间的连接。 FIG. 13B shows a connection between the EEPROM.

首先,将跟踪标记或标识码施加到承载体上(参见图14中的流程框图)。 First, the track mark or identification code is applied to the carrier body (see Figure 14 flow diagram). 然而,要注意的是,可在将芯片装载到承载体上之后,将跟踪标记施加到承载体上。 However, it should be noted that, after the chip can be loaded on the carrier, the trace flag is applied to the carrier. 将晶片切成小片。 The wafer is cut into small pieces. 当将各个芯片装入到承载体中时,涉及那芯片的信息被储存在承载体上的跟踪标记中。 When loaded into each chip carrier, the information related to that chip is stored in the tracking marks on the carrier. 该信息可包括(但不仅限于此):识别出形成该芯片的特定晶片的信息、识别出特定批量的晶片中的一特定半导体晶片的信息、识别出形成该晶片的一具体晶片加工批量的信息、以及芯片在晶片上的位置。 This information may include (but are not limited to): the information identifying a particular wafer forming the chip, to identify a particular batch of information in a particular wafer of a semiconductor wafer, the wafer is formed identify a particular batch wafer processing information , as well as chip location on the wafer. 跟踪标记可包括条形码、或者储存在位于承载体上的、诸如磁性媒体或半导体存储装置之类的存储装置中的编码。 Tracking tag can include bar codes, or stored on the carrier body is located, such as coding or magnetic media storage device like a semiconductor memory device in.

这种处理在一特殊的较佳实施例中甚至更有功效。 Such treatment of a particular embodiment efficacy even more preferred embodiment. 照常执行晶片的探查。 Expected to perform wafer probe. 注意甚至在基本测试中就被淘汰的部分。 Note that even at a basic test was eliminated part. 对于适于变型的装置而言,可在此时更改这些部分。 For suitable modification device can change these parts at this time. 例如,许多的储存装置均制有多余的子单元。 For example, many of the storage devices are formed with excess subunits. 初步测试识别出通过或者淘汰的子单元,自动化设备可选出适当的功能单元组,这样总体上装置将性能正常。 Preliminary tests identified or eliminated by sub-units, automation equipment can select an appropriate functional unit group so that the whole device performance is normal. 在这些部分上能够跟踪任何数量的信息,从仅仅注意到失效到在装置是起作用的单元上进行记录,以及对制造可以有用的任何其它信息。 On these parts can track any number of information, from merely note in device failure to be any other information on the work record of units and can be useful for manufacturing. 正如再一个例子,在许多制造情况中,在一半导体晶片的否则是无用的部分制造测试部分。 As a further example, in many manufacturing situations, the otherwise useless portion of a partially fabricated semiconductor wafer testing. 这些区域包括划线区域,或者是在晶片附近的无用部分。 These areas include scribe region, or in the vicinity of the portion of the wafer useless. 关于这些测试单元的信息与关于在该晶片上发现的装置的信息一起保存在数据库中。 Information about these test units and the information about the device found on the wafer is stored together in the database.

在半导体制造中的很多不同的加工步骤很可能在一晶片的不同区域有某种程度的变化。 In semiconductor manufacturing many different processing steps is likely to have some degree of change in different regions of a wafer. 要特别注意使这些变化减少到最低程度,但是对于在一晶片的不同区域中某些范围的部分很可能有稍许差别。 Pay special attention to make these changes to minimize, but for some it might be some scope slightly differ in different regions of a wafer. 当各个芯片从晶片上分离和进行测试以及其它使用时,跟踪单个芯片的标识,能够再构造一晶片图,显示对于一晶片的任何区域的某一芯片以及它的附近芯片的任何所需测试的结果。 When separating the individual chips from the wafer and the test carried out and when the other used to track individual identification chip, a wafer can be re-configured view showing a wafer for any given chip area and its vicinity of any desired test chip Results. 以及能够检测和评价各批量晶片的变化。 And the ability to detect and assess changes in each batch wafer. 至今,由于在复杂的大批量制造的环境中诸部分的标识简直变得太艰难而不能监测,因此此类跟踪是极其困难的。 So far, as identified in the complex high-volume manufacturing environment, all part of simply become too difficult and can not be monitored, so this type of tracking is extremely difficult.

对于在制造中运行一加工过程,该信息能够是极有价值的。 For operation in the manufacture of a process, this information can be extremely valuable. 一旦从测试搜集的信息是可实用的,就可用于制造车间。 Once the test is to gather information from a practical, it can be used for manufacturing workshop. 在一自动系统中,能够建立临界值,它对不合技术规格的加工触发警报装置,立即通知制造车间。 In an automated system, it is possible to establish the critical value, the technical specifications of its substandard working trigger alarm device, immediately notify the manufacturing plant. 当使用目前的系统时,在这反馈系统中至少有两个主要优点。 When using the current system, in which the feedback system has at least two major advantages. 首先,在晶片被切割之后能立即测试晶片,从制造释放到得到第一此测试结果的时间间隔最短。 First, after the wafer is cut wafer can be tested immediately released from manufacturing to obtain a first result of this test the shortest time interval. 但是这与利用目前加工过程至少几天和通常几周相比较,虽然这通常将是很少几天,它能在仅仅几小时内完成。 But at least several days and weeks, compared with the usual use of the current process, although this is usually a few days will be very little that can be completed in just a few hours. 第二大优点是依靠跟踪每个芯片的标识,能够再构成一晶片图。 The second big advantage is that rely on tracking the identity of each chip, can no longer constitute a wafer map. 图中测试结果显示了相对晶片上的位置的任何类型的变化,这信息对制造车间证实在制造期间、在晶片的所有区域是一致的可以是很有价值的。 FIG test results show the relative position of any kind on the wafer changes, this information is confirmed during manufacture manufacturing plant, in all regions of the wafer are consistent can be valuable. 在能够评价一加工的早期样品和能够适当改进相同加工的后来比例方面,这迅速的时间响应(快速反馈回路)是特别有价值的。 Can be evaluated in an early sample and processing the same processing can be suitably modified later aspect ratio, this rapid response time (fast feedback loop) is particularly valuable.

现在回到较佳实施例,在测试和最初的装置修理之后,自动设备切割晶片。 Returning now to the preferred embodiment, after the initial test and repair equipment, automated equipment cut wafer. 处理设备将被选择的芯片放入一承载体内。 Processing device to be selected into a chip carrier body. 如在一制造数据库内,跟踪关于在一特定晶片上的一特定芯片的特定位置的信息。 As in a manufacturing database, tracking information about a particular location on a particular wafer in a particular chip. 例如,一组八个芯片可以装载在图2A的承载体中。 For example, a set of eight chip can be loaded in the carrier of FIG. 2A. 依靠跟踪在承载体中的诸特定位置,这足以使制造数据库跟踪承载体识别信息和每一芯片在承载体中的位置。 Rely on tracking the various carrier specific position, which is sufficient to manufacture a database to track carrier identification information and each chip carrier position.

如上述指出,可以用许多方式标记承载体。 As noted above, it can be used in many ways mark carrier. 一特别较佳的标记是一条形码或者沿着承载体的侧边、甚至在一盖子位于一承载体之上时能够被自动处理装置和操作者阅读的一位置印制的其它机械宽度的代码。 A particularly preferred label is a barcode or along the side of the carrier, even in a cap located on top of a carrier when the width can code for a position other mechanical devices and operator-read printed automatically processed. 另一个特别较佳的标记包括在承载体中的EEPROM装置。 Another particularly preferred markers included in the carrier in the EEPROM devices. 自动处理设备能够将关键信息送入EEPROM。 Automatic processing equipment capable of critical information into the EEPROM. 该设备也能够从EEPROM阅读信息。 The device is also capable of reading information from the EEPROM. 这可以是如与制造数据库连接的一特定标识码那样简单。 This may be as a specific code and manufacturing of database connections that simple.

这组承载体可以处于一托架内。 This group can be in a carrier bracket. 能够用与承载体很相类似的方式标记一托架。 The ability to mark a bracket with the carrier very similar manner. 较高数量级的编组是很适用的,如在一车内的托架的编组方面。 Magnitude higher grouping is applicable, as in a car bracket grouping aspect. 根据在一承载体中的芯片数量和诸部分的尺寸,一晶片可以分成诸单个芯片,芯子填充在较小数量的托架内的诸承载体内,例如5到10的数量级。 According to the chip number and size of various parts of a carrier, such a chip can be divided into individual chips, the core is filled in a small number of various bearing bracket body, e.g., of the order of 5-10. 根据一生产运行的规模,例如25个晶片的一批量,那么将占据大约125到250个托架。 Depending on the size of a production run, for example, a batch of 25 wafers, it will occupy approximately 125-250 bracket.

参阅图13C,托架130可以装有一系列沟槽131,每个沟槽容纳一承载体。 Referring to FIG. 13C, the bracket 130 may be provided with a series of grooves 131, each groove accommodating a carrier. 托架130的一前边缘包含标记132。 A front edge of the bracket 130 comprises a label 132. 该托架支承可编程的装置134,适当地是一EEPROM,并带有用于自动处理设备接触的、易于达到的连接133。 The bracket support programmable device 134, suitably a EEPROM, and with a device for automatic processing of the contact, the connection is easy to reach 133. 如果需要,该标记能够是用于操作者和机器可扫描的一引导装置。 If desired, the tag can be a guide means for the operator and the machine can be scanned. 可编程的连接允许进入电跟踪装置。 Programmable electrical connection admission tracking device.

一个识别标记也可以施加于每个芯片自身。 An identification mark to be applied to each of the chip itself. 通常,在芯片装入承载体之后,这一识别标记将被施加到芯片的背侧(与弹性触头相对的一侧),其中标记通过承载体中的一孔口施加,或者可以在芯片放入成套之前施加。 Typically, after the chip carrier is loaded, the identification mark to be applied to the backside of the chip (opposite side of the elastic contact), wherein the label is applied through an opening in the carrier, or may be placed in the chip Before applying the sets. 在芯片上的识别标记可以包括表明一测试过程的成功或失败的一墨点、一唯一的或半唯一的标识号、包含关于那具体芯片过去情况的较特殊的信息的条形码,或者其它有用的信息。 On-chip identification mark may include a test procedure that indicates success or failure of an ink dot, a unique or semi-unique identification number, a bar code that contains more specific information about the circumstances of that particular chip in the past, or other useful information. 正如一个例子,一批量中的一系列芯片能够用顺序的、唯一的识别信息标记。 As one example, a batch of a series of chips can use sequential, unique identification information marks. 一单独的批量可以利用相同的标识信息,但是可以用其它方法,例如在制造厂内的时间、在一外部承载体中的某个位置等与第一批量相区别。 A separate batch can use the same identification information, but you can use other methods, such as the time at the factory, and in an external carrier in a certain location with the first batch phase difference. 如在一具体例子中,可以利用16位信息跟踪一批量中的芯片,可以利用较高数量级位数的某些数量级较大的产品组。 As a specific example, the information 16 can be used to track a batch of chips, you can utilize some of the higher order bits of magnitude larger group of products.

可以编排本发明的设备并以各种方式使用(举一例子,请参见图15的流程图)。 You can arrange the device of the present invention and used in various ways (for an example, see Figure flowchart. 15). 例如,可以将芯片装载在一承载体内,并用一保持件固定在承载体内,形成一承载体组件。 For example, the chip is mounted on a carrier body, and with a bearing holder fixed to the body, forming a carrier assembly. 然后可以将该承载体组件定位在一板上,然后例如用一夹子将它固定下来。 The bearing assembly can then be positioned in a plate, then for example a clip fixed it. 或者,可以将承载体组件安装在夹子上或连接机构上,然后当它被固定/锁定在适当位置时,被定位在板上。 Alternatively, the carrier components can be installed on or connected to the clamp mechanism, then when it is fixed / locked in place, it is positioned on the board. 或者承载体组件首先安装在板上,随后在其中装载和固定芯片。 Or carrier component mounted on the board first, then loaded therein and fixed chip. 存在有在承载体组件的编排和它在一测试板或一最终基板处壳上安装方面所跟随的步骤上的其它变化。 There are other variations exist on the carrier assembly choreography and step it in a test board or installed on a final board of the housing aspect of the follow. 本发明并不要求在本发明的编排方面遵循该步骤的一特定的顺序。 The present invention is not required to follow the steps in the choreography aspect of the present invention, a specific order.

Citada por
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