CN1561656A - Method for mounting an electronic component - Google Patents
Method for mounting an electronic component Download PDFInfo
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- CN1561656A CN1561656A CNA998141097A CN99814109A CN1561656A CN 1561656 A CN1561656 A CN 1561656A CN A998141097 A CNA998141097 A CN A998141097A CN 99814109 A CN99814109 A CN 99814109A CN 1561656 A CN1561656 A CN 1561656A
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- electronic component
- supporting body
- chip
- substrate
- test
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit which is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elongate, resilient, electrical contact elements which are mounted on a corresponding first electrical contact pads on the electronic component. The electronic component is secured to the carrier, and the carrier is pressed against a first substrate having a plurality of second electrical contacts on a surface of the first substrate. In a typical example of this method, the electronic component is an integrated circuit which is being tested while being held in a carrier. The integrated circuit has been singulated from a wafer containing a plurality of integrated circuits.
Description
Background of invention
TECHNICAL FIELD OF THE INVENTION
The present invention relates generally to electronic building brick and method of testing thereof.More specifically, the present invention relates to from initial wafer to test board, printed circuit board (PCB), with and/or final product substrate method and apparatus that chip is transmitted and handles.
Description of related art
The theme of chip-scale package is the hot research problem in the industry always for many years.A very promising technology comprises a mini-bomb gonosome is fixed on the suitable substrate, and makes these elements form contact between the device of operation and other circuit.It is known being used for making the method that is used for microelectronic elastic interconnection body and is used for the Elastic Contact body directly is configured on the semiconductor device.One useful especially elastic interconnection body comprises an Elastic Contact body of freely erectting, and this Elastic Contact body at one end is fixed on the electronic installation, and has the free end away from this electronic installation, thereby easily contacts second electronic device.For example, see the 5th, 476, No. 211 United States Patent (USP)s " Method for ManufacturingElectrical contacts, Using a Sacrificial Member " (" using sacrificial body to make the method that electrically contacts body ").
Semiconductor device with Elastic Contact body mounted thereto can be considered flexible semiconductor device.The elastic semiconductor device can interconnect with a kind of and interconnect substrates in two kinds of main modes.Can for good and all connect, for example be welded on interconnect substrates for example on the corresponding terminals of a printed circuit board (PCB) by free end with the Elastic Contact body.In addition, also can be simply by connecting between the contact portion of terminals and Elastic Contact body, to form pressure facing to interconnect substrates pushing elastic semiconductor device, thereby interchangeable be connected in terminals.Interconvertible pressure like this connects the oneself who can be described as the elastic semiconductor device and pegs graft.Manufacturing has elasticity encapsulation (MicroSpring
TMContact) semi-conductive discussion can be in the 5th of mandate on November 3rd, 1998, find in 829, No. 128 United States Patent (USP)s " Method of MountingResilient Contact Structures to Semiconductor Devices " (" resilient contact structure is installed in method on the semiconductor device ").Use and test has MicroSpring
TMThe semi-conductive discussion of contact is disclosed in by name " the Socket for Matingwith Electronic Component; Particularly Semiconductor Device withSpring Packaging; for Fixturing; Testing; Burning-in or Operating Sucha Component " that submitted on November 4th, 1998 (" with electronic component; particularly have the elasticity package semiconductor device and be complementary, be used for fixing, test, welding (burning-in) or operate the socket of this element ") and transfer in the assignee's of the present invention U.S. Patent application 09/205,502.
Can from the pressure connection status of interconnect substrates remove the elastic semiconductor device replace or the situation of upgrading elastic semiconductor device under very useful, can interconvertible the connection obtain a very useful purpose by forming simply with the elastic semiconductor device.This also is useful for whether reaching its specification with the flexible semiconductor device of welding or definite this flexible semiconductor device on the interconnect substrates that temporarily or for good and all is installed to a system.Generally speaking, this can finish by being connected with Elastic Contact body formation pressure.Such contact has releasable restrictions such as the contact force of dependence.
In a typical manufacturing process, wafer is accepted limited test to determine the inefficacy of the single part on general function and the wafer.Then good semiconductor portions of this function or chip are packed is used for further welding and more comprehensively test.Packaging technology is costliness but also time-consuming not only.
The chip that use is used to interconnect and can have tested fully when the MicroSpring contact of body provides on being positioned at wafer.A preferred methods of testing wafer be make they individualized (singulate), then move their typical testing processs more or less by carrying out on the device that is encapsulating.The difference of a key is a chip in case just packed after individualized from wafer, but present test equipment is not suitable for this type of device use.
For this reason, the part of chip-scale or IC wafer are in case just can be placed into the supporting body after initial wafer is cut into small pieces.Then supporting body is sent on the test board chip to carry out for example welding test.In case all chips in the supporting body are by checking, then supporting body can be used to chip transmitted and is installed on the printed circuit board (PCB) or on the final product substrate.
This supporting body is particularly useful for the chip with MicroSpring contact or similar contact.This supporting body also is useful for forming the traditional die that contacts with testing apparatus with suitable bindiny mechanism or final products.Testing apparatus or final products with MicroSpring contact are useful especially for connecting traditional chip.
The supporting body of chip-scale provides several advantages with respect to prior art.The first, can test single chip, and if it can not replaced by test.The second, the supporting body of chip-scale can be in conjunction with follower that can a tracking report chip, and stores relevant information is to monitor and to follow the tracks of on supporting body.The 3rd, in transmission, storage and use, the supporting body of chip-scale makes it possible to easily to handle many chips and protects all chips and their Elastic Contact body.And, Elastic Contact body the decrement when test of supporting body on can limited chip, this decrement can be less than the compression that is allowed in the main use of subsequently chip.The restriction of compression can be by determining that the Elastic Contact body obtains in the design of the maximum compression that test phase allowed.Then, can adopt different restrictions for the use of reality.This feature can prolong the elastomeric " RUN " life-span.
Summary of the invention
The present invention relates generally to a kind of method that is used to install the electronic component such as integrated circuit.In an example of the inventive method, electronic component is placed against the supporting body such as framework.This electronic component comprises elongated elasticity electric contact piece on corresponding first electrical contact pad that is installed on the electronic component, a plurality of.These elongated elasticity electric contact pieces extend beyond a surface of supporting body.Electronic component is fixed on the supporting body, this supporting body is pressed on first substrate, this substrate has a plurality of second electrical contacts of a near surface that is positioned at this first substrate.
In one of the inventive method special example, when these elongated elasticity electric contact pieces were used to be electrically connected, the size of framework defined the maximum compression limit for each elongated resilient contact.
Brief description
By further describing the present invention with way of example with reference to the accompanying drawings, in the accompanying drawings:
Figure 1A is the cutaway view of carrier module of the present invention, and this assembly comprises the supporting body that supports a chip and chip is fixed on a lid in the supporting body.
Figure 1B and 1C illustrate a preferred embodiment of the present invention.
Fig. 1 D illustrates another preferred embodiment of the present invention.
Fig. 1 E illustrates the JEDEC carriage that contains nine supporting bodies, and the tenth carriage that will append on this carriage is shown.
Fig. 2 A is the vertical view of an embodiment of supporting body of the present invention.
Fig. 2 B is the vertical view of second embodiment of supporting body of the present invention.
Fig. 3 A is the vertical view of an embodiment with a lid of the present invention in all holes that are positioned at it.
Fig. 3 B is the vertical view of second embodiment with a lid of the present invention in all holes that are positioned at it.
Fig. 4 is the cutaway view of another embodiment of carrier module of the present invention, and this assembly comprises that supporting body of supports chip and elastic locking are fixed on a lid in the described supporting body on described supporting body and with described chip.
Fig. 5 is the cutaway view that is installed on the test board shown in Figure 1A and uses this embodiment of the present invention of leg.
Fig. 6 A is mounted on the test board and uses the cutaway view of the another embodiment of the present invention of shim liner.
Fig. 6 B is mounted on the test board and uses the cutaway view of the another embodiment of the present invention of shim liner.
Fig. 7 is the cutaway view of another embodiment of the present invention, and wherein supporting body has two flanges that are arranged in each opening, and lid has and extends downwardly in the opening chip is fixed on the additional part of one in the supporting body.
Fig. 8 is the cutaway view of another embodiment of the present invention, and wherein supporting body self is by using snap lock rather than lid with the chip fix in position.
Fig. 9 A illustrates by reduction to cross the arm at rear portion of plate with the cutaway view of a carrier module of the present invention folder method onboard.
Fig. 9 B is the cutaway view of another embodiment of the present invention, wherein by spring-loaded keeping arm supporting body is fixed on the load board.
Fig. 9 C is the cutaway view of another embodiment of the present invention, wherein by spring-loaded bolt supporting body is fixed on the load board.
Fig. 9 D illustrates a special preferred embodiment of the present invention.
Figure 10 illustrates the cutaway view that carrier module is installed to the other method on the plate, and wherein carrier module at first is installed on the arm, then is reduced in the appropriate location on the plate.
Figure 11 is the cutaway view that the method on the plate that carrier module shown in Figure 8 is installed to is shown.
Figure 12 A is the cutaway view of a carrier module of the present invention, and wherein the location hole on the plate has the leading edge of inclination, so that carrier module slides in the appropriate location and the Elastic Contact body of the chip by crossing the corresponding contact pad on the plate produces wiping action.
Figure 12 B and 12C illustrate the end view and the vertical view of a test board that comprises elastic part, corresponding supporting body, lid and chip.
Figure 13 A is the vertical view that also comprises the tracking tags that is positioned on the supporting body and be positioned at the supporting body of the present invention of the identification mark on the chip.
Figure 13 B is the end-view that also comprises the tracking tags that is positioned on the supporting body and be connected to the supporting body of the present invention that a junction of electronic storage device divides.
Figure 13 C is the stereogram that a carriage that is used for a plurality of supporting bodies is shown.
Figure 14 illustrates the flow chart that is included in the step of following the tracks of supporting body and/or single chip in manufacturing, transmission and the final use.
Figure 15 illustrates to be included in the flow chart of making and utilizing the step among the present invention.
The detailed description of invention
A method and apparatus of handling integrated circuit (IC) chip by test and final should being used for is now described.Disclosed a method and apparatus that is used to follow the tracks of this chip.In following detailed description, a plurality of details have been listed more fully to understand the present invention.But, can not having to implement the present invention under the situation of these details yet, this is conspicuous for a person skilled in the art.In others, well-known device, method, process and discrete component do not have detailed description, as long as can make the aspects of the present invention indigestion that becomes necessarily.
The invention provides at the supporting body that after initial wafer cutting, test process, is used for transmitting and following the tracks of integrated circuit (IC) chip.Supporting body of the present invention generally is used for transmitting and supports chip in test, and can be by labelled to follow the tracks of this supporting body and single part thereof.Supporting body of the present invention can be used for having the chip of welding elasticity, pin hole elasticity or pressure Elastic Contact body.In case finish test, this supporting body can be transmitted and be installed on the printed circuit board (PCB) to form final substrate package.
This supporting body can be used for there is not elastomeric chip at all, to engage with comprising the test or the final application product that are used for setting up with chip the suitable contact mechanism electrically contact.Preferable test products comprise with the application in detailed description be positioned at elastomer on the silicon chip similar flexible, the contact freely erect.A preferable final application product comprises similar elastomer.
Of the present invention one total embodiment is illustrated among Figure 1A.This supporting body or lower part 10 are used to carries chips 12 in transmission, test at chip 12 and/or the final application.Supporting body 10 is generally with for example polymer manufacturing and can use injection molding to form of organic material.In a preferred embodiment, epoxy glass laminate material is cut into certain size and is processed into the shape of wanting.By opening 14 chip 12 is placed in the supporting body 10, it rests on the flange 18 of lining of at least a portion of the base portion that forms opening 14 at this.The wall of noticing opening 14 is preferably the inclined-plane and easily chip 12 is inserted in the opening 14 allowing.And, note before this chip of encapsulation, this chip being placed in the supporting body.That is, there is not to center on and protect the shell of chip.After the test, this supporting body can be used as the final shell of chip 12 in supporting body 10.
The elastic part 16 of chip 12 is by opening 14 downward extensions so that the contact mat formation with test board, printed circuit board (PCB) or the final substrate package of using electrically contacts in future.Elastic part 16 extends through opening 14 and stretches out the downside of flange 18.Elastic part or contact 16 generally are the elongated flexible bodies that electrically contacts.This type of is flexiblely electrically contacted talking out of body and be disclosed in people such as licensing to Eldridge on February 2nd, 1999 and transfer the 5th of assignee of the present invention, 864, during No. 946 United States Patent (USP) " was made the method for contact end structure ", the content of this patent was combined in this by citation.
Notice that height H=H1-H2 is provided with maximum compressed limits for elastic part 16.H1 is that the bottom of lid 20 is the positions at the top of chip when elastic part is compressed from the size of bottom to lid 20 bottoms of supporting body 10.H2 is the thickness of chip.Another factor that needs to consider is under particular geometric shapes, and elastic part exceeds the terminals of some contact surface with contact and is in the opening 14.Under this situation, must consider the thickness of terminals when under the compression of maximum, determining minimum elastic part length.
In other words, compressed elastic part can not surpass height H.Generally, three elastic part height-1 that should be noted that are especially arranged) new product or static height (for example 30 mils), 2) welding that is used to test height (for example 28 mils), 3) operation height (for example 25 mils).Elasticity of compression part is not with the life-span of maintenance elastic part as far as possible in test process, that is, maintenance elasticity is to present best performance in the operation of back.In other words, for last operation, the compression that increases elastic part is desirable to guarantee good electrical contact, and compression minimum before last operation is desirable.
Figure 1B and 1C illustrate the end view and the vertical view of the decomposition of Figure 1A shown device.These views illustrate 2 * 4 chips of arranging, and the lid 20 that has respective openings.Fig. 1 D illustrates another preferred embodiment of the present invention.This view illustrates 1 * 8 eight chips, supporting body 10, lid 20 and the radiant body 20A that arranges.In the view of this decomposition, the length of shown fixing pin 8 is exaggerated so that the view of decomposition to be shown.In fact, the length of fixing pin 8 can clamping be in place securely facing to supporting body 10 with lid 20, and fixes supporting body 10 facing to plate 30.
Fig. 2 A and 2B illustrate the vertical view of supporting body 10, show two examples of the possibility layout of the opening 14 in the supporting body 10.Fig. 2 A is the diagram with supporting body 10 (corresponding to the cutaway view of supporting body shown in Figure 1A 10) of eight openings being arranged to two each four opening of row.Fig. 2 B is another layout, and wherein eight opening 14a (this vertical view is not directly corresponding to the cutaway view shown in Figure 1A) in supporting body 10 are positioned to single straight line row.Although shown in attention Fig. 2 A and Fig. 2 B is the supporting body 10 with eight openings 14 of the linear fashion be arranged to, this is not requirement of the present invention.On the contrary, according to a plurality of factors, actual quantity, position and the direction of the opening 14 in the design alternative supporting body 10.
Refer again to Figure 1A, lid 20 (or cap or the like) be connected on the supporting body 10.For this supporting body, available organic material uses the method for injected plastics material to form lid 20.In a preferred embodiment, this lid is processed into epoxy glass laminate material.This lid can also comprise a metal level to help heat radiation, and can increase radiator portion, fin for example mounted thereto.This lid can be regarded as one and keep body.Notice that any maintenance style such as snap lock (snap lock), ball bearing, retainer, single bar or the like all can be used to append on the lid so that chip is fixed in the supporting body.This maintenance body will be oriented to when this chip is placed in the supporting body part that the machinery adjoining farmland neighbour connects the rear side surface of chip usually.
Although lid 20 does not need to have opening and can be solid flaky material, all openings provide several advantages for supporting body of the present invention.At first, all opening 24 allows the gas of control temperature directly to be sent to the rear side of chip 12.In welding test, it is constant temperature required that the gas of control temperature helps to keep.Mainly, this allows to change the temperature of chip 12, therefore can come assessed for performance in different operating temperatures.Hot gas directly can be transmitted in the purpose of rear side to be used to test of chip 12 when needing.The second, opening 24 allows to carry out other connection to chip when test.For example, a thermocouple can be used to monitor the temperature of each chip, and perhaps other connection can be used to measure for example resistance when test or operation.The 3rd, opening 24 provides the path near the rear side of each chip 12, thereby can add identification mark ID (seeing Figure 13) as required.For example, chip 12 can be put on ink dot to represent by test.A part can be put on mark so that the result of test to be shown, and for example directly puts on speed class.The identification information that can apply product is manufacturer, lot number or the like for example.In addition, bar code or other machine-readable coding can be printed on the rear portion of each chip can follow the tracks of each chip 12, perhaps have coding magnetic strips can be placed on the chip (seeing following) to following the tracks of more detailed discussion.
Please get back on Figure 1A now, be used for also being used to provide leg (stand off) 26 snap-fastener that supporting body 10 is connected with lid 20.In a preferred example, this leg 26 is the parts that snap-fastener 22B are fixed to the securing member on the supporting body 10.This leg can be designed to be fixed among the housing 10 or otherwise be fixed on this housing.
Leg also provides very significant second function, promptly helps supporting body is located onboard exactly.At test period, will as shown in Figure 5 supporting body 10 be installed on the test board 30.Elastic part 16 will be placed with contact mat 31 on the test board 30 and contact.When being installed to supporting body 10 on the plate 30, to guarantee that importantly each elastic part 16 aligns with contact mat 31 on the plate 30 and contacts.For this reason, the location hole 32 on the test board 30 will match with leg 26.In this mode, when supporting body 10 is installed on the plate 30 and leg 26 when being arranged in location hole 32, the contact mat 31 on the top surface of elastic part 16 and plate 30 contacts.In situation embodiment illustrated in fig. 5, test board 30 can have all holes 32, and this hole is than being that hole on the final substrate of a part of final packaging of chip is come shallowly.Compression degree when like this, the compression degree of elastic part in test is less than final the use.From Fig. 2 A and 2B, can see, in a preferred embodiment, adopt three groups or more location hole and corresponding leg by this way, so that only once just can accurately align and assemble.Though be noted that only to show three legs 26 among Fig. 2 A and the 2B, be easy to set up more leg as required.In the special preferred embodiment shown in Figure 1B and the 1C, the location hole of two biasings promptly is enough to make the pin alignment.With alignment pins 13 fix in position on the backing plate 13 of a side of plate 30.Alignd with alignment pins 13 in hole 15 in supporting body and the lid.Under the situation of appropriateness biasing, operating personnel are easy to align exactly supporting body.Though supporting body can be inserted on the relative alignment pins, this supporting body also can with the obvious deflection of positioner (fixture), thereby be easy to accurate alignment.
Fig. 1 E shows a kind of JEDEC carriage of standard, except that one of them groove is open, respectively is provided with a supporting body in other nine grooves.Supporting body 10 shown in the figure is just being prepared to be inserted in the carriage to go.
Though it is preferable adopting leg, the present invention is not limited in the use leg.For example, shown in Fig. 6 A and 6B, also can adopt shim liner 60, so that prevent the elastic part pressurized to greatest extent.This type of shim liner can only use at test period, but can not use between the operating period of chip, so that the compression degree of elastic part in test is less than the compression degree when using.When adopting shim liner 60 to replace leg, location and alignment when needing another kind of device to assist supporting body on being installed to plate.For example, can adopt the standard alignment techniques such as the dijection light beam, with the position of identification elastic part and terminals, and with they accurate alignment.
The second embodiment of the present invention has been shown among Fig. 7.In this second embodiment, supporting body 70 has first flange 72 and second flange 74 of the lining of making opening 76 simultaneously.Chip 12 puts down by opening 76, and by 72 supportings of first flange.Lid 78 has and is assembled in the opening 76 downwards and rests in extension 79 on second flange 74.By this way, this extension 79 is used for chip 12 is fixed on supporting body 70, and can overcome the spring contact institute applied pressure facing to chip 12.Yet, be noted that this embodiment also can have other version, can remove the second present flange, replace so that extension 79 rests on the back side of chip 12.In an embodiment of the present invention, can adopt the different bight of all extensions, so that the compression degree of elastic component in test is less than the compression degree when using with differing heights.
The third embodiment of the present invention has been shown among Fig. 8.Fig. 8 shows a kind ofly only to have supporting body and not to have the bogey of lid.The substitute is, this supporting body 80 has and is used for chip 12 is fixed on snap lock 82 among the opening 84.This snap lock adopts a kind of form that is connected the keeper on the supporting body.When transferring to chip 12 in the opening 84, this snap lock is relaxed, and passes through to allow chip 12.In case chip 12 is transferred in the opening 84 fully, then snap lock 82 just is back to its original position, and chip 12 lockings are on the throne.Snap lock can be remained on " opening " position so that chip is easy to enter supporting body by commanding apparatus, then, move to " closure " position so that chip is held in place.This embodiment of the present invention can advantageously remove the some steps in some parts and the manufacture process.Yet owing to the dorsal part of chip 12 is not supported fully, thereby when being under pressure, silicon 12 is understood flexural deformations and is damaged.The concrete selection of the intensity of the size of test chip, chip, elastic force, material etc. will have influence on the applicability of this design for certain application.
In case carrier module (comprising supporting body, chip and lid) must be connected onboard securely with various embodiment setting onboard.This connection can be by any realization the in the some kinds of modes.In numerous preferred embodiments, this connection is not permanent, and this carrier module just can be released and remove like this.Be noted that on a plate single or multiple supporting bodies can be installed.
A kind of being used for be shown among Fig. 9 A is connected to one preferred embodiment-clam shell equipment (clamshell) on the plate with carrier module.Supporting arm 90 is positioned at a lateral edges place of this plate.Articulated jib 92 is from the whole dorsal part of supporting arm 90 extend through carrier module 94.In case carrier module is arranged on the plate 30, this articulated jib 92 just descends, so that its entire back of crossing carrier module 94 keeps flat.In case articulated jib 92 descends, then it just engages with second supporting arm 93 on the opposite side that is positioned at carrier module 94 and puts in place, and this second supporting arm 96 has the admittance snap lock 98 that can keep articulated jib 92 securely.Articulated jib 92 depends primarily on the size of carrier module 94 with respect to the quantity of the size of carrier module 94 and articulated jib.Give one example, a kind of articulated jib 92 can be fixed single carrier module 94, and another kind of articulated jib 92 then can be fixed several carrier module.
See also Fig. 9 B, a hinged lid is fixed on chip on the appropriate location on one support plate.Housing 91 includes the opening that is used for chip 12, and the structure of this housing is extremely similar with the structure that for example combines Fig. 7 supporting body described in detail.Top 92A is articulated in housing 91 rotationally.When being shown in an open position, it is easy to insert chip 12.When being in the close position, it is used for fixing chip 12.It can be fixed on the make position by lock bolt 93.For example available screw is fixed on (not shown) on this plate with housing 91 with the opposite side of permanent or semi-permanent mode slave plate 30.This is particularly useful for testing a limited number of chips in the conceptual phase in early days.
Fig. 9 C shows supporting body is fixed to another kind of method on the plate.One of each root pillar 90B supporting pivots facing to supporting body so that this supporting body is fixed to arm 92B on the plate 30.This arm 92B is under the tension force of torsionspring (not shown), thereby keeps supporting body is exerted pressure.This elastic force is enough to supporting body is held in place, but can be by supporting body setting operating personnel are onboard overcome.
As shown in figure 10, can be clear that, carrier module 104 at first need not be provided with/be installed on the plate 30.The substitute is, in one embodiment, can (nationality is by some volatile mechanical device) carrier module 104 itself be installed on the arm 102, descend then, up to carrier module 104 is in accurately on the position with respect to plate 30 till, then, this arm 102 is put in place by snap lock 108 engaging of second supporting member 106 and is fixing.
Can come together to adopt a kind of version of above-mentioned design together with above-mentioned the 3rd embodiment shown in Fig. 8 (that is, a kind of utilize snap lock but not lid fixes the supporting body of chip).Figure 11 shows a kind of arm 112 with the extension 115 that is assembled in the opening 84.In the time of under chip is in pressure, these extensions 115 provide required supporting and resistance, and they can prevent that chip is impaired because of flexural deformation.In the situation that possesses above-mentioned clam shell equipment, arm 112 descends, till its snap lock 118 engagings by second supporting member 116 put in place and be fixing.
Another characteristics in the various embodiments of the invention of can being included in are to allow spring contact to have when carrier module is installed on the test board, sweep away the wiping action of whole land (or contact) pad.When carrying out any connection between two electronic components, it helps one of them is moved with respect to another usually, so that this electronic component and another electronic component sliding contact.So often can remove and bring the detritus of influence may for good electrical connection.Therefore, the ability of allow at test period, using the elastic part that is welded to carry out wiping is a significant advantage.
At test period, wiping action is normally intrinsic because of the pressure connection of elastic part, but the elastic part that is welded to connect not is necessary.The preferable resilient shapes that is used for the elastic part of pressure contact comprises a kind of geometry, so that directly towards the compression of the elastic part of supporting substrates (if this substrate is in the XY plane, then this compression is along the Z axle) can make the contact area sidesway of elastic part, promptly have an XY component.Will cause the wiping action that sweeps away the wiring end face that more or less is plane usually like this.XY when the preferable shape of the elastic part that the elastic part that is used to be welded to connect or pin hole connect can not have a large amount of or any compression moves.
Figure 12 A shows a kind of method that realizes wiping action.In this embodiment, the location hole 122 on the plate 120 can omit to some extent and change, so that they have the front edge 124 of inclination.When carrier module place location hole 122 front edge 124 the top and when transferring to the appropriate location, before the fixed static position of leg 128 in arriving location hole 124, the front edge 124 along this inclination glides earlier.This slip of carrier module 126 can make the elastic part of contact usefulness touch the contact mat on the plate 120 and sweep away this contact mat of wiping.This wiping action can be set up better finally electrically contacting between elastic part that contacts usefulness and contact mat.
Another kind of embodiment (not shown) has a kind of different location holes of pattern on the plane of the plate that roughly is positioned at the usefulness that moves with respect to plate for supporting body.When supporting body began to contact with plate, this supporting body moved in this location hole, thereby carries out wiping action.When locating this supporting body by a processor, can be directly to lateral movement programming as the part of loading process.
Up to the present, discuss and concentrated on the supporting body that is used for chip, wherein this chip includes elastic part.Yet identical principle is applicable to test board or the final packaging facilities equipment and the method that include elastic component wherein too.See also Figure 12 B and 12C, and they and Figure 1B and 1C are made comparisons, support plate 30A can prepare flexible.Be entitled as and describe a kind of being used in No. 5,772,451, the United States Patent (USP) of " socket and the method that is connected electronic component that are used for electronic component " in detail elastic component is installed in preferred methods on this type of plate.This patent has disclosed spring contact has been fixed on the suitable substrate.This substrate can include contact such as bead, relative with elastic component, and then soft heat (reflow), so that be connected on the terminals on the substrate such as printed circuit board (PCB).Adopt this class component herein, substrate 125 can prepare flexible 127, and is configured to contact with terminals on the illustrated semiconductor chip.A kind of embodiment is arranged on bead 123 on the side of the substrate 125 relative with elastic component 127.These beads can for example be fixed on the terminals of plate by soft heat.These elastic components can begin to contact with chip, for the usefulness of chip testing or other operation.When needs, can will remove on substrate 125 slave plates, to reach replacing, to repair or other purpose.Can increase the height of leg 26, so that set elasticity tension accurately at test period.Correspondingly, if adopt a similar supporting body in finished product, then can provide the elasticity shown in Figure 12 B to connect, wherein suitable leg is used for suitable connection.
Chip can be placed in the supporting body, and as described in this disclosure, managing.Like this, even the traditional chip that does not have an elastic part also can be to handle, to test and to use with the above-mentioned very identical mode that is used to have the chip of elastic part.
By using tracking means can further improve the present invention.For example, as shown in FIG. 13A, in supporting body 130, can set up a follower.At random, identifier ID can be applied on the dorsal part that is positioned at the chip 12 among the supporting body 130.Follow the tracks of supporting body and know that the ability that is supported on the what happens that chip wherein goes up at any given time provides the some advantages that are better than prior art.By be provided with on the supporting body trace labelling, and record relate to and be added on the supporting body and/or unload the information that each chip of supporting body is gone up at any given time, the user can carry out access to the information on the chip, this information comprise it from concrete wafer and even comprise the specific manufacturing (lot) in batches of the wafer of particular manufacturer.Though follow-up control is present on the wafer level, still fail at present to obtain to be present in this type of follow-up control on the chip level.Yet,, can keep the information on the chip level by on supporting body of the present invention, trace labelling being set.
Shown in Figure 13 B, trace labelling can be advantageously provided on the side of supporting body, also can see this trace labelling even if lid is on the throne like this.In addition, for example another kind of method, supporting body can be equipped with the programmable device such as EEPROM (electrically erasable programmable ROM).Illustrated among Figure 13 B with an EEPROM between be connected.
At first, trace labelling or identification code are applied to (referring to the FB(flow block) among Figure 14) on the supporting body.Yet, be noted that and can after being loaded into chip on the supporting body, trace labelling be applied on the supporting body.Wafer is cut into pieces.When being encased in each chip in the supporting body, the information that relates to that chip is stored in the trace labelling on the supporting body.This information can comprise (but being not limited only to this): identify the particular wafer that forms this chip information, identify the particular semiconductor die in the wafer of particular batch information, identify the information and the position of chip on wafer of a concrete wafer process batch that forms this wafer.Trace labelling can comprise bar code or be stored in and is arranged in coding on the supporting body, the storage device such as magnetic medium or semiconductor storage.
This processing is in a special preferred embodiment even more powerful.As usual carry out detecting of wafer.The part of noting even in basic test, just being eliminated.For the device that is suitable for modification, can change these parts at this moment.For example, many storage devices all are shaped on unnecessary subelement.Preliminary test identify by or the subelement eliminated, automation equipment can be selected appropriate functional unit group, installs performance normal so generally.On these parts, can follow the tracks of any amount of information, from only noticing the enterprising line item in unit that lost efficacy and work to being at device, and to make can be useful any out of Memory.As another example, in many manufacturing situations, semiconductor wafer otherwise be useless part manufacturing test part.These zones comprise scribe area, or near the nonuseable part wafer.Be kept in the database with information about the information of these test cells about the device on this wafer, found.
A lot of different procedure of processing in the semiconductor manufacturing has to a certain degree variation in the zones of different of a wafer probably.Pay special attention to make these variations to be reduced to a minimum, but difference is slightly arranged probably for the part of some scope in the zones of different of a wafer.When each chip from wafer separate and test and other when using, the sign of following the tracks of single chip can be constructed a wafer map again, shows the result for any required test of a certain chip in any zone of a wafer and near its chip.And can detect and estimate each variation of wafer in batches.So far, because the sign of all parts becomes too difficult simply and can not monitor in the environment of the manufacturing in enormous quantities of complexity, so this type of tracking is extremely difficult.
For moving a course of processing in the mill, this information can be extremely valuable.In case can be practical from the information that test is collected, just can be used for the manufacturing shop.In an automatic system, can set up critical value, it triggers alarm device to the processing that does not conform to technical specification, notifies the manufacturing shop immediately.When using present system, in this reponse system, have two major advantages at least.At first, testing wafer immediately after wafer is cut, it is the shortest to be discharged into the time interval that obtains first this test result from manufacturing.But this with utilized the present course of processing several days and compare in common several weeks at least, though this will be seldom several days usually, it can only be finished in several hours.Second largest advantage is to rely on the sign of following the tracks of each chip, can reconstruct a wafer map.Test result has shown the variation of any kind of the position on the relative wafer among the figure, this information to the manufacturing shop confirm during manufacture, the All Ranges of wafer be consistent can be of great value.Aspect the early stage sample and the ratio afterwards that can suitably improve identical processing that can estimate a processing, this rapidly time response (quick feedback loop) be valuable especially.
Get back to preferred embodiment now, after test and the repairing of initial device, the automatic equipment cut crystal.Treatment facility is put into a supporting body with selecteed chip.As in a manufacturing database, follow the tracks of information about the ad-hoc location of the certain chip on a particular wafer.For example, one group of eight chip can be loaded in the supporting body of Fig. 2 A.Rely on all ad-hoc locations of following the tracks of in supporting body, this is enough to make manufacturing database to follow the tracks of supporting body identifying information and the position of each chip in supporting body.
Point out as above-mentioned, can be with many mode mark supporting bodies.One preferable especially mark is the code of a bar code or other the mechanical width that can be printed by the position that automatic processing device and operator read along the side of supporting body even on a lid is positioned at a supporting body time.Another preferable especially mark is included in the EEPROM device in the supporting body.Automatic processing equipment can be sent key message into EEPROM.This equipment also can be from the EEPROM reading information.This can be simple as a particular identification code that is connected with manufacturing database.
This group supporting body can be in the carriage.Can enough and very similar mode mark one carriage of supporting body.The marshalling of comparatively high amts level is very suitable, aspect the marshalling of the carriage in a car.According to the size of the number of chips in a supporting body and all parts, a wafer can be divided into all single chips, and fuse is filled in all supporting bodies in the carriage of lesser amt, for example 5 to 10 the order of magnitude.According to the scale of a production operation, for example one of 25 wafers in batches, will occupy about 125 to 250 carriages so.
Consult Figure 13 C, carriage 130 can be equipped with a series of grooves 131, and each groove holds a supporting body.One leading edge of carriage 130 comprises mark 132.The programmable device 134 of this bearing bracket suitably is an EEPROM, and has and be used for connection 133 automatic processing equipment contact, that be easy to reach.If desired, this mark can be to be used for the guiding device that operator and machine can scan.Programmable connection allows to enter the electric tracing device.
An identification mark also can put on each chip self.Usually, after chip is packed supporting body into, this identification mark will be applied to the dorsal part (side relative with spring contact) of chip, and wherein mark applies by the aperture in the supporting body, perhaps can put at chip to apply before complete.Identification mark on chip can comprise the success that shows a test process or failure an ink dot, unique or half a unique identification number, comprise about that concrete chip bar code of the more special information of situation, perhaps other Useful Information in the past.As an example, a series of chips in the batch can identifying information mark enough orders, unique.One independent batch can utilize identical identification information, but can use other method, and for example the time in manufactory, certain position in an external bearer body etc. are other with the first batch phase region.As in an object lesson, can utilize the chip in 16 information traces, one batch, can utilize the bigger product group of some order of magnitude of comparatively high amts level figure place.
Can layout equipment of the present invention and use (, seeing also the flow chart of Figure 15) in every way for an example.For example, chip can be loaded in the supporting body, and be fixed in the supporting body, form a carrier module with a keeper.This carrier module can be positioned on the plate then, for example it be fixed up then with a clip.Perhaps, can be installed in carrier module on the clip or in the bindiny mechanism, then when it is fixed/when being locked in the appropriate location, is positioned onboard.Perhaps carrier module is at first installed onboard, loads therein subsequently and fixed chip.Have layout and its other variation on the step of being followed aspect the installation on a test board or the final substrate place shell in carrier module.The present invention does not also require a specific order of following this step aspect the layout of the present invention.
Claims (29)
1. method that is used to install electronic component, described method comprises:
Described electronic component is placed against the framework of supporting body, described electronic component has a plurality of elongated elasticity electric contact piece on corresponding first electrical contact pad that is installed on the described electronic component, and described a plurality of elongated elasticity electric contact pieces extend beyond a surface of described supporting body;
Described electronic component is fixed on the described supporting body;
Described supporting body is pressed on first substrate, and described substrate has a plurality of second electrical contacts of a near surface that is positioned at described first substrate.
2. the method for claim 1 is characterized in that, described electronic component is integrated circuit (IC).
3. method as claimed in claim 1 or 2 is characterized in that, described method also comprises:
Before described electronic component is placed against described framework, earlier described a plurality of elongated elasticity electric contact pieces are installed on the described electronic component.
4. method as claimed in claim 3 is characterized in that, also comprises:
After the electronic component that described a plurality of elongated elasticity electric contact pieces is installed on the described wafer, make the described wafer that comprises described electronic component be divided into individualized.
5. method as claimed in claim 4 is characterized in that, after described elongated elasticity electric contact piece was mounted to described electronic component, described each elongated elasticity electric contact piece was independently in a spot of treatment step at least.
6. method as claimed in claim 5 is characterized in that, be placed on a top on the described supporting body described fixedly comprising.
7. method as claimed in claim 5 is characterized in that, when described elongated elasticity electric contact piece was used to be electrically connected, the size of described framework defined the maximum compression limit for described each elongated resilient contact.
8. method as claimed in claim 7 is characterized in that, described elongated elasticity electric contact piece is electrically connected to described first electrical contact pad on corresponding described second electrical contact.
9. method as claimed in claim 7 is characterized in that, described first substrate is the testing circuit board that is used to test described electronic component.
10. method as claimed in claim 7 is characterized in that, described first substrate is the final packaging that is used to use described electronic component.
11. method as claimed in claim 7 is characterized in that, described electronic component is placed against described framework, and does not have a packing of separating that is used for described electronic component.
12. method as claimed in claim 6 is characterized in that, it is plane that described top is substantially.
13. method as claimed in claim 6 is characterized in that, described top comprises that described part is constituted as on the surface that is pressed on described electronic component from an outstanding part of a surface at described top.
14. method as claimed in claim 7 is characterized in that, the compression degree when the described elongated compression degree of elasticity electric contact piece in the test of described electronic component is less than the use of test back.
15. method as claimed in claim 7 is characterized in that, also comprises:
Described supporting body is alignd automatically with respect to described first substrate.
16. method as claimed in claim 15, it is characterized in that, described supporting body comprises a plurality of firsts, and described first substrate comprises a plurality of second portions, described second portion is constituted as unique coupling with described a plurality of firsts, so that described supporting body aligns automatically with respect to described first substrate.
17. method as claimed in claim 16, it is characterized in that, described a plurality of first is outstanding from the described surface of described supporting body, described surface is in the face of described first substrate, and described a plurality of second portion is the receiving structure that is positioned on described first substrate, and described receiving structure is used to admit described first.
18. method as claimed in claim 17; it is characterized in that; described a plurality of first is greater than the development length of described a plurality of elongated elasticity electric contact piece from the development length of described supporting body; take this; described a plurality of first will touch the plane earlier early than described a plurality of elongated elasticity electric contact pieces; thereby when described supporting body is not pressed on described first substrate, protect described contact.
19. method as claimed in claim 5 is characterized in that, described electronic component is fixed on the described supporting body by following manner:
Fix first side of described electronic component with being connected keeper on the described supporting body; Second side of the described electronic component of described frame fixation, described second side is relative with described first side, and described a plurality of elongated elasticity electric contact pieces are installed on described second side of described electronic component.
20. method as claimed in claim 19 is characterized in that, described keeper machinery adjoins at least a portion of described first side of described electronic component, and described framework machinery adjoins at least a portion of described second side of described electronic component.
21. method as claimed in claim 20 is characterized in that, described keeper comprises at least one opening.
22. method as claimed in claim 21 is characterized in that, also comprises:
After being fixed on described electronic component in the described supporting body, on described electronic component, make mark by described at least one opening in the described keeper.
23. method as claimed in claim 22 is characterized in that, described marked body reveals the information of the test structure that relates to described electronic component.
24. method as claimed in claim 23 is characterized in that, described test comprises the welding test of described electronic component.
25. method as claimed in claim 5 is characterized in that, also comprises:
Will be from the heat transferred of the described electronic component heat transferred medium to the described supporting body.
26. method as claimed in claim 20 is characterized in that, described keeper comprises the opening that is used to transmit from the heat of described electronic component.
27. method as claimed in claim 20 is characterized in that, described keeper comprises the probe that is used to measure described temperature of electronic component.
28. method as claimed in claim 20 is characterized in that, described supporting body is installed against described first substrate, then, described electronic component is placed against described framework, then, described electronic component is fixed on the described supporting body.
29. method as claimed in claim 20 is characterized in that, described electronic component is placed against described framework, then, described electronic component is fixed on the described supporting body, then, described supporting body is pressed on described first substrate.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/205,502 | 1998-12-04 | ||
| US09/205,502 US20020004320A1 (en) | 1995-05-26 | 1998-12-04 | Attaratus for socketably receiving interconnection elements of an electronic component |
| US09/260,795 | 1999-03-01 | ||
| US09/260,795 US6627483B2 (en) | 1998-12-04 | 1999-03-01 | Method for mounting an electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1561656A true CN1561656A (en) | 2005-01-05 |
| CN1294787C CN1294787C (en) | 2007-01-10 |
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|---|---|---|---|
| CNB998141097A Expired - Fee Related CN1294787C (en) | 1998-12-04 | 1999-12-03 | Method for mounting an electronic component |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1145612B1 (en) |
| JP (1) | JP3648455B2 (en) |
| CN (1) | CN1294787C (en) |
| DE (1) | DE69924152T2 (en) |
| TW (1) | TWI241870B (en) |
| WO (1) | WO2000035262A2 (en) |
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| US5772451A (en) * | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
| JPH10282172A (en) * | 1997-04-07 | 1998-10-23 | Alps Electric Co Ltd | Electronic apparatus and its measuring method |
-
1999
- 1999-12-03 EP EP99962994A patent/EP1145612B1/en not_active Expired - Lifetime
- 1999-12-03 WO PCT/US1999/028636 patent/WO2000035262A2/en active IP Right Grant
- 1999-12-03 DE DE69924152T patent/DE69924152T2/en not_active Expired - Lifetime
- 1999-12-03 JP JP2000587594A patent/JP3648455B2/en not_active Expired - Fee Related
- 1999-12-03 CN CNB998141097A patent/CN1294787C/en not_active Expired - Fee Related
- 1999-12-03 TW TW088121434A patent/TWI241870B/en not_active IP Right Cessation
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101854788A (en) * | 2010-03-02 | 2010-10-06 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and double-head buckle thereof |
| CN104685986A (en) * | 2012-09-27 | 2015-06-03 | 富士机械制造株式会社 | Component feeder |
| CN104685986B (en) * | 2012-09-27 | 2017-07-04 | 富士机械制造株式会社 | Component supplying apparatus |
| CN108802436A (en) * | 2017-04-28 | 2018-11-13 | 株式会社爱德万测试 | The carrier of device for testing electronic parts |
| CN108802436B (en) * | 2017-04-28 | 2021-09-07 | 株式会社爱德万测试 | Carrier for electronic component testing device |
| CN111819916A (en) * | 2018-04-27 | 2020-10-23 | 宝马股份公司 | Method for transporting and mounting electronic components and reusable transport and assembly module |
| US11297749B2 (en) | 2018-04-27 | 2022-04-05 | Bayerische Motoren Werke Aktiengesellschaft | Method for transporting and installing an electronic device, and reusable transport and assembly module |
| CN112192170A (en) * | 2019-11-14 | 2021-01-08 | 谷歌有限责任公司 | Memory insertion machine |
| CN112192170B (en) * | 2019-11-14 | 2023-08-18 | 谷歌有限责任公司 | Memory inserting machine |
| US11800695B2 (en) | 2019-11-14 | 2023-10-24 | Google Llc | Memory insertion machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1294787C (en) | 2007-01-10 |
| WO2000035262A3 (en) | 2002-10-24 |
| WO2000035262A2 (en) | 2000-06-15 |
| JP3648455B2 (en) | 2005-05-18 |
| TWI241870B (en) | 2005-10-11 |
| EP1145612A2 (en) | 2001-10-17 |
| EP1145612B1 (en) | 2005-03-09 |
| DE69924152T2 (en) | 2006-04-27 |
| DE69924152D1 (en) | 2005-04-14 |
| JP2003523073A (en) | 2003-07-29 |
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