CN1575107A - 导电连接方法 - Google Patents

导电连接方法 Download PDF

Info

Publication number
CN1575107A
CN1575107A CNA2004100429526A CN200410042952A CN1575107A CN 1575107 A CN1575107 A CN 1575107A CN A2004100429526 A CNA2004100429526 A CN A2004100429526A CN 200410042952 A CN200410042952 A CN 200410042952A CN 1575107 A CN1575107 A CN 1575107A
Authority
CN
China
Prior art keywords
wire line
wiring board
mid
conduction
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2004100429526A
Other languages
English (en)
Other versions
CN100536637C (zh
Inventor
A·格恩哈特
T·古勒特
C·门策尔
W·奥利科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOVAL GmbH
Original Assignee
NOVAL GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NOVAL GmbH filed Critical NOVAL GmbH
Publication of CN1575107A publication Critical patent/CN1575107A/zh
Application granted granted Critical
Publication of CN100536637C publication Critical patent/CN100536637C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece

Abstract

用于使一线路板的导线线路与用MID工艺制造的构件的导线线路导电连接的方法，包括以下工步：在从其上获得线路板的板件上使导线线路至少一直通到线路板的边缘；板件沿此边缘在导线线路的区域内设置通孔；通孔通过电镀进行通孔镀敷；从板件上割下来的线路板相对于MID－构件这样地定位，使得线路板和MID－构件相互邻接的导线线路可相互焊接。线路板适宜于得到与终止于其边缘的导线线路重叠的背面的导电连接面，它们通过金属化和通孔镀敷的孔与正面的导线线路导电连接。

Description

导电连接方法
技术领域
本发明涉及一种用于至少一个终止于一线路板边缘的导线线路与位于一相邻的由热塑性塑料用MID工艺制成的构件上的导线线路导电连接的方法。
背景技术
作为所谓的成型射出装置(MID)，亦即用MID-工艺制造的电气构件可以按照不同的方法，例如掩模法，用带有后续电镀金属化的双组分压注，通过激光直接形成结构、后喷涂(Hinterspritzen)薄膜或热压印设有所希望的导线线路。这样制造的MID-构件—与由GFK等等组成的普通线路板不同—是带有内置导线线路布置图案(layout)和在某些情况下其它电子或电子机械元件的三维成形件。采用这种类型的MID-构件，即使它仅仅设有导线线路并用作电气或电子装置内的普通布线的替代品—不仅节省空间并由此使有关装置小型化，还通过减少安装和导电连接工序数量降低制造成本。
然而MID-构件不适合于用作通用的其上以SMD工艺设置大量具有高封装密度和非常小的导线线路间距的电子元件的印刷线路板或线路板的替代品，在这种情况下经常出现这样的问题，即一个或多个线路板与一个MID-构件导电连接。迄今为止的方法，亦即焊入跨接线或通过插接接线柱、弹簧接线柱、导电橡胶条等的机械式导电连接，耗费材料，另一方面占用空间大，昂贵和花费宝贵的制造时间。
发明内容
本发明的目的是，提供一种特别经济合理同时可靠的开头所述类型的导电连接方法。
按照本发明在开头所述类型的方法中通过以下工步实现这个目的：
a)在提供至少一块线路板的至少单面敷铜/镀铜的板件以一布置图案产生线路板的导线线路，在该布置图案中导线线路延长超过限定以后朝向MID-构件的线路板边缘的分割线，
b)板件沿分割线至少在导线线路的区域内设有通孔，
c)电镀地对通孔进行通孔镀敷，
d)将线路板从板件上分离下来，
e)将线路板相对于MID-构件定位，线路板和MID-构件的相邻的导线线路相互焊接。
为了每块板件制造一块以上线路板，作为工步a)的另一种选择，
a’)在提供至少两块线路板的至少一侧敷铜的板件以一布置图案产生线路板的导线线路，在该布置图案中以后朝向MID-构件的边缘沿共同的分割线相互邻接，并且相关的导线线路跨接此分割线(权利要求2)。
其它工步b)至e)如前所述进行。
也就是说本发明的核心在于，待导电连接的导线线路在板件上—即在以后从其中分离下线路板的板上—超过线路板的以后的边缘延长到与MID-构件的导线线路在其边缘处在其中终止的栅格相同的栅格内，所述(板件上的)导线线路正好在以后的边缘高度处设有镀敷的通孔，然后才将线路板从板件上例如折断下来或冲裁下来，从而各导线线路终止于一镀敷的半圆柱表面上。在单块线路板的情况下板件比线路板大相应的边条即可。在线路板以后的实际边缘的高度上线路板配备镀敷的通孔。接着将多余的边条折掉。如果象通常那样应该同时产生多块线路板，那么按上述可选择的工步a’)进行处理要有利得多。这时在板件上分别头连头地相对设置至少两块线路板，例如用这样的方法，即布置图案使得在板件上产生一相对于另一线路板绕垂直轴旋转180°的线路板。基本上在相关边缘的整个长度上产生一导线线路栅格，而与多少导线线路传导电信号无关，则是适宜的。对于MID-构件对应的边缘也一样。用这种方法实现线路板和MID-构件之间的机械连接的最大强度。
这样准备好的线路板可以毫无问题地与相邻MID-构件的导线线路焊接。这种类型的导电连接表明在电气上是安全和可靠的，并且在机械上特别稳定。所建议的方法不需要附加的连接元件，并且只由于这个原因便已经节省费用，同时这还节省线路板上的空间，并使额外的迄今为止在现有技术已知的导电连接方法中必需的制造工步变得多余。
在实际上可以不需要额外的开支通过这样的方法提高导电连接的安全性，即线路板的导线线路至少在其边缘处加宽成导电连接面，即所谓的焊接区/焊盘(pads)(权利要求3)。由于电路技术方面的原因不需要导线线路的地方，在边缘侧只形成焊接区就足够了。
非常小的额外加工费用的条件下，通过焊接/钎焊同时造成的在线路板和MID-构件之间的机械连接的改善之处在于，板件在背面至少在分割线与正面的导线线路重叠的区域内设置(焊接区)(权利要求4)。所述导电连接面可以在双面线路板时延续到背面的传输信号的导线线路上。
这里，当背面的导电连接面或焊接区延伸到背面的导线线路时，正面的导线线路与背面的导电连接面或焊接区通过金属化的和通孔镀敷的孔连接是适宜的(权利要求5)。即使相应的边缘处的半圆柱表面的金属化由于棱边包夹不充分或其它原因在正面的导线线路或其加宽成的导电连接面与线路板背面的导线线路或导电连接面之间没有或只有不充分的导电连通，这种通孔镀敷仍建立与MID-构件的相关导线线路的可靠的导电连通。
如果线路板和MID-构件这样地相互定位，使得线路板和MID-构件待相互导电连接的导线线路相互在高度上错开大约一个线路板的厚度，并相互搭接，那么首先对于机械强度是有好处的(权利要求6)。由此形成线路板和MID-构件之间面积较大的焊接/钎焊连接。
线路板的导线线路和MID-构件的导线线路可以特别是按回流法相互钎焊/焊接(权利要求7)。但是也可以采用其它导电连接方法，如激光焊接、过热汽相焊接(Heiβdampfphasenlten)或机器人焊接或者导电粘接。事先要求的焊膏涂覆可例如按丝网印刷法或逐点地借助于分配器机器人进行。
板件或线路板可以还在导电连接之前至少局部地配备MID-构件的导线线路(权利要求8)，使得例如在后续的回流处理中在一个工步内既使所配备的元件与线路板的导线线路又使导线线路与MID-构件焊接。
所建议的导电连接法特别适合于和在它上面例如用热压法(权利要求9)或通过激光直接形成构造(权利要求10)安装有导线线路的MID-构件结合。
附图说明
下面借助于示意简化的附图举例地说明按本发明的方法。其中：
图1示出一线路板的俯视透视图，
图2示出同一线路板的后视图，
图3示出一包括四个这种线路板的板件，
图4示出一与用MID工艺制作的构件机械和导电连接的线路板，和
图5示出一对应于图4中沿A-A线的剖面的大大放大的导电连接部位。
具体实施方式
图1用透视图简化表示一例如由玻璃纤维强化的环氧树脂制成的线路板，它设有这里仅仅用符号表示的通过导线线路4相互连接的元件2和3。元件2和3的电源接头和信号线接头通过另一导线线路5通向线路板的上边缘处的边缘触点6。在那里各导线线路转接到加宽的导电连接面6a，见放大的局部。导电连接面6a在规定的栅格中且几乎沿线路板1的整个上边缘设置，而且它不需要引出的导电接头。线路板1背面也可以设置导线线路，并配备电气元件。
即使象在本实施例中那样，线路板仅在前侧设有导线线路和元件，如图2所示，在线路板的背侧仍设有与导电连接面6a相对的相同的导电连接面6b。导电连接面6a和6b既通过在线路板1上边缘形成的半圆柱面6c，又附加地通过通孔镀敷的孔6d相互连接。
线路板1的边缘触点6按借助于图3说明的方法产生。在两面敷铜的板件20上按已知方法中的一种在正面和背面产生一相当于四块相同的线路板1.1至1.4的布置图案，仅仅是为了看清楚，这里所述线路板表示成正面已经配备了元件2和3。布置图案设计成使得各两块线路板1.1和1.2以及1.3和1.4以其带有边缘触点的边缘相互邻接地相对设置。也就是说在这个示例中线路板1.2和1.4的布置图案相对于线路板1.1和1.3的布置图案绕垂直轴线旋转180°。在产生导线线路4和5和导电连接面6a以及这里不可见的背面的导线线路和导电连接面之前或之后，板件沿导电连接面6.1a、6.2a和6.3a、6.4a越过其延伸的分割线2.1在这些导电连接面的高度上、在和所述导电连接面相同的栅格内设置通孔8和孔6d，在这个工步中还制造全部其它必要的孔，特别是用来装备和导电连接元件2和3所需要的孔。接着全部的孔，亦即通孔8和孔6d，按常用的方法电镀地进行通孔镀敷。在最后一个工步中沿分割线2.1至2.6从板件20上冲下线路板1.1至1.4。然后在线路板1.1至1.4各待导电连接的边缘区域内使导电连接面6a、6b按图1通过金属化的半圆柱形表面6c和附加地通过完全金属化的孔6d导电连接。即使在冲下过程中半圆柱形面6c的薄的只有几个μm厚的金属化层可能受到损坏，在孔6d区域内的镀敷仍确保多个导电连接面6a与背面的相对面6b的导电连接。
线路板1设定成用来与用MID工艺制造的电气构件导电和机械连接。图4举例表示一壳体下部10形式的这种MID-构件，其三维表面带有大量例如按热压印法(Heissprgeverfahren)或通过激光直接形成构造所产生的终止于导电连接面12的导线线路11，其它电气元件(未画出)焊接在所述导电连接面上。导线线路11与线路板1的边缘触点6焊接。按任何一种已知方法的焊接既用于线路板1的导电连接又用于线路板1在壳体下部10内的机械固定。
图5以沿图4中A-A线的放大剖视图表示焊接连接。线路板1以其边缘搭接地位与MID-构件10的边缘上。上侧的导电连接面6a与下侧的导电连接面6b一方面通过金属化的半圆柱形面6c，另一方面通过孔6d的金属化层6e连接。MID-构件10的导线线路11通过焊料30既与半圆柱形表面6c又与下导电连接面6b连接，且焊料30由于毛细作用填充这个下侧的导电连接面6b和导线线路11之间的缝隙。由于毛细作用焊料30还上升到孔6d内。

Claims (10)

1.用于使终止于一线路板至少一个边缘上的导线线路与安装在用MID工艺由热塑性塑料制成的一相邻构件上的导线线路导电连接的方法，其特征为：
a)在一提供至少一块线路板的至少单面敷铜的板件上以一布置图案产生线路板的导线线路，在所述布置图案中导线线路延长超过限定线路板以后朝向MID-构件的边缘的分割线，
b)板件至少在导线线路区域内沿分割线设置有通孔，
c)电镀地使通孔进行通孔镀敷，
d)从板件上分离线路板，和
e)各待导电连接的线路板相对于MID-构件定位，线路板和MID-构件的相互邻接的导线线路相互焊接。
2.按权利要求1的用来同时制造一块以上线路板的方法，其特征为：以下工步代替工步a)：
a’)在一提供至少两块线路板的、至少单面敷铜的板件上以一布置图案产生线路板的导线线路，在所述布置图案中以后朝向MID-构件的边缘沿一共同的分割线相互邻接，并且相关导线线路跨接此分割线。
3.按权利要求1或2所述的方法，其特征为：线路板的导线线路至少在其边缘处加宽成导电连接面或焊接区。
4.按权利要求1至3之任一项所述的方法，其特征为：板件在背面至少在分割线区域内与正面的导线线路重叠地设置导电连接面或焊接区。
5.按权利要求4所述的方法，其特征为：至少当背面的导电连接面延伸到背面的导线线路时，正面的导线线路与背面的导电连接面通过金属化和通孔镀敷的孔连接。
6.按权利要求1至5之任一项所述的方法，其特征为：线路板和MID-构件这样地相互定位，使得线路板和MID-构件待相互导电连接的导线线路相互在高度上错开一个线路板的厚度，并相互搭接。
7.按权利要求1至6之任一项所述的方法，其特征为：线路板的导线线路和MID-构件的导线线路按回流法相互焊接。
8.按权利要求1至7之任一项所述的方法，其特征为：板件或线路板在导电连接之前至少局部配备MID-构件的导线线路。
9.按权利要求1至7之任一项所述的方法，其特征为：用于在其上面通过热压法装有导线线路的MID-构件。
10.按权利要求1至8之任一项所述的方法，其特征为：用于在其上面通过激光直接形成结构装有导线线路的MID-构件。
CNB2004100429526A 2003-06-05 2004-06-04 导电连接方法 Expired - Fee Related CN100536637C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10325550A DE10325550B4 (de) 2003-06-05 2003-06-05 Elektrisches Kontaktierungsverfahren
DE10325550.8 2003-06-05

Publications (2)

Publication Number Publication Date
CN1575107A true CN1575107A (zh) 2005-02-02
CN100536637C CN100536637C (zh) 2009-09-02

Family

ID=33154566

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100429526A Expired - Fee Related CN100536637C (zh) 2003-06-05 2004-06-04 导电连接方法

Country Status (6)

Country Link
US (1) US7155815B2 (zh)
EP (1) EP1484950B1 (zh)
CN (1) CN100536637C (zh)
AT (1) ATE342649T1 (zh)
DE (2) DE10325550B4 (zh)
ES (1) ES2274338T3 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113394208A (zh) * 2021-05-25 2021-09-14 武汉光迅科技股份有限公司 一种光电探测器

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7612296B2 (en) * 2004-08-31 2009-11-03 Synergy Microwave Corporation Visually inspectable surface mount device pad
JP4455301B2 (ja) * 2004-12-07 2010-04-21 日東電工株式会社 配線回路基板およびその接続構造
TW200742511A (en) * 2006-04-21 2007-11-01 Innolux Display Corp Printed circuit board
US9867530B2 (en) 2006-08-14 2018-01-16 Volcano Corporation Telescopic side port catheter device with imaging system and method for accessing side branch occlusions
WO2009009802A1 (en) 2007-07-12 2009-01-15 Volcano Corporation Oct-ivus catheter for concurrent luminal imaging
US9596993B2 (en) 2007-07-12 2017-03-21 Volcano Corporation Automatic calibration systems and methods of use
WO2009009799A1 (en) 2007-07-12 2009-01-15 Volcano Corporation Catheter for in vivo imaging
KR101545019B1 (ko) * 2007-09-05 2015-08-18 삼성전자주식회사 Lds를 이용한 전자 기기의 제조방법 및 그에 의해 제조된 전자 기기
US8393918B2 (en) * 2008-06-11 2013-03-12 Pulse Electronics, Inc. Miniaturized connectors and methods
US7863722B2 (en) * 2008-10-20 2011-01-04 Micron Technology, Inc. Stackable semiconductor assemblies and methods of manufacturing such assemblies
JP5087642B2 (ja) * 2010-01-14 2012-12-05 Ｔｄｋラムダ株式会社 基板
DE102010010331A1 (de) * 2010-03-04 2011-09-08 Phoenix Contact Gmbh & Co. Kg Elektrische Kontaktanordnung
US11141063B2 (en) 2010-12-23 2021-10-12 Philips Image Guided Therapy Corporation Integrated system architectures and methods of use
US8472205B2 (en) * 2010-12-30 2013-06-25 Research In Motion Limited Adaptive printed circuit board connector
US11040140B2 (en) 2010-12-31 2021-06-22 Philips Image Guided Therapy Corporation Deep vein thrombosis therapeutic methods
US8897032B2 (en) * 2011-05-24 2014-11-25 Xirrus, Inc. Surface mount antenna contacts
US9360630B2 (en) 2011-08-31 2016-06-07 Volcano Corporation Optical-electrical rotary joint and methods of use
US20130335931A1 (en) * 2012-06-15 2013-12-19 Delphi Technologies, Inc. Surface mount interconnection system for modular circuit board and method
JP5525574B2 (ja) 2012-08-07 2014-06-18 ホシデン株式会社 部品モジュール及び部品モジュールの製造方法
JP5484529B2 (ja) * 2012-08-07 2014-05-07 ホシデン株式会社 部品モジュール及び部品モジュールの製造方法
JP2015532536A (ja) 2012-10-05 2015-11-09 デイビッド ウェルフォード， 光を増幅するためのシステムおよび方法
US9858668B2 (en) 2012-10-05 2018-01-02 Volcano Corporation Guidewire artifact removal in images
US9292918B2 (en) 2012-10-05 2016-03-22 Volcano Corporation Methods and systems for transforming luminal images
US9367965B2 (en) 2012-10-05 2016-06-14 Volcano Corporation Systems and methods for generating images of tissue
US11272845B2 (en) 2012-10-05 2022-03-15 Philips Image Guided Therapy Corporation System and method for instant and automatic border detection
US10568586B2 (en) 2012-10-05 2020-02-25 Volcano Corporation Systems for indicating parameters in an imaging data set and methods of use
US9324141B2 (en) 2012-10-05 2016-04-26 Volcano Corporation Removal of A-scan streaking artifact
US10070827B2 (en) 2012-10-05 2018-09-11 Volcano Corporation Automatic image playback
US9286673B2 (en) 2012-10-05 2016-03-15 Volcano Corporation Systems for correcting distortions in a medical image and methods of use thereof
US9307926B2 (en) 2012-10-05 2016-04-12 Volcano Corporation Automatic stent detection
US9840734B2 (en) 2012-10-22 2017-12-12 Raindance Technologies, Inc. Methods for analyzing DNA
JP6322210B2 (ja) 2012-12-13 2018-05-09 ボルケーノ コーポレイション 標的化された挿管のためのデバイス、システム、および方法
US10939826B2 (en) 2012-12-20 2021-03-09 Philips Image Guided Therapy Corporation Aspirating and removing biological material
US10942022B2 (en) 2012-12-20 2021-03-09 Philips Image Guided Therapy Corporation Manual calibration of imaging system
WO2014099899A1 (en) 2012-12-20 2014-06-26 Jeremy Stigall Smooth transition catheters
JP2016504589A (ja) 2012-12-20 2016-02-12 ナサニエル ジェイ． ケンプ， 異なる撮像モード間で再構成可能な光コヒーレンストモグラフィシステム
EP2934282B1 (en) 2012-12-20 2020-04-29 Volcano Corporation Locating intravascular images
US11406498B2 (en) 2012-12-20 2022-08-09 Philips Image Guided Therapy Corporation Implant delivery system and implants
US9486143B2 (en) 2012-12-21 2016-11-08 Volcano Corporation Intravascular forward imaging device
US9612105B2 (en) 2012-12-21 2017-04-04 Volcano Corporation Polarization sensitive optical coherence tomography system
WO2014099896A1 (en) 2012-12-21 2014-06-26 David Welford Systems and methods for narrowing a wavelength emission of light
US10058284B2 (en) 2012-12-21 2018-08-28 Volcano Corporation Simultaneous imaging, monitoring, and therapy
US10191220B2 (en) 2012-12-21 2019-01-29 Volcano Corporation Power-efficient optical circuit
WO2014099672A1 (en) 2012-12-21 2014-06-26 Andrew Hancock System and method for multipath processing of image signals
US9226711B2 (en) 2012-12-21 2016-01-05 Volcano Corporation Laser direct structured catheter connection for intravascular device
JP2016502884A (ja) 2012-12-21 2016-02-01 ダグラス メイヤー， 延在カテーテル本体テレスコープを有する回転可能超音波撮像カテーテル
US10413317B2 (en) 2012-12-21 2019-09-17 Volcano Corporation System and method for catheter steering and operation
US10166003B2 (en) 2012-12-21 2019-01-01 Volcano Corporation Ultrasound imaging with variable line density
JP2016508757A (ja) 2012-12-21 2016-03-24 ジェイソン スペンサー， 医療データのグラフィカル処理のためのシステムおよび方法
CN105103163A (zh) 2013-03-07 2015-11-25 火山公司 血管内图像中的多模态分割
US10226597B2 (en) 2013-03-07 2019-03-12 Volcano Corporation Guidewire with centering mechanism
EP3895604A1 (en) 2013-03-12 2021-10-20 Collins, Donna Systems and methods for diagnosing coronary microvascular disease
US20140276923A1 (en) 2013-03-12 2014-09-18 Volcano Corporation Vibrating catheter and methods of use
US11026591B2 (en) 2013-03-13 2021-06-08 Philips Image Guided Therapy Corporation Intravascular pressure sensor calibration
CN105120759B (zh) 2013-03-13 2018-02-23 火山公司 用于从旋转血管内超声设备产生图像的系统和方法
US9301687B2 (en) 2013-03-13 2016-04-05 Volcano Corporation System and method for OCT depth calibration
EP2967606B1 (en) 2013-03-14 2018-05-16 Volcano Corporation Filters with echogenic characteristics
US10219887B2 (en) 2013-03-14 2019-03-05 Volcano Corporation Filters with echogenic characteristics
US10292677B2 (en) 2013-03-14 2019-05-21 Volcano Corporation Endoluminal filter having enhanced echogenic properties
US10514134B2 (en) 2014-12-05 2019-12-24 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
CN106704993A (zh) * 2017-01-09 2017-05-24 宁波亚茂光电股份有限公司 一种插卡式电源与光源板的连接结构
US10498085B2 (en) 2018-03-01 2019-12-03 Te Connectivity Corporation Molded interconnect substrate for a cable assembly
US11764503B2 (en) * 2020-09-23 2023-09-19 Victor Tikhonov PCB external device connector

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3522647A1 (de) * 1985-06-25 1987-01-08 Merten Kg Pulsotronic Schaltungsmodul-traegerplatte
US4821007A (en) * 1987-02-06 1989-04-11 Tektronix, Inc. Strip line circuit component and method of manufacture
US4790894A (en) * 1987-02-19 1988-12-13 Hitachi Condenser Co., Ltd. Process for producing printed wiring board
US5140745A (en) * 1990-07-23 1992-08-25 Mckenzie Jr Joseph A Method for forming traces on side edges of printed circuit boards and devices formed thereby
JP2936833B2 (ja) * 1991-10-02 1999-08-23 株式会社村田製作所 表面実装型電子部品
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
US6518088B1 (en) * 1994-09-23 2003-02-11 Siemens N.V. And Interuniversitair Micro-Electronica Centrum Vzw Polymer stud grid array
US5938455A (en) * 1996-05-15 1999-08-17 Ford Motor Company Three-dimensional molded circuit board having interlocking connections
JPH10247766A (ja) 1997-03-03 1998-09-14 Alps Electric Co Ltd 回路基板
JPH10313157A (ja) * 1997-05-12 1998-11-24 Alps Electric Co Ltd プリント基板
JP3664001B2 (ja) * 1999-10-25 2005-06-22 株式会社村田製作所 モジュール基板の製造方法
US6496384B1 (en) * 2001-09-21 2002-12-17 Visteon Global Technologies, Inc. Circuit board assembly and method of fabricating same
SG111069A1 (en) * 2002-06-18 2005-05-30 Micron Technology Inc Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113394208A (zh) * 2021-05-25 2021-09-14 武汉光迅科技股份有限公司 一种光电探测器
CN113394208B (zh) * 2021-05-25 2023-05-05 武汉光迅科技股份有限公司 一种光电探测器

Also Published As

Publication number Publication date
EP1484950A2 (de) 2004-12-08
DE502004001703D1 (de) 2006-11-23
ATE342649T1 (de) 2006-11-15
ES2274338T3 (es) 2007-05-16
CN100536637C (zh) 2009-09-02
EP1484950A3 (de) 2005-05-25
EP1484950B1 (de) 2006-10-11
US7155815B2 (en) 2007-01-02
DE10325550B4 (de) 2007-02-01
US20040248439A1 (en) 2004-12-09
DE10325550A1 (de) 2005-01-05

Similar Documents

Publication Publication Date Title
CN100536637C (zh) 导电连接方法
EP0934687B1 (de) Anordnung, umfassend ein trägersubstrat für leistungsbauelemente und einen kühlkörper sowie verfahren zur herstellung derselben
EP1255299B1 (de) Leistungshalbleitermodul in Druckkontaktierung
EP1980143B1 (de) Leiterplatte mit zusätzlichen funktionalen elementen sowie herstellverfahren und anwendung
CA2616793C (en) Bending-type rigid printed wiring board and process for producing the same
DE10306643B4 (de) Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul
US6243946B1 (en) Method of forming an interlayer connection structure
EP1192841B1 (de) Intelligentes leistungsmodul
CN1400696A (zh) 电触点的制造方法
EP1817803B1 (de) Kontaktierung von vielschicht-piezoaktoren bzw. -sensoren
CN1263355C (zh) 由平面导体元件制成的复合叠层件及其应用
US6172307B1 (en) Feedthrough via connection on solder resistant layer
CN100419924C (zh) 复合电子元件和生产该元件的方法
EP1472915A2 (de) Schaltungsträger und herstellung desselben
JP2003142797A5 (zh)
CN1765160A (zh) 用于两个电路板的电的和机械的连接的方法和装置
DE19924991A1 (de) Intelligentes Leistungsmodul in Sandwich-Bauweise
CN1254159C (zh) 柔性印刷电路板
JPS63114299A (ja) プリント配線板
CN1893764A (zh) 一种复合式印刷电路板及电子装置
JP3417123B2 (ja) フラット・ハーネス
WO2004017400A1 (de) Anordnung mit einem halbleiterchip und dessen träger sowie verfahren zur bond-drahtverbindung
JPH07162120A (ja) フレキシブルプリント配線板の回路接続方法及びフレキシブルプリント配線板
JP3250390B2 (ja) 多層プリント配線板
JP4388168B2 (ja) 樹脂成形基板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090902

CF01 Termination of patent right due to non-payment of annual fee